Reliability Report

AOS Semiconductor
Product Reliability Report
AOT298L & AOB298L & AOTF298L,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOT298L & AOB298L &
AOTF298L. Accelerated environmental tests are performed on a specific sample size, and then
followed by electrical test at end point. Review of final electrical test result confirms that AOT298L
& AOB298L & AOTF298L pass AOS quality and reliability requirements. The released products
will be categorized by the process family and be monitored on a quarterly basis for continuously
improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOT298L & AOB298L & AOTF298L use Trench MOSFET technology that is uniquely
optimized to provide the most efficient high frequency switching performance. Power losses are
minimized due to an extremely low combination of RDS(ON) and Crss. In addition, switching
behavior is well controlled with a soft recovery body diode. This device is ideal for boost
converters and synchronous rectifiers for consumer, telecom, industrial power supplies and LED
backlighting.
-RoHS Compliant
-Halogen Free
Details refer to the datasheet.
II. Die / Package Information:
AOT298L & AOB298L & AOTF298L
Standard sub-micron
Middle voltage N channel process
Package Type
TO220/TO263/TO220F
Lead Frame
Bare Cu
Die Attach
Soft solder
Bond wire
Al wire
Mold Material
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOT298L & AOB298L & AOTF298L
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@250°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
130 +/- 2°c ,
85%RH,
33.3 psi, Vgs =
80% of Vgs max
121°c , 29.7psi,
RH=100%
100 hrs
96 hrs
-65°c to 150°c ,
air to air,
250 / 500
cycles
HTGB
HTRB
HAST
Pressure Pot
Temperature
Cycle
168hrs
500 hrs
1000 hrs
Lot
Attribution
Total
Sample size
Number
of
Failures
Reference
Standard
9 lots/package
1485pcs
0
JESD22A113
2 lots
385pcs
0
JESD22A108
77 pcs / lot
385pcs
0
JESD22A108
(Note A*)
3 lots/package
77 pcs / lot
495pcs
0
JESD22A110
(Note A*)
3 lots/package
55 pcs / lot
495pcs
0
JESD22A102
(Note A*)
3 lots/package
55 pcs / lot
495pcs
0
JESD22A104
(Note A*)
55 pcs / lot
3 lots
(Note A*)
2 lots
3 lots
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 7
MTTF = 16536 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOT298L & AOB298L & AOTF298L). Failure Rate
Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours.
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9
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Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
8
MTTF = 10 / FIT = 1.45 x 10 hrs = 16536 years
/ [2x (4x77x168+6x77x1000) x258] = 7
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
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Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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