HIP0051 0.25A/50V Octal Low Side Power Driver with Serial Bus Control June 1996 Features Description • Eight Open Drain - NDMOS Low Side Drivers Each Capable of 250mA The HIP0051 is a logic controlled, eight channel Octal Low Side Power Driver. As shown in the Block Diagram, the outputs are controlled via the serial data interface which allows the data to be shifted out, allowing control of other cascaded serial devices. • High Voltage Power BiMOS with Low Idle and Standby Current • Over-Voltage Clamp Protection - Each Output . . . . . . . . . . . . . . . . . . . . . . . 50V Typical The HIP0051 is fabricated in a Power BiMOS IC process, and is intended for use in automotive and other applications having a wide range of temperature and electrical stress conditions. It is particularly suited for driving lamps, displays, relays, and solenoids in applications where low operating power, high breakdown voltage, and high output current at high temperature is required. • Serial Data Input, Parallel Output Power Drive • Common Enable for Output Drivers and Data Storage Register • -40oC to 85oC Operating Range Ordering Information Applications PART NUMBER • Automotive and Industrial Systems • Solenoids, Relays and Lamp Drivers HIP0051IB TEMP. RANGE (oC) -40 to 85 PACKAGE 20 Ld SOIC PKG. NO. M20.3 • Logic and µP Controlled Drivers • Robotic Controls Pinout Block Diagram HIP0051 (SOIC) TOP VIEW EN GND 1 20 GND VCC 2 19 LGND SI 3 18 SO DR0 4 17 DR7 DR1 5 16 DR6 DR2 6 15 DR5 DR3 7 14 DR4 NC 8 13 SCK EN 9 12 STR GND 10 11 GND STR OUTPUT DRIVER (CHANNEL 1 OF 8) (ENABLE) DR#0 (STROBE) Q0 SI SCK SO 8-BIT SERIAL (SPI) INPUT REGISTER (DATA IS PARALLEL OUTPUT LATCHED WHEN STROBED) Q1 OUTPUT LATCH Q2 Q3 Q4 Q5 Q6 Q7 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 1 File Number 4155 Specifications HIP0051 Absolute Maximum Ratings Thermal Information Output Voltage, VOUT (Note 1). . . . . . . . . . . . . . . . . . . -0.3V to 40V Input Voltage, VIN . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V Logic Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7V Output Clamp Energy, 25oC (5ms Pulse). . . . . . . . . . . . . . . . . 75mJ Continuous Output Load Current, ILOAD (Each Output) . . . . . 0.25A Continuous Output Current, ILOAD (All Outputs ON, Note 2). . 1.69A Peak Output Current Each Output, Other Outputs OFF . . . . . . . . . . . . . . . . . . . . . ±2A Peak Avalanche Current (3ms duration) . . . . . . . . . . . . . . . . . . 1A Thermal Resistance (Typical, Note 3) θJA (oC/W) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range, TSTG . . . . -55oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC Lead Tips Only) Operating Conditions Operating Ambient Temperature Range, TA . . . . . . . -40oC to 85oC Operating Logic Supply Voltage Range, VCC . . . . . +4.5V to +5.5V Power Output Driver Voltage Range. . . . . . . . . . . . . . . . . . 0 to VOC Max. Supply Current, with 100mA each Output . . . . . . . . . . . 100µA Max. Supply Current, with No Load, Outputs OFF . . . . . . . . . 100µA Logic Input High Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . .0.7xVCC Logic Input Low Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.2xVCC Typical Output RDSON Channel Resistance. . . . . . . . . . . . . . . . . 2Ω Typical Output Rise Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4µs Typical Output Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10µs CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The MOSFET Output Drain is internally clamped with a Drain-to-Gate zener diode that turns-on the MOSFET; holding the Drain at the Output Clamp voltage VOC. 2. The maximum continuous current with all outputs on is limited by package dissipation. At 25oC ambient temperature, the maximum equal current with all outputs ON is 211mA in each output for a total of 1.69A. At a maximum ambient temperature of TA = 85oC and rDSON(Max) = 3.5Ω, each output is limited to 152mA and the total current for all 8 outputs ON is 8 x 152mA = 1.22A. 3. θJA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications VCC = 4.5V to 5.5V, VBATT = 8V to 16V, TA = -40oC to 85oC, Unless Otherwise Specified. PARAMETER SYMBOL TEST CONDITIONS rDS(ON) Output Current = 200mA, TA = 85oC MIN TYP MAX UNITS 2 3.5 Ω 58 V OUTPUTS DRIVERS (DR0 TO DR7) Output Channel Resistance Output Clamping Voltage Output Clamping Energy VOC Outputs OFF 42 50 EOC 5ms Pulse, TA = 25oC 75 190 mJ Peak Output Load Currents, Short Duration IPEAK 100µs Duration, Each Output, all Outputs ON, Duty Cycle ≤ 2% 0.85 - - A Cold Start-up Lamp Currents ILAMP 5ms Duration, Each Output, all Outputs ON, Duty Cycle ≤ 17% 0.3 - - A Output OFF Leakage Current IOFF Output Voltage = 40V, TA = 85oC - -0.2 10 µA Output Rise Time trise 0.5 4 30 µs Output Fall Time tfall Load = 75Ω, 0.01µF (RC in Parallel), VBATT = 18V 0.5 10 30 µs Output Delay from Strobe, High to Low Output Transition tDHL 1 4 10 µs Output Delay from Strobe, Low to High Output Transition tDLH 0.2 2.6 10 µs LOGIC SUPPLY Logic Supply Current, Loaded ICC All Outputs ON, 200mA Load at each Output - - 100 µA Logic Supply Current, No Load ICC All Outputs OFF - - 100 µA 2 Specifications HIP0051 Electrical Specifications VCC = 4.5V to 5.5V, VBATT = 8V to 16V, TA = -40oC to 85oC, Unless Otherwise Specified. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS LOGIC INPUTS (EN, SI, SCK, STR) Threshold Voltage at Falling Edge VT- VCC = 5V ± 10% 0.2VCC 0.3VCC - V Threshold Voltage at Rising Edge VT+ VCC = 5V ± 10% - 0.6VCC 0.7VCC V Hysteresis Voltage VH VT+ - VT- 0.85 1.4 2.25 V Leakage Current I LIN VCC = 5V -10 -0.2 10 µA Leakage Current I LIN VCC = 0V -10 -0.1 10 µA fSCK - - 1.6 MHz Pulse Width High tW(CKH) 175 27 - ns Pulse Width Low tW(CKL) 175 27 - ns Input Setup Time tSUI - 1.1 75 ns Input Hold Time THI - 1.5 75 ns Strobe Pulse Width tW(S) 150 12 - ns Min. Clock to Strobe Delay tD(CS) 75 5 - ns - 0.2 0.4 V 3.7 4.4 - V 75 260 - ns SERIAL DATA CLOCK (SCK) Frequency SERIAL DATA IN (SI) STROBE (STR) SERIAL DATA OUT (SO) Low Level Output Voltage VOL Sink Current = 1.6mA High Level Output Voltage VOH Source Current = -1.6mA Propagation Delay tP(CD) tW(SCK) tW(SCK) SCK (CLOCK) tSUI tHI SI (SERIAL DATA IN) tW(S) tD(CS) STR (STROBE) tDHL tDLH 90% 10% DRx (POWER OUTPUT DRIVER) tP(CD) SO (SERIAL DATA OUT) FIGURE 1. LOGIC TIMING CONTROL SPECIFICATIONS 3 tfall, trise HIP0051 Pin Descriptions VCC - Logic Power Supply SO - Serial Data Out The VCC pin is the positive 5V logic voltage supply input for the IC. The normal operating voltage range is 4.5 to 5.5V. When switched on, the POR forces all outputs off. The Serial Data Out allows other ICs to be serially cascaded. For example, a 10-bit LED driver may be located behind the HIP0051. A controlling microprocessor may then clock out 18 bits of information and simultaneously strobe both parts. The cascaded ICs may be the same or different from the HIP0051. SCK - Serial Clock SCK is the clock input for the SPI interface. Output ON/OFF control data is clocked into an eight stage shift register on the rising edge of an external clock. This input has a Schmitt trigger. DR0 to DR7 - Outputs 0 Thru 7 The Drain Output pins of the DMOS Power Drivers are capable of sinking 250mA. SI - Serial Data In EN - Enable SI is the Serial Data Input pin for the SPI interface. The eight Power Outputs are controlled by the serial data via the Output Data Buffer. This input has a Schmitt trigger. The Enable pin is an active low enable function for all eight output drivers. When EN is high, drive from the Output Data Buffer is held low and all output drivers are disabled. When EN is low, the output drivers are enabled and data in the 8-bit shift register is transparent to the Output Data Buffer. This input has a Schmitt trigger. STR - Strobe for the SPI Interface When the STR pin is high, data from the 8-bit shift register is passed into the Output Data Buffers where it controls the ON-OFF state of each output driver. The data is latched in the Output Data Buffers on the trailing edge of the STR pulse. This input has a Schmitt trigger. LGND and GND - Ground LGND is the logic input power supply ground pin. The GND pins are common grounds for the Power Output Drivers. The power supplies for the logic and power circuits require a common ground. To minimize ground bounce at the logic input, the external ground return path for the GND pin should be separate from the LGND pin. LGND and GND have common substrate ground connections on the chip. OUTPUT CONTROL TABLE STROBE 8-BIT SERIAL DATA (LATCHED) OUTPUT D1 D2 D3 D4 D5 D6 D7 D8 DR1 DR2 DR3 DR4 DR5 DR6 DR7 DR8 0 0 0 0 0 0 0 0 OFF OFF OFF OFF OFF OFF OFF OFF 1 0 0 0 0 0 0 0 ON OFF OFF OFF OFF OFF OFF OFF 1 1 0 0 0 0 0 0 ON ON OFF OFF OFF OFF OFF OFF 1 1 1 0 0 0 0 0 ON ON ON OFF OFF OFF OFF OFF 1 1 1 1 0 0 0 0 ON ON ON ON OFF OFF OFF OFF 0 0 0 0 1 1 1 1 OFF OFF OFF OFF ON ON ON ON 1 1 1 1 1 1 1 1 ON ON ON ON ON ON ON ON 4 HIP0051 Small Outline Plastic Packages (SOIC) M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M B S MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.4961 0.5118 12.60 13.00 3 E 0.2914 0.2992 7.40 7.60 4 0.050 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 8o 0o N α NOTES: MILLIMETERS MAX A1 e α MIN 20 0o 20 7 8o Rev. 0 12/93 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 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