AOS Semiconductor Product Reliability Report AOI444, rev A Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc 495 Mercury Drive Sunnyvale, CA 94085 U.S. Tel: (408) 830-9742 www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOI444. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOI444 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: The AOI444 combine advanced trench MOSFET technology with a low resistance package to provide extremely low RDS(ON). Those devices are suitable for use in PWM, load switching and general purpose applications. - RoHS Compliant - Halogen Free Detailed information refers to datasheet. II. Die / Package Information: Process Package Type Lead Frame Die Attach Bond wire Mold Material Flammability Rating Backside Metallization MSL (moisture sensitive level) AOI444 Standard sub-micron Low voltage N channel process 3 leads TO251A Bare Cu Soft solder Au & Al wire Epoxy resin with silica filler UL-94 V-0 Ti / Ni / Ag Level 1 based on J-STD-020 Note * based on info provided by assembler and mold compound supplier 2 III. Result of Reliability Stress for AOI444 Test Item Test Condition Time Point MSL precondition 168hr 85°°c /85%RH +3 cycle reflow@260°°c Temp = 150°°c , Vgs=100% of Vgsmax Temp = 150°°c , Vds=80% of Vdsmax 168hrs 500 hrs 1000 hrs HTGB Lot Attribution Total Sample size - 3 lots 495pcs 0 JESD22A113 168hrs 500 hrs 1000 hrs 231pcs 0 3 lots JESD22A108 0 JESD22A108 165pcs 0 JESD22A110 (Note A*) HTRB Number of Failures 77 pcs / lot 231pcs 3 lots (Note A*) Standard 77 pcs / lot HAST 130 +/- 2°°c , 85%RH, 33.3 psi, Vgs = 80% of Vgs max 100 hrs 3 lots Pressure Pot 121°°c , 29.7psi, RH=100% 96 hrs (Note A*) 3 lots 55 pcs / lot 165pcs 0 JESD22A102 Temperature Cycle -65°°c to 150°°c , air to air 250 / 500 cycles (Note A*) 3 lots 55 pcs / lot 165pcs 0 JESD22A104 (Note A*) 55 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 15 MTTF = 7435 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOI444). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10 9 7 MTTF = 10 / FIT = 6.51 x 10 hrs = 7435 years / [2 x2x3x77x500x258] = 15 Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 K = Boltzmann’s constant, 8.617164 X 10-5eV / K 3