RENESAS HD74HC592

HD74HC592
8-bit Register/Binary Counter
REJ03D0633-0200
(Previous ADE-205-513)
Rev.2.00
Mar 30, 2006
Description
The HD74HC592 consists of a parallel input, 8-bit storage register feeding an 8-bit binary counter. Both the register
and the counter have individual positive edge-triggered clocks. In addition, the counter has direct load and clear
functions. Expansion is easily accomplished by connecting RCO of the first stage to the count enable of the second
stage, etc.
Features
• High Speed Operation: tpd (CCK to RCO) = 24 ns typ (CL = 50 pF)
• High Output Current: Fanout of 10 LSTTL Loads
• Wide Operating Voltage: VCC = 2 to 6 V
• Low Input Current: 1 µA max
• Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
• Ordering Information
Part Name
Package Type
HD74HC592FPEL
SOP-16 pin (JEITA)
Package Code
(Previous Code)
Package
Abbreviation
PRSP0016DH-B
(FP-16DAV)
FP
Taping Abbreviation
(Quantity)
EL (2,000 pcs/reel)
Function Table
RCK
CLoad
Inputs
CCLR
CCKEN
CCK
X
X
L
H
H
L
X
X
X
X
Register data loaded into counter
Counter clear
H
H
H
H
X
X
X
X
Input data A to H stored into register
No change in register
X
X
H
H
H
H
L
L
X
H
H
H
RCO = QA’•QB’•QC’•QD’•QE’•QF’•QG’•QH’• (CCKEN)
(QA’ to QH’: Output of Internal Counter)
Rev.2.00 Mar 30, 2006 page 1 of 8
Function
Count up
No count
X
No cont
HD74HC592
Pin Arrangement
B 1
16 VCC
C 2
15 A
D 3
14 C Load
E 4
13 RCK
F 5
12 CCKEN
G 6
11 CCK
H 7
10 CCLR
9 RCO
GND 8
(Top view)
Rev.2.00 Mar 30, 2006 page 2 of 8
CLOAD
CCLR
RCK
RCK
RCK
D
D
D
E
D
F
D
G
D
H
D
CCK
Rev.2.00 Mar 30, 2006 page 3 of 8
T
T
T
T
RCK
CCKEN
LD
CLR
CCK
CCK
LD
CLR
CCK
CCK
D
LD
CLR
CCK
CCK
LD
CLR
CCK
CCK
D
Q
T
LD
CLR
CCK
CCK
RCK
Q
T
D
Q
T
LD
CLR
CCK
CCK
RCK
D
D
Q
T
LD
CLR
CCK
CCK
D
LD
CLR
CCK
CCK
D
LD
CLR
CCK
CCK
D
RCK
C
RCK
RCK
D
RCK
RCK
B
RCK
RCK
D
RCK
RCK
A
RCK
RCK
HD74HC592
Logic Diagram
Q
Q
Q
Q
RCO
HD74HC592
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage range
Input / Output voltage
VCC
VIN, VOUT
–0.5 to 7.0
–0.5 to VCC +0.5
V
V
IIK, IOK
IOUT
±20
±25
mA
mA
ICC or IGND
PT
±50
500
mA
mW
Input / Output diode current
Output current
VCC, GND current
Power dissipation
Storage temperature
Tstg
–65 to +150
°C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Recommended Operating Conditions
Item
Supply voltage
Symbol
VCC
Ratings
2 to 6
Unit
V
Input / Output voltage
Operating temperature
VIN, VOUT
Ta
0 to VCC
–40 to 85
V
°C
tr , tf
0 to 1000
0 to 500
Input rise / fall time
Note:
*1
ns
0 to 400
1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Conditions
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
Electrical Characteristics
Item
Input voltage
Symbol VCC (V)
VIH
VIL
Output voltage
VOH
VOL
Input current
Quiescent supply
current
Iin
ICC
Min
Ta = 25°C
Typ Max
Ta = –40 to+85°C
Unit
Min
Max
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
1.5
3.15
4.2
—
—
—
1.9
4.4
5.9
—
—
—
—
—
—
2.0
4.5
6.0
—
—
—
0.5
1.35
1.8
—
—
—
1.5
3.15
4.2
—
—
—
1.9
4.4
5.9
—
—
—
0.5
1.35
1.8
—
—
—
4.5
6.0
2.0
4.5
6.0
4.5
6.0
6.0
6.0
4.18
5.68
—
—
—
—
—
—
—
—
—
0.0
0.0
0.0
—
—
—
—
—
—
0.1
0.1
0.1
0.26
0.26
±0.1
4.0
4.13
5.63
—
—
—
—
—
—
—
—
—
0.1
0.1
0.1
0.33
0.33
±1.0
40
Rev.2.00 Mar 30, 2006 page 4 of 8
Test Conditions
V
V
V
V
Vin = VIH or VIL IOH = –20 µA
