Single Tap .050 x .100 Series

Single-Tap .050 x .100 Series
Thin Film Single-Tap Chip Resistors (.050 x .100 Series)
Chip resistors provide variations in resistor material, temperature coefficient of resistance,
resistance and tolerance.
Features
Photo
Chip Size: .050” x .100”
Alumina Substrate
Wire bond or solder pads
•
•
•
Available Options Include:
• Resistor Tolerance to 0.5%
• Nickel Chrome or Tantalum Nitride
Resistor Materials
• Back Gold Option00
API Technologies thin film single-tap chip resistors .050 x .100 series are available in a wide range of resistances and
tolerances with values available from 10 ohms to 1500 ohms. The thin film resistor layer is made of Nickel-Chromium or
Tantalum Nitride (TaN), with a gold or nickel-gold conductor layer. The nickel-gold resistors are solder dipped.
Applications for thin film center-Tap chip resistors include military and industrial hybrids, and medical, aerospace and
communications equipment.
Single-tap chip resistors are available with either passivated nickel chrome or tantalum-nitride resistor metalization.
• Nickel chrome provides excellent stability and temperature coefficient in hermetic applications
• Tantalum-nitride provides superior moisture-resistance for non-hermetic applications.
Electrical Specifications
Parameter
Limit
Power Rating
Life
400 mW
+/-0.2% max
Noise
-35 dB typ
Test conditions
(70 C derated to 0 mW @ 150 C)
1000 hours @ 125 degrees C
MIL-STD-202 method 308
High Temp Exposure
+/-0.2% max
100 hours at 150 degrees C
TCR (Nickel Chrome)
+/-50 ppm/C
-55 to 125 degrees C
0 to -120 ppm/C
-55 to 125 degrees C
TCR (Tantalum Nitride)
Operating voltage
100 VDC max
Moisture resistance
+/-0.5% max
MIL-STD-202 method 106
Thermal shock
+/-0.5% max
MIL-STD-202 method 107
VSWR (alumina substrate only)
<1.2
<1.4
From DC to 8 GHz
From 8 GHz to 18 GHz
Rev Date: 6/10/2014
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Single-Tap .050 x .100 Series
Mechanical Specifications
Substrate
99.6% as-fired alumina
Bond pad metalization
Bondable Gold or solderable Nickel Gold
Size
.050 x .100 typical (1.27 x 1.27 mm typical)
Thickness
.012 +/-.003 “ for silicon, .010 +/- 0.001 for alumina
Bond pad dimensions
Varies – 0.016 x 0.040 minimum
Protective overcoat (passivation)
Silox glass on NiCr versions only is option
Back side
AF alumina or gold.
Typical Configuration
Packaging Options
• Waffle Pack (170 resistors per pack) - standard
• Waffle Pack (50 resistors per pack)
• Waffle Pack (100 resistors per pack)
• Tape and reel
Rev Date: 6/10/2014
© API Technologies Corp. Proprietary Information
Page # 2
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www.apitech.com
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micro.apitech.com
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+1.888.553.7531
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[email protected]
Single-Tap .050 x .100 Series
Ordering Information
All parts are 100% electrically tested, sample tested per MIL-STD-38534 section 3.4, and visually inspected to MIL-STD883 requirements. Chips are supplied in standard 2”x 2” matrix tray packaging.
Base part code
Ohm value (total of both halves)
Tolerance letter
4MCB- (NiCr, no back metal)
NNNE
X
4MCG- (NiCr, gold backed)
NNNE
X
4MCS- (NiCr, solder dipped)
NNNE
X
4CBT – (TaN, no back metal)
NNNE
X
4CGT – (TaN, gold backed)
NNNE
X
Availability
• NiCr series is available from 10 ohms to 1500 ohms
• TaN series is available from 10 ohms to 1500 ohms
Part Number Breakout/Designation
Base
Code
Type
4MCB
4MCG
4MCS
4CBT
4CGT
NNNE
X
Value
Tolerance
D=0.5%
F=1%
G=2%
J=5%
K=10%
NNN = Value
E = Exponent
YY
Special Options
-P – Polyimide coating over resistor
(NiCr versions only)
Rev Date: 6/10/2014
© API Technologies Corp. Proprietary Information
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www.apitech.com
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micro.apitech.com
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+1.888.553.7531
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[email protected]
Single-Tap .050 x .100 Series
Bonding/
Soldering Areas
Bonding Areas and Dimensions
0.050 typ
0.040 typ
0.042 typ
0.100
typ
Factory Information
API Technologies, 400 Nickerson Road, Marlborough, MA 01752
TEL: 508-251-6400
FAX: 508-251-6401
http://micro.apitech.com/thin_film.aspx
Rev Date: 6/10/2014
© API Technologies Corp. Proprietary Information
Page # 4
|
www.apitech.com
|
micro.apitech.com
|
+1.888.553.7531
|
[email protected]