HA-2510/883 ® Data Sheet January 3, 2006 FN3697.4 High Slew Rate Operational Amplifier Features The HA-2510/883 is a high performance operational amplifier which sets the standards for maximum slew rate and wide bandwidth operation in moderately powered, internally compensated, monolithic devices. In addition to excellent dynamic characteristics, this dielectrically isolated amplifier also offers low offset current and high input impedance. • This Circuit is Processed in Accordance to MIL-STD-883 and is Fully Conformant Under the Provisions of Paragraph 1.2.1. • High Slew Rate . . . . . . . . . . . . . . . . . . . . . . .50V/µs (Min) 65V/µs (Typ) • Wide Power Bandwidth . . . . . . . . . . . . . . . . 750kHz (Min) The ±50V/µs minimum slew rate and fast settling time of the HA-2510/883 are ideally suited for high speed D/A, A/D, and pulse amplification designs. The HA-2510/883’s superior bandwidth and 750kHz minimum full power bandwidth are extremely useful in RF and video applications. To insure compliance with slew rate and transient response specifications, all devices are 100% tested for AC performance characteristics over full temperature limits. To improve signal conditioning accuracy, the HA-2510/883 provides a maximum offset current of 25nA and a minimum input impedance of 50MΩ, both at 25oC, as well as offset voltage adjust capability. • Low Offset Current . . . . . . . . . . . . . . . . . . . . . . 25nA (Min) 10nA (Typ) Ordering Information • RF Amplifiers PART NUMBER PART MARKING TEMP. RANGE (oC) PACKAGE HA2-2510/883 HA2-2510/883 -55 to 125 8 Pin Can PKG. DWG. # T8.C • High Input Impedance . . . . . . . . . . . . . . . . . . 50MΩ (Min) 100MΩ (Typ) • Wide Small Signal Bandwidth . . . . . . . . . . . .12MHz (Typ) • Fast Settling Time (0.1% of 10V Step) . . . . . . 250ns (Typ) • Low Quiescent Supply Current . . . . . . . . . . . . 6mA (Max) • Internally Compensated For Unity Gain Stability Applications • Data Acquisition Systems • Video Amplifiers • Signal Generators • Pulse Amplification HA7-2510/883 HA7-2510/883 -55 to 125 8 Ld CERDIP F8.3A Pinouts HA-2510/883 (METAL CAN) TOP VIEW HA-2510/883 (CERDIP) TOP VIEW COMP BAL 1 -IN 2 +IN 3 V- 4 8 + COMP 7 V+ 6 OUT 5 BAL 8 BAL 1 + 2 -IN +IN 7 V+ 6 OUT 5 3 BAL 4 V- 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2002, 2004, 2005, 2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HA-2510/883 Absolute Maximum Ratings Thermal Information Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . .40V Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V Voltage at Either Input Terminal . . . . . . . . . . . . . . . . . . . . . V+ to VPeak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .<2000V Thermal Resistance (Typical, Note 1) Operating Conditions Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V VINCM ≤ 1/2 (V+ - V-) RL ≥ 2kΩ θJA θJC Metal Can Package . . . . . . . . . . . . . . . . . 160oC/W 75oC/W CERDIP Package. . . . . . . . . . . . . . . . . . . 120oC/W 30oC/W Package Power Dissipation Limit at 75oC for TJ ≤ 175oC Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .625mW CERDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .870mW Package Power Dissipation Derating Factor Above 75oC Metal Can Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3mW/oC CERDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.7mW/oC Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .175oC Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω, RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified. PARAMETER SYMBOL Input Offset Voltage VIO Input Bias Current +IB CONDITIONS VCM = 0V VCM = 0V, +RS = 100kΩ, -RS = 100Ω -IB Input Offset Current Common