INTERSIL HI3-7159A-5

HI-7159A
Data Sheet
January 1999
Microprocessor-Compatible, 5- 1/2 Digit
A/D Converter
• ±200,000 Count A/D Converter
• 2V Full Scale Reading With 10µV Resolution
• 15 Conversions Per Second in 51/2 Digit Mode
• 60 Conversions Per Second in 41/2 Digit Mode
• Serial or Parallel Interface Modes
• Four Selectable Baud Rates
• Differential Analog Input
• Differential Reference Input
• Digital Autozero
Applications
• Weigh Scales
• Part Counting Scales
Ordering Information
HI3-7159A-5
• Laboratory Instruments
TEMP.
RANGE (oC)
0 to 70
2936.4
Features
The Intersil HI-7159A is a monolithic A/D converter that uses
a unique dual slope technique which allows it to resolve input
changes as small as 1 part in 200,000 (10µV) without the use
of critical external components. Its digital autozeroing feature
virtually eliminates zero drift over temperature. The device is
fabricated in Intersil’ proprietary low noise BiMOS process,
resulting in exceptional linearity and noise performance. The
HI-7159A’s resolution can be switched between a high
resolution 200,000 count (51/2 digit) mode, and a high speed
20,000 count (41/2 digit) mode without any hardware
modifications. In the 41/2 digit uncompensated mode, speeds
of 60 conversions per second can be achieved. The HI-7159A
is designed to be easily interfaced with most microprocessors
through either of its three serial and one parallel interface
modes. In the serial modes, any one of four common baud
rates is available.
PART NUMBER
File Number
28 Ld PDIP
Pinout
• Process Control/Monitoring
PKG.
NO.
PACKAGE
• Energy Management
E28.6
• Seismic Monitoring
Functional Block Diagram
HI-7159A
(PDIP)
TOP VIEW
AGND
INT IN 3
XTAL
DGND
28 SEL
27 XTAL
26 DGND
CINT
5
24 P6/BRS0
6
23 P5/SAD3
7
CREF+
8
GUARD
VREF HI 9
22 P4/SAD2
VREF LO 10
19 P1/SMS1
VIN HI
AGND 11
18 P0/SMS0
VIN LO
VIN HI 12
17 CS/SAD4
CREF
VIN LO 13
16 WR/TXD
VEE 14
15 RD/RXD
COMPARATOR
+
+
25 P7/BRS1
-
CONTROL
SECTION
AND
LATCHES
RINT
BUFFER
VREF HI
20 P2/SAD0
VREF LO
8 BIT
BUS
BUS
INTERFACE
UNIT
CS
+
-
21 P3/SAD1
1
INTEGRATOR
-
4
BUF OUT
CREFGUARD
CREFCREF+
VCC
I/O PORTS
VCC 1
INT OUT 2
VEE
WR
RD
UART
ANALOG SWITCHES
ANALOG
STATE
MACHINE
SEL
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
HI-7159A
Absolute Maximum Ratings
Thermal Information
Supply Voltage
VCC to GND (AGND/DGND) . . . . . . . . . . . . . . -0.3V < VCC < +6V
VEE to GND (AGND/DGND) . . . . . . . . . . . . . . +0.3V < VCC < -6V
Digital Pins, (pins 15 - 28) . . . . . . . . DGND -0.3V < VD <VCC +0.3V
Analog Pins, (pins 2 - 13). . . . . . . . . . .VEE -0.3V < VA < VCC +0.3V
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
50
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature, TSTG . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Test Conditions: VCC = +5V, VEE = -5V, DGND = 0V, AGND = 0V, VREF HI = +1.00000V, VREF LO = AGND,
fCLOCK = 2.40MHz, RINT = 400kΩ, CINT = 0.01µF, TA = 25oC, VIN LO = AGND, CREF = 1.0µF, 51/2 Digit
Compensated Mode, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
Integral Non-Linearity, INL
MIN
TYP
MAX
UNITS
0V to +2V (Notes 2, 3, 4, 5)
-
±0.0015
±0.0035
% FS
-2V to 0V (Notes 2, 3, 4, 5)
-
±0.0015
±0.0035
% FS
99996
100000
100003
Counts
Ratiometric Reading
VIN HI = VREF HI = 1.00000V
Zero Error, ZE
VIN HI = 0.00000V
-
0
±1
Counts
Voltage Range of VIN LO Input
(Pin 13), VIN LO
-2V ≤ VIN HI - VIN LO ≤ 2V
-1
-
1
V
Voltage Range of VIN HI Input
(Pin 12), VIN HI
-2V ≤ VIN HI - VIN LO ≤ 2V
VIN LO-2V
-
VIN LO +2V
V
Common Mode Rejection, CMR
VIN HI = VIN LO = -3V to +3V
-
3
-
Counts
Input Leakage Current, IIN
Pins 9, 10, 12, 13, VIN = +3V, -3V
-
-
±0.1
µA
Input Capacitance, CIN
Pins 9, 10, 12, 13
-
5
-
pF
-
±1
-
Counts
Noise (Peak-to-Peak Value, Not
Exceeded 95% of Time), eN
Zero Drift, TC(ZE)
VIN HI = 0.00000V
-
0
-
Counts/oC
Full Scale Error Tempco, TC(FSE)
VIN HI = ±2.00000V
-
±0.1
-
Counts/oC
VCC
+4.75
+5.0
+5.5
V
VEE
-4.75
-5.0
-5.5
V
VCC Supply Current, ICC
-
-
10
mA
VEE Supply Current, IEE
-
-
4.5
mA
Digital GND Current, IDGND
-
-
5.5
mA
Analog GND Current, IAGND
-
+3
-
µA
-
3
-
Counts
±10
-
-
µA
Supply Range, VSUPPLY
VCC , VEE Power Supply Rejection,
PSR
VIN HI = VREF HI = 1.00000V, VCC = +4.75V,
VEE = -4.75V to VCC = +5.50V, VEE = -5.50V
Guard Driver Pins 5, 8
Output Current, IOGD
VIN (Pins 9, 10) = +3V, -3V
NOTES:
2. All typical values have been characterized but are not production tested.
3. Not production tested, guaranteed by design and characterization.
4. Reference adjusted for correct full-scale reading.
5. VIN = VIN HI - VIN LO .
2
HI-7159A
DC Electrical Specifications
Test Conditions: VCC = +5V, VEE = -5V, DGND = 0V, AGND = 0V, VREF HI = +1.00000V, VREF LO = AGND,
fCLOCK = 2.40MHz, RINT = 400kΩ, CINT = 0.01µF, TA = 25oC, VIN LO = AGND, CREF = 1.0µF, 51/2 Digit
Compensated Mode, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Input Low Voltage, VIL
Pins 15-25, 28
-
-
0.8
V
Input High Voltage, VIH
Pins 15-25, 28
2.0
-
-
V
Output Low Voltage, VOL
Pins 16, 18-25, IOL = 1.6mA
-
-
0.4
V
Output High Voltage, VOH
Pins 16, 18-25, IOH = -400µA
2.4
-
-
V
Three-State Leakage Current,
Pins 18-25, IOL
All Digital Drivers In High Impedance State,
Parallel Mode. CS = VCC , VIN = 0V, VCC
-
-
±10
µA
Leakage, Pins 15-17, 28, IIN
VIN = 0V, VCC
-
-
±1
µA
Input Capacitance, CIN
Pins 15, 17-25, 28
-
5
-
pF
Pin 16
-
10
-
pF
Pins 18-25 at DGND
SEL = DGND (Serial Modes)
-
-5
-
µA
Input Pullup Current (Pins 18-25), IPU
AC Electrical Specifications
TA = 0oC to 75oC; Test Conditions: VCC = +4.75V, VEE = -5.00V (Note 8), DGND = 0V, AGND = 0V,
VIN LO = AGND , VREF HI = +1.00000V, VREF LO = AGND , fCLOCK = 2.40MHz, RINT = 400kΩ ,
CINT = 0.01µF, VIL = 0V, VIH = 4V, VOL = VOH = 1.5V, tr = tf < 10ns, 51/2 Digit Compensated Mode,
Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
CS Setup/Hold of WR, t1
0
-
-
ns
WR Setup of Data In, t2
50
-
-
ns
WR Pulse Width, t3
150
-
-
ns
Data Hold After WR, t4
20
-
-
ns
25
-
-
ns
-
-
100
ns
-
-
70
ns
CS Setup/Hold of RD, t5
(Note 7)
RD to Data Out, t6
CL = 50pF, VO = 1.5V
RD to Hi-Z State, t7
WR to RD, WR to WR, tA
(Note 7)
5/fCLOCK
-
-
s
RD to WR, tB
(Note 7)
200
-
-
ns
RXD Setup of Data In, tC
(Note 7)
60
-
-
ns
40
-
-
ns
-
-
300
ns
100
-
-
ns
Data Hold After EXT CLK, tD
EXT CLK to DATA OUT, tE
CS Setup of TXD, tf
NOTES:
6. All typical values have been characterized but are not production tested.
7. Not production tested, guaranteed by design and characterization.
8. All AC characteristics are guaranteed for VCC = +5V 15%, VEE = -5V 15%, over TA = 0oC to 75oC.
3
HI-7159A
Timing Waveforms
CS
t1
t1
t3
WR
WR
tA
t2
P0 - P7
t4
RD
DATA IN
FIGURE 1A. WRITE
FIGURE 1B. WRITE TO READ CYCLE
WR
tA
FIGURE 1C. WRITE TO WRITE CYCLE
CS
RD
t5
t5
RD
tB
t6
WR
t7
P0 - P7
DATA OUT
FIGURE 1D. READ
FIGURE 1E. READ TO WRITE CYCLE
FIGURE 1. PARALLEL MODE TIMING
CLK
(PIN 15)
RXD/TXD
(PIN 16)
D0
D1
D2
D3
D4
D5
D6
D7
(HI-7159A RECEIVING)
tC
tD
D0
RXD/TXD
(PIN 16)
D1
D2
D3
D4
D5
D6
D7
(HI-7159A TRANSMITTING)
tE
FIGURE 2A. SERIAL MODE 0 TIMING
CS
(SERIAL MODE 1)
tf
TXD OR RXD
START
D0
D1
D2
D3
D4
D5
DATA CLOCK
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
BIT DETECTOR
SAMPLE TIME
NOTE: All input timing shown is defined at 50% points.
FIGURE 2B. SERIAL MODE TIMING
4
D6
D7
PARITY
STOP
HI-7159A
Pin Descriptions
PIN
SYMBOL
1
VCC
2
INT OUT
3
INT IN
4
BUF OUT
5
CREF - Guard
6
CREF -
7
CREF +
8
CREF + Guard
DESCRIPTION
Positive 5V Power Supply for analog and digital sections.
Integrator Output; external component terminal.
Integrator Input; external component terminal.
VIN HI Voltage Buffer Output; external component terminal.
Reference Capacitor guard ring terminal (negative).
Reference Capacitor negative terminal.
Reference Capacitor positive terminal.
Reference Capacitor guard ring terminal (positive).
9
VREF HI
Positive Reference Input terminal.
10
VREF LO
Negative Reference Input terminal.
11
AGND
Analog Ground (0V).
12
VIN HI
Positive Analog Input Voltage terminal.
13
VIN LO
Negative Analog Input Voltage terminal.
14
VEE
Negative 5V Power Supply for analog section.
15
RD/RXD
Parallel Read; serial receive (modes 1 and 2), serial clock (mode 0).
16
WR/TXD
Parallel Write; serial transmit (modes 1 and 2), serial receive/transmit (mode 0).
17
CS/SAD4
Chip Select (parallel and serial modes 0 and 1), serial address bit 4 (mode 2).
18
P0/SMS0
Parallel I/O Port (P0); serial mode select pin.
19
P1/SMS1
Parallel I/O Port (P1); serial mode select pin.
MODE
SMS0
SMS1
Serial Mode 0
0
0
Serial Mode 1
0
1
Serial Mode 2
1
0
Reserved
1
1
20
P2/SAD0
Parallel I/O Port (P2); serial address bit 0.
21
P3/SAD1
Parallel I/O Port (P3); serial address bit 1.
22
P4/SAD2
Parallel I/O Port (P4); serial address bit 2.
23
P5/SAD3
Parallel I/O Port (P5); serial address bit 3.
24
P6/BRS0
Parallel I/O Port (P6); serial baud rate select.
25
P7/BRS1
Parallel I/O Port (P7); serial baud rate select.
BAUD RATE
BRS0
BRS1
300
0
0
1200
0
1
9600
1
0
19200
1
1
26
DGND
Digital Ground (0V).
27
XTAL
Oscillator Out; crystal connection pin (other crystal pin connected to VCC).
28
SEL
Select pin for parallel or serial operation.
Parallel
SEL = 1
Serial Modes
SEL = 0
5
HI-7159A
Theory of Operation
Communication Modes
The HI-7159A attains its 51/2 digit resolution through the use
of multiple integrations per conversion, creating an effective
integrator swing greater than the supply rails, and a
successive integration technique used to measure the
residue on the integrator capacitor to 51/2 digit accuracy.
The HI-7159A A/D converter receives instructions from and
transmits data to the user host processor through one of four
communication modes. The modes are: parallel
microprocessor (Parallel); synchronous serial (Serial Mode 0);
serial non-addressed (Serial Mode 1); and serial addressed
(Serial Mode 2). The mode is determined by the states of the
SEL, SMS0, and SMS1 pins as shown in Table 1.
In the 51/2 digit mode, the input voltage is integrated and
reference de-integrated four times. This results in a count with
the same effective resolution as a single integration with four
times the integrator swing amplitude. In this manner effective
integrator swings of ±12V or greater can be achieved with ±5V
supplies. The four integrations are spaced so that commonmode signals whose frequency is an integer multiple of
fCRYSTAL/40,000 are rejected. In the 41/2 digit mode, only one
input integration is performed, thus the minimum frequency for
common-mode rejection becomes fCRYSTAL/10,000.
These first four integrations measure the input voltage to an
resolution of 31/2 digits, or 1mV/count. To achieve 51/2 digit
accuracy (10µV/count), the error voltage remaining on the
integrator capacitor (representing the overshoot of the
integrator due to comparator delay and clock quantization)
must be measured and subtracted from the 31/2 digit result.
This is accomplished by multiplying the residue by a factor of
10, then integrating and reference de-integrating the error.
This error is subtracted from the 31/2 digit result, yielding a
41/2 digit accurate result. The error remaining from this step
is then multiplied by 10 and subtracted, and the process is
repeated a third time to achieve an internal accuracy of 61/2
digits. This result is rounded to 51/2 digits and transferred to
the holding register, where it can be accessed by the user
through one of the three communications modes.
Conversion Types
The HI-7159A offers the user a choice of three different
conversion types. They are: (1) the converter’s internal offset
voltage, measured by internally connecting VIN HI and VIN LO
to AGND and doing a conversion (Error Only Mode); (2) the
input voltage (VIN HI minus VIN LO) including the converter’s
internal offset (Uncompensated Mode); and (3) the input
voltage including internal offset errors, minus the internal offset
errors (Compensated Mode). This last measurement is a digital
subtraction of an Error Only conversion from an
Uncompensated conversion, and is the default conversion type.
Since a Compensated conversion consists of two conversions,
it takes twice as long to perform as the first two types.
Under some conditions, it may be desirable to increase the
conversion rate without loss of resolution or accuracy. Since
the short term drift of the internal offset error is slight when
temperature is controlled, it is not always necessary to
convert the error voltage once for every input voltage
conversion. It is possible for the host processor to do an
error conversion periodically, store the result, and subtract
the error from a stream of uncompensated input conversions
with its own internal ALU. In this way the conversion rate can
be effectively doubled.
6
The parallel mode allows the converter to be attached directly
to a microprocessor data bus. Data is read and written to the
device under control of the microprocessor’s RD, WR and CS
signals. Serial Mode 0 permits high speed serial data transfer
at up to 1 megabits/s. Serial Mode 1 reads and writes industry
standard serial data packets consisting of 1 start bit, 8 data
bits, 1 parity bit (EVEN), and 1 stop bit, at one of 4 hardware
selectable baud rates. Serial Mode 2 is identical to Serial
Mode 1 with the addition of addressing capabilities which
allow up to 32 HI-7159As to share the same serial line, with
each assigned a unique address.
TABLE 1. COMMUNICATION MODE SELECTION
SEL PIN
28
SM S0
PIN 18
SM S1
PIN 19
Parallel
VCC
N/A
N/A
Serial 0
DGND
DGND
DGND
Serial 1
DGND
DGND
VCC
Serial 2
DGND
VCC
DGND
COMMUNICATION MODE
All four modes follow the same interface protocol: a request
or a command is sent from the host to the HI-7159A, and the
converter responds with the requested data and, in the case
of a command, begins a new conversion.
Parallel Mode Operation
The parallel communication mode (Figure 3) is selected
when SEL (Pin 28) is high. Pins 18-25 become the eight
bidirectional data bits, P0-P7. Pins 15, 16, and 17
respectively become read (RD), write (WR), and chip select
(CS). Timing parameters for the parallel mode are shown in
Figure 1.
Serial Mode 0
Serial Mode 0 is the high speed synchronous serial interface,
directly compatible with the MCS-51 series of microcontrollers.
It is enabled by tying SEL (Pin 28), SMS0 (Pin 18) and SMS1
(Pin 19) low (Figure 4A). Pin 16 is the bidirectional serial data
path, and pin 15 is the data clock input. Data sent to the
HI-7159A is latched on the rising edge of the serial clock. See
Figure 2A for detailed timing information.
Only 8 data bits are used in this mode - no start, stop, or
parity bits are transmitted or received. CS must either be tied
to DGND or pulled low to access the device. The
SAD0 - SAD3 and BRS0 - BRS1 pins are unused in this
mode and should be tied high.
HI-7159A
Serial Mode 1
Serial Mode 1 is selected by tying SMS0 (Pin 18) low, SMS1
(Pin 19) high, and SEL (Pin 28) low (Figure 4B). In this mode
the HI-7159A interface emulates a UART, reading and
writing data in serial data packets of 1 start bit, 8 data bits,
1 parity bit (EVEN), and 1 stop bit. The baud rate is
determined by the state of BRS0 and BRS1 (Pins 24 and 25)
as shown in Table 2. Pin 15 becomes the serial receiver pin
(RXD) and pin 16 the serial transmitter pin (TXD). CS (Pin
17) remains a chip select and must either be tied to DGND or
pulled low (see Figure 2B) to access the device.
SAD0-SAD3 (Pins 20-23) are unused in this mode and
should be tied high.
-5V
+5V
VCC
VEE
10
CLK
14
15
CLK
RXD/TXD
RXD/TXD
1
16
11
XTAL
27
8051
µP
XTAL
HI-7159A
+5V
SM0
20-25
18
SM1
19
17
26
CS
28
DGND SEL
TABLE 2. BAUD RATE SELECTION FOR MODES 1 AND 2
BRS0
PIN 24
BRS1
PIN 25
BAUD RATE
(fXTAL = 2.4576MHz)
BAUD RATE vs
fXTAL
DGND
DGND
300
fXTAL/8192
DGND
VCC
1200
fXTAL/2048
VCC
DGND
9600
fXTAL/256
VCC
VCC
19200
fXTAL/128
FIGURE 4A. SERIAL MODE 0
-5V
TXD
RXD
14
TXD 15
16
+5V
VEE
RD
WR
WR
14
15
SEL
28
ADDRESS
DECODER
BUS
D0
CS
XTAL
27
XTAL
20K
BRS0
HI-7159A
24
25
BRS1
XTAL
SM0
18
+5V
27
+5V
SM1
20 - 23
19
17
26
28
HI- 7159A
CS
DGND
SEL
D0
18
DATA
BUS
17
20K
UART/µP
VCC
1
16
ADDRESS
1
+5V
-5V
RD
VCC
VEE
RXD
µP
+5V
D7
D7
25
FIGURE 4B. SERIAL MODE 1
26
DGND
FIGURE 3. PARALLEL MODE CONFIGURATION
TO UP TO 31 ADDITIONAL
HI-7159As
1. Always read the status byte twice to make sure that it is
cleared.
3. Read each digit pair five times before reading the next
byte to ensure that the output data is correct.
4. Use a watchdog timer to monitor conversion time. If
conversion time is either too long or too short, reissue the
conversion command.
+5V
VCC
VEE
Design Hints for Operating in the Parallel
Mode
2. Make sure the status byte is cleared before issuing a
command to change modes.
-5V
TXD
RXD
RXD
TXD
+5V
20K
UART/µP
20K
BRS0
BRS1
+5V
SM0
SM1
14
15
1
XTAL
27
16
XTAL
HI-7159A
24
20
21
22
23
17
25
18
19
26
ADDRESS
SELECT
28
DGND
SEL
FIGURE 4C. SERIAL MODE 2
FIGURE 4. SERIAL MODE CONFIGURATIONS
7
HI-7159A
Serial Mode 2
Serial Mode 2 is selected by tying SEL (pin 28) low, SMS0
(pin 18) high, and SMS1 (pin 19) low, as shown in Figure 4C.
This mode of operation is identical to Serial Mode 1, except
that each device now has one of 32 unique addresses
determined by the state of pins 20-23 and 17, as shown in
Table 3. This allows multiple HI-7159As to be attached to the
same pair of serial lines.
When the microprocessor sends out an Address Byte (Table
4) that matches one of the HI-7159As’ hardwired addresses,
that particular HI-7159A is selected for all further I/O until
another Address Byte with a different address is
transmitted.
TABLE 3. HARDWARE ADDRESS SELECTION FOR MODE 2
PIN 17
PIN 23
PIN 22
PIN 21
PIN 20
B4 (MSB)
B3
B2
B1
B0 (LSB)
Reading the HI-7159A
Despite the wide variety of interface options available on the
HI-7159A, the procedure for communicating with it is
essentially the same in all four modes. (Serial Mode 2 differs
from the rest in two respects: the chip to be communicated
with must first be sent an address byte to select it, and the
digit bytes are sent one by one, for a total of six bytes,
instead of in pairs.) There are two types of bytes that can be
sent to the converter, commands and requests. A command
byte (Table 5) sets the parameters of and initiates a
conversion. Those parameters are: continuity of the
conversion (single or continuous), resolution (51/2 or 41/2
digits), and type of conversion (Compensated,
Uncompensated, or Error Only). Bit D0 = 0 indicates that this
is a command byte and a new conversion(s) should be
started.
A request byte (Table 6) asks for either the status of the
converter or the result of a conversion. All bits of a request
should be set to 0 except D3, D2, and D0. D3 and D2
determine the type of request (status or digit pair), and D0 =
1 indicates to the HI-7159A that this is a request byte. Serial
Mode 2 uses a slightly modified request byte, shown in Table
7, allowing it to individually select each of the six digit bytes.
Upon receipt of a request, the HI-7159A will respond with
either a status or a digit byte. The status byte (Table 8)
returns the current state of the converter. Bit D6 = 1
indicates that a new conversion has been completed since
the last time the status byte was read. Bit D6 is cleared after
it is read. Bit D4 shows the current continuity (single or
continuous). Bit D3 indicates the resolution (51/2 or 41/2
digits) of the conversion, and bits D2 and D1 indicate the
type (Compensated, Uncompensated, or Error Only). Bit
D0 = 0 indicates that there was no parity error detected in
the last request byte.
The three digit bytes (Table 9) each contain two nibbles
representing two digits of the conversion. The sixth nibble
contains the MSD (most significant digit), polarity
(1 = positive) and overrange (1 = overrange) information. In
Serial Mode 2 the digits (Table 10) are requested and
received individually, so a total of six requests and six reads
is necessary to obtain all 51/2 digits.
TABLE 4. SERIAL MODE 2 ADDRESS BYTE FORMAT (SENT TO HI-7159A)
ADDRESS BIT
(RESERVED)
(MSB)
(LSB)
D7
D6
D5
D4
D3
D2
D1
D0
1
0
0
B4
B3
B2
B1
B0
TABLE 5. COMMAND BYTE FORMAT (SENT TO HI-7159A)
(RESERVED)
CONTINUITY
D7
D6
D5
0
0
0
RESOLUTION
D4
CONVERSION TYPE
D3
COMMAND BIT
D2
D1
D0
0
Single
0
51/2
1
Comp
1
1
Continuous
1
41/2
0
Uncomp
1
0
Error Only
0
1
TABLE 6. REQUEST BYTE FORMAT, PARALLEL AND SERIAL MODE 1 (SENT TO HI-7159A)
(RESERVED)
BYTE REQUEST
D7
D6
D5
D4
0
0
0
0
8
(RESERVED)
REQUEST BIT
D3
D2
D1
D0
Digit Pair 0, 1
0
0
0
1
Digit Pair 2, 3
0
1
Digit Pair 4, 5
1
0
Converter Status
1
1
HI-7159A
TABLE 7. REQUEST BYTE FORMAT, SERIAL MODE 2 (SENT TO HI-7159A)
(RESERVED)
BYTE REQUEST
D7
D6
D5
D4
0
0
0
0
REQUEST BIT
D3
D2
D1
D0
Digit 0
0
0
0
1
Digit 1
0
0
1
Digit 2
0
1
0
Digit 3
0
1
1
Digit 4
1
0
0
Digit 5
1
0
1
Converter Status
1
1
0
TABLE 8. STATUS BYTE FORMAT (RECEIVED FROM HI-7159A)
CONVERTER
UPDATE STATUS
(†)
D7
0
(†)
D6
D5
No Update
0
0
Updated
1
CONTINUITY
RESOLUTION
D4
PARITY
ERROR
CONVERSION TYPE
D3
D2
D1
D0
Single
0
51/2
1
Comp
1
1
No
0
Continuous
1
41/2
0
Uncomp
1
0
Yes
1
Error
0
1
(† = Reserved)
TABLE 9. DIGIT BYTE FORMAT, PARALLEL AND SERIAL MODE 1 (RECEIVED FROM HI-7159A)
DIGIT BYTE
D7
D6
D5
D4
D3
D2
D1
D0
Digit Pair 0, 1
MSB1
LSB1
MSB0
LSB0
Digit Pair 2, 3
MSB3
LSB3
MSB2
LSB2
Digit Pair 4, 5
Polarity
(1 = POS)
LSB5
MSB4
LSB4
Overrange
(1 = OR)
MSB5
TABLE 10. DIGIT BYTE FORMAT, SERIAL MODE 2 (RECEIVED FROM HI-7159A)
DIGIT BYTE
D7
D6
D5
D4
D3
Digits 0 - 4
0
0
1
1
MSB
Digit 5
0
0
1
1
Polarity
(1 = POS)
D2
D1
D0
LSB
Overrange
(1 = OR)
MSB
LSB
Single Conversion Mode
Continuous Conversion Mode
The suggested algorithm for reading the HI-7159A in its
single conversion mode of operation is shown in Figure 5.
Essentially it consists of initiating a conversion, waiting until
the conversion is complete, and then reading the results.
Since no further conversions take place, the data may be
read out at any time and at any speed. This is the most
straightforward method of reading the HI-7159A.
Once a command byte is sent to the HI-7159A initiating the
continuous conversion mode, the output data registers will be
updated continuously after every conversion. This makes
obtaining a valid reading more difficult, since the possibility
exists that the current data could be overwritten by a new
conversion before all the digit bytes are read. To prevent this,
the status byte should be read before and after the data is
read from the converter, to ensure that the converter has not
updated during the reads. This is demonstrated in Figure 6.
9
HI-7159A
Percentages in the 20-50% range indicate that it is possible to
get valid data out with very tight code. In all cases the status
byte should be checked before and after the reading to ensure
data integrity.
SEND COMMAND BYTE
(INITIATE SINGLE CONVERSION)
GET STATUS BYTE
TABLE 11. SERIAL MODES 1/2
CONVERSION TYPE
NO
D6 = 1?
YES
GET DIGIT BYTES
CONVERSION RESULT
IS VALID
51/2
UNCOMP
41/2 COMP
41/2
UNCOMP
54%/*
*/*
*/*
*/*
*/*
*/*
*/*
9600
7%/13%
14%/25%
27%/50%
54%/*
19200
4%/7%
7%/13%
14%/25%
27%/50%
BAUD
RATE
51/2 COMP
300
*/*
1200
Crystal Oscillator
FIGURE 5. READING THE HI-7159A IN THE SINGLE
CONVERSION MODE
GET STATUS BYTE
NO
D6 = 1?
The HI-7159A uses a single pin crystal oscillator design
(Figure 7). The crystal is connected between Pin 27 and
VCC ; no load capacitors or other components are
necessary. The user has a choice of crystal frequencies:
2.4576MHz or 2.4MHz. An off-the-shelf 2.4576MHz crystal
works well and provides baud rates of exactly 19.2K, 9600,
1200, and 300. However its total integration period will be
16.28ms, or 0.39ms shorter than a 60Hz cycle. This
effectively reduces the normal mode AC rejection.
+5V
VCC
YES
CRYSTAL
(2MHz TO 2.5MHz)
1
GET DIGIT BYTES
HI-7159A
27
XTAL
GET STATUS BYTE
FIGURE 7. SINGLE-PIN OSCILLATOR
CONVERSION
RESULT IS
VALID
YES
NO
D6 = 0?
CONVERSION
RESULT MAY
BE INVALID:
DISCARD
RESULT
FIGURE 6. READING THE HI-7159A IN THE CONTINUOUS
CONVERSION MODE
Due to the wide range of baud rates available in the serial
modes, some of the lower baud rates will take longer to transfer
the output data than it takes to perform a conversion. In these
cases the continuous mode should not be used. Table 11
shows the percentage of the total conversion time that it takes
to read all the data from the converter for the two serial modes.
These are best case numbers, assuming that the bytes are
transmitted and received end-to-end. An asterisk indicates that
it is impossible to get all the data out within one conversion.
10
A 2.4MHz crystal results in an integration period of 16.67ms,
exactly the length of one 60Hz AC cycle. Normal mode AC
rejection is greatest at this frequency. At 2.4MHz, however,
the Baud rates will be off by -2.34%. This error is not large
enough to cause any errors with most peripherals, and only
applies to operation in Serial Modes 1 and 2.
Communication in Serial Mode 0 and the Parallel Mode is
independent of the crystal frequency. For this mode a
2.4MHz crystal is recommended.
While the oscillator was designed to operate at
2MHz - 2.5MHz, the HI-7159A itself will operate reliably
down to less than 600kHz when driven with an external
clock. Benefits at lower clock frequencies include reduced
rollover error (gain error for negative input voltages) and
lower noise. The baud rates mentioned throughout this data
sheet correspond to a crystal frequency of 2.4576MHz. At
1.2MHz, the actual baud rates will be half the speed they
were at 2.4MHz, i.e., 9600, 4800, 600 and 150 baud. At
600kHz they will be one-fourth.
