Package Information www.vishay.com Vishay Siliconix MICRO FOOT®: 4-Bumps (1.6 mm x 1.6 mm, 0.8 mm Pitch, 0.290 mm Bump Height) 4x Ø b1 4x 0.30 to .31 (Note 3) Solder mask-0.4 S Mark on backside of die D S G e e Recommended land pattern S XXX D e E XXXX S e S D b Note 5 A1 A A2 b1 K Notes 1. Bumps are 95.5/3.8/0.7 Sn/Ag/Cu. 2. Backside surface is coated with a Ti/Ni/Ag layer. 3. Non-solder mask defined copper landing pad. 4. Laser marks on the silicon die back. 5. “b1” is the diameter of the solderable substrate surface, defined by an opening in the solder resist layer solder mask defined. 6. • is the location of pin 1 DIM. MILLIMETERS INCHES MIN. NOM. MAX. MIN. NOM. MAX. A 0.550 0.575 0.600 0.0217 0.0226 0.0236 A1 0.260 0.275 0.290 0.0102 0.0108 0.0114 A2 0.290 0.300 0.310 0.0114 0.0118 0.0122 b 0.370 0.390 0.410 0.0146 0.0153 0.0161 b1 0.300 e 0.0118 0.800 0.0314 s 0.360 0.380 0.400 0.0141 0.0150 D 1.520 1.560 1.600 0.0598 0.0614 0.0157 0.0630 E 1.520 1.560 1.600 0.0598 0.0614 0.0630 K 0.155 0.185 0.215 0.0061 0.0073 0.0085 Note • Use millimeters as the primary measurement. ECN: T15-0175-Rev. A, 27-Apr-15 DWG: 6038 Revision: 27-Apr-15 1 Document Number: 69378 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000