Reliability Report

AOS Semiconductor
Product Reliability Report
AO3460,
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AO3460.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AO3460
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
II.
III.
IV.
V.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
Physical testing
I. Product Description:
The AO3460 uses advanced trench technology to provide excellent RDS(ON) and low gate
charge, and operation with gate voltages as low as 4.5V, in the small SOT-23 footprint. It can
be used for a wide variety of applications, including load switching, low current inverters and
low current DC-DC converters. It is ESD protected.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AO3460
Standard sub-micron
60V N-channel MOSFET
Package Type
3 leads SOT23
Lead Frame
Cu
Die Attach
Ag Epoxy
Bonding Wire
Au wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Process
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AO3460
Test Item
Test
Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3
cycle
reflow@260°c
Temp = 150 c,
Vgs=100% of
Vgsmax
HTRB
HAST
HTGB
Pressure Pot
Temperature
Cycle
Lot
Attribution
Total
Sample
size
Number
of
Failures
-
39 lots
7249pcs
0
JESD22A113
168hrs
500 hrs
1000 hrs
2 lots
4 lots
2 lots
616pcs
0
JESD22A108
Temp = 150 c,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
(Note A*)
2 lots
4 lots
2 lots
77pcs / lot
616pcs
0
JESD22A108
130 +/- 2c,
85%RH, 33.3
psi, Vgs =
100% of Vgs
max
121c, 29.7psi,
RH=100%
100 hrs
(Note A*)
38 lots
77pcs / lot
2090 pcs
0
JESD22A110
(Note A*)
55 pcs / lot
2156 pcs
0
JESD22A102
-65c to 150c,
air to air
250 / 500
cycles
(Note A*)
39 lots
77 pcs / lot
3003 pcs
0
JESD22A104
(Note A*)
77 pcs / lot
96 hrs
28 lots
Standard
Note A: The reliability data presents the available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 5
MTTF = 21493 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AO3460). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
2
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
9
= 1.83 x 10 / [2x (4x77x168+8x77x500+4x77x1000) x258] = 5
9
8
MTTF = 10 / FIT = 1.88 x 10 hrs = 21493 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°c)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s )]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
-5
K = Boltzmann’s constant, 8.617164 X 10 eV / K