Thin Film North America Review of Select Products - 2009 THIN FILM NA RESISTORS PRECISION DIVIDERS AND NETWORKS MATCHED PAIRS MP, MPM, MPD (SC70, SOT23, SOT143) SERIES MATCHED NETWORKS ORN, NOMC, OSOP (SOIC 8, 14, 16, 20) SERIES CSO CUSTOMS MARKET TRENDS ¾ TRANSITIONING AWAY FROM CUSTOMS TO STANDARD OFF-THE-SHELF VALUES USING STANDARD FORMATS ¾ OPPORTUNITIES IN INDUSTRIAL, INSTRUMENTATION, AND TEST AND MEASURMENT APPLICATIONS ¾ MOBILE APPLICATIONS NEED TO HAVE SMALL SIZE AND IMPROVED FUNCTIONALITY MPM/MP/MPDA SERIES – PRECISION MATCHED PAIRS AND DIVIDERS • FEATURES PUSH (’05) • Matched pair resistors • Small size (SOT-23, SC70, SOT-143 packages) • Tight resistance ratio tolerances (+/- 0.01 % on equal values) • Low TC tracking (+/- 2.0 ppm) • Excellent long term stability( +/- 0.03 % delta R ratio 2000 hours @ 70 deg. C • Available lead (Pb) and lead (Pb)-free e3 solder (RoHS) SAMPLES: 1 week L-TIME: Stock – 4 wks DATA SHEET: Released Yes On WEB Yes BUD-PRICE: $0.50 to $0.95 EA Respons. G. Giambra TARGET APPLICATIONS DESCRIPTION / REMARKS TELECOM • Ratio tolerances of +/- 0.025 % and +/-0.01 % not offered by competition • Inventory of popular divider ratios (1:1 to 100:1) • Custom divider ratios available • Datasheet: http://www.vishay.com/docs/60001/mpm.pdf • Datasheet: http://www.vishay.com/docs/60092/mpseries.pdf • Datasheet: http://www.vishay.com/docs/60016/mpmpda.pdf Main Competitors and Products: IRC (SOT) BI Technologies (SS103) Maxim (MAX5490) KOA (RTY) SIGNAL CONDITIONING COMP CONSUM INDUST - FREQUENCY COUNTERS - PROCESS CONTROLS - AUTOMATIC TEST EQUIPMENT - TEST EQUIPMENT - DATA ACQUISITION MEDICAL -RADIOGRAPHY FILM PROCESSING EQUIPMENT AMS - INSTRUMENTATION - ENGINE CONTROLS - NIGHT VISION SYSTEMS THIN FILM RESISTORS PRECISION CHIP RESISTORS QPL MIL APPROVED MIL-PRF-55342 SERIES INDUSTRIAL PRECISION P , PTN, M , FC SERIES MARKET TRENDS ¾ TRANSITIONING TO STANDARD SMALLER FORMATS ¾ OPPORTUNITIES IN APPLICATIONS THAT REQUIRE HIGH RELIABILITY ,STABLE PERFORMANCE, AND HIGH FREQUENCY ¾ MOBIL APPLICATIONS NEED TO HAVE SMALL SIZE AND IMPROVED FUNCTIONALITY PTN SERIES – TANTALUM NITRIDE CHIP RESISTORS PTN SERIES • FEATURES • Moisture-impervious • Precision (± 0.1 % tol and ± 25 ppm/C TCR) • Very low noise: < -35 dB and voltage coefficient 0.1 ppm/v • Available lead or lead (Pb)-free (e1) solder (RoHS) • Non-std. values available (i.e., 24.9563 kohms) STATUS: MATURE (’95) SAMPLES: 1 weeks L-TIME: 8 – 12 weeks DATA SHEET: Released YES On WEB YES BUD-PRICE: $0.25 - $0.50 ea. Respons. A. Tapani TARGET APPLICATIONS DESCRIPTION / REMARKS • Self-passivated tantalum nitride resistor film • Custom resistor values: 10 – 3 Mohms • Power ratings to 2 watts • Available in 12 chip case sizes: 0402 thru 2512 • Datasheet: http://www.vishay.com/docs/60026/ptn.pdf • Sales sheet: VMN-PT9187-0605 MEDICAL TELECOM - BASE STATIONS COMP - MOBILE COMMUNICATIONS, SERVERS CONSUM INDUST - POWER SUPPLIES - VOLTAGE REGULATORS - TEST INSTRUMENTS AutoL AMS • Main Competitors and Products: IRC (PFC Series) Mini Systems (WATF Series) - COMMUNICATIONS - GUIDANCE AND CONTROL SYSTEMS - MISSILES - SATELLITES THIN FILM NA RESISTORS PATTERN SUBSTRATES USING THIN FILM TECHNOLOGY SUBSTRATES • Al2O3, AlN, BeO, ferrite, garnet METAL SYSTEMS • Cr, TiW, NiCr, Pd, Pt, Ni, Cu, Au RESISTORS • Ta2N, NiCr, CrSiO VIA HOLES • Plated, filled, Au or Cu PASSIVATION AND SOLDER BARRIERS • SiO2, Si3N4, polyimide, nickel oxide, low-temperature polymer LASER MACHINING • Cutouts and custom shapes MARKET TRENDS ¾ TRANSITIONING AWAY FROM GOLD/TIN PREFORMS TO DIRECTLY DEPOSITED, CONTROLLED GOLD/TIN ¾ OPPORTUNITIES IN SUBASSEMBLIES THAT REQUIRE THERMAL MANAGEMENT, SPECIAL SHAPES, AND SMALL SIZES AuSn SERIES – LASER SUBMOUNTS FEATURES • Custom layout to fit application • Gold/tin die mount area • 80/20 AuSn integrated composition • Freeze time: 120 seconds @ 320 C • Substrate choices: Aln, BeO, Al203 • Multiple substrate thicknesses available STATUS: NEW (’06) SAMPLES: 3 – 4 weeks L-TIME: 6 – 10 weeks DATA SHEET: Released YES On WEB YES BUD-PRICE: $7.00 - $10.00 Ea. Respons. D. Coulton TARGET APPLICATIONS DESCRIPTION / REMARKS • Thin film metallization stack with AuSn • Optional solid filled gold or copper vias for thermal dissipation or electrical through substrate connection • Provides precise component placement to +/-0.0005 inches • Eliminates conventional pre-forms for mounting • Datasheet: http://www.vishay.com/doc/61081 • Sales sheet: VMN-PT9187-0605 TELECOM COMP CONSUM INDUST MEDICAL • Main Competitors: Ultrasource, Rhinehardt AMS -LASER SUBMOUNTS: - OPTICAL RECEIVERS / TRANSCEIVERS - TOSA/ROSA PACKAGES - DIODE LASERS