AVAGO AFBR

AFBR-59R5LZ
Digital Diagnostic 2x7 SFF 850 nm 4.25/2.125/1.0625 GBd,
RoHS-Compliant Optical Transceiver
Data Sheet
Description
Features
Avago Technologies’ AFBR-59R5LZ optical transceiver
supports high-speed serial links over multimode optical
fiber at signaling rates up to 4.25 GBd. Compliant with
the Small Form Factor (SFF) Multi Source Agreement
(MSA) 2x5/2x10 mechanical specifications for LC Duplex
transceivers, ANSI Fibre Channel FC-PI and IEEE 802.3 for
gigabit applications the part is electrically interoperable
with 2x5 and 2x6 conformant devices. The AFBR-59R5LZ
is dimensionally compliant with the SFF MSA form factor
with the exception of two additional pins for communicating with the diagnostic interface.
• Fully RoHS Compliant
As an enhancement to the conventional SFF 2x5 interface
defined in the SFF MSA (Multi-Source Agreement), the
AFBR-59R5LZ is compliant to SFF-8472 (digital diagnostic
interface for optical transceivers). Using the 2-wire serial
interface defined in the SFF-8472 MSA, the AFBR-59R5LZ
provides real time temperature, supply voltage, laser bias
current, laser average output power and received average
input power.
This information is in addition to conventional SFP/GBIC
base data. The digital diagnostic interface also adds the
ability to disable the transmitter (TX_DISABLE), monitor for Transmitter Faults (TX_FAULT) and monitor for
Receiver Signal Detect (Sig_Det). This 2x7 package also
includes one dedicated ‘hard’ pin for TX_FAULT.
Application
• Fibre Channel and iSCSI HBA Cards
Related Products
• AFBR-57R5APZ: 850 nm +3.3 V LC SFP for 4.25/2.125/1.0625 GBd Fibre Channel
• Diagnostic Features Per SFF-8472 “Diagnostic
Monitoring Interface for Optical Transceivers”
• Real time monitoring of:
- Transmitted Optical Power
- Received Optical Power
- Laser Bias Current
- Temperature
- Supply Voltage
• Wide Temp and supply voltage operation
(-10°C to 85°C) (3.3 +/- 10%)
• Transceiver Specifications per SFF 2x5 Multi-Source
Agreement and SFF-8472 (revision 9.3)
- 4.25 GBd Fibre Channel operation
for FC-PI 400-M5-SN-I and 400-M6-SN-I
- 2.125 GBd Fibre Channel operation
for FC-PI 200-M5-SN-1 and 200-M6-SN-I
- 1.0625 GBd Fibre Channel operation
for FC-PI 100-M5-SN-I and 100-M6-SN-I
• Link Lengths at 4.25 Gbd:
- 150 m with 50 um MMF, 70 m with 62.5 um MMF
• Link Lengths at 2.125 Gbd
- 300m with 50um MMF, 150m with 65.5um MMF
• Link Lengths at 1.0625 GBd:
- 500 m with 50 µm MMF, 300 m with 62.5 µm MMF
• LC Duplex optical connector interface conforming
to ANSI TIA/EIA604-10 (FOCIS 10A)
• 850nm Vertical Cavity Surface Emitting Laser
(VCSEL) Source Technology
• IEC 60825-1 Class 1/CDRH Class 1 laser eye safe
• Compatible with Gigabit Ethernet
Patent - www.avagotech.com/patents
Digital Diagnostic Interface and Serial Identification
Compliance Prediction:
The 2-wire serial interface is based on ATMEL AT24C01A
series EEPROM protocol and signaling detail. Conventional EEPROM memory, bytes 0-255 at memory address
0xA0, is organized in compliance with SFF-8074i. New
digital diagnostic information, bytes 0-255 at memory
address 0xA2, is compliant to SFF-8472. The new diagnostic information provides the opportunity for Predictive Failure Identification, Compliance Prediction, Fault
Isolation and Component Monitoring.
Compliance prediction is the ability to determine if an
optical transceiver is operating within its operating and
environmental requirements. AFBR-59R5LZ devices
provide real-time access to transceiver internal supply
voltage and temperature, allowing a host to identify
potential component compliance issues. Received
optical power is also available to assess compliance of
a cable plant and remote transmitter. When operating
out of requirements, the link cannot guarantee error free
transmission.
The I2C accessible memory page address 0xB0 is used
internally by SFP for the test and diagnostic purposes
and it is reserved.
Predictive Failure Identification
The predictive failure feature allows a host to identify
potential link problems before system performance is
impacted. Prior identification of link problems enables
a host to service an application via “fail over” to a redundant link or replace a suspect device, maintaining system
uptime in the process. For applications where ultra-high
system uptime is required, a digital SFF provides a means
to monitor two real-time laser metrics associated with
observing laser degradation and predicting failure: average laser bias current (Tx_Bias) and average laser optical
power (Tx_Power).
Fault Isolation
The fault isolation feature allows a host to quickly pinpoint the location of a link failure, minimizing system
downtime. For optical links, the ability to identify a fault
at a local device, remote device or cable plant is crucial
to speeding service of an installation. AFBR-59R5LZ realtime monitors of Tx_Bias, Tx_Power, Vcc, Temp and Rx
average power can be used to assess local transceiver
current operating conditions. In addition, status flags Tx
Disable and Rx Signal Detect are mirrored in memory and
available via the two-wire serial interface.
