Package Information www.vishay.com Vishay Siliconix MICRO FOOT®: 30-Bumps (2.4 mm x 2 mm, 0.4 mm Pitch, 0.184 mm Bump Height) 30x Ø 0.205 to 0.225 Solder mask~Ø 0.215 30x Ø b1 Index-bump (Note 6) 4 2 G G S S S S S D D D D D S S S S S D D D D D S S S S S e e e A e D e B e C E e 0.40 D E e e D e XXXX F s XXX D e e 1 e 3 e 5 0.40 s Top side (die back) e e e e D Recommended land pattern Bump side view K A1 Bump (Note 1) A2 A b b1 Notes 1. Bumps are 95.5/3.8/0.7 Sn/Ag/Cu. 2. Backside surface is coated with a Ti/Ni/Ag layer. 3. Non-solder mask defined copper landing pad. 4. Laser marks on the silicon die back. 5. “b1” is the diameter of the solderable substrate surface, defined by an opening in the solder resist layer solder mask defined. 6. • is the location of pin 1 DIM. MILLIMETERS INCHES MIN. NOM. MAX. MIN. NOM. MAX. A 0.328 0.365 0.402 0.0129 0.0144 0.0158 A1 0.136 0.160 0.184 0.0054 0.0063 0.0072 A2 0.192 0.205 0.218 0.0076 0.0081 0.0086 b 0.200 0.220 0.240 0.0079 0.0087 0.0094 b1 0.175 e 0.0069 0.400 0.0157 s 0.160 0.180 0.200 0.0063 0.0071 D 1.920 1.960 2.000 0.0756 0.0772 0.0079 0.0787 E 2.320 2.360 2.400 0.0913 0.0929 0.0945 K 0.040 0.070 0.100 0.0016 0.0028 0.0039 Note • Use millimeters as the primary measurement. ECN: T15-0177-Rev. A, 27-Apr-15 DWG: 6040 Revision: 27-Apr-15 1 Document Number: 69366 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000