INTERSIL ID82C84A

82C84A
®
Data Sheet
December 6, 2005
FN2974.3
CMOS Clock Generator Driver
Features
The Intersil 82C84A is a high performance CMOS Clock
Generator-driver which is designed to service the requirements
of both CMOS and NMOS microprocessors such as the
80C86, 80C88, 8086 and the 8088. The chip contains a crystal
controlled oscillator, a divide-by-three counter and complete
“Ready” synchronization and reset logic.
• Generates the System Clock For CMOS or NMOS
Microprocessors
Static CMOS circuit design permits operation with an external
frequency source from DC to 25MHz. Crystal controlled
operation to 25MHz is guaranteed with the use of a parallel,
fundamental mode crystal and two small load capacitors.
• Generates System Reset Output From Schmitt Trigger
Input
All inputs (except X1 and RES) are TTL compatible over
temperature and voltage ranges.
• Single 5V Power Supply
Power consumption is a fraction of that of the equivalent
bipolar circuits. This speed-power characteristic of CMOS
permits the designer to custom tailor his system design with
respect to power and/or speed requirements.
Ordering Information
PART
NUMBER
PART
MARKING
• Up to 25MHz Operation
• Uses a Parallel Mode Crystal Circuit or External
Frequency Source
• Provides Ready Synchronization
• TTL Compatible Inputs/Outputs
• Very Low Power Consumption
• Operating Temperature Ranges
- C82C84A . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
- I82C84A . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
- M82C84A . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
• Pb-Free Plus Anneal Available (RoHS Compliant)
Pinouts
TEMP.
RANGE (°C)
PACKAGE
CP82C84A
CP82C84A
0 to +70
18 Ld PDIP
E18.3
CP82C84AZ
(See Note)
CP82C84AZ
0 to +70
18 Ld PDIP*
(Pb-free)
E18.3
IP82C84A
IP82C84A
-40 to +85
18 Ld PDIP
E18.3
CS82C84A
CS82C84A
0 to +70
20 Ld PLCC
N20.35
CS82C84AZ
(Note)
CS82C84AZ
0 to +70
20 Ld PLCC
(Pb-free)
N20.35
CS82C84AZ96 CS82C84AZ
(Note)
0 to +70
N20.35
20 Ld PLCC
Tape and Reel
(Pb-free)
IS82C84A
IS82C84A
-40 to +85
CD82C84A
CD82C84A
0 to +70
18 Ld CERDIP F18.3
18 Ld CERDIP F18.3
PCLK
2
17
X1
AEN1
3
16
X2
RDY1
4
15
ASYNC
READY
5
14
EFI
RDY2
6
13
F/C
AEN2
7
12
OSC
CLK
8
11
RES
GND
9
10
RESET
ID82C84A
ID82C84A
-40 to +85
MD82C84A/B
MD82C84A/B
-55 to +125 18 Ld CERDIP F18.3
8406801VA
8406801VA
-55 to +125 18 Ld CERDIP F18.3
SMD#
X1
VCC
VCC
18
CSYNC
1
PCLK
N20.35
CSYNC
AEN1
20 Ld PLCC
82C84A (PDIP, CERDIP)
TOP VIEW
PKG.
DWG. #
3
2
1
20
19
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100% matte
tin plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
1
4
18
X2
READY
5
17
ASYNC
RDY2
6
16
EFI
AEN2
7
15
F/C
NC
8
14
NC
9
10
11
12
13
OSC
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
RDY1
RES
-55 to +125 20 Pad CLCC J20.A
SMD#
RESET
-55 to +125 20 Pad CLCC J20.A
84068012A
GND
MR82C84A/B
84068012A
CLK
MR82C84A/B
82C84A (PLCC, CLCC)
TOP VIEW
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 1997, 2002, 2005. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
82C84A
Functional Diagram
11
D
RES
X1
16
X2
XTAL
OSCILLATOR
10
RESET
12
OSC
13
F/C
Q
CK
17
÷3
SYNC
÷2
SYNC
2
PCLK
14
EF1
1
CSYNC
4
RDY1
8
CLK
3
AEN1
6
RDY2
CK
D
Q
FF1
7
AEN2
CK
5
D
Q
FF2
READY
15
ASYNC
CONTROL PIN
2
LOGICAL 1
LOGICAL 0
F/C
External Clock
Crystal Drive
RES
Normal
Reset
RDY1, RDY2
Bus Ready
Bus Not Ready
AEN1, AEN2
Address Disabled
Address Enable
ASYNC
1 Stage Ready
Synchronization
2 Stage Ready
Synchronization
FN2974.3
December 6, 2005
82C84A
Pin Description
SYMBOL
NUMBER
TYPE
DESCRIPTION
AEN1,
AEN2
3, 7
I
ADDRESS ENABLE: AEN is an active LOW signal. AEN serves to qualify its respective Bus Ready
Signal (RDY1 or RDY2). AEN1 validates RDY1 while AEN2 validates RDY2. Two AEN signal inputs are
useful in system configurations which permit the processor to access two Multi-Master System Busses.