HI-7159A
It may also be possible to directly program the host’s serial
hardware for operation at nonstandard baud rates, allowing
HI-7159A operation at any arbitrary frequency. For example:
50Hz AC rejection requires a 2MHz clock. At this frequency
the “9600” baud rate becomes 7812.5 baud. The host’s
UART must be programmed with the proper divider to
operate at this baud rate. The data clock (see Figure 2) is
defined as 16 times the baud rate, so the data clock of this
configuration would be 125kHz. The data clock can also be
determined by dividing the oscillator (clock) frequency by the
correct divider from Table 12.
TABLE 12. CRYSTAL DIVIDER RATIOS
+5V
-5V
1
CRYSTAL DIVIDER
“300”
512
“1200”
128
“9600”
16
“19200”
8
27
14
2
VREF HI
9
3
REF LO
10
VIN HI
VIN LO
BAUD RATE SELECTED
XTAL
VCC
CINT
INT OUT
INT IN
BUF OUT
HI-7159A
12
5
13
6
11
8
26
RINT
4
7
AGND
VEE
CREF - GUARD
CREFCREF
CREF+
CREF+ GUARD
DGND
AGND
The following equation determines the divider needed to
operate the HI-7159A at any given crystal frequency:
f CLOCK ( 7159A )
f CRYSTAL ( Host UART )
-------------------------------------------- = ---------------------------------------------------------------- = Data Clock
Divider ( 7159A )
Divider ( Host UART )
Once determined, the new divider must be written directly to
the Host’s UART. Most PC compatibles use an 8250 UART with
a 1.8432MHz crystal, so the proper divider for the 2MHz
example given above would be 15. Again, these considerations
apply only to Serial Modes 1 and 2. Parallel and Serial Mode 0
communication rates are independent of crystal frequency.
Conversion Time
The conversion time of the HI-7159A is a function of the
crystal frequency and the type of conversion being made.
The conversion times for fCLOCK = 2.4MHz are shown in
Table 13. At other clock frequencies the times may be
calculated from the following formula:
C
t CONV = --------------------f CLOCK
where the constant C is determined from Table 13.
TABLE 13. CONVERSION TIMES
CONVERSION TYPE
51/
f = 2.4MHz
C
COMP
51/2
UNCOMP
41/2
COMP
41/2
UNCOMP
133ms
66.7ms
33.3ms
16.7ms
320,000
160,000
80,000
40,000
2
Component Selection
Three external passive components must be chosen for the
HI-7159A: the integrating capacitor (CINT), the integrating
resistor (RINT), and the reference capacitor (CREF). They are
chosen based on the crystal frequency, the reference voltage
(VREF), and the desired integrating current. Figure 8 illustrates
the analog components necessary for the HI-7159A to function.
11
REFERENCE
CAPACITOR
GUARD
RINGS
DGND
FIGURE 8. ANALOG COMPONENTS AND INPUTS
TABLE 14. RECOMMENDED COMPONENT VALUES vs
CLOCK FREQUENCY
fCLOCK
RINT
CINT
CREF
2.4MHz
400kΩ
0.01µF
1.0µF
1.2MHz
360kΩ
0.022µF
2.2µF
600kHz
330kΩ
0.047µF
4.7µF
NOTE: CINT MUST be a high quality polypropylene capacitor or
performance may be degraded.
The reference capacitor and integrating components can
either be selected from Table 14, or calculated from the
following equations.
CREF acts as a voltage source at different times during a
conversion. Its value is determined by two considerations: it
must be small enough to be fully charged from its
discharged state at power-on; yet it also must be large
enough to supply current to the circuit during conversion
without significantly drooping from its initial value. For
2.4MHz operation, a 1µF capacitor is recommended. The
equation for other frequencies is:
2.5
C REF = --------------------f CLOCK
The values of RINT and CINT are selected by choosing the
maximum integration current and the maximum integrator
output voltage swing. The maximum integration current and
voltage swing occurs when VIN = full scale = 2 X VREF. The
recommended integration current for the HI-7159A is
5mA - 10mA. This will help determine the value of RINT,
since:
V IN
I INT = ------------R INT
V IN
so R INT = ----------- ,
I INT
where VIN = VIN HI - VIN LO = 2 x VREF.
HI-7159A
Therefore values of RINT should be between 200kΩ and
400kΩ. The exact value of RINT may be altered to get the
exact integrator swing desired after choosing a standard
capacitor value for CINT.
( V IN ) ( t INT )
V SWING = ------------------------------------( R INT ) ( C INT )
-100,000
-200,012
COUNTS
-200,000
-2
-1
0
INPUT (V)
1
2
CREF Guard Pins
( V IN ) ( t INT )
C INT = ----------------------------------------------( R INT ) ( V SWING )
where VSWING is the maximum output voltage swing of the
integrator, VIN is the full scale input voltage (VIN HI - VIN LO)
to the converter (equal to 2 X VREF), and tINT is the time in
which VIN is integrated. The best results are achieved when
the maximum integrator output voltage is made as large as
possible, yet still less than the nonlinear region in the vicinity
of the power supply limit. A full scale output swing of about
3V provides the greatest accuracy and linearity.
