Reliability Data Report Product Family R570 LT3905 / LT8300 / LT8301 / LT8302 / LT8309 / LT8330 / LT8331 / LT8601 / LT8602 / LT8609 / LT8610 / LT8611 / LT8612 / LT8613 / LT8614 / LT8616 / LT8620 / LT8640 / LT8641 / LT8697 Reliability Data Report Report Number: R570 Report generated on: Mon Feb 29 11:07:20 PST 2016 OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+125°C) 1 No. of FAILURES 2,3 SOIC/MSOP QFN/DFN SOT 5404 693 462 1206 1112 1206 1438 1517 1220 3787 1327 2586 0 0 0 Totals 6,559 - - 7,700 0 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+85°C) No. of FAILURES 4 SOIC/MSOP QFN/DFN 255 133 1318 1117 1514 1142 541 523 0 0 SOT Totals 77 465 1141 - 1141 - 258 1,322 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE OLDEST DATE NEWEST DATE SSOP/TSSOP SOIC/MSOP 154 524 CODE CODE 1302 1239 1314 1416 51 52 0 0 QFN/DFN SOT 682 149 0227 1302 1419 1417 110 3 0 0 Totals 1,509 - - 216 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES SSOP/TSSOP SOIC/MSOP QFN/DFN 154 485 916 1302 1240 0227 1314 1416 1419 154 507 761 0 0 0 SOT Totals 585 2,140 1141 - 1417 - 405 1,827 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP 154 1302 1314 154 0 SOIC/MSOP QFN/DFN SOT 478 913 430 1240 0227 1141 1429 1419 1417 280 684 250 0 0 0 Totals 1,975 - - 1,368 0 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =1.54 FITS (3) Mean Time Between Failure in Years = 74182.73 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning Reliability Data Report Report Number: R570 Report generated on: Mon Feb 29 11:07:20 PST 2016 HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE SSOP/TSSOP SOIC/MSOP QFN/DFN 154 222 274 Totals 650 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 1302 1325 0227 1314 1332 1343 154 222 274 0 0 0 - - 650 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 1308 - 1309 - 229 229 0 0 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SOIC/MSOP Totals SAMPLE SIZE 229 229