TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 D D D D D D D Dual Voltage Output, 3.3 V ±3% and 1.8 V ±2% 3.3-V Output Within 2 V of 1.8-V Output Under All Conditions 1.5-A Load Current Capability on 3.3-V Output 300-mA Load Current Capability on 1.8-V Output Overcurrent Protection for Both Outputs Thermally-Enhanced Packaging Concept for Efficient Heat Management Thermal Shutdown to Protect Device During Excessive Power Dissipation DWP HSOP PACKAGE (TOP VIEW) NC NC NC 3.3VOUT NC 5VCC NC 1.8VOUT NC NC 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 GND NC NC NC NC NC NC NC NC NC description The TPPM0110 is a power source intended for use in systems that have a single 5-V input source and require dual, linearly-regulated, low-dropout voltage sources. The outputs must track within 2 V of each other during all conditions and modes of operation. Each output is protected against overcurrent conditions. In the event that one of the outputs is shorted to ground, the other output must maintain a voltage output differential of less than 2 V compared to the output with the abnormal condition. The 3.3-V ± 3% regulated output is capable of driving loads of 1.5 A, and the 1.8-V ± 2% regulated output is capable of driving loads of 300 mA under all normal operating conditions. The device is available in a PowerPAD thermally-enhanced package for efficient heat management, and requires a copper plane to dissipate the heat. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 functional block diagram Bandgap Reference 5VCC + 3.3VOUT – Bandgap Reference Startup, Interlock, Overcurrent, and Thermal Shutdown Control Control Bandgap Reference + – Control Startup, Interlock, Overcurrent, and Thermal Shutdown Control GND 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1.8VOUT TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 Terminal Functions TERMINAL NAME NC I/O NO. DESCRIPTION 1–3, 5, 7, 9–12 13–17† 18,9 I No connection 3.3VOUT 4 O 3.3-V regulated output 5VCC 6 I 5-V input 1.8VOUT 8 O 1.8-V regulated output GND 20 I Ground † These terminals are to be used for test purposes only, and are not connected in system applications. No signal traces should be connected to these terminals. Table 1. Input Selection‡ INPUT CONDITION 3.3VOUT CONDITION 1.8VOUT CONDITION Power up 0 to 5 V V(3.3VOUT) Within 2 V of 1.8VOUT I(3.3VOUT) 0 to overcurrent limit V(1.8VOUT) 0 to 1.8 V I(1.8VOUT) 0 to overcurrent limit 5V 3.3V ±3% 0 to 1.5 A 1.8 V ±2% 0 to 300 mA Power down 5 V to 0 Within 2 V of 1.8VOUT 1.5 A to 0 1.8 V to 0 300 mA to 0 5V 0V Up to 5.4 A 1.8 V 0 to 300 mA 5V Less than 2 V Don’t care 0V Up to 1.08 A Within 2 V of 1.8VOUT Don’t care 1.8 V to 0 Don’t care 0V ‡ See Figures 2, 3, and 4. absolute maximum ratings over operating free-air temperature (unless otherwise noted)§ 5-V input, V(5VCC) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V 3.3-V output current limit, IL(3.3VOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 A 1.8-V output current limit, IL(1.8VOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.08 A Continuous power dissipation, PD (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 W Electrostatic discharge susceptibility, V(HBMESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV Operating ambient temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 150°C Lead temperature (soldering, 10 sec), T(LEAD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C § Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values are with respect to GND. 2. Absolute negative voltage values on these terminals should not be below –0.5 V. 3. Assumed correct thermal management technique implementation and ambient temperature of 25°C. recommended operating conditions MIN 5-V input, V(5VCC) Load capacitance, CL current IO Output load current, 4.7 10 mΩ < ESR(CL) < 1 Ω TYP MAX UNIT 5.3 V 100 µF 3.3VOUT 0 1.5 A 1.8VOUT 0 300 mA 0 55 °C Ambient temperature, TA POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 electrical characteristics, TA = 0°C to 55°C, CL = 100 µF, V(5VCC) = 5 V (unless otherwise noted) The operating ratings specified below is interpreted as conditions that do not degrade the device’s parametric or functional specifications for the life of the product. PARAMETER V(5VCC) TEST CONDITIONS Input voltage I(Q) MIN TYP MAX 4.7 5 5.3 IO(3.3VOUT) = 1.2 A and IO(1.8VOUT) = 300 mA Quiescent supplyy current With no loads on outputs IO Output load current V(3.3VOUT) V(1.8VOUT) 3.3-V output 3.3VOUT V(DO) Regulator g drop-out voltage I(3.3VOUT)OC (3 3VOUT)OC Overcurrent protection I(1.8VOUT)OC (1 8VOUT)OC Overcurrent protection CL Load capacitance for both regulated outputs ESR(CL) Equivalent series resistance