WHH Package Variation: WHH38MA 38-Lead Plastic QFN (5mm × 9mm) (Reference LTC DWG # 05-08-1934 Rev Ø) 0.70 ±0.05 1.22 REF 0.72 REF 3.59 ±0.05 0.35 REF 5.5 ±0.05 3.59 ±0.05 4.1 ±0.05 0.7 2.7 ±0.05 BSC 0.5 REF 2.93 ±0.05 PACKAGE OUTLINE 4.14 ±0.05 0.70 ±0.05 0.25 ±0.05 0.5 BSC 7.5 REF (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ±0.10 (2 SIDES) PIN 1 NOTCH R = 0.30 0.350 REF 0.9 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 1 2 2.93 ±0.10 3.59 ±0.10 0.50 REF 9.00 ±0.10 (2 SIDES) 7.50 REF 4.14 ±0.10 1.22 0.72 REF REF 0.25 ±0.05 3.59 ±0.10 0.5 BSC (WHH36MA) QFN 1212 REV Ø 0.7 BSC 0.203 REF 0.00 – 0.05 0.90 ±0.10 0.40 ±0.10 2.7 REF BOTTOM VIEW—EXPOSED PAD SEATING PLANE NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE