Package Information

Package Information
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Vishay Siliconix
MICRO FOOT®: 4-Bump (0.8 mm x 0.8 mm, 0.4 mm Pitch)
D
S
e
S
e
XXX
S
D
S
S
4x Ø b
G
D
S
AK
Mark on Backside of die
A2
4-Ø 0.205 to 0.225 Note 5
Solder Mask ~Ø 0.215
A1
A
e
b
k
b1
e
Bump Note 2
Note 4
Notes
(1) Laser mark on the backside surface of die
(2) Bumps are 95.5 % Sn,3.8 % Ag,0.7 % Cu
(3) “i” is the location of pin 1
(4) “b1” is the diameter of the solderable substrate surface, defined by an opening in the solder resist layer solder mask defined.
(5) Non-solder mask defined copper landing pad.
DIM.
MILLIMETERS a
INCHES
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.328
0.365
0.402
0.0129
0.0144
0.0158
A1
0.136
0.160
0.184
0.0053
0.0062
0.0072
A2
0.192
0.205
0.218
0.0076
0.0081
0.0086
b
0.200
0.220
0.240
0.0078
0.0086
0.0094
b1
0.175
0.0068
e
0.400
0.0157
S
0.160
0.180
0.200
0.0062
0.0070
0.0078
D
0.720
0.760
0.800
0.0283
0.0299
0.0314
K
0.040
0.070
0.100
0.0015
0.0027
0.0039
Note
a. Use millimeters as the primary measurement.
ECN: T15-0053-Rev. A, 16-Feb-15
DWG: 6033
Revision: 16-Feb-15
1
Document Number: 69442
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000