In non-Multi-Master configurations, the AEN signal inputs are tied true (LOW).
RDY1,
RDY2
4, 6
I
BUS READY (Transfer Complete). RDY is an active HIGH signal which is an indication from a device
located on the system data bus that data has been received, or is available RDY1 is qualified by AEN1
while RDY2 is qualified by AEN2.
ASYNC
15
I
READY SYNCHRONIZATION SELECT: ASYNC is an input which defines the synchronization mode of
the READY logic. When ASYNC is low, two stages of READY synchronization are provided. When
ASYNC is left open or HIGH, a single stage of READY synchronization is provided.
READY
5
O
READY: READY is an active HIGH signal which is the synchronized RDY signal input. READY is
cleared after the guaranteed hold time to the processor has been met.
X1, X2
17, 16
IO
CRYSTAL IN: X1 and X2 are the pins to which a crystal is attached. The crystal frequency is 3 times
the desired processor clock frequency, (Note 1).
F/C
13
I
FREQUENCY/CRYSTAL SELECT: F/C is a strapping option. When strapped LOW. F/C permits the
processor’s clock to be generated by the crystal. When F/C is strapped HIGH, CLK is generated for the
EFI input, (Note 1).
EFI
14
I
EXTERNAL FREQUENCY IN: When F/C is strapped HIGH, CLK is generated from the input frequency
appearing on this pin. The input signal is a square wave 3 times the frequency of the desired CLK
output.
CLK
8
O
PROCESSOR CLOCK: CLK is the clock output used by the processor and all devices which directly
connect to the processor’s local bus. CLK has an output frequency which is 1/3 of the crystal or EFI
input frequency and a 1/3 duty cycle.
PCLK
2
O
PERIPHERAL CLOCK: PCLK is a peripheral clock signal whose output frequency is 1/2 that of CLK
and has a 50% duty cycle.
OSC
12
O
OSCILLATOR OUTPUT: OSC is the output of the internal oscillator circuitry. Its frequency is equal to
that of the crystal.
RES
11
I
RESET IN: RES is an active LOW signal which is used to generate RESET. The 82C84A provides a
Schmitt trigger input so that an RC connection can be used to establish the power-up reset of proper
duration.
RESET
10
O
RESET: RESET is an active HIGH signal which is used to reset the 80C86 family processors. Its timing
characteristics are determined by RES.
CSYNC
1
I
CLOCK SYNCHRONIZATION: CSYNC is an active HIGH signal which allows multiple 82C84As to be
synchronized to provide clocks that are in phase. When CSYNC is HIGH the internal counters are reset.
When CSYNC goes LOW the internal counters are allowed to resume counting. CSYNC needs to be
externally synchronized to EFI. When using the internal oscillator CSYNC should be hardwired to
ground.
GND
9
Ground
VCC
18
VCC: The +5V power supply pin. A 0.1µF capacitor between VCC and GND is recommended for
decoupling.
NOTE:
1. If the crystal inputs are not used X1 must be tied to VCC or GND and X2 should be left open.
3
FN2974.3
December 6, 2005
82C84A
Functional Description
Oscillator
The oscillator circuit of the 82C84A is designed primarily for
use with an external parallel resonant, fundamental mode
crystal from which the basic operating frequency is derived.
The crystal frequency should be selected at three times the
required CPU clock. X1 and X2 are the two crystal input
crystal connections. For the most stable operation of the
oscillator (OSC) output circuit, two capacitors (C1 = C2) as
shown in the waveform figures are recommended. The
output of the oscillator is buffered and brought out on OSC
so that other system timing signals can be derived from this
stable, crystal-controlled source.
TABLE 1. CRYSTAL SPECIFICATIONS
PARAMETER
TYPICAL CRYSTAL SPEC
Frequency
2.4 - 25MHz, Fundamental, “AT” cut
Type of Operation
Parallel
Unwanted Modes
6dB (Minimum)
Load Capacitance
18 - 32pF
Capacitors C1, C2 are chosen such that their combined
capacitance
C1 x C2
CT = ---------------------- (Including stray capacitance)
C1 + C2
matches the load capacitance as specified by the crystal
manufacturer. This ensures operation within the frequency
tolerance specified by the crystal manufacturer.
Clock Generator
The clock generator consists of a synchronous divide-bythree counter with a special clear input that inhibits the
counting. This clear input (CSYNC) allows the output clock
to be synchronized with an external event (such as another
82C84A clock). It is necessary to synchronize the CSYNC
input to the EFI clock external to the 82C84A. This is
accomplished with two flip-flops. (See Figure 1). The counter
output is a 33% duty cycle clock at one-third the input
frequency.
NOTE: The F/C input is a strapping pin that selects either the crystal
oscillator or the EFI input as the clock for the ÷ 3 counter. If
the EFI input is selected as the clock source, the oscillator
section can be used independently for another clock source.
Output is taken from OSC.
Clock Outputs
The CLK output is a 33% duty cycle clock driver designed to
drive the 80C86, 80C88 processors directly. PCLK is a
peripheral clock signal whose output frequency is 1/2 that of
CLK. PCLK has a 50% duty cycle.
Reset Logic
The reset logic provides a Schmitt trigger input (RES) and a
synchronizing flip-flop to generate the reset timing. The reset
signal is synchronized to the falling edge of CLK. A simple RC
network can be used to provide power-on reset by utilizing this
function of the 82C84A.
READY Synchronization
Two READY input (RDY1, RDY2) are provided to
accommodate two system busses. Each input has a qualifier
(AEN1 and AEN2, respectively). The AEN signals validate
their respective RDY signals. If a Multi-Master system is not
being used the AEN pin should be tied LOW.
Synchronization is required for all asynchronous active-going
edges of either RDY input to guarantee that the RDY setup
and hold times are met. Inactive-going edges of RDY in
normally ready systems do not require synchronization but
must satisfy RDY setup and hold as a matter of proper system
design.
The ASYNC input defines two modes of READY
synchronization operation.
When ASYNC is LOW, two stages of synchronization are
provided for active READY input signals. Positive-going
asynchronous READY inputs will first be synchronized to flipflop one of the rising edge of CLK (requiring a setup time
tR1VCH) and the synchronized to flip-flop two at the next
falling edge of CLK, after which time the READY output will go
active (HIGH). Negative-going asynchronous READY inputs
will be synchronized directly to flip-flop two at the falling edge
of CLK, after which the READY output will go inactive. This
mode of operation is intended for use by asynchronous
(normally not ready) devices in the system which cannot be
guaranteed by design to meet the required RDY setup timing,
TR1VCL, on each bus cycle.
When ASYNC is high or left open, the first READY flip-flop is
bypassed in the READY synchronization logic. READY inputs
are synchronized by flip-flop two on the falling edge of CLK
before they are presented to the processor. This mode is
available for synchronous devices that can be guaranteed to
meet the required RDY setup time.
ASYNC can be changed on every bus cycle to select the
appropriate mode of synchronization for each device in the
system.
4
FN2974.3
December 6, 2005
82C84A
EFI
CLOCK
SYNCHRONIZE
D
EFI
>
Q
82C84A
D
Q
CSYNC
>
(TO OTHER 82C84As)
NOTE: If EFI input is used, then crystal input X1 must be tied to VCC or GND and X2 should be left open. If the crystal inputs are used,
then EFI should be tied to VCC or GND.