Mode Range VCM = 0V, +RS = 100Ω, -RS = 100kΩ IIO VCM = 0V, +RS = 100kΩ, -RS = 100kΩ +CMR V+ = 5V, V- = -25V -CMR Large Signal Voltage Gain V+ = 25V, V- = -5V +AVOL VOUT = 0V and +10V, RL = 2kΩ -AVOL Common Mode Rejection Ratio VOUT = 0V and -10V, RL = 2kΩ ∆VCM = +10V, V+ = +5V, V- = -25V, VOUT = -10V +CMRR ∆VCM = -10V, V+ = +25V, V- = -5V, VOUT = +10V -CMRR 2 GROUP A SUBGROUPS TEMP (oC) MIN MAX UNITS 1 25 -8 8 mV 2, 3 125, -55 -18 10 mV 1 25 -200 200 nA 2, 3 125, -55 -400 400 nA 1 25 -200 200 nA 2, 3 125, -55 -400 400 nA 1 25 -25 25 nA 2, 3 125, -55 -50 50 nA 1 25 +10 - V 2, 3 125, -55 +10 - V 1 25 - -10 V 2, 3 125, -55 - -10 V 4 25 10 - kV/V 5, 6 125, -55 7.5 - kV/V 4 25 10 - kV/V 5, 6 125, -55 7.5 - kV/V 1 25 80 - dB 2, 3 125, -55 80 - dB 1 25 80 - dB 2, 3 125, -55 80 - dB FN3697.4 January 3, 2006 HA-2510/883 TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) Device Tested at: VSUPPLY = ±15V, RSOURCE = 100Ω, RLOAD = 500kΩ, VOUT = 0V, Unless Otherwise Specified. PARAMETER Output Voltage Swing SYMBOL CONDITIONS +VOUT RL = 2kΩ -VOUT Output Current RL = 2kΩ +IOUT VOUT = -10V -IOUT Quiescent Power Supply Current VOUT = +10V +ICC VOUT = 0V, IOUT = 0mA -ICC Power Supply Rejection Ratio VOUT = 0V, IOUT = 0mA ∆VSUP = 10V, V+ = +20V, V- = -15V, V+ = +10V, V- = -15V +PSRR ∆VSUP = 10V, V+ = +15V, V- = -20V, V+ = +15V, V- = -10V -PSRR Offset Voltage Adjustment +VIOAdj Note 2 -VIOAdj Note 2 GROUP A SUBGROUPS TEMP (oC) MIN MAX UNITS 4 25 10 - V 5, 6 125, -55 10 - V 4 25 - -10 V 5, 6 125, -55 - -10 V 4 25 10 - mA 5, 6 125, -55 7.5 - mA 4 25 - -10 mA 5, 6 125, -55 - -7.5 mA 1 25 - 6 mA 2, 3 125, -55 - 6.5 mA 1 25 -6 - mA 2, 3 125, -55 -6.5 - mA 1 25 80 - dB 2, 3 125, -55 80 - dB 1 25 80 - dB 2, 3 125, -55 80 - dB 1 25 VIO-1 - mV 2, 3 125, -55 VIO-1 - mV 1 25 VIO+1 - mV 2, 3 125, -55 VIO+1 - mV NOTE: 2. Offset adjustment range is [VIO (Measured) ±1mV] minimum referred to output. This test is for functionality only to assure adjustment through 0V. TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS Device Tested at: VSUPPLY = ±15V, RSOURCE = 50Ω, RLOAD = 2kΩ, CLOAD = 50pF, AVCL = +1V/V, Unless Otherwise Specified. PARAMETER Slew Rate SYMBOL CONDITIONS VOUT = -5V to +5V, 25% ≤ +SR ≤ 75% +SR VOUT = +5V to -5V, 75% ≥ -SR ≥ 25% -SR Rise and Fall Time VOUT = 0 to +200mV, 10% ≤ tr ≤ 90% tr VOUT = 0 to -200mV, 10% ≤ tf ≤ 90% tf 3 GROUP A SUBGROUPS TEMP (oC) MIN MAX UNITS 7 25 50 - V/µs 8A, 8B 125, -55 45 - V/µs 7 25 50 - V/µs 8A, 8B 125, -55 45 - V/µs 7 25 - 50 ns 8A, 8B 125, -55 - 60 ns 7 25 - 50 ns 8A, 8B 125, -55 - 60 ns FN3697.4 January 3, 2006 HA-2510/883 TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) Device Tested at: VSUPPLY = ±15V, RSOURCE = 50Ω, RLOAD = 2kΩ, CLOAD = 50pF, AVCL = +1V/V, Unless Otherwise Specified. PARAMETER SYMBOL Overshoot CONDITIONS +OS VOUT = 0 to +200mV -OS VOUT = 0 to -200mV GROUP A SUBGROUPS TEMP (oC) MIN MAX UNITS 7 25 - 40 % 8A, 8B 125, -55 - 50 % 7 25 - 40 % 8A, 8B 125, -55 - 50 % TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS Device Characterized at: VSUPPLY = ±15V, RLOAD = 2kΩ, CLOAD = 50pF, Unless Otherwise Specified. PARAMETER SYMBOL Differential Input Resistance RIN CONDITIONS VCM = 0V Full Power Bandwidth FPBW VPEAK = 10V Minimum Closed Loop Stable Gain CLSG RL = 2kΩ, CL = 50pF Quiescent Power Consumption PC VOUT = 0V, IOUT = 0mA NOTES TEMP (oC) MIN MAX UNITS 3 25 50 - MΩ 3, 4 25 750 - kHz 3 -55 to 125 1 - V/V 3, 5 -55 to 125 - 195 mW NOTES: 3. Parameters listed in Table 3 are controlled via design or process parameters and are not directly tested at final production. These parameters are lab characterized upon initial design release, or upon design changes. These parameters are guaranteed by characterization based upon data from multiple production runs which reflect lot to lot and within lot variation. 4. Full Power Bandwidth guarantee based on Slew Rate measurement using FPBW = Slew Rate/(2πVPEAK). 5. Quiescent Power Consumption based upon Quiescent Supply Current test maximum. (No load on outputs.) TABLE 4. ELECTRICAL TEST REQUIREMENTS MIL-STD-883 TEST REQUIREMENTS Interim Electrical Parameters (Pre Burn-In) Final Electrical Test Parameters SUBGROUPS (SEE TABLES 1 AND 2) 1 1 (Note 6), 2, 3, 4, 5, 6, 7, 8A, 8B Group A Test Requirements 1, 2, 3, 4, 5, 6, 7, 8A, 8B Groups C and D Endpoints 1 NOTE: 6. PDA applies to Subgroup 1 only. 4 FN3697.4 January 3, 2006 HA-2510/883 Die Characteristics SUBSTRATE POTENTIAL (Powered Up): Unbiased TRANSISTOR COUNT: 40 PROCESS: Bipolar Dielectric Isolation Metallization Mask Layout HA-2510/883 +IN -IN BAL COMP V- V+ BAL OUT Burn-In Circuit HA7-2510/883 1 R1 VD2 8 2 - 3 + 4 V+ 7 6 C3 C1 D1 5 C2 R1 = 1MΩ, ±5%, 1/4W (Min) C1 = C2 = 0.01µF/Socket (Min) or 0.1µF/Row (Min) C3 = 0.01µF/Socket (10%) D1 = D2 = 1N4002 or Equivalent/Board |(V+) - (V-)| = 30V 5 FN3697.4 January 3, 2006 HA-2510/883 Metal Can Packages (Can) T8.C MIL-STD-1835 MACY1-X8 (A1) REFERENCE PLANE A 8 LEAD METAL CAN PACKAGE e1 L L2 L1 INCHES ØD2 A A k1 Øe ØD ØD1 2 N 1 β Øb1 Øb F α k C L BASE AND SEATING PLANE Q BASE METAL Øb1 LEAD FINISH Øb2 SECTION A-A NOTES: 1. (All leads) Øb applies between L1 and L2. Øb1 applies between L2 and 0.500 from the reference plane. Diameter is uncontrolled in L1 and beyond 0.500 from the reference plane. 2. Measured from maximum diameter of the product. 3. α is the basic spacing from the centerline of the tab to terminal 1 and β is the basic spacing of each lead or lead position (N -1 places) from α, looking at the bottom of the package. MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.165 0.185 4.19 4.70 - Øb 0.016 0.019 0.41 0.48 1 Øb1 0.016 0.021 0.41 0.53 1 Øb2 0.016 0.024 0.41 0.61 - ØD 0.335 0.375 8.51 9.40 - ØD1 0.305 0.335 7.75 8.51 - ØD2 0.110 0.160 2.79 4.06 - e e1 0.200 BSC 5.08 BSC 0.100 BSC - 2.54 BSC - F - 0.040 - 1.02 - k 0.027 0.034 0.69 0.86 - k1 0.027 0.045 0.69 1.14 2 12.70 19.05 1 1.27 1 L 0.500 0.750 L1 - 0.050 L2 0.250 - 6.35 - 1 Q 0.010 0.045 0.25 1.14 - - β 45o BSC 45o BSC 45o BSC 45o BSC N 8 8 α 3 3 4 Rev. 0 5/18/94 4. N is the maximum number of terminal positions. 5. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 6. Controlling dimension: INCH. 6 FN3697.4 January 3, 2006 HA-2510/883 Ceramic Dual-In-Line Frit Seal Packages (CERDIP) 8 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE -D- -A- BASE METAL E M (b) -BC A-B S SECTION A-A D S D BASE PLANE -C- SEATING PLANE Q A L S1 α eA A A b2 e b ccc M (c) b1 M bbb S F8.3A MIL-STD-1835 GDIP1-T8 (D-4, CONFIGURATION A) LEAD FINISH c1 C A-B S eA/2 c aaa M C A - B S D S D S INCHES SYMBOL MIN MAX MIN MAX NOTES A - 0.200 - 5.08 - b 0.014 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 0.405 - 10.29 5 E 0.220 0.310 5.59 7.87 5 e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - 3.81 BSC - eA/2 NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. MILLIMETERS L 0.150 BSC 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 6 S1 0.005 - 0.13 - 7 α 90o 105o 90o 105o - aaa - 0.015 - 0.38 - bbb - 0.030 - 0.76 - 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2, 3 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. N 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 8 8 8 Rev. 0 4/94 5. This dimension allows for off-center lid, meniscus, and glass overrun. 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 7 FN3697.4 January 3, 2006