v01.0109 SC70 (E) – 6 LEAD 2x2 mm PLASTIC SC70 PACKAGE PACKAGE OUTLINES SC70 (E) Package Outline Drawing NOTES: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD MATERIAL: COPPER ALLOY 3. LEAD PLATING: Sn/Pb SOLDER 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Package Information Part Number Suffix Package Body Material Lead Finish MSL Rating SC70 RoHS Compliant Mold Compound Sn/Pb Solder MSL1 SC70E RoHS Compliant Mold Compound 100% matte Sn MSL1 Package Marking [3][4] [1] NNN XXXX [2] NNNE XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX [4] 3-Digit part number NNN B - 40 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com v01.0109 SC70 (E) – 6 LEAD 2x2 mm PLASTIC SC70 PACKAGE PACKAGE OUTLINES Suggested SC70 (E) PCB Land Pattern NOTES: 1. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 2. PAD WIDTH SHOWN IS FOR SOLDERING ONLY. BEYOND SOLDERING AREA ALL CONDUCTORS THAT CARRY RF AND MICROWAVE SIGNALS SHOULD HAVE 50 OHM CHARACTERISTIC IMPEDANCE. B - 22 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com