ROHM BD8105FV_09

Power Management IC Series for Automotive Body Control
LED Driver
BD8105FV
No.09039EBT01
●Description
The BD8105FV is a serial parallel control LED driver with 35V input voltage rating.
Responding to the 3-line serial data, it turns the 12ch open drain output on/off.
Due to its compact size, it is optimal for small spaces.
●Features
1) Open Drain Output
2) 3-line Serial Control + Enable Signal
3) Internal Temperature Protection Circuit (TSD)
4) Cascade Connection Compatible
5) SSOP-B20W
6) Internal 12ch Power Transistor
Applications
These ICs can be used with car and consumer electronic.
●Absolute Maximum Ratings (Ta=25℃)
Item
Symbol
Value
Unit
VCC
7
V
Output Voltage(Pin No : 4~9, 11~16)
VDmax
35
V
Input Voltage(Pin No : 1, 2, 3, 17, 18)
VIN
-0.3~VCC
V
Power Dissipation
Pd
1187*
mW
Operating Temperature Range
Topr
-40~+105
℃
Storage Temperature Range
Tstg
-55~+150
℃
Drive Current (DC)
IomaxD
50
mA
Drive Current(Pulse)
IomaxP
150**
mA
Tjmax
150
℃
Power Supply Voltage
Junction Temperature
* Pd decreased at 9.50mW/℃ for temperatures above Ta=25℃,mounted on 70×70×1.6mm Glass-epoxy PCB.
** Do not however exceed Pd. Time to impress≦200msec
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1/12
2009.07 - Rev.B
Technical Note
BD8105FV
●Operational Conditions (Ta=-40~105℃)
Item
Symbol
Power Supply Voltage
Drive Current
Standard Value
Min
Typ
Max
Unit
Vcc
4.5
5
5.5
V
Io
-
20
40
mA
* This product is not designed for protection against radioactive rays.
●Electrical Characteristics (Unless specified, Ta=-40~105℃ Vcc=4.5~5.5V)
Item
Symbol
Standard Value
Unit
Conditions
Min
Typ
Max
RON
-
6
12
Ω
ID=20mA
IDL
-
0
5
uA
VD=34V
【Output D0~D11】(Pin No : 4~9, 11~16)
ON Resistor
Output leakage current
【Logic input】(Pin No : 1, 2, 3, 17, 18)
Upper limit threshold voltage
VTH
Vcc
×0.8
-
-
V
Bottom limit threshold voltage
VTL
-
-
Vcc
×0.2
V
FCLK
-
-
1
MHz
Input Current
IIN
20
50
100
uA
VIN=5V
Input leakage Current
IINL
-
0
5
uA
VIN=0V
Circuit Current
ICC
-
0.3
5
mA
Static Current
ISTN
-
0
50
uA
Output Voltage high
VOH
4.6
4.8
-
V
VCC=5V, ISO=-5mA
Output voltage Low
VOL
-
0.2
0.4
V
VCC=5V, ISO=5mA
Serial clock frequency
【WHOLE】
Serial Data Input,
VCC=5V,CLK=500KHz,
SEROUT=OPEN
RST_B=OPEN,
SEROUT=OPEN
【SER OUT】(Pin No. : 20)
* This product is not designed for protection against radioactive rays.
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2/12
2009.07 - Rev.B
Technical Note
BD8105FV
●Electrical Characteristic Diagrams (Unless otherwise specified Ta=25℃)
10
230
250
9
150
105℃
-40℃
100
50
225
OUTPUT RESISTANCE:RON[Ω]
25℃
200
SUPPLY CURRENT:Icc[μA]
SUPPLY CURRENT:Icc[μA]
5.5V
5.0V
220
4.5V
215
210
105℃
8
7
25℃
6
5
-40℃
4
3
2
1
205
0
1
2
3
4
SUPPLY VOLTAGE:Vcc[V]
0
-40
5
5
5.5V
3
2
1
0
85
4.5
-15
10
35
60
5.6
4.5V
5.4
5.2
5V
5.0
4.8
5.5V
4.6
4.4
4.2
85
20
30
40
Fig.4 Dxx on resistance 2
(at IDD=20mA)
Fig.5 Dxx on resistance
6.0
4.0
3.5
3.0
-15
10
35
60
85
AMBIENT TEMPERATURE : Ta[℃]
Fig.7 SEROUT high side voltage 2
(at ISO=-5mA)
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25℃
4.4
105℃
4.2
4.7
4.9
5.1
5.3
SUPPLY VOLTAGE: Vcc[V]
5.5
0.35
0.30
25℃
0.25
0.20
0.15
-40℃
0.10
0.05
4.5V
0.25
0.20
5V
0.15
5.5V
0.10
0.05
0.00
0.00
-40
4.6
Fig.6 SEROUT high side voltage 1
(at ISO=-5mA)
OUTPUT VOLTAGE : VOL[V]
OUTPUT VOLTAGE : VOL[V]
4.5V
4.5
4.8
4.5
105℃
0.30
5.5
5.0
50
0.35
5.5V
-40℃
5.2
4.0
10
INPUT CURRENT: ID [mA]
5V
5.5
5.4
5.8
AMBIENT TEMPERATURE : Ta[℃]
5.0
4.7
4.9
5.1
5.3
SUPPLYVOLTAGE:Vcc[V]
Fig.3 Dxx on resistance 1
(at IDD=20mA)
4.0
-40
OUTPUT VOLTAGE : VOH[V]
60
6.0
OUTPUT ON RESISTANCE : RON[ Ω]
OUTPUT ON RESISTANCE : RON[Ω]
5V
4
35
Fig.2 Circuit current 2
4.5V
7
6
10
AMBIENT TEMPERATURE : Ta[℃]
Fig.1 Circuit current 1
8
-15
OUTPUT VOLTAGE : VOH[V]
0
4.5
4.7
4.9
5.1
5.3
5.5
SUPPLY VOLTAGE : Vcc[V]
Fig.8 SEROUT low side voltage 1
(at ISO=5mA)
3/12
-40
-15
10
35
60
85
AMBIENT TEMPERATURE : Ta[℃]
Fig.9 SEROUT low side voltage 2
(at ISO=5mA)
2009.07 - Rev.B
Technical Note
BD8105FV
●Block Diagram
SDWN
3
TSD
<11:0>
17
1
18
2
SERIN
Driver
LATCH
Serial
I/F
CLK
<11:0> <11:0>
<11:0>
RST_B
4
D11
5
D10
6
D9
7
D8
8
D7
9
D6
11
D5
12
D4
13
D3
14
D2
15
D1
16
D0
VCC
10
SEROUT
SEROUT
19
20
GND
Fig.10
●Terminal Number・Terminal Name
●Pin Setup Diagram
BD8105FV(SSOP-B20W)
Pin
Number
Terminal
Name
1
LATCH
2
RST_B
SDWN
Function
Latch Signal Input Terminal
(H: Latches Data)
Reset Reversal Input Terminal
(L: FF Data 0)
Shutdown Input Terminal
(H: Output Off)
LATCH
1
20
SEROUT
RST_B
2
19
VCC
SDWN
3
18
CLK
3
D11
4
17
SERIN
4
D11
Drain Output Terminal 11
5
D10
Drain Output Terminal 10
6
D9
Drain Output Terminal 9
7
D8
Drain Output Terminal 8
D10
5
16
D0
D9
6
15
D1
D8
7
14
D2
8
D7
Drain Output Terminal 7
D7
8
13
D3
9
D6
Drain Output Terminal 6
D6
9
12
D4
10
GND
11
D5
Drain Output Terminal 5
GND 10
11
D5
12
D4
Drain Output Terminal 4
13
D3
Drain Output Terminal 3
14
D2
Drain Output Terminal 2
15
D1
Drain Output Terminal 1
16
D0
Drain Output Terminal 0
17
SERIN
18
CLK
Clock Input Terminal
19
VCC
Supply Voltage Input Terminal
20
SEROUT
Serial Data Output Terminal
Fig.11
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4/12
Ground Terminal
Serial Data Input Terminal
2009.07 - Rev.B
Technical Note
BD8105FV
●Block Operation
1)Serial I/F
The I/F is a 3-line serial (LATCH, CLK, SERIN) style.
12-bit output ON/OFF can be set-up. This is composed of shift register. + 12-bit register.
2)Driver
It is a 12-bit open drain output.
3)TSD (Thermal Shut Down)
To prevent heat damage and overheating, when the chip temperature goes over approximately 175℃, the output turns
off. When the temperature goes back down, normal operation resumes. However, the intended use of the
temperature protection circuit is to protect the IC, so please construct thermal design with the junction temperature
Tjmax under 150℃.