OPTICAL INTERFACE
ELECTRICAL INTERFACE
RECEIVER
LIGHT FROM FIBER
PHOTO-DETECTOR
AMPLIFICATION
& QUANTIZATION
RD+ (RECEIVE DATA)
RD- (RECEIVE DATA)
Rx LOSS OF SIGNAL
CONTROLLER & MEMORY
MOD-DEF2 (SDA)
MOD-DEF1 (SCL)
MOD-DEF0
TRANSMITTER
LIGHT TO FIBER
VCSEL
LASER
DRIVER &
SAFETY
CIRCUITRY
TX_DISABLE
TD+ (TRANSMIT DATA)
TD- (TRANSMIT DATA)
TX_FAULT
Figure 1. Transceiver Functional Diagram
2
Component Monitoring
Eye Safety Circuit
The AFBR-59R5LZ real-time monitors of Tx_Bias, Tx_Power, Vcc, Temp and Rx Average Power may potentially be
used as a debugging aid for system installation and design, and transceiver parametric evaluation for factory or
field qualification. For example, temperature per module
can be observed in high-density applications to facilitate
thermal evaluation of blades and systems.
The AFBR-59R5LZ provides Class 1 (single fault tolerant)
eye safety by design and has been tested for compliance
with the requirements listed in Table 1. The eye safety
circuit continuously monitors optical output power levels
and will disable the transmitter upon detecting an unsafe condition beyond the scope of Class 1 certification.
Such unsafe conditions can be due to inputs from the
host board (Vcc fluctuation, unbalanced code) or a fault
within the transceiver.
Transmitter Section
The transmitter section contains 850nm VCSEL (Vertical
Cavity Surface Emitting Laser) light source, located at the
optical interface which mates with the LC optical connector. The VCSEL is driven by a custom IC which uses
the incoming differential (PECL compatible) high speed
logic signal to modulate laser diode driver current. This
Tx laser driver circuit regulates optical output power at a
constant level provided the incoming data pattern is dc
balanced (8B/10B code, for example).
Receiver Section
Transmit Disable (Tx_Disable)
The post-amplification IC also includes the transition
detection circuitry which monitors the ac level of incoming optical signals and provides a TTL status signal to the
host. An adequate optical input results in high signal
detect output while a low signal detect output indicates
an unusable optical input. The signal detect thresholds
are set so that a low output indicates a definite optical
fault has occurred. Signal Detect can be monitored via
the two-wire serial (address A2h, byte 110, bit 1).
The AFBR-59R5LZ accepts a TTL transmit disable control
signal input which shuts down the transmitter. A high
signal implements this function while a low signal allows
normal transceiver operation. In the event of a fault (e.g.
eye safety circuit activated), cycling this control signal
resets the module as depicted in Figure 5. An internal
pull down resistor enables the laser if the line is not connected on the host board. Host systems should allow
a 10ms interval between successive assertions of this
control signal. Tx_Disable can be asserted via the twowire serial interface (address A2h, byte 110, bit 6) and
monitored (address A2h, byte 110, bit 7).
The contents of A2h, byte 110 bit 6 are logic Or’d with the
TX_DISABLE pin to control the transmit output.
3
The receiver section contains a PIN photodiode and custom transimpedance preamplifier, located at the optical
interface which mates with the LC optical connector. The
output is fed to a custom IC that provides post-amplification and quantization.
Signal Detect (Sig_Det)
Functional Data I/O
Caution
The AFBR-59R5LZ interfaces with the host circuit board
through fourteen I/O pins (2x7) identified by function
in Table 2. These pins are sized for the use in boards between 0.062 in. and 0.100 in. thick. The board layout for
this interface is depicted in Figure 7.
There are no user serviceable parts nor maintenance
requirements for the AFBR-59R5LZ. All mechanical
adjustments are made at the factory before shipping.
Tampering with, modifying, misusing or improperly handling the AFBR-59R5LZ will void the product warranty.
It may also result in improper operation and possibly
overstress the laser source. Performance degradation
or device failure may result. Connection of the AFBR59R5LZ to a light source not compliant to IEEE 802.3 or
ANSI FC-PI specifications, operating above the maximum
operating conditions or in a manner inconsistent with it’s
design and function may result in exposure to hazardous
light radiation and may constitute an act of modifying or
manufacturing a laser product.
The AFBR-59R5LZ transmit and receive interfaces are
PECL compatible. To simplify board requirements,
transmitter bias resistors and ac coupling capacitors are
incorporated into the transceiver module and so are not
required on the host board. The Tx_Disable and Signal
Detect lines require TTL lines on the host board if they
are to be utilized. The transceiver will operate normally if
these lines are not connected on the host board.
Figure 2 depicts the recommended interface circuit to
link the AFBR-59R5LZ to the supporting physical layer
ICs. Timing for MSA compliant control signals implemented in the transceiver are listed on Page 12 and
diagramed in Figure 5.
PCB Assembly Process Compatibility
The AFBR-59R5LZ is compatible with industry standard
wave solder and aqueous wash processes as detailed on
Page 13. The transceiver is shipped with a process plug
to keep out impinging liquids, but is not intended to be
immersed. After assembly, the process plug should be
kept in place as a dust plug when the transceiver is not
in use.
4
Persons performing such an act are required by law to
re-certify and re-identify the laser product under the
provisions of U.S. 21 CFR (Subchapter J) and the TUV.
Ordering Information
Please contact your local field sales engineer or one of
Avago Technologies franchised distributors for ordering
information. For technical information, please visit Avago Technologies’ WEB page at www.avagotech.com or
contact Avago Technologies Customer Response Center
at 1-800-235-0312. For information related to SFF Committee documentation visit www.sffcommittee.org
Regulatory Compliance
The AFBR-59R5LZ complies with all applicable laws and
regulations as detailed in Table 1. Certification level
is dependent on the overall configuration of the host
equipment. The transceiver performance is offered as a
figure of merit to assist the designer.
Electrostatic Discharge (ESD)
The AFBR-59R5LZ is compatible with ESD levels found
in typical manufacturing and operating environments
as described in Table 1. In the normal handling and operation of optical transceivers, ESD is of concern in two
circumstances.
If the optical interface is exposed to the exterior of host
equipment cabinet, the transceiver may be subject to
system level ESD requirements.
Electromagnetic Interference (EMI)
Equipment incorporating gigabit transceivers is typically
subject to regulation by the FCC in the United States, TUV
and CENELEC EN55022 (CISPR 22) in the European Union
and VCCI in Japan. The AFBR-59R5LZ’s compliance to
these standards is detailed in Table 1. The metal housing
and shielded design of the AFBR-59R5LZ minimize the
EMI challenge facing the equipment designer.
Flammability
The first case is during handling of the transceiver prior
to soldering onto the host board. To protect the device,
it’s important to use normal ESD handling precautions.
These include using grounded wrist straps, workbenches
and floor mats wherever the transceiver is handled.
The AFBR-59R5LZ optical transceiver is made of metal
and high strength, heat resistant, chemical resistant and
UL 94V-0 flame retardant plastic.
The second case to consider is static discharges to the
exterior of the host equipment chassis after assembly.
Due to its shielded design, the EMI immunity of the
AFBR-59R5LZ exceeds typical industry standards.
EMI Immunity
Table 1. Regulatory Compliance
Feature
Test Method
Performance
Electrostatic Discharge (ESD)
to the Electrical Pins
MIL-STD-883C
Method 3015.4
Class 1 (> 2000 Volts)
Electrostatic Discharge (ESD)
to the Duplex LC Receptacle
Variation of IEC 61000-4-2
Typically withstands at least 15 kV without damage when the duplex LC connector receptacle is
contacted by a Human Body Model probe.
Fulfills Live Traffic ESD testing up to 8 kV with
less than 1 errored second.
Electromagnetic Interference
(EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class 1
System margins are dependent on customer
board and chassis design.
Immunity
Variation of IEC 61000-4-3
Typically shows no measurable effect from a 10
V/m field swept from 10 MHz to 1 GHz applied
to the transceiver without a chassis enclosure
Laser Eye Safety and
Equipment Type Testing
US FDA CDRH AEL Class 1
US21 CFR, Subchapter J per Paragraphs
1002.10 and 1002.12.
CDRH certification #9720151-57
TUV file #R72102088.01
BAUART
¨
GEPRUFT
¨
TUV
Rheinland
Product Safety
TYPE
APPROVED
Component Recognition
RoHS Compliance
5
(IEC) EN60825-1: 2007
(IEC) EN60825-2: 2004+A1
(IEC) EN60950-1: 2006+A11
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition for Information Technology
Equipment Including Electrical Business
Equipment
UL File # E173874
Must comply with UL1950 or CUL 1950.
Less than 1000ppm of cadmium, lead, mercury,
hexavalent chromium, polybrominated biphenyls, and polybrominated biphenyl ethers
GND
GND,T
6.8 k
Tx DIS
Tx_DISABLE
Tx FAULT
Tx_FAULT
TD+
0.01 F
100
TDÐ
0.01 F
LASER DRIVER
4.7 k to 10 k
1 H
VCC,T
0.1 F
3.3 V
SERDES IC
PROTOCOL IC
10 F
0.1 F
1 H
10 F
VCC,R
VCC,R
VCC,R
0.1 F
50
50
RD+
0.01 F
100
RD0.01 F
RX_SD
RX_SD
POST AMPLIFIER
3.3 V
GND
GND
4.7 k to 10 k
VCC,R
4.7 k to 10 k
SCL
SDA
Figure 2. Typical Application Configuration
1 µH
VCCT
0.1 µF
1 µH
3.3 V
VCCR
0.1 µF
SFF MODULE
10 µF
0.1 µF
10 µF
HOST BOARD
NOTE: INDUCTORS MUST HAVE LESS THAN 1 W SERIES RESISTANCE TO LIMIT VOLTAGE DROP TO THE SFF MODULE.
Figure 3. Recommended Power Supply Filter
6
SCL
SDA
Table 2. Pin Description
Pin
Name
Function/Description
Notes
1
VEER
Receiver Signal Ground
7
2
VCCR
Receiver Power Supply: +3.3V
5
3
SD
TTL Signal Detect: Active High
3
4
RD-
Received Data Out Bar
4
5
RD+
Received Data Out
4
6
VCCT
Transmitter Power Supply: +3.3V
5
7
VEET
Transmitter Signal Ground
7
8
TX_DISABLE TTL Transmitter Disable: Active High,
(Open = Enabled)
1
9
TD+
Transmitter Data In
6
10
TD-
Transmitter Data In Bar
6
A
SDA
Serial Interface Data I/O (Mod-def2)
2
B
SCL
Serial Interface Clock Input (Mod-def1)
2
C
NC
D
TX_FAULT
5
4
3
2
1
A
C
6
7
8
9
10
B
D
TOP VIEW
Figure 4. Module pin configuration.
Transmitter Fault Indication - High Indicates a
fault condition
8
Notes:
1. TX_DISABLE is an input that is used to shut down the transmitter optical output. It is pulled down with 6.8 kW internal to the transceiver.
Low (0 – 0.8 V) or Open: Transmitter Enabled
Between (0.8 V and 2.0 V): Undefined
High (2.0 – VCC max): Transmitter Disabled
The TX_DISABLE pin state is logic Or’d with the contents of EEPROM address A2h, byte 110 bit 6 (soft disable control bit) to control the transmit output.
2. The signals SDA and SCL designate the two wire serial interface pins. They must be pulled up with a 4.7 k – 10 kW resistor on the host board.
SCL is the serial clock line of two wire serial interface. SDA is the serial data line of two wire serial interface
3. Signal Detect is a normally high LVTTL output. When high it indicates the received optical power is adequate for normal operation. When
Low, it indicates the received optical power is insufficient to guarantee error free operation. In the low state, the output will be pulled to <
0.8 V.
4. RD-/+ designate the differential receiver outputs. They are ac coupled 100 W differential lines which should be terminated with 100 W differential at the host SerDes input. AC coupling is done inside the transceiver and is not required on the host board. The voltage swing on these
lines will be between 600 and 1600 mV differential (300 – 800 mV single ended) when properly terminated.
5.VCCR and VCCT are the receiver and transmitter power supplies. They are defined at the transceiver pins.
6. TD-/+ designate the differential transmitter inputs. They are ac coupled differential lines with 100 W differential termination inside the module. The ac coupling is done inside the module and is not required on the host board. The inputs will accept differential swings of 400 – 2400
mV (200 – 1200 mV single ended), though it is recommended that values between 500 and 1200 mV differential (250 – 600 mV single ended)
be used for best EMI performance.
7. Transmitter and Receiver Ground are common internally on the transceiver PCB. They are electrically connected to signal ground within the
transceiver.
8. TX_FAULT is an open collector/drain output, which must be pulled up with a 4.7k – 10kW resistor on the host board. When high, this output
indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.
7
Table 3. Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Storage Temperature
TS
-40
+100
°C
1, 2
Case Operating Temperature
TC
-40
+100
°C
1, 2
110
psi
+260
°C
4
Aqueous Wash Pressure
Maximum Wave or Flow Soldering Temperature
TF
Relative Humidity, non condensing
RH
5
95
%
1
Supply Voltage
VCCT, R
-0.5
3.8
V
1, 2, 3
Voltage to any pin
-0.5
3.8
V
VIN
-0.5
VCC + 0.5
V
1
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Case Operating Temperature
TC
-10
+85
°C
5, 6
Supply Voltage
VCCT, R
2.97
3.63
V
6, 7
1.0625
4.25
Gb/s
6
Symbol
Minimum
Maximum
Unit
Notes
PSNR
100
mV
6
TX + RX
Low Speed Input Voltage
Table 4. Recommended Operating Conditions
Data Rate
Table 5. Transceiver Electrical Characteristics
(TC = -10°C to +85C, VCCT, VCCR = 3.3 V ± 10%)
Parameter
AC Electrical Characteristics
Power Supply Noise Rejection (Peak-to-Peak)
DC Electrical Characteristics
Module Supply Current
ICC
210
mA
Power Dissipation
PDISS
765
mW
Low Speed Outputs:
Signal Detect [SD], SDA
Low Speed Inputs:
Transmitter Disable [TX_DIS], SCL, SDA
VOH
VOL
2.0
VCCT, R + 0.3
0.8
V
V
VIH
VIL
2.00
VCC
0.8
V
V
7
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a
short period of time. See Reliability Data Sheet for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
is not implied, and damage to the device may occur over an extended period of time.
3. The module supply voltages, VCCT and VCCR must not differ by more than 0.5 V or damage to the device may occur.
4. Maximum wave or flow soldering temperature should not be applied for more than 10 seconds.
5. Recommended Operating Conditions are those values for which functional performance and device reliability is implied.
6. Filter per SFF specification is required on host board to remove 10 Hz to 4 MHz content.
7. SCL and SDA are to be pulled up externally with a 4.7 k – 10 kW resistor on the host board to 3.3 V.
8
Table 6. Transmitter and Receiver Electrical Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter
Symbol
Minimum
Maximum
Unit
Notes
High Speed Data Input:
VI
400
2400
mV
1
High Speed Data Output:
VO
600
1600
mV
2
Receiver Contributed Total Jitter
(4.25 Gb/s)
TJ
0.26
UI
4
62
ps
Receiver Contributed Total Jitter
(2.125 Gb/s)
TJ
0.262
UI
123
ps
Receiver Contributed Total Jitter
(1.0625 Gb/s)
TJ
0.218
UI
205
ps
Receiver Electrical Output Rise & Fall Times
(20-80%)
tr, tf
150
ps
Transmitter Differential Input Voltage (TD +/-)
Receiver Differential Output Voltage (RD +/-)
50
4
4
5
Notes:
1. Internally ac coupled and terminated (100 Ohm differential).
2. Internally ac coupled but requires an external load termination (100 Ohm differential).
3. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern
4. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter
(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed
RJ is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ
remain within their specified FC-PI maximum limits with the worst case specified component jitter input.
5. 20%-80% electrical rise & fall times measured with a 500 MHz signal utilizing a 1010 data pattern.
9
Table 7. Transmitter Optical Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter
Symbol
Minimum
Unit
Notes
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 4.25 Gb/s
OMA
247
Maximum
µW
8
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 2.125 Gb/s
OMA
196
µW
3
Modulated Optical Output Power (OMA)
(Peak-to-Peak) 1.0625 Gb/s
OMA
156
µW
4
Average Optical Output Power
Pout
-9.0
dBm
1, 2
Center Wavelength
lC
830
Spectral Width - rms
860
nm
s,rms
0.85
nm
Optical Rise/Fall Time
tr, tf
90
ps
RIN 12 (OMA)
RIN
-118
dB/Hz
Transmitter Contributed Total Jitter (4.25 Gb/s)
TJ
0.25
UI
60
ps
0.254
UI
120
ps
0.267
UI
251
ps
-35
dBm
Transmitter Contributed Total Jitter (2.125 Gb/s)
Transmitter Contributed Total Jitter (1.0625 Gb/s)
Pout TX_DISABLE Asserted
TJ
TJ
POFF
7
6
6
6
Notes:
1. Max Pout is the lesser of Class 1 safety limits (CDRH and EN 60825) or receiver power max.
2. Into 50/125 µm (0.2 NA) and 62.5/125 µm (0.275 NA)multimode optical fiber.
3. An OMA of 196 is approximately equal to an average power of –9 dBm assuming an Extinction Ratio of 9 dB.
4. An OMA of 156 is approximately equal to an average power of –10 dBm assuming an Extinction Ratio of 9 dB.
5. Contributed DJ is measured on an oscilloscope in average mode with 50% threshold and K28.5 pattern.
6. Contributed TJ is the sum of contributed RJ and contributed DJ. Contributed RJ is calculated for 1x10-12 BER by multiplying the RMS jitter
(measured on a single rise or fall edge) from the oscilloscope by 14. Per FC-PI (Table 13 - MM jitter output, note 1), the actual contributed RJ
is allowed to increase above its limit if the actual contributed DJ decreases below its limits, as long as the component output DJ and TJ remain within their specified FC-PI maximum limits with the worst case specified component jitter input.
7. Measured 20-80%.
8. An OMA of 247 µW is approximately equal to an average power of –8 dBm,avg assuming an Extinction Ratio of 9 dB.
10
Table 8. Receiver Optical Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter
Symbol
Input Optical Power [Overdrive]
PIN
Input Optical Modulation Amplitude (p-p)
4.25 Gb/s
OMA
61
µW, OMA
6, 7
Input Optical Modulation Amplitude (p-p)
2.125 Gb/s
OMA
49
µW, OMA
1, 6
Input Optical Modulation Amplitude (p-p)
1.0625 Gb/s
OMA
31
µW, OMA
2, 6
Stressed receiver sensitivity (OMA)
4.25 Gb/s
138
µW, OMA
50/125 µm fiber, 8
148
µW, OMA
62.5/125 µm fiber, 8
Stressed receiver sensitivity (OMA)
2.125 Gb/s
96
µW, OMA
50/125 µm fiber, 3
109
µW, OMA
62.5/125 µm fiber, 3
Stressed receiver sensitivity (OMA)
1.0625 Gb/s
55
µW, OMA
50/125 µm fiber, 4
67
µW, OMA
62.5/125 µm fiber, 4
Return Loss
12
dB
Signal Detect - Deassert
Minimum
PD
-30
Signal Detect - Assert
Loss of Signal Hysteresis
PA
PA - PD
0.5
Maximum
Unit
0
dBm, avg
27.5
uW, OMA
-17.5
dBm, avg
31
uW, OMA
-17.0
dBm, avg
Notes
5
5
dB
Notes:
1. 50/125 µm. An OMA of 49 is approximately equal to an average power of –15 dBm with an Extinction Ratio of 9dB.
2. 50/125 µm. An OMA of 31 is approximately equal to an average power of –17 dBm with an Extinction Ratio of 9 dB.
3. 2.125 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.26 dB for 50 µm fiber and 2.03 dB for 62.5 µm fiber. Stressed receiver
DCD component min (at TX) is 40 ps.
4. 1.0625 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 0.96 dB for 50 µm fiber and 2.18 dB for 62.5 µm fiber. Stressed receiver
DCD component min (at TX) is 80 ps.
5. These average power values are specified with an Extinction Ratio of 9 dB. The signal detect circuitry responds to valid 8B/10B encoded peak
to peak input optical power, not average power.
6. Input Optical Modulation Amplitude (commonly known as sensitivity) requires a valid 8B/10B encoded input.
7. 50/125um. An OMA of 61 µW is approximately equal to an average power of –14 dBm with an Extinction Ratio of 9 dB.
8. 4.25 Gb/s stressed receiver vertical eye closure penalty (ISI) min is 1.67 dB for 50 µm fiber and 2.14 dB for 62.5 µm fiber. Stressed receiver DCD
component min (at TX) is 20 ps.
11
Table 9. Transceiver Soft Diagnostic Timing Characteristics
(TC = -10°C to +85°C, VCCT, VCCR = 3.3 V ± 10%)
Parameter
Symbol
Maximum
Unit
Notes
Hardware TX_DISABLE Assert Time
t_off
Minimum
Typical
10
µs
1
Hardware TX_DISABLE Negate Time
t_on
1
ms
2
Time to initialize, including reset of
TX_FAULT
t_init
300
ms
3
Hardware TX_DISABLE to Reset
t_reset
µs
4
Hardware Signal_Detect Deassert Time
t_loss_on
100
µs
5
Hardware Signal_Detect Assert Time
t_loss_off
100
µs
6
Software TX_DISABLE Assert Time
t_off_soft
100
ms
7
Software TX_DISABLE Negate Time
t_on_soft
100
ms
8
Software Tx_FAULT Assert Time
t_fault_soft
100
ms
9
Software Signal_Detect DeAssert Time
t_loss_on_soft
100
ms
10
Software Signal_Detect Assert Time
t_loss_off_
soft
100
ms
11
Analog parameter data ready
t_data
1000
ms
12
Serial bus hardware ready
t_serial
300
ms
13
Write Cycle Time
t_write
10
ms
14
Serial ID Clock Rate
f_serial_clock
400
kHz
10
Notes:
1. Time from rising edge of TX_DISABLE to when the optical output falls below 10% of nominal.
2. Time from falling edge of TX_DISABLE to when the modulated optical output rises above 90% of nominal.
3. Time from power on or falling edge of Tx_Disable to when the modulated optical output rises above 90% of nominal.
4. Time TX_DISABLE must be held high to reset the laser fault shutdown circuitry.
5. Time from loss of optical signal to Signal Detect De-Assertion.
6. Time from valid optical signal to Signal Detect Assertion.
7. Time from two-wire interface assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the optical output falls below 10% of nominal. Measured
from falling clock edge after stop bit of write transaction.
8. Time from two-wire interface de-assertion of TX_DISABLE (A2h, byte 110, bit 6) to when the modulated optical output rises above 90% of
nominal.
9. Time from fault to two-wire interface TX_FAULT (A2h, byte 110, bit 2) asserted.
10.Time for two-wire interface de-assertion of Signal Detect (A2h, byte 110, bit 1) from loss of optical signal.
11.Time for two-wire interface assertion of Signal Detect (A2h, byte 110, bit 1) from presence of valid optical signal.
12.From power on to data ready bit asserted (A2h, byte 110, bit 0). Data ready indicates analog monitoring circuitry is functional.
13.Time from power on until module is ready for data transmission over the serial bus (reads or writes over A0h and A2h).
14.Time from stop bit to completion of a 1-8 byte write command.
12
Table 10. PCB Assembly Process Compatibility
Parameter
Symbol
Hand Lead Soldering
Temperature/Time
Wave Soldering and
Aqueous Wash
Minimum
Typical
Maximum
Unit
TSOLD/tSOLD
+ 260/10
°C/sec
TSOLD/tSOLD
+ 260/10
°C/sec
110
psi
Aqueous Wash Pressure
Notes
Table 11. Transceiver Digital Diagnostic Monitor (Real Time Sense) Characteristics
(TC = -10 °C to +85 °C, VCCT, VCCR = 3.3 V ± 10%)
Parameter
Symbol
Min
Units
Notes
Transceiver (Internal)
Temperature Accuracy
TINT
± 3.0
°C
Temperature is measured internal to the transceiver and does
not reflect case temperature.
Valid from = -10°C to +70 °C internal transceiver temperature.
Transceiver (Internal)
Supply Voltage Accuracy
VINT
± 0.1
V
Supply voltage is measured internal to the transceiver and
can, with less accuracy, be correlated to voltage at the SFF Vcc
pin. Valid over 3.3 V ± 10%.
Transmitter Laser DC
Bias Current Accuracy
IBIAS
± 10
%
IBIAS is better than ± 10% of the nominal value.
Transmitted Optical Output Power
Accuracy (AVG - average power)
PT
± 3.0
dB
Coupled into 50/125 µm multimode fiber.
Valid from 100 µW,avg to 500 µW, avg.
Received Optical Input Power
Accuracy (Average power))
PR
± 3.0
dB
Coupled from 50/125 µm multimode fiber.
Valid from 31 µW,OMA to 500 µW,OMA.
13
VCC > 2.97 V
VCC > 2.97 V
Tx_FAULT
Tx_FAULT
Tx_DISABLE
Tx_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_init
t_init
t-init: TX DISABLE NEGATED
t-init: TX DISABLE ASSERTED
Tx_FAULT
Tx_DISABLE
TRANSMITTED SIGNAL
t_off
t_on
t-off & t-on: TX DISABLE ASSERTED THEN NEGATED
OCCURANCE OF FAULT
OCCURANCE OF FAULT
Tx_FAULT
Tx_FAULT
Tx_DISABLE
Tx_DISABLE
TRANSMITTED SIGNAL
TRANSMITTED SIGNAL
t_reset
t_fault
* CANNOT READ INPUT...
t-fault: TX FAULT ASSERTED, TX SIGNAL NOT RECOVERED
t_init*
t-reset: TX DISABLE ASSERTED THEN NEGATED, TX SIGNAL RECOVERED
OCCURANCE OF FAULT
Tx_FAULT
LOS
TRANSMITTED SIGNAL
t_fault
* SFP SHALL CLEAR Tx_FAULT IN
t_init IF THE FAILURE IS TRANSIENT
t_loss_on
t_reset
t-fault: TX DISABLE ASSERTED THEN NEGATED,
TX SIGNAL NOT RECOVERED
t_init*
t-loss-on & t-loss-off
Figure 5. Transceiver Timing Diagrams (Tx_FAULT as reported by A2h Byte 110 Bit 2)
14
OCCURANCE
OF LOSS
OPTICAL SIGNAL
Tx_DISABLE
t_loss_off
Table 12. EEPROM Serial ID Memory Contents – Conventional SFF Memory (Address A0h)
Byte #
Decimal
Data
Hex
Notes
Byte #
Decimal
Data
Hex
Notes
0
02
SFF physical device (soldered device)
37
00
Hex Byte of Vendor OUI 4
1
04
Serial ID function supported
38
17
Hex Byte of Vendor OUI 4
2
07
LC optical connector
39
6A
Hex Byte of Vendor OUI 4
3
00
40
41
“A” - Vendor Part Number ASCII character
4
00
41
46
“F” - Vendor Part Number ASCII character
5
00
42
42
“B” - Vendor Part Number ASCII character
6
00
43
52
“R” - Vendor Part Number ASCII character
7
20
Intermediate distance (per FC-PI)
44
2D
“-” - Vendor Part Number ASCII character
8
40
Shortwave laser w/o OFC (open fiber control)
45
35
“5” - Vendor Part Number ASCII character
9
0C
Multi-mode 50 µm and 62.5 µm optical media
46
39
“9” - Vendor Part Number ASCII character
10
15
100, 200 & 400 MBytes/sec FC-PI speed 1
47
52
“R” - Vendor Part Number ASCII character
11
01
Compatible with 8B/10B encoded data
48
35
“5” - Vendor Part Number ASCII character
12
2B
4300 MBit/sec nominal bit rate (4.25 Gbit/s)
49
--
“*” - Vendor Part Number ASCII character 9
13
00
50
4C
“L” - Vendor Part Number ASCII character
14
00
51
5A
“Z” - Vendor Part Number ASCII character
15
00
52
20
“ “ - Vendor Part Number ASCII character
53
20
“ “ - Vendor Part Number ASCII character
54
20
“ “ - Vendor Part Number ASCII character
16
0F
150m of 50/125 µm fiber @ 4.25GBit/sec 2
17
07
70m of 62.5/125um fiber @ 4.25GBit/sec 3
18
00
55
20
“ “ - Vendor Part Number ASCII character
19
00
56
20
“ “ - Vendor Part Number ASCII character
20
41
“A” - Vendor Name ASCII character
57
20
“ “ - Vendor Part Number ASCII character
21
56
“V” - Vendor Name ASCII character
58
20
“ “ - Vendor Part Number ASCII character
22
41
“A” - Vendor Name ASCII character
59
20
“ “ - Vendor Part Number ASCII character
23
47
“G” - Vendor Name ASCII character
60
03
Hex Byte of Laser Wavelength 5
24
4F
“O” - Vendor Name ASCII character
61
52
Hex Byte of Laser Wavelength 5
25
20
“ “ - Vendor Name ASCII character
62
00
26
20
“ “ - Vendor Name ASCII character
63
27
20
“ “ - Vendor Name ASCII character
64
00
28
20
“ “ - Vendor Name ASCII character
65
1C
29
20
“ “ - Vendor Name ASCII character
66
00
30
20
“ “ - Vendor Name ASCII character
67
00
31
20
“ “ - Vendor Name ASCII character
68-83
Vendor Serial Number ASCII characters 7
32
20
“ “ - Vendor Name ASCII character
84-91
Vendor Date Code ASCII characters 8
33
20
“ “ - Vendor Name ASCII character
92
68
Digital Diagnostics, Internal Cal, Rx Avg Pwr
34
20
“ “ - Vendor Name ASCII character
93
F0
A/W, Soft TX_DISABLE, TX_FAULT & “RX_LOS”
(signal detect)
35
20
“ “ - Vendor Name ASCII character
94
01
SFF-8472 Compliance to revision 9.3
36
00
Checksum for Bytes 0-62 6
Checksum for Bytes 64-94 6
95
96 - 255
Hardware SFF TX_DISABLE, TX_FAULT & SigDet
00
Notes:
1. FC-PI speed 100 MBytes/sec is a serial bit rate of 1.0625 GBit/sec. 200 MBytes/sec is a serial bit rate of 2.125 GBit/sec. 400 MBytes/sec is a serial
bit rate of 4.25 GBit/sec.
2. Link distance with 50/125um cable at 1.0625 Gbit/sec is 500m. Link distance at 2.125 Gbit/sec is 300m.
3. Link distance with 62.5/125um cable at 1.0625 Gbit/sec is 300m. Link distance with 62.5/125um cable at 2.125 Gbit/sec is 150m.
4. The IEEE Organizationally Unique Identifier (OUI) assigned to Avago Technologies is 00-17-6A (3 bytes of hex).
5. Laser wavelength is represented in 16 unsigned bits. The hex representation of 850 (nm) is 0352.
6. Addresses 63 and 95 are checksums calculated (per SFF-8472 and SFF-8074i) and stored prior to product shipment.
7. Addresses 68-83 specify the AFBR-59R5LZ ASCII serial number and will vary on a per unit basis.
8. Addresses 84-91 specify the AFBR-59R5LZ ASCII date code and will vary on a per date code basis.
9. For AFBR-59R5LZ, address 49-51 contains “L”, “Z”, “ “ (Hex 4C 5A and 20). For AFBR-59R5ALZ, address 49-51 contains “A”, “L”, “Z” (Hex 41 4C 5A).
15
Table 13. EEPROM Serial ID Memory Contents – Enhanced Feature Set Memory (Address A2h)
Byte #
Decimal
Notes
Byte #
Decimal
Notes
Byte #
Decimal
Notes
0
Temp H Alarm MSB1
26
Tx Pwr L Alarm MSB4
104
Real Time Rx Pwr, MSB5
1
Temp H Alarm LSB1
27
Tx Pwr L Alarm LSB4
105
Real Time Rx Pwr, LSB5
2
Temp L Alarm MSB1
28
Tx Pwr H Warning MSB4
106
Reserved
3
Temp L Alarm LSB1
29
Tx Pwr H Warning LSB4
107
Reserved
4
Temp H Warning MSB1
30
Tx Pwr L Warning MSB4
108
Reserved
5
Temp H Warning LSB1
31
Tx Pwr L Warning LSB4
109
Reserved
6
Temp L Warning MSB1
32
Rx Pwr H Alarm MSB5
110
Status/Control - See Table 14
7
Temp L Warning LSB1
33
Rx Pwr H Alarm LSB5
111
Reserved
8
VCC H Alarm MSB2
34
Rx Pwr L Alarm MSB5
112
Flag Bits - See Table 15
9
VCC H Alarm LSB2
35
Rx Pwr L Alarm LSB5
113
Flag Bits - See Table 15
10
VCC L Alarm MSB2
36
Rx Pwr H Warning MSB5
114
Reserved
11
VCC L Alarm LSB2
37
Rx Pwr H Warning LSB5
115
Reserved
12
VCC H Warning MSB2
38
Rx Pwr L Warning MSB5
116
Flag Bits - See Table 15
13
VCC H Warning LSB2
39
Rx Pwr L Warning LSB5
117
Flag Bits - See Table 15
14
VCC L Warning MSB2
40-55
Reserved
118
Reserved
15
VCC L Warning LSB2
56-94
External Calibration Constants6
119
Reserved
16
Tx Bias H Alarm MSB3
95
Checksum for Bytes 0-947
120-127
Reserved
17
Tx Bias H Alarm LSB3
96
Real Time Temperature MSB1
128-247
Customer Writeable8
18
Tx Bias L Alarm MSB3
97
Real Time Temperature LSB1
248-254
Vendor Specific
19
Tx Bias L Alarm LSB3
98
Real Time VCC MSB2
20
Tx Bias H Warning MSB3
99
Real Time VCC LSB2
21
Tx Bias H Warning LSB3
100
Real Time Tx Bias MSB3
22
Tx Bias L Warning MSB3
101
Real Time Tx Bias LSB3
23
Tx Bias L Warning LSB3
102
Real Time Tx Power MSB4
24
Tx Pwr H Alarm MSB4
103
Real Time Tx Power LSB4
25
Tx Pwr H Alarm LSB4
Notes:
1. Temperature (Temp) is decoded as a 16 bit signed twos compliment integer in increments of 1/256 degrees C.
2. Supply Voltage (Vcc) is decoded as a 16 bit unsigned integer in increments of 100 uV.
3. Laser bias current (Tx Bias) is decoded as a 16 bit unsigned integer in increments of 2 uA.
4. Transmitted average optical power (Tx Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.
5. Received average power (RX Pwr) is decoded as a 16 bit unsigned integer in increments of 0.1 uW.
6. Bytes 56-94 are not intended for use with AFBR-59R5LZ, but have been set to default values per SFF-8472.
7. Byte 95 is a checksum calculated (per SFF-8472) and stored prior to product shipment.
8. Bytes 128-247 are write enabled (customer writeable) .
16
Table 14. EEPROM Serial ID Memory Contents – Soft Commands (Address A2h, Byte 110)
Bit #
Status/Control Name
Description
Notes
7
TX_ DISABLE State
Digital state of SFF TX_ DISABLE Input Pin (1 = TX_DISABLE asserted)
1
6
Soft TX_ DISABLE
Read/write bit for changing digital state of SFF TX_DISABLE function1
1, 2
5
reserved
4
reserved
3
reserved
2
TX_FAULT State
Digital state of the laser fault function (1 = Laser Fault Detected)
1
1
Signal Detect State
Digital state of the SFF Sig_Det Output Pin (1 = Signal Detect asserted)
1
0
Data Ready (Bar)
Indicates transceiver is powered and real time sense data is ready. (0 = Ready)
1
Notes:
1. The response time for soft commands of the AFBR-59R5LZ is 100msec as specified by the MSA SFF-8472
2. Bit 6 is logic OR’d with the SFF TX_DISABLE input pin 8 either asserted will disable the SFF transmitter.
3. AFBR-59R5LZ meets the MSA SFF-8472 data ready timing of 1000 msec.
Table 15. EEPROM Serial ID Memory Contents – Alarms and Warnings (Address A2h, Bytes 112, 113, 116, 117)
Byte
Bit
Flag Bit Name
Description
112
7
Temp High Alarm
Set when transceiver internal temperature exceeds high alarm threshold.
6
Temp Low Alarm
Set when transceiver internal temperature exceeds low alarm threshold.
5
VCC High Alarm
Set when transceiver internal supply voltage exceeds high alarm threshold.
4
VCC Low Alarm
Set when transceiver internal supply voltage exceeds low alarm threshold.
3
Tx Bias High Alarm
Set when transceiver laser bias current exceeds high alarm threshold.
2
Tx Bias Low Alarm
Set when transceiver laser bias current exceeds low alarm threshold.
1
Tx Power High Alarm
Set when transmitted average optical power exceeds high alarm threshold.
0
Tx Power Low Alarm
Set when transmitted average optical power exceeds low alarm threshold.
7
Rx Power High Alarm
Set when received average optical power exceeds high alarm threshold.
6
Rx Power Low Alarm
Set when received average optical power exceeds low alarm threshold.
0-5
reserved
7
Temp High Warning
Set when transceiver internal temperature exceeds high warning threshold.
6
Temp Low Warning
Set when transceiver internal temperature exceeds low warning threshold.
5
VCC High Warning
Set when transceiver internal supply voltage exceeds high warning threshold.
4
VCC Low Warning
Set when transceiver internal supply voltage exceeds low warning threshold.
3
Tx Bias High Warning
Set when transceiver laser bias current exceeds high warning threshold.
2
Tx Bias Low Warning
Set when transceiver laser bias current exceeds low warning threshold.
1
Tx Power High Warning
Set when transmitted average optical power exceeds high warning threshold.
0
Tx Power Low Warning
Set when transmitted average optical power exceeds low warning threshold.
7
Rx Power High Warning
Set when received average optical power exceeds high warning threshold.
6
Rx Power Low Warning
Set when received average optical power exceeds low warning threshold.
0-5
reserved
113
116
117
17
13.35
0.53
13.59 MAX
0.54
48.8
1.92
VccT
VeeT
Tx-Disable
TD+
TDSCL
TX fault
RD+
RDSD
VccR
VeeR
SDA
AREA FOR
PROCESS
PLUG
15
13 ±0.10
0.512 ±0.004
14.20 ±0.10
0.559 ±0.004
Rate select
TC position
Figure 6. Mechanical Drawing - AFBR-59R5LZ
18
9.65
0.38
1.02 ±0.05 (X2)
0.040 ±0.002
C A 1 2 3 4 5
D B 10 9 8 7 6
2.92 MIN
0.115
14.23
0.56
1.78 (12X)
0.07
10.16
0.40
0.46 ±0.05 (X14)
0.018 ±0.002
10.16
0.40
9.35
0.37
6.25 ±0.05
0.246 ±0.002
13.35
0.53
13.59 MAX
0.54
48.8
1.92
9.65
0.38
14.23
0.56
10.16
0.400
1.78 (12X)
0.07
Figure 7. Mechanical Drawing - AFBR-59R5ALZ
15.24 MIN PITCH
0.600
12.00 REF MAX
0.47
19
14.22 ±0.10
0.560 ±0.004
A
0.00
15.75 - 0.75
0.00
0.62 - 0.03
Figure 8. Assembly Drawing
A
10.16 ±0.10
0.400 ±0.004
+0.15
1.00 0.00
+0.006
0.039 0.000
Top of PCB
SECTION A-A
2.15 MIN
0.085
9.35
0.37
6.25 ±0.05
0.246 ±0.002
Figure 9. Board Layout
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-3624EN
AV02-0109EN - January 29, 2013