Vth g Threshold voltage 1.8VOUT mA 600 µA 1.5 A 300 mA 3.23 3.33 3.43 V 1.78 1.82 1.85 V IO < 1.2 A IO < 250 mA 1 2.5 3.3VOUT, IL↑, See Note 4 2.25 Hysteresis 3 5.4 500 1.8VOUT, See Note 4 0.45 Hysteresis 0.6 3.4 1.08 150 Hysteresis A A mA 100 µF 1 Ω 4.2 V 250 Temperature ↑ V mA 200 5 V ↓, IO(3.3VOUT)= 1.2 A, IO(1.8VOUT) = 250 mA Thermal shutdown hysteresis 1 1.8VOUT = 1.8 V ±2% Hysteresis TTSD† V 3.3VOUT = 3.3 V ±3% IO = 1 mA to 1.2 A IO = 1 mA to 250 mA 1.8-V output UNIT mV 180 15 °C † Design targets only. Not tested in production. NOTE 4: In the event of an overcurrent condition, the output should be a constant current limit such that the current never exceeds 360% of IO(TYP). Once the overcurrent condition is removed, the device returns to within the specified regulation limits. electrical characteristics, TA = 0°C to 55°C, CL = 100 µF, V(5VCC) = 5 V (unless otherwise noted)† The following parametric requirements are applicable to both 3.3VOUT and 1.8VOUT when subjected to these transient tests. PARAMETER TEST CONDITIONS V(OTL) Output transient voltage limit Voltage that load step can affect nominal output voltage (see Note 5) IO(STEP) IO(SLEW) Output load step current See Note 5 Output load step current slew rate See Note 5 and 6 t(STEP) Output transient time limit See Note 5 Power up overshoot Maximum voltage overshoot allowed on either output when component begins regulation. Voltage transient time limit is t(STEP) (see Note 5) MIN TYP MAX –3% 3% 0 IO(TYP) 8 UNIT A A/µs µs 10 7 % † Design targets only. Not tested in production.. NOTES: 5. Both outputs must maintain voltage regulation within ±3% of nominal, for a load step from 0 to IO(TYP) and from IO(TYP) to 0 A with a current slew rate of 8A/ms. Load may be toggled at a rate of 20 kHz typical. The outputs must return to the specified regulation limits within the specified time of 10 µs (typical). 6. Both linear regulators must be capable of regulating small ESR ceramic capacitors or aluminum electrolytic capacitors (see ESR specification). 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 thermal characteristics PARAMETER RθJC MIN TYP Thermal impedance, junction-to-case RθJA Thermal impedance, junction-to-ambient See Note 7 NOTE 7: See JEDEC PCB specifications for high-K and correct implementation for 150 LFM air flow. MAX UNIT 8 °C/W 33 °C/W TYPICAL CHARACTERISTICS Bandgap Reference 5VCC + 3.3VOUT – 100 µF 0.1 µF 100 µF 0.1 µF Bandgap Reference Startup, Interlock, Overcurrent, and Thermal Shutdown Control Control Bandgap Reference + – 1.8VOUT Control Startup, Interlock, Overcurrent, and Thermal Shutdown Control GND NOTE: The 100-µF capacitor has: ESL = 3 nH and ESR = 0.5 Ω to 1 Ω. Testing circuit includes 100-µF aluminum capacitors which may be replaced with 10-µF ceramic capacitors. Both capacitors must have equivalent series inductance ESL < 3 nH and equivalent series resistance ESR < 1 Ω. Figure 1. Test Circuit POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 TYPICAL CHARACTERISTICS 3.3VOUT 5VCC 1.8VOUT NOTE: The outputs track within 2 V in the power-up and power-down sequence. Figure 2. Power-Up and Power-Down Sequence 3.3VOUT 5VCC 1.8VOUT NOTE: The outputs track within 2 V in the power-up sequence. Figure 3. Power-Up Sequence 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 TYPICAL CHARACTERISTICS 3.3VOUT, with 1.5-A Load 5VCC 1.8VOUT NOTE: The power-up sequence is for an output with 1.5 A on 3.3VOUT. Figure 4. Power-Up Sequence 5VCC 1.8VOUT Load Step 1 mA to 300 mA NOTE: Load regulation on 1.8VOUT with a load step of 1 mA to 300 mA. Figure 5. Load Regulation on 1.8VOUT POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 TYPICAL CHARACTERISTICS 5VCC 3.3VOUT Load Step 1 mA to 1.5 A NOTE: Load regulation on 3.3VOUT with a load step of 1 mA to 1.5 A Figure 6. Load Regulation on 3.3VOUT 5VCC 3.3VOUT Load Step 1 mA to 1.5 A NOTE: Output settling time on 3.3VOUT due to load regulation step of 1 mA to 1.5 A Figure 7. Settling Time Due to Load Regulation on 3.3VOUT 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 TYPICAL THERMAL CHARACTERISTICS To ensure reliable operation of the device, the junction temperature of the output device must be within the safe operating area (SOA). This is achieved by providing a means to dissipate the heat generated from the junction of the output structure. There are two components that contribute to thermal resistance. They consist of two paths in series. The first is the junction-to-case thermal resistance, RθJC; the second is the case-to-ambient thermal resistance, RθCA. The overall junction-to-ambient thermal resistance, RθJA, is determined by: RθJA = RθJC + RθCA The ability to efficiently dissipate the heat