Vin = VIH or VIL
IOH = –4 mA
IOH = –5.2 mA
IOL = 20 µA
IOH = 4 mA
IOH = 5.2 mA
µA Vin = VCC or GND
µA Vin = VCC or GND, Iout = 0 µA
HD74HC592
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°C
Item
Symbol VCC (V)
Maximum clock
frequency
fmax
Propagation delay
time
tPLH
tPHL
tPLH
tPHL
tPLH
tPLH
tPHL
Pulse width
Removal time
Setup time
tw
trem
tsu
Ta = –40 to +85°C
2.0
Min
—
Typ
—
Max
5
Min
—
Max
4
4.5
6.0
—
—
—
—
25
29
—
—
20
24
2.0
4.5
—
—
—
24
200
40
—
—
250
50
6.0
2.0
—
—
—
—
34
200
—
—
43
250
4.5
6.0
—
—
27
—
40
34
—
—
50
43
2.0
4.5
—
—
—
26
200
40
—
—
250
50
6.0
2.0
—
—
—
—
34
300
—
—
43
375
4.5
6.0
—
—
29
—
60
51
—
—
75
64
2.0
4.5
80
16
—
8
—
–
100
20
—
—
6.0
2.0
14
100
—
—
—
—
17
125
—
—
4.5
6.0
20
17
12
—
—
—
25
21
—
—
2.0
4.5
100
20
—
0
—
—
125
25
—
—
6.0
2.0
17
200
—
—
—
—
21
250
—
—
4.5
6.0
40
34
14
—
—
—
50
43
—
—
Output rise/fall
time
tTLH
tTHL
2.0
4.5
—
—
—
5
75
15
—
—
95
19
Input capacitance
Cin
6.0
—
—
—
—
5
13
10
—
—
16
10
Unit
Test Conditions
MHz
ns
CCK to RCO
ns
C Load to RCO
ns
CCLR to RCO
ns
RCK to RCO
ns
ns
CCLR to CCK
ns
CCKEN to CCK
ns
CCK to RCK
ns
pF
Test Circuit
VCC
VCC
CLoad
Pulse Generator
Zout = 50 Ω
Input
Pulse Generator
Zout = 50 Ω
See Function Table
Input
RCK
Output
CCKEN
CCK
RCO
CCLR
A to H
Note : 1. CL includes probe and jig capacitance.
Rev.2.00 Mar 30, 2006 page 5 of 8
CL = 50 pF
HD74HC592
Waveforms
• Waveform – 1 (CCK, RCK to RCO)
tf
tr
Input CCK
RCK
VCC
90 %
50 % 50 %
10 %
50 %
tw(H)
0V
tw(L)
t PHL
t PHL
90 %
Output RCO
50 %
10 %
VOH
90 %
50 %
10 %
50 %
10 %
t TLH
VOL
t THL
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
• Waveform – 2 (CLoad to RCO)
tf
Input CLoad
tr
90 %
90 %
50 %
VCC
50 %
10 %
10 %
0V
tW
t PLH
90 %
50 %
10 %
Output RCO
VOH
VOL
t TLH
t PHL
VOH
90 %
Output RCO
50 %
10 %
t THL
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
Rev.2.00 Mar 30, 2006 page 6 of 8
VOL
HD74HC592
• Waveform – 3 (CCLR to RCO, CCLR to CCK)
tf
tr
90 %
Input CCLR
VCC
90 %
50 %
50 %
10 %
10 %
0V
tW
t rem
VCC
90 %
Input CCK
50 %
10 %
0V
tr
t PLH
VOH
90 %
Output RCO
50 %
10 %
VOL
t TLH
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
• Waveform – 4 (CCKEN, RCK to CCK)
tr
Input CCKEN
RCK
tf
90 %
VCC
90 %
50 %
50 %
50 %
10 %
10 %
t su
th
t su
0V
th
VCC
90 %
Input CCK
50 %
10 %
50 %
10 %
tr
50 %
0V
tf
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
• Waveform – 5 (Data to RCK)
tr
tf
90 %
Input Data
VCC
90 %
50 %
50 %
10 %
50 %
10 %
t su
th
t su
0V
th
VCC
90 %
Input RCK
50 %
10 %
50 %
10 %
tr
tf
Note : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns
Rev.2.00 Mar 30, 2006 page 7 of 8
0V
HD74HC592
Package Dimensions
JEITA Package Code
P-SOP16-5.5x10.06-1.27
RENESAS Code
PRSP0016DH-B
*1
Previous Code
FP-16DAV
MASS[Typ.]
0.24g
D
F
16
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
9
c
HE
*2
E
bp
Index mark
Terminal cross section
( Ni/Pd/Au plating )
1
Z
8
e
*3
bp
x
Reference
Symbol
M
A
L1
A1
θ
y
L
Detail F
Rev.2.00 Mar 30, 2006 page 8 of 8
D
E
A2
A1
A
bp
b1
c
c1
θ
HE
e
x
y
Z
L
L1
Dimension in Millimeters
Min Nom Max
10.06 10.5
5.50
0.00 0.10 0.20
2.20
0.34 0.40 0.46
0.15 0.20 0.25
0°
8°
7.50 7.80 8.00
1.27
0.12
0.15
0.80
0.50 0.70 0.90
1.15
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0