Power Management Switch ICs for PCs and Digital Consumer Products Power Switch ICs for ExpressCardTM BD4153FV,BD4153EFV No.10029EBT08 ●Description TM BD4153FV/EFV is a power management switch IC for the next generation PC card (ExpressCard ) that PCMCIA recommends. TM TM TM Conforms to PCMCIA’s ExpressCard Standard, ExpressCard Compliance Checklist, and ExpressCard Implementation Guideline, and obtains the world first Compliance ID “EC100001” from PCMCIA. Offers various functions such as adjustable soft-starter, overcurrent detector (OC function), card detector, and system condition detector, which are ideally suited for laptop and desktop computers. ●Features TM 1) Incorporates three low on-resistance FETs for ExpressCard . 2) Incorporates an FET for output discharge. 3) Incorporates an enabler. 4) I Incorporates an undervoltage lockout (UVLO) 5) I Employs SSOP-B24 package. 6) I Employs HTSSOP-B24 package. 7) Incorporates a thermal shutdown protector (TSD). 8) Incorporates a soft-starter. 9) Incorporates an overcurrent protector (OCP). 10) Incorporates an overcurrent flag output (OC). 11) Conforms to ExpressCardTM Standard. TM 12) Conforms to ExpressCard Compliance Checklist. 13) Conforms to ExpressCardTM Implementation Guideline. ●Use Laptop and desktop computers, and other digital devices equipped with ExpressCard. ●Lineup Parameter Package BD4153FV SSOP-B24 BD4153EFV HTSSOP-B24 “ExpressCardTM” is a trademark registered by PCMCIA(Personal Computer Memory Card International Association). ●Absolute Maximum Ratings ◎BD4153FV/BD4153EFV Parameter Power Supply Voltage Logic Input Voltage Logic Output Voltage 1 Logic Output Voltage 2 Input Voltage 1 Input Voltage 2 Output Voltage Output current 1 Output current 2 Power Dissipation 1 Power Dissipation 2 Operating Temperature Range Storage Temperature Range Maximum Junction Temperature Symbol VCC EN,CPPE#,CPUSB#,SYSR,PERST_IN# OC PERST# V3_IN, V15_IN V3AUX_IN V3,V3AUX,V15 IOV3, IOV15 IOV3AUX Pd1 Pd2 Topr Tstg Tjmax BD4153FV 5.0 *1 5.0 *1 5.0 *1 VCC *1 5.0 *1 VCC *1 5.0 *1 2.0 1.0 787 *2 1025 *3 -40～+100 -55～+150 +150 BD4153EFV 5.0 *1 5.0 *1 5.0 *1 VCC *1 5.0 *1 VCC *1 5.0 *1 2.0 1.0 1100 *4 -40～+100 -55～+150 +150 Unit V V V V V V V A A mW mW ℃ ℃ ℃ *1 However, not exceeding Pd. *2 Pd derating at 6.3mW/℃ for temperature above Ta=25℃ *3 In the case of Ta≥25°C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 8.2 mW/°C. *4 In the case of Ta≥25°C (when mounting to 70mmx70mmx1.6mm glass epoxy substrate), derated at 8.8 mW/°C. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 1/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Recommended Operating Conditions ◎BD4153FV/BD4153EFV Parameter Power Supply Voltage Logic Input Voltage 1 Logic Input Voltage 2 Logic Output Voltage 1 Logic Output Voltage 2 Input Voltage 1 Input Voltage 2 Input Voltage 3 Soft Start Setup Capacitor 1 Soft Start Setup Capacitor 2 Symbol MIN MAX Unit VCC EN CPPE#,CPUSB#,SYSR,PERST_IN# OC PERST# V3_IN V3AUX_IN V15_IN CSS_V3, CSS_V15 CSS_V3AUX 3.0 -0.2 -0.2 3.0 3.0 1.35 0.001 0.001 3.6 3.6 VCC 3.6 VCC 3.6 VCC 1.65 1.0 0.1 V V V V V V V V μF μF * This product is designed for protection against radioactive rays. ●Electrical Characteristics (unless otherwise noted, Ta=25℃ VCC=3.3V VEN=3.3V V3_IN=V3AUX_IN=3.3V,V15_IN=1.5V) Standard Value Parameter Symbol Unit MIN TYP MAX Condition Standby current IST - 35 70 μA VEN=0V Bias current 1 Icc1 - 0.25 0.50 mA VSYSR=0V Bias current 2 Icc2 - 1.0 2.0 mA VSYSR=3.3V High Level Enable Input Voltage VENHI 2.3 - 5.5 V Low Level Enable Input Voltage VENLOW -0.2 - 0.8 V IEN - 3 10 μA High Level Logic Input Voltage VLHI 2.3 - VCC V Low Level Logic Input Voltage VLLOW -0.2 - 0.8 V IL -1 0 1 μA [Enable] Enable Pin Input current VEN=3V [Logic (CPPE#,CPUSB#)] Logic Pin Input current VCPPE#=3.3V or VCPUSB#=3.3V [Logic (SYSR)] High Level Logic Input Voltage VSYSRHI 2.3 - VCC V Low Level Logic Input Voltage VSYSRLOW -0.2 - 0.8 V ISYSR 6 11 18 μA High Level Logic Input Voltage VPSTHI 2.3 - VCC V Low Level Logic Input Voltage VPSTLOW -0.2 - 0.8 V IPST -18 -11 -6 μA Logic Pin Input current VSYSR=3.3V [Logic (PERST_IN#)] Logic Pin Input current www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 2/17 VPERST_IN#=0V 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Electrical Characteristics – Continued (unless otherwise noted, Ta=25℃ VCC=3.3V VEN=3.3V V3_IN=V3AUX_IN=3.3V,V15_IN=1.5V) Standard Value Parameter Symbol Unit MIN TYP MAX Condition [Switch V3] On Resistance Discharge On Resistance RV3 - 35 73 mΩ RV3Dis - 60 150 Ω RV3AUX - 100 210 mΩ RV3AUXDis - 60 150 Ω RV15 - 42 85 mΩ RV15Dis - 60 150 Ω Ichr 1.0 2.0 3.0 μA Tj=-10～100℃ * [Switch V3AUX] On Resistance Discharge On Resistance Tj=-10～100℃ * [Switch V15] On Resistance Discharge On Resistance Tj=-10～100℃ * [Soft Start] Charge current SS_V3 High Voltage SS_V3high V3+4 V3+5 V3+6 V SS_V15 High Voltage SS_V15high V15+4 V15+5 V15+6 V SS_V3AUX High Voltage SS_AUXhigh 1.5 1.8 2.1 V IDis 0.3 1.0 - mA SSLOW - - 50 mV OCPV3_S 1.0 - - A Discharge current Low Voltage Vss=1V [Over Current Protection] OC Flag V3 V3 Over current OCPV3 2.0 - - A OC Flag V3AUX OCPV3AUX_S 0.25 - - A V3AUX Over current OCPV3AUX 0.50 - - A OC Flag V15 OCPV15_S 0.50 - - A OCPV15 1.20 - - A OC_Delay Charge current IOCP_Delaych 1.0 2.0 3.0 μA OC_Delay Discharge current IOCP_Delaydis 1.0 2.0 - mA OC_Delay Standby Voltage VOCP_Delayst - - 50 mV OC_Delay Threshold Voltage V15 Over current VOC_DELAY=1V VOCP_Delayth 0.6 0.7 0.8 V OC Low Voltage VOCP - 0.1 0.2 V IOC=0.5mA OC Leak current IOCP - - 1 μA VOC=3.65V VUVLOV3_IN 2.80 2.90 3.00 V sweep up [Under Voltage Lockout] V3_IN UVLO OFF Voltage V3_IN Hysteresis Voltage ⊿VUVLOV3_IN 80 160 240 mV V3AUX_IN UVLO OFF Voltage VUVLOV3AUX_IN 2.80 2.90 3.00 V V3AUX_IN Hysteresis Voltage ⊿VUVLOV3AUX_IN 80 160 240 mV V15 UVLO OFF Voltage VUVLOV15 1.25 1.30 1.35 V V15 Hysteresis Voltage ⊿VUVLO15 50 100 150 mV VCC UVLO OFF Voltage VUVLOVCC 2.80 2.90 3.00 V VCC Hysteresis Voltage ⊿VUVLOVCC 80 160 240 mV sweep down sweep up sweep down sweep up sweep down sweep up sweep down * Design Guarantee www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 3/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Reference data V3AUX V3AUX V3AUX V3 V3 V3 CP# CP# CP# SYSR SYSR SYSR Fig.1 System Stand-by→Active (Card) Fig.2 System Active⇔Stand-by (Card) Fig. System Stand-by⇔Active (No Card) V3AUX V3AUX CPUSB# V3 V3 V3 CP# CP# SYSR SYSR V3AUX PERST# Fig.4 PCI Card Assert/DeAssert (Stand-by) Fig.5 