NTE7226 Integrated Circuit High Voltage, High Speed MOSFET/IGBT Driver w/High and Low Side Outputs 14−Lead DIP Type Package Description: The NTE7226 is a high voltage, high speed power MOSFET and IGBT driver with independent high and low side referenced output channels in a 14−Lead DIP type package. HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. Logic inputs are compatible with standard CMOS or LSTTL output, down to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross−conduction. Propagation delays are matched to simplify use in high frequency applications. The floating channel can be used to drive an N−Channel power MOSFET or IGBT in the high side configuration which operates up to 500 volts. Features: D Floating Channel Designed for Bootstrap Operation Fully Operational to +500V Tolerant to Negative Transient Voltage dV/dt Immune D Gate Drive Supply Range from 10V to 20V D Undervoltage Lockout for Both Channels D 3.3V Logic Compatible Separate Logic Supply Range from 3.3V to 20V Logic an Power Ground ±5V Offset D CMOS Schmitt−Triggered Inputs with Pull−Down D Cycle by Cycle Edge−Triggered Shutdown Logic D Matched Propagation Delay for Both Channels D Outputs in Phase with Inputs Absolute Maximum Ratings: (Note 1) High Side Floating Supply Voltage, VB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 525V High Side Floating Supply Offset Voltage, VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . VB −25 to VB +0.3V High Side Floating Output Voltage, VHO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VS −0.3 to VB +0.3V Low Side Fixed Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to +25V Low Side Output Voltage, VLO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to VCC +0.3V Logic Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to VSS +25V Logic Supply Offset Voltage, VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC −25 to VCC +0.3V Logic Input Voltage (HIN, LIN, & SD), VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS −0.3 to VDD +0.3V Maximum Allowable Offset Supply Voltage Transient, dVs/dt . . . . . . . . . . . . . . . . . . . . . . . . . . 50V/ns Package Power Dissipation (TA ≤ +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6W Note 1. Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Absolute Maximum Ratings (Cont’d): (Note 1) Operating Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55° to +150°C Thermal Resistance, Junction−to−Ambient, RthJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75°C/W Lead Temperature (During Soldering, 10sec), TL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C Note 1. Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Recommended Operating Conditions: (Note 2) Parameter Symbol Min Max Unit High Side Floating Supply Absolute Voltage VB VS +10 VS +20 V High Side Floating Supply Offset Voltage VS Note 3 500 V High Side Floating Output Voltage VHO VS VB V Low Side Fixed Supply Voltage VCC 10 20 V Low Side Output Voltage VLO 0 VCC V Logic Supply Voltage VDD VSS +3 VSS +20 V Logic Supply Offset Voltage VSS −5 (Note 4) 5 V Logic Input Voltage (HIN, LIN, & SD) VIN VSS VDD V Ambient Temperature TA −40 +125 °C Note 2. For proper operation, the device should be used within the recommended conditions. The VS and VSS offset ratings are tested with all supplies biased at 15V differential. Note 3. Logic operational for VS of −4V to +500V. Logic state held for VS of −4V to −VBS. Note 4. When VDD < 5V, the minimum VSS offset is limited to −VDD. Electrical Characteristics: (VBIAS (VCC, VBS, VDD) = 15V, VSS = COM, TA = +25°C unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Dynamic Characteristics (CL = 1000pF) Turn−On Propagation Delay ton VS = 0V − 120 150 ns Turn−Off Propagation Delay toff VS = 500V − 94 125 ns Shutdown Propagation Delay tsd VS = 500V − 110 140 ns Turn−On Rise Time tr − 25 35 ns Turn−Off Fall Time tf − 17 25 ns MT − − 10 ns Logic “1” Input Voltage VIH 9.5 − − V Logic “0” Input Voltage VIL − − 6.0 V High Level Output Voltage, VBIAS − VO VOH IO = 0A − − 1.2 V Low Level Output Voltage, VO VOL IO = 0A − − 0.1 V Offset Supply Leakage Current ILK VB = VS = 500V − − 50 μA Quiescent VBS Supply Current IQBS VIN = 0V or VDD − 125 230 μA Quiescent VCC Supply Current IQCC VIN = 0V or VDD − 180 340 μA Quiescent VDD Supply Current IQDD VIN = 0V or VDD − 15 30 μA Delay Matching, HS & LS Turn−On/Off Static Characteristics (Note 5) Note 5. The VIN, VTH, and IIN parameters are referenced for VSS and are applicable to all three logic input leads: HIN, LIN and SD. The VO and IO parameters re referenced to COM and are applicable to the respective output leads: HO or LO. Electrical Characteristics (Cont’d): (VBIAS (VCC, VBS, VDD) = 15V, VSS = COM, TA = +25°C unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Static Characteristics (Cont’d) (Note 5) Logic “1” Input Bias Current IIN+ VIN = VDD − 20 40 μA Logic “0” Input Bias Current IIN− VIN = 0V − − 1.0 μA VBS Supply Undervoltage Positive Going Threshold VBSUV+ 7.5 8.6 9.7 V VBS Supply Undervoltage Negative Going Threshold VBSUV− 7.0 8.2 9.4 V VCC Supply Undervoltage Positive Going Threshold VCCUV+ 7.4 8.5 9.6 V VCC Supply Undervoltage Negative Going Threshold VCCUV− 7.0 8.2 9.4 V Output High Short Circuit Pulsed Current IO+ VO = 0V, VIN = VDD, PW ≤ 10μs 2.0 2.5 − A Output Low Short Circuit Pulsed Current IO− VO = 15V, VIN = VDD, PW ≤ 10μs 2.0 2.5 − A Note 5. The VIN, VTH, and IIN parameters are referenced for VSS and are applicable to all three logic input leads: HIN, LIN and SD. The VO and IO parameters re referenced to COM and are applicable to the respective output leads: HO or LO. Pin Definitions: Symbol Description VDD Logic Supply HIN Logic Input for High Side Gate Driver Output (HO), In Phase SD Logic Input for Shutdown LIN Logic Input for Low Side gate Driver Output (LO), In Phase VSS Logic Ground VB High Side Floating Supply HO High Side Gate Drive Output VS High Side Floating Supply Return VCC Low Side Supply LO Low Side Gate Drive Output COM Low Side Return Pin Connection Diagram LO 1 COM 2 14 N.C. VCC 3 13 VSS 12 LIN N.C. 4 11 SD VS 5 10 HIN VB 6 9 VDD HO 7 8 N.C. 14 8 1 7 .795 (20.2) Max .260 (6.6) .210 (5.33) Max .100 (2.45) .115 (2.9) Min