●Application Circuit
VCC
10uF
VBAT
10uF
↓IF
Rres
VF
VCC
SDWN
LATCH
RST_B
CLK
SERIN
SEROUT
GND
Microcomputer
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
VCC
10uF
VCC
SDWN
LATCH
RST_B
CLK
SERIN
SEROUT
GND
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
IF=
VBAT - VF
Rres + RON
Fig.12
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5/12
2009.07 - Rev.B
Technical Note
BD8105FV
●Serial Communication
The serial I/F is composed of a shift register which changes the CLK and SERIN serial signals to parallel signals, and a
register to remember those signals with a LATCH signal. The registers are reset by applying a voltage under VCC×0.2 to
the RST_B terminal or opening it, and D11~D0 become open. To prevent erroneous LED lighting, please apply voltage
under VCC×0.2 to RST_B or make it open during start-up.
CLK
12bit
Shift
Register
SERIN
12bit
Driver
Register
LATCH
Fig.13
1)Serial Communication Timing
The 12-bit serial data input from SERIN is taken into the shift register by the rise edge of the CLK signal, and is
recorded in the register by the rise edge of the LATCH signal. The recorded data is valid until the next rise edge of the
LATCH signal.
2)Serial Communication Data
The serial data input configuration of SERIN terminal is shown below:
First →
→Last
d11 d10 d9
d8
d7
d6
d5
d4
d3
d2
d1
d0
Data
Terminal
Name
Output
Status
d11 d10 d9
ON
1
*
*
D11
OFF
0
*
*
ON
*
1
*
D10
OFF
*
0
*
ON
*
*
1
D9
OFF
*
*
0
ON
*
*
*
D8
OFF
*
*
*
ON
*
*
*
D7
OFF
*
*
*
ON
*
*
*
D6
OFF
*
*
*
ON
*
*
*
D5
OFF
*
*
*
ON
*
*
*
D4
OFF
*
*
*
ON
*
*
*
D3
OFF
*
*
*
ON
*
*
*
D2
OFF
*
*
*
ON
*
*
*
D1
OFF
*
*
*
ON
*
*
*
D0
OFF
*
*
*
* represents “Don’t care”.
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Data
d8
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
d7
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
d6
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
d5
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
6/12
d4
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
d3
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
d2
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
d1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
d0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
2009.07 - Rev.B
Technical Note
BD8105FV
3)Enable Signal
By applying voltage at least VCC×0.8 or more to the SDWN terminal, D0 (16 pin)~D11 (4 pin) become open forcibly.
At this time, the temperature protection circuit (TSD) stops. D11~D0 become PWM operation by inputting PWM to
SDWN(3 pin).
4)SEROUT
A cascade connection can be made (connecting at least 2 or more IC’s in serial).
Serial signal input from SERIN is transferred into receiver IC by the fall edge of the CLK signal.
Since this functionality gives enough margins for the setup time prior to the rise edge of the CLK signal on the receiver
IC (using the exact same CLK signal of sender IC), the application reliability can be improved as cascade connection
functionality.
LATCH
SERIN
d11 d10
CLK
1
d9
2
d8
3
d7
4
d5
d6
5
6
d3
d4
7
8
d2
9
d1
10
d0
11
12
SEROUT
13
D11
Fig.14
●Cascade Connection
By using (at least) 2 ICs, each IC’s D11~D0, at (at least) 24ch, can be controlled by the 24-bit SERIN signal. The serial
data input to the sender IC can be transferred to the receiver IC by inputting 12CLK to the CLK terminal.
