® Technical Data Sheet SELECT-10™ Selective Solder Flux Zero-Halogen, No-Clean Product Description Kester SELECT-10TM is a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. Specific to selective soldering, SELECT-10™ does not spread beyond the spray pattern and will not clog nozzles. SELECT-10TM residues are non-tacky for improved cosmetics. SELECT-10TM is classified as ROL0 flux under IPC J-STD-004B. Performance Characteristics: ■ Zero-halogen (none intentionally added) ■ Provides good solderability under air atmosphere ■ Controlled flux application, flux does not spread beyond the spray pattern ■ Non-corrosive, non-conductive and non-tacky residues ■ Ability to provide desired hole-fill with preheat temperatures over 135°C ■ No Clogging ■ Compliant to GR-78-CORE (Telcordia/Bellcore) ■ Classified as ROL0 per J-STD-004B ■ Pass SIR in raw and preheating condition RoHS Compliance This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2015/863/EU for the stated banned substances. Physical Properties Specific Gravity: 0.835 Anton Paar DMA @ 25°C Percent Solids (theoretical): 10% Reliability Properties Surface Insulation Resistivity (SIR): Pass All Readings > 1.0x108 Ω Tested to J-STD-004B, IPC-TM-650, Method 2.6.3.7 Test Conditions: 40°C, 90% RH, 7 days, 12.5V Board Prepare Conditions: Room Temperature: Dry with 80°C Preheating. Pattern up through by soldering process, pattern down through by soldering process Surface Insulation Resistivity (SIR): Pass Tested to J-STD-004A, IPC-TM-650, Method 2.6.3.3 Test Conditions: 85°C, 85% RH, 7 days, 100V Board Prepare Conditions: Room Temperature: Dry with 80°C Preheating. Pattern up through by soldering process, pattern down through by soldering process Bellcore SIR, IPC: Pass All Readings >2.0x1010 Ω Tested to GR-78 13.1.3 Test Conditions: 35°C, 85% RH, 4 days, 100V Board Prepare Conditions: Room Temperature: Dry with 80°C Preheating. Pattern up through by soldering process, pattern down through by soldering process Electrochemical Migration (ECM): Pass Tested to J-STD-004B, IPC-TM-650, Method 2.6.14.1 Test Conditions: 65°C, 90% RH, 25 days, 100V Board Prepare Conditions: Room Temperature: Dry with 80°C Preheating. Pattern up through by soldering process, pattern down through by soldering process Copper Mirror Corrosion: Low Tested to J-STD-004B, IPC-TM-650, Method 2.3.32 Corrosion Test: Low Tested to J-STD-004B, IPC-TM-650, Method 2.6.15 Bono Corrosion Test: Pass; Fc=1.05% Test Conditions: 85°C, 85% RH, 15 days, 20V Halogen Content: None Detected Tested to J-STD-004-B, IPC-TM-650, Method 2.3.28.1 Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 ■ Phone: +1 800.2.KESTER ■ Fax: +1 630.616.4044 Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 ■ Phone: +65 6.449.1133 ■ Fax: +65 6.242.9036 European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany ■ Phone: +49 (0) 8142 4785 0 ■ Fax: +49 (0) 8142 4785 61 Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone ■ Suzhou, Jiangsu Province, China 215200 ■ Phone: +86 512.82060807 ■ Fax: +86 512.8206 0808 ■ Website: www.kester.com ■ ® Application Notes Flux Application SELECT-10TM is designed for a drop jet fluxer or ultrasonic fluxer in selective solder applications. Flux deposition should be 186-465μgr/cm2 ( 1200-3000μgr/in2) of solids. Process Considerations Circuit Board Process Recommendations Flux deposition 186-465μgr/cm2 ( 1200-3000μgr/in2) of solids Top side board temperature (bottom preheaters only) 90°C-140°C (194°F-284°F) Top side board temperature (top preheaters only) 90°C-150°C (194°F-302°F) 1 Top side board temperature (bottom and top preheaters) 90°C-140°C (194°F-284°F) Bottom side board temperature Delta 0°C-20°C (0°F-36°F) versus top side board temperature Recommended preheat profile Straight ramp to top side board temperature Solder contact time 2.5-6 seconds Maximum soldering time in the soldering module with pre- 12 minutes heat at 125°C Solder bath temperature2 280°C-320°C (536°F-608°F) for SnCu or SAC alloy 260°C-300°C (500°F-572°F) for Sn63Pb37 alloy Board is heated from top and bottom there will be a smaller delta temperature between the top and bottom of the board and minimizing the risk of sublimation. Caution: Using top and bottom preheaters simultaneously does not insure the center of the board reach proper temperature for soldering. 2 The solder bath temperature is a function of the solder nozzle size, circuit board design and components. 1 Above information is a guideline and it is advisable to note that the optimum settings for a given assembly may vary and this is dependent on the circuit board design, board thickness, components used and equipment used. A design of experiment is recommended to be done to optimize the soldering process. Flux Control SELECT-10TM is designed to be sprayed with a drop jet fluxer or ultrasonic fluxer. Incoming solderability inspection of circuit boards and components is advisable as a part of process control to maintain consistent soldering results. Cleaning SELECT-10TM residues are non-conducive, non-corrosive and do not require removal in most applications. If residue removal is required, call Kester Technical Support. Storage, Handling and Shelf Life SELECT-10TM is flammable. Store away from sources of ignition. Shelf life is 1-year from the date of manufacture when handled properly and held at 10-25°C (50-77°F). Health and Safety This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet and warning label before using this product. Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 ■ Phone: +1 800.2.KESTER ■ Fax: +1 630.616.4044 Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 ■ Phone: +65 6.449.1133 ■ Fax: +65 6.242.9036 European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany ■ Phone: +49 (0) 8142 4785 0 ■ Fax: +49 (0) 8142 4785 61 Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone ■ Suzhou, Jiangsu Province, China 215200 ■ Phone: +86 512.82060807 ■ Fax: +86 512.8206 0808 ■ Website: www.kester.com ■