from the junction is a function of the package style and board layout incorporated in the application. The operating junction temperature is determined by the operating ambient temperature, TA, and the junction power dissipation, PJ. The junction temperature, TJ, is determined by the following thermal equation: TJ = TA + PJ (RθJC) + PJ (RθCA) TJ = TA + PJ (RθJA) This particular application uses the 20-pin DWP power pad package with a standard lead frame with a dedicated ground terminal. Using a multilayer printed-circuit board (PCB), the power pad is mounted as recommended in the TI packaging application. The power pad is electrically connected to the ground plane of the board through a dedicated ground pin and the die mount power pad. This provides a means for heat spreading through the copper plane associated within the PCB (ground layer). The thermal resistance from junction to ambient, RθJA, is dependent of several factors, the implemented method of package attachment to the heat spreading material and the air flow in the system application. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 APPLICATION INFORMATION packaging To maximize the efficiency of this package for application on a single layer or multilayer PCB, certain guidelines must be followed. The following information is to be used as a guideline only. For further information, refer to the PowerPAD concept implementation document. multilayer PCB The following are guidelines for mounting the PowerPAD IC on a multilayer PCB with a ground plane. Solid Pad (Land Pattern) Package Thermal Pad Thermal Vias Package Outline Via = 0,33 mm Diameter Minimum Pitch Between Vias is 1,52 mm Figure 8. Package and Land Configuration for a Multilayer PCB 0,18 mm (Square) Package Solder Pad Component Traces 1,5038 – 1,5748 mm Component Trace (2 oz Cu) 2 Plane 4 Plane 1,5748 mm Thermal Via Thermal Isolation Power Plane Only Package Solder Pad (Bottom Trace) Figure 9. Multilayer Board (Side View) 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1,0142 – 1,0502 mm Ground Plane (1 oz Cu) 0,5246 – 0,5606 mm Power Plane (1 oz Cu) 0 – 0,071 mm Board Base and Bottom Pad TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 APPLICATION INFORMATION In a multilayer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. The efficiency of this method depends on several factors (die area, number of thermal vias, thickness of copper, etc.). Consult the PowerPAD Thermally Enhanced Package Technical Brief. single layer PCB Use as Much Copper Area as Possible for Heat Spread Package Thermal Pad Package Outline Figure 10. Land Configuration for Single-Layer PCB Layout recommendation is to utilize as much copper area for the power management section of a single-layer board as possible. In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by using a low thermal impedance attachment method (solder paste or thermal-conductive epoxy). In both of these cases, it is advisable to use as much copper traces as possible to dissipate the heat. IMPORTANT If this attachment method is not implemented correctly, this product will not operate efficiently. Power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. 6 5VCC 100 µF 5VCC 3.3VOUT 4 0.1 µF 0.1 µF 100 µF 0.1 µF 100 µF † 3.3VOUT TPPM0110 20-Pin DWP PowerPAD Package 20 GND 1.8VOUT 8 † 1.8VOUT † It is recommended that the capacitors on the outputs (100 µF) have a low ESR < 1 Ω. These stabilizing capacitors must be placed in close proximity of their corresponding output terminals for optimal performance. Figure 11. Application Schematic POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 11 TPPM0110 DUAL LOW-DROPOUT LINEAR REGULATOR SLVS365 –MARCH 2001 DWP (R-PDSO-G**) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE 20 PINS SHOWN 0.020 (0,51) 0.014 (0,35) 0.050 (1,27) 20 0.010 (0,25) M 11 Thermal Pad (See Note D) 0.419 (10,65) 0.400 (10,16) 0.299 (7,59) 0.010 (0,25) NOM 0.293 (7,45) Gage Plane 1 10 0.010 (0,25) A 0°– 8° 0.050 (1,27) 0.016 (0,40) Seating Plane 0.006 (0,15) 0.104 (2,65) MAX 0.004 (0,10) 0.002 (0,05) PINS ** 16 20 24 28 A MAX 0.410 (10,41) 0.510 (12,95) 0.610 (15,49) 0.710 (18,03) A MIN 0.400 (10,16) 0.500 (12,70) 0.600 (15,24) 0.700 (17,78) DIM 4147575/A 04/98 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. PowerPAD is a trademark of Texas Instruments. 12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 4-Mar-2005 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPPM0110DWP ACTIVE SO Power PAD DWP 20 25 None CU NIPDAU Level-1-220C-UNLIM TPPM0110DWPR ACTIVE SO Power PAD DWP 20 2000 None CU NIPDAU Level-1-220C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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