FIGURE 1. CSYNC SYNCHRONIZATION
5
FN2974.3
December 6, 2005
82C84A
Absolute Maximum Ratings
Thermal Information
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to VCC +0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance. . . . . . . . . . . . . . . . . θJA (oC/W) θJC (oC/W)
CERDIP Package. . . . . . . . . . . . . . . . .
80
20
CLCC Package . . . . . . . . . . . . . . . . . .
95
28
PDIP Package* . . . . . . . . . . . . . . . . . .
85
N/A
PLCC Package. . . . . . . . . . . . . . . . . . .
85
N/A
Storage Temperature Range . . . . . . . . . . . . . . . . . -65oC to +150oC
Max Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .+175oC
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . .+300oC
(PLCC - Lead Tips Only)
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range
C82C84A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to +70oC
I82C84A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to +85oC
M82C84A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to +125oC
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
DC Electrical Specifications VCC = +5.0V ±10%,
TA = 0oC to +70oC (C82C84A),
TA = -40oC to +85oC (I82C84A),
TA = -55oC to +125oC (M82C84A)
SYMBOL
PARAMETER
MIN
MAX
UNITS
TEST CONDITIONS
VIH
Logical One Input Voltage
2.0
2.2
-
V
V
C82C84A, I82C84
M82C84A, Notes 1, 2
VIL
Logical Zero Input Voltage
-
0.8
V
Notes 1, 2, 3
VIHR
Reset Input High Voltage
VCC -0.8
-
V
VILR
Reset Input Low Voltage
-
0.5
V
Reset Input Hysteresis
0.2 VCC
-
-
VOH
Logical One Output Current
VCC -0.4
-
V
IOH = -4.0mA for CLK Output
IOH = -2.5mA for All Others
VOL
Logical Zero Output Voltage
-
0.4
V
IOL = +4.0mA for CLK Output
IOL = +2.5mA for All Others
-1.0
1.0
µA
VIN = VCC or GND except ASYNC,
X1: (Note 4)
-
40
mA
Crystal Frequency = 25MHz
Outputs Open, Note 5
VT+ - VT-
II
Input Leakage Current
ICCOP
Operating Power Supply Current
NOTES:
1. F/C is a strap option and should be held either ≤ 0.8V or ≥ 2.2V. Does not apply to X1 or X2 pins.
2. Due to test equipment limitations related to noise, the actual tested value may differ from that specified, but the specified limit is
guaranteed.
3. CSYNC pin is tested with VIL ≤ 0.8V.
4. ASYNC pin includes an internal 17.5kΩ nominal pull-up resistor. For ASYNC input at GND, ASYNC input leakage current = 300µA
nominal, X1 - crystal feedback input.
5. f = 25MHz may be tested using the extrapolated value based on measurements taken at f = 2MHz and f = 10MHz.
Capacitance TA = +25oC
SYMBOL
CIN
COUT
PARAMETER
TYPICAL
UNITS
Input Capacitance
10
pF
Output Capacitance
15
pF
6
TEST CONDITIONS
FREQ = 1MHz, all measurements are
referenced to device GND
FN2974.3
December 6, 2005
82C84A
AC Electrical Specifications VCC = +5V± 10%,
TA = 0oC to +70oC (C82C84A),
TA = -40oC to +85oC (I82C84A),
TA = -55oC to +125oC (M82C84A)
LIMITS
SYMBOL
PARAMETER
MIN
MAX
UNITS
(NOTE 1)
TEST
CONDITIONS
TIMING REQUIREMENTS
(1)
TEHEL
External Frequency HIGH Time
13
-
ns