Card Assert/DeAssert (Active) V3 RISETIME V3 rise propagation delay TIME Fig.6 USB Card Assert/ DeAssert (Active) 10000 PERST# 10000 1000 Delay Time (ms) Rise Time (ms) 1000 100 100 10 1 SS_V3 1 Logic Input(SYSR) 0.1 0.1 0.01 V3 10 1.00E-10 1.00E-09 1.00E-08 1.00E-07 1.00E-06 CSS_V3 (F) Fig.7 V3 RISETIME 0.01 1.00E-10 1.00E-09 1.00E-08 1.00E-07 1.00E-06 CSS_V3 (F) Fig.8 V3 rise Propagation delay TIME Fig.9 V3 Start up (Stand-by→Active) V3AUX RISE TIME 10000 V3 V3 1000 ) PERST# Delay Time (ms) PERST# ( SS_V3 SS_V3 Logic Input(CP#) 100 10 1 0.1 Logic Input(EN) 1.00E-10 0.01 1.00E-09 1.00E-08 1.00E-07 CSS_V3AUX (F) Fig.10 V3 Start up (Card Assert) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. Fig.11 V3 Wave Form (Shut down→Active) 4/17 Fig.12 V3AUX RISE TIME 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note V3AUX rise propagation delay 10000 PERST# PERST# V3AUX V3AUX Delay Time (ms) 1000 100 10 SS_V3AUX SS_V3AUX 1 Logic Input(SYSR) Logic Input(CP#) 0.1 1.00E-10 1.00E-09 1.00E-08 1.00E-07 CSS_V3AUX (F) 0.01 Fig.14 V3AUX Start up (Stand-by→Active) Fig.13 V3AUX rise propagation delay Fig.15 V3AUX Start up (Card Assert) V15 RISE TIME V15 10000 10000 PERST# 1000 Logic Input(EN) Delay Time (ms) SS_V3AUX Delay Time (ms) 1000 V3AUX 100 10 1 100 10 1 1 0.1 0.1 1.00E-10 1.00E-09 1.00E-08 1.00E-07 CSS_V15 (F) 0.01 Fig.16 V3AUX Start up (Shut down→Active) rise propagation delay time Fig.17 V15 RISE TIME 1.00E-10 0.01 1.00E-07 CSS_V15 (F) Fig.18 V15 rise propagation delay time PERST# PERST# PERST# V15 V15 V15 SS_V15 SS_V15 SS_V15 Logic Input(CP#) Logic Input(SYSR) Fig.19 V15 Start up (Stand-by→Active) 1.00E-08 1.00E-09 Fig.20 V15 Start up (Card Assert) Logic Input(EN) Fig.21 V15 Start up (Shut down→Active) Ishort(500mA/div) OCP_DELAY PERST# PERST# PERST#_DELAY OCP_FLAG PERST#_DELAY SYSR V3AUX Fig.22 V3AUX Short Circuit www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. SYSR Fig.23 PERST# L→H Wave Form 5/17 Fig.24 PERST# H→L Wave Form 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Block Diagram V3_IN1 3.3V V3-1 21 3 VD 22 4 V3_IN2 SS_V3 V3AUX_IN 3.3V/1.30A V3-2 TSD,CL,UVLO 2 3.3V AUX/275mA 20 5 V3AUX_IN V3AUX 3.3V SS_V3AUX TSD,CL,UVLO_AUX 6 V15_IN1 V15_IN2 1.5V 17 8 18 CPUSB# SYSR SS_V15 12 1.5V/625mA 9 V15-2 VD CPPE# 11 V15-1 Input logic Power good 10 19 TSD,CL,UVLO 16 PERST# VCC 7 EN,SYSR,CPUSB#,CPPE# PERST_IN# 13 Thermal protection VCC 24 TSD PERST#_DELAY V3_IN,V3AUX_IN,V15 CL V3,V3AUX,V15 EN 23 Reference Block V3_IN V3AUX_IN Charge Pump VD V15_IN VCC 15 Under UVLO OC voltage lock out 14 UVLO_AUX OC_DELAY 1 GND www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 6/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Pin Configration GND 1 24 VCC SS_V3 2 23 EN V3_1 3 22 V3_IN2 V3_2 4 21 V3_IN1 V3AUX 5 20 V3AUX_IN SS_V3AUX 6 19 PERST# PERST_IN# 7 (SysReset#) 18 V15_IN2 V15_1 8 17 V15_IN1 V15_2 9 16 SS_V15 SYSR 10 15 OC CPPE# CPUSB# 11 14 OC_DELAY 12 13 PERST#_DELAY SSOP-B24 Package ●Pin Function PIN No PIN NAME 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 GND SS_V3 V3_1 V3_2 V3AUX SS_V3AUX PERST_IN# V15_1 V15_2 SYSR CPPE# CPUSB# PERST#_DELAY OC_DELAY OC SS_V15 V15_IN1 V15_IN2 PERST# V3AUX_IN V3_IN1 V3_IN2 EN VCC www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. PIN