Send side IC
Receive side IC
LATCH
SERIN
CLK
d23 d22 d21 d20
1
2
3
4
d19 d18 d17
5
6
7
d16 d15 d14 d13
8
9
10
11
d12 d11 d10
12
13
14
d9
15
d8
16
d7
17
d6
18
d5
19
d4
20
d3
21
d2
22
d1
23
d0
24
Fig.15
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7/12
2009.07 - Rev.B
Technical Note
BD8105FV
●INPUT SIGNAL’S TIMING CHART
TCK
50%
CLK
TCKH
TCKL
TSESTTSEHD
SERIN
50%
TLADZ
TSEW
50%
LATCH
TLAH
Fig.16
●INPUT SIGNAL’S TIMING RULE(Ta=-40~105℃ Vcc=4.5~5.5V)
Parameter
Symbol
Min
Unit
TCK
1000
ns
CLK high pulse width
TCKH
480
ns
CLK low pulse width
TCKL
480
ns
SERIN high and low pulse width
TSEW
980
ns
SERIN setup time prior to CLK rise
TSEST
150
ns
SERIN hold time after CLK fall
TSEHD
150
ns
TLAH
480
ns
TLADZ
250
ns
CLK period
LATCH high pulse time
Last CLK rise to LATCH rise
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8/12
2009.07 - Rev.B
Technical Note
BD8105FV
●OUTPUT SIGNAL’S DELAY CHART
SDWN
50%
TDSNL
TDSNH
OUTPUT
(D11~D0)
LATCH
50%
50%
TDLAH
OUTPUT
(D11~D0)
CLK
50%
50%
TDSOH
SEROUT
TDSOL
50%
Fig.17
●OUTPUT SIGNAL’S DELAY TIME(Ta=-40~105℃ Vcc=4.5~5.5V)
Parameter
Symbol
Max
Unit
SDWN Switching Time(L→H)
TDSNH
300
ns
SDWN Switching Time(H→L)
TDSNL
300
ns
LATCH Switching Delay Time
TDLAH
300
ns
SEROUT Propagation Delay Time(L→H)
TDSOH
350
ns
SEROUT Propagation Delay Time (H→L)
TDSOL
350
ns
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9/12
2009.07 - Rev.B
Technical Note
BD8105FV
●INPUT/OUTPUT EQUIVALENT CIRCUIT(PIN NAME)
4PIN(D11),5PIN(D10)
6PIN(D9),7PIN(D8)
8PIN(D7),9PIN(D6)
11PIN(D5),12PIN(D4)
13PIN(D3),14PIN(D2)
15PIN(D1),16PIN(D0)
1PIN(LATCH)
2PIN(RST_B)
3PIN(SDWN)
17PIN(SERIN)
18PIN(CLK)
VCC
20PIN(SEROUT)
VCC
VCC
100k
(TYP)
Fig.18
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10/12
2009.07 - Rev.B
Technical Note
BD8105FV
●Operation Notes
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in
IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such damage is
suffered.
A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute
maximum ratings may be exceeded is anticipated.
(2) Reverse connection of a power supply connector
If the connector of power is wrong connected, it may result in IC breakage. In order to prevent the breakage from the wrong
connection, the diode should be connected between external power and the power terminal of IC as protection solution.
(3) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Setting of heat
Use a setting of heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
(5) Pin short and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature
range may result in IC damage.
(6) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
(7) Thermal shutdown circuit(TSD)
This IC built-in a Thermal shutdown circuit (TSD circuit). If Chip temperature becomes 175 (TYP.), make the output an Open
state. Eventually, warmly clearing the circuit is decided by the condition of whether the heat excesses over the assigned limit,
resulting the cutoff of the circuit of IC, and not by the purpose of preventing and ensuring the IC. Therefore, the warm
switch-off should not be applied in the premise of continuous employing and operation after the circuit is switched on.
(8) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and
use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process
(9) IC terminal input
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P/N junctions
are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic elements.
For example, when a resistor and transistor are connected to pins. (See the chart below.)
 the P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or GND > (Pin B) for the transistor (NPN).
 Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines with the N layer of other
adjacent elements to operate as a parasitic NPN transistor.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's
architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage.
For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements,
such as by the application of voltages lower than the GND (PCB) voltage to input pins.
Transistor (NPN)
(Pin B)
C
B
E
~
~
(Pin B)
~
~
~
~
B
(Pin A)
GND
P+
P+
N
N
P
P
N
N
N
GND
Parasitic elements
Parasitic
elements
P+
N
P substrate
Parasitic elements
GND
E
GND
N
P
P+
C
(Pin A)
~
~
Resistor
Parasitic
elements
GND
(10) Ground wiring patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by
large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns of any
external components.
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11/12
2009.07 - Rev.B
Technical Note
BD8105FV
Selecting a Model Name When Ordering
B
8
D
ROHM model
1
0
5
F
V
-
Package type
FV : SSOP-B20W
Part number
E
2
E2 = Reel-wound embossed taping
SSOP-B20W
<Tape and Reel information>
6.5 ± 0.2
Embossed carrier tape
Quantity
2000pcs
0.3Min.
Direction
of feed
1
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
10
0.15 ± 0.1
0.11
1.7 ± 0.2
Tape
11
6.1 ± 0.2
8.1 ± 0.3
20
0.1
0.65
0.22 ± 0.1
1pin
Reel
(Unit : mm)
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12/12
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.07 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
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More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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