90%-90% VIN
(2)
TELEH
External Frequency LOW Time
13
-
ns
10%-10% VIN
(3)
TELEL
EFI Period
36
-
ns
XTAL Frequency
2.4
25
MHz
(4)
TR2VCL
RDY1, RDY2 Active Setup to CLK
35
-
ns
ASYNC = HIGH
(5)
TR1VCH
RDY1, RDY2 Active Setup to CLK
35
-
ns
ASYNC = LOW
(6)
TR1VCL
RDY1, RDY2 Inactive Setup to CLK
35
-
ns
(7)
TCLR1X
RDY1, RDY2 Hold to CLK
0
-
ns
(8)
TAYVCL
ASYNC Setup to CLK
50
-
ns
(9)
TCLAYX
ASYNC Hold to CLK
0
-
ns
(10)
TA1VR1V
AEN1, AEN2 Setup to RDY1, RDY2
15
-
ns
(11)
TCLA1X
AEN1, AEN2 Hold to CLK
0
-
ns
(12)
TYHEH
CSYNC Setup to EFI
20
-
ns
(13)
TEHYL
CSYNC Hold to EFI
(14)
TYHYL
CSYNC Width
(15)
TI1HCL
(16)
TCLI1H
Note 2
20
-
ns
2 TELEL
-
ns
RES Setup to CLK
65
-
ns
Note 3
RES Hold to CLK
20
-
ns
Note 3
125
-
ns
Note 6
TIMING RESPONSES
(17)
TCLCL
CLK Cycle Period
(18)
TCHCL
CLK HIGH Time
(1/3 TCLCL) +2.0
-
ns
Note 6
(19)
TCLCH
CLK LOW Time
(2/3 TCLCL) -15.0
-
ns
Note 6
(20)
(21)
TCH1CH2
TCL2CL1
CLK Rise or Fall Time
-
10
ns
1.0V to 3.0V
(22)
TPHPL
PCLK HIGH Time
TCLCL-20
-
ns
Note 6
(23)
TPLPH
PCLK LOW Time
TCLCL-20
-
ns
Note 6
(24)
TRYLCL
Ready Inactive to CLK (See Note 4)
(25)
TRYHCH
Ready Active to CLK (See Note 3)
(26)
TCLIL
CLK to Reset Delay
(27)
TCLPH
CLK to PCLK HIGH Delay
-
22
ns
(28)
TCLPL
CLK to PCLK LOW Delay
-
22
ns
(29)
TOLCH
OSC to CLK HIGH Delay
-5
22
ns
(30)
TOLCL
OSC to CLK LOW Delay
2
35
ns
-8
-
ns
Note 4
(2/3 TCLCL) -15.0
-
ns
Note 5
-
40
ns
NOTES:
1. Tested as follows: f = 2.4MHz, VIH = 2.6V, VIL = 0.4V, CL = 50pF, VOH ≥ 1.5V, VOL ≤ 1.5V, unless otherwise specified. RES and F/C must switch
between 0.4V and VCC -0.4V. Input rise and fall times driven at 1ns/V. VIL ≤ VIL (max) - 0.4V for CSYNC pin. VCC = 4.5V and 5.5V.
2. Tested using EFI or X1 input pin.
3. Setup and hold necessary only to guarantee recognition at next clock.
4. Applies only to T2 states.
5. Applies only to T3 TW states.
6. Tested with EFI input frequency = 4.2MHz.
7
FN2974.3
December 6, 2005
82C84A
Timing Waveforms
NAME
EFI
I
OSC
O
CLK
PCLK
NOTE:
(3)
I/O
tOLCH
(29)
O
O
CSYNC
I
RES
I
RESET
O
tELEH
tELEL
(19)
tCLCH
(17) tCLCL
tCL2CL1
(21)
tCH1CH2
(20)
(13)
tEHYL
(1)
tEHEL
tCHCL
(18)
tCLPL
(28)
tCLPH
(27)
(30)
tOLCL
tYHEH
(12)
(2)
(22)
tPHPL
(16)
(15)
tCLI1H
tI1HCL
tPLPH
(23)
(14)
tYHYL
(26)
tCLIL
All timing measurements are made at 1.5V, unless otherwise noted.
FIGURE 2. WAVEFORMS FOR CLOCKS AND RESETS SIGNALS
CLK
(7)
tCLR1X
tR1VCH
(5)
RDY1, 2
tR1VCL
(6)
(10)
tA1VR1V
tCLR1X
(7)
tCLA1X
(11)
AEN1, 2
tAYVCL
(8)
ASYNC
(9)
tCLAYX
READY
(25)
tRYHCH
(24) tRYLCL
FIGURE 3. WAVEFORMS FOR READY SIGNALS (FOR ASYNCHRONOUS DEVICES)
CLK
(7)
(4)
tCLR1X
tR1VCL
(6)
tR1VCL
RDY 1, 2
(10)
tA1VRIV
tCLR1X
(7)
AEN1, 2
(8)
tCLA1X
tAYVCL
(11)
ASYNC
tCLAYX
READY
(9)
(25)
tRYHCH
(24)
tRYLCL
FIGURE 4. WAVEFORMS FOR READY SIGNALS (FOR SYNCHRONOUS DEVICES)
8
FN2974.3
December 6, 2005
82C84A
Test Load Circuits
2.25V
OUTPUT FROM
DEVICE UNDER TEST
R = 740Ω FOR ALL OUTPUTS
EXCEPT CLK
463Ω FOR CLK OUTPUT
CL
(SEE NOTE 3)
NOTES:
1. CL =100pF for CLK output.
2. CL = 50pF for all outputs except CLK.
3. CL = Includes probe and jig capacitance.
FIGURE 5. TEST LOAD MEASUREMENT CONDITIONS
LOAD
(SEE NOTE 1)
CLK
X1
C1
PULSE
GENERATOR
CLK
EF1
LOAD
(SEE NOTE 1)
VCC
X2
C2
F/C
F/C
CSYNC
CSYNC
FIGURE 6. TCHCL, TCLCH LOAD CIRCUITS
VCC
CLK
LOAD
(SEE NOTE 1)
READY
LOAD
(SEE NOTE 2)
AEN1
C1
X1
24MHz
C2
PULSE
GENERATOR
TRIGGER
PULSE
GENERATOR
X2
LOAD
(SEE NOTE 1)
READY
LOAD
(SEE NOTE 2)
VCC
F/C
AEN1
TRIGGER
PULSE
GENERATOR
OSC
RDY2
CLK
EF1
RDY2
AEN2
CSYNC
F/C
AEN2
CSYNC
FIGURE 7. TRYLCL, TRYHCH LOAD CIRCUITS
AC Testing Input, Output Waveform
OUTPUT
INPUT
VIH + 0.4V
VOH
1.5V
VIL - 0.4V
NOTE:
1.5V
VOL
Input test signals must switch between VIL (maximum) -0.4V and VIH (minimum) +0.4V. RES and F/C must switch between 0.4V
and VCC -0.4V. Input rise and fall times driven at 1ns/V. VIL ≤ VIL (max) -0.4V for CSYNC pin. VCC -4.5V and 5.5V.
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82C84A
Burn-In Circuits
MD82C84A CERDIP
VCC
C1
R1
F9
VCC
GND
R2
R2
R1
F6
F5
VCC
GND
F7
F8
VCC
GND
1
18
2
17
3
16
R1
R2
4
R2
15
F10
R1
5
R2
14
R1
R1
R2
R2
OPEN
R3
R1
F0
6
13
7
12
8
11
9
10
F1
R1
R2
R2
R1
R2
R2
F11
VCC
GND
F12
VCC
GND
MR82C84A CLCC
R4
F0
F9
5
17
6
16
7
15
8
14
VCC / 2
OPEN
R4
R4
R4
F10
F1
F11
OPEN
10 11 12 13
R4
R4
9
F12
OPEN
R4
18
VCC / 2
F8
20 19
R4
F7
R4
C1
4
R4
VCC / 2
R4
1
VCC / 2
F5
2
R4
F6
R4
R4
3
R4
VCC / 2
VCC
NOTES:
VCC = 5.5V ±0.5V, GND = 0V.
VIH = 4.5V ±10%.
VIL = -0.2 to 0.4V.
R1 = 47kΩ, ±5%.
R2 = 10kΩ, ±5%.
R3 = 2.2kΩ, ±5%.
R4 = 1.2kΩ, ±5%.
C1 = 0.01µF (minimum).
F0 = 100kHz ±10%.
F1 = F0/2, F2 = F1/2, . . . F12 = F11/2.
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82C84A
Die Characteristics
DIE DIMENSIONS:
66.1 x 70.5 x 19 ± 1mils
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ ± 1kÅ
METALLIZATION:
Type: Si - AI
Thickness: 11kÅ ± 1kÅ
WORST CASE CURRENT DENSITY:
1.42 x 105 A/cm2
Metallization Mask Layout
82C84A
AEN1
PCLK
CSYNC
VCC
X1
X2
RDY1
ASYNC
READY
RDY2
EFI
AEN2
F/C
CLK
GND
RESET
RES
OSC
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