FUNCTION GND pin V3 soft start pin V3 output pin 1 V3 output pin 2 V3AUX output pin V3AUX soft start pin PERST# control input pin (SysReset#) V15 output pin 1 V15 output pin 2 Logic input pin Logic input pin Logic input pin PERST# delay time setting pin OCP delay time setting pin over current protect signal output pin V15 soft start pin V15 input pin 1 V15 input pin 2 Logic output pin V3AUX input pin 1 V3 input pin 1 V3 input pin 2 Enable input pin Input voltage 7/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Description of operations VCC BD4153FV/EFV has an independent power input pin for an internal circuit operation in order to activate UVLO, Input logic, and charge pump, the maximum current through which is rated to 2 mA. It is recommended to connect a bypass capacitor of 0.1 μF or so to VCC pin. EN With an input of 2.3 volts or higher, this terminal turns to “High” level to activate the circuit, while it turns to “Low” level to deactivate the circuit (with the standby circuit current of 35 μA), discharges each output and lowers output voltage If the input is lowered to 0.8 volts or less. V3_IN, V15_IN, and V3AUX_IN These are the input terminals for each channel of a 3ch switch. V3_IN and V15_IN terminals have two pins each, which should be short-circuited on the pc board with a thick conductor. And V3AUX IN terminal should be short-circuited to VCC terminal. Through these three terminals, a big current runs (V3_IN: 1.35A, V3AUX_IN: 0.275 A, and V15_IN: 0.625 A). In order to lower the output impedance of the power supply to be connected, it is recommended to provide ceramic capacitors (of B-characteristics or better) between these terminals and ground; 1 μF or so between V3_IN and GND and between V15_IN and GND, and 0.1 μF or so between V3AUX_IN and GND. V3, V15, and V3AUX These are the output terminals for each switch. V3 and V15 terminals have two pins each, which should be short-circuited on the pc board and connected to an ExpressCard connector with a thick conductor as shortest as possible. In order to stabilize the output, it is recommended to provide ceramic capacitors (of B-characteristics or better) between these terminals and ground; 10 μF or so between V3 and GND and between V15 and GND, and 1 μF or so between V3AUX and GND. CPPE# The pin used to find whether a PCI-Express signal compatible card is provided or not. Turns to “High” level with an input of 2.3 volts or higher, which means that no card is provided, while it turns to “Low” level when the input is lowered to 0.8 volts or less, which means that a card is provided. Controls turning ON/OFF of the switch according to the status of the system. CPUSB# The pin used to find whether a USB2.0 signal compatible card is provided or not. Turns to “High” level with an input of 2.3 volts or higher, which means that no card is provided, while it turns to “Low” level when the input is lowered to 0.8 volts or less, which means that a card is provided. Controls turning ON/OFF of the switch according to the system status. SYSR The pin used to detect the system status. Turns to “High” level with an input of 2.3 volts or higher, which means that the system is activated, while it turns to “Low” level