NOTE: The integrator is auto-zeroed to the voltage at VIN LO . If VIN
LO is negative with respect to AGND, the integrator will have | VIN LO
| less headroom for positive input voltages (inputs where VIN
HI - VIN LO > 0). If VIN LO is positive with respect to AGND, the integrator will have | VIN LO | less headroom for negative input voltages
(inputs where VIN HI - VIN LO < 0). In most applications VIN LO is at
or near AGND and the above equations will be adequate. In applications where VIN LO may be more than 0.1V away from AGND, it
should be included in the integrator swing considerations. The following formula combines all the above considerations:.
( V IN HI – V IN LO ) ( 10, 000 )
V IN LO – ----------------------------------------------------------------------- ≤ 3V
(R
)(C
)(f
)
INT
000,000
FIGURE 9. TYPICAL HI-7159A TRANSFER CHARACTERISTIC
Solving for CINT yields:
INT
100,000
OUTPUT COUNT
The most critical component in any integrating A/D converter
is the integrating capacitor, CINT. For a converter of this
resolution, it is imperative that this component perform as
closely to an ideal capacitor as possible. Any amount of
leakage or dielectric absorption will manifest itself as
linearity errors. For this reason CINT must be a high quality
polypropylene capacitor. Use of any other type may degrade
performance. The value of CINT is determined by the
magnitude of the desired maximum integrator output voltage
swing as shown below:
200,000
OSC
Gain Error Adjustments
While the HI-7159A has a very linear transfer characteristic
in both the positive and negative directions, the slope of the
line is slightly greater for negative inputs than for positive.
This results in the transfer characteristic shown in Figure 9.
One end point of this curve, typically the positive side, can
be adjusted to zero error by trimming the reference voltage.
The other (negative) side will have a fixed gain error. This
error can be removed in software by multiplying all negative
readings by a scale factor, determined by dividing the ideal
full scale reading (-200,000 counts) by the actual full scale
reading when VIN = -2.00000V.
12
Depending on the polarity of the input signal, either the
negative or the positive terminal of the reference capacitor
will be connected to AGND to provide the correct polarity for
reference deintegration. In systems where VREF LO is tied
to analog ground, the reference capacitor is effectively
shifted down by | VREF | for positive input voltages, and is
not shifted at all for negative input voltages. This shift can
cause some charge on the reference capacitor to be lost
due to stray capacitance between the reference capacitor
leads and ground traces or other fixed potentials on the
board. The reference voltage will now be slightly smaller for
positive inputs. This difference in reference voltages for
positive and negative inputs appears as rollover error.
The HI-7159A provides two guard ring outputs to minimize
this effect. Each guard ring output is a buffered version of the
voltage at its respective CREF pin. If the traces going to the
CREF pins and under CREF itself are surrounded by their
corresponding guard rings, no charge will be lost as CREF is
moved. Figure 10 shows two slightly different patterns. The
first one is for capacitors of symmetrical construction, the
second is for capacitors with outside foils (one end of the
capacitor is the entire outside.
(5) CREF- GUARD
(6) CREFHI -7159A
(7) CREF+
(8) CREF+ GUARD
(5) CREF-
GUARD
(6) CREF(7) CREF+
HI -7159A
(8) CREF+ GUARD
FIGURE 10. TYPICAL GUARD RING LAYOUT
HI-7159A
Die Characteristics
PASSIVATION:
Type: PSG/Nitride
Thickness: 15kÅ ±1kÅ
DIE DIMENSIONS:
5817µm x 3988µm
Metallization Mask Layout
METALLIZATION:
Type: SiAl
Thickness: 10kÅ ±1kÅ
HI-7159A
BUF
OUT
INT
IN
INT
OUT
VCC
VCC
SEL
XTAL
DGND
P7/BRS1
P6/BRS0
CREF GUARD
P5/SAD3
P4/SAD2
P3/SAD1
CREF CREF +
P2/SAD0
P1/SMS1
CREF +
GUARD
VREF
HI
VREF
P0/SMS0
LO
AGND VIN VIN VEE
HI
LO
13
RD/RXD
WR/TWD
CS/SAD4
HI-7159A
Dual-In-Line Plastic Packages (PDIP)
E28.6 (JEDEC MS-001-BF ISSUE D)
N
28 LEAD NARROW BODY DUAL-IN-LINE PLASTIC
PACKAGE
E1
INDEX
AREA
1 2 3
N/2
INCHES
-B-
-AE
D
BASE
PLANE
-C-
A2
SEATING
PLANE
A
C
L
L
D1
eA
A1
D1
e
B1
eC
B
0.010 (0.25) M
C A B S
C
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.250
-
6.35
4
A1
0.015
-
0.39
-
4
A2
0.125
0.195
3.18
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.030
0.070
0.77
1.77
8
C
0.008
0.015
D
1.380
1.565
D1
0.005
-
0.13
E
0.600
0.625
15.24
15.87
6
E1
0.485
0.580
12.32
14.73
5
e
0.204
0.381
35.1
0.100 BSC
-
39.7
5
-
5
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
6
eB
-
0.700
-
17.78
7
L
0.115
0.200
2.93
5.08
4
N
28
28
9
Rev. 0 12/93
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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14
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