when the input is lowered to 0.8 volts or less, which means that the system is on standby. PERST_IN# The pin used to control a reset signal to a card (PERST#) from the system side. (Also referred to as “SysReset#” by PCMCIA.) Turns to “High” level with an input of 2.3 volts or higher, and turns PERST# to “High” level AND with a “Power Good” output. Turns to “Low” level and turns PERST# to “Low” level when the input is lowered to 0.8 volts or less. PERST# The pin used to provide a reset signal to a PCI-Express compatible card. The status is determined by each output, PERST#_IN, CPPE# system status, and EN on/off status. Turns to “High” level and activates the PCI-Express compatible card only if each output is within the “Power Good” threshold with the card kept inserted and with PERST_IN# turned to “High” level. PERST#_DELAY Delay during which the level at PERST# pin turns from Low to High may be set with a capacitor externally applied. The delay time is determined by the regulated current (2 μA), the reference voltage (0.7 volts) inside the IC and the capacitance of the capacitor externally applied. The delay time is specified as “at least 1 ms” in “ExpressCard Standard”. It does not synchronize with PERST_IN#, and it synchronizes only with a “Power Good” output inside the IC. Turns to “Low” level when SW is turned OFF. OC Turns its output to “Low” level if an overcurrent condition is detected. This open drain output may be pulled up to 3.6 volts power supply via resistor. OC-Delay Delay during which the level at OC pin turns from High to Low may be set with a capacitor externally applied. The delay time is determined by the regulated current (2 μA), the reference voltage (0.7 volts) inside the IC and the capacitance of the capacitor externally applied. May be used to control with the OC status fed back to the system. If fed back to EN terminal of this IC, it may be used to turn OFF the output that is provided when an overcurrent condition is detected. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 8/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Timing Chart Power ON/OFF Status of ExpressCardTM System Status Primary Auxiliary OFF OFF ON ON ON Power Switch Status ExpressCARDTM Module Status ON Primary Auxiliary(3.3V Aux) Don’t Care OFF OFF De-asserted OFF OFF Asserted ON ON De-asserted OFF OFF Asserted Before This System Status OFF ON Asserted After This System Status OFF OFF ExpressCardTM States Transition Diagram SYSR=L CP#=Ｌ→Ｈ SYSR=H⇔L CP#=H SYSR=H CP#=H→L SYSR=L CP#=H⇔L V3AUX=OFF V15=V3=OFF SYSR=Ｌ→Ｈ CP#=L V3AUX=ON V15=V3=ON SYSR=H→L CP#=L SYSR=H CP#=Ｌ→Ｈ SYSR=L→H CP#=L V3AUX=ON V15=V3=OFF SYSR=H→L CP#=L SYSR=L CP#=L ⇔ SYSR=H CP#=H System Status Card Status Stand-by Status :SYSR=L CardAsserted Status :CP#=L ON Status :SYSR=H Card De-asserted Status :CP#=H From ON to Stand-by Status :SYSR=H→L From De-asserted to Asserted Status :CP#=H→L From Stand-by to ON Status :SYSR=L→H From Asserted to De-asserted Status :CP#=L→H www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 9/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ■ BD4153FV Evaluation Board Circuit U1 TP16 TP15 1 C2 TP1 4 TP2 5 C6a 6 C6 C3 TP21 VCC R7 V3_AUXIN C5 2 TP17 3 7 S2 R7a TP4 TP18 C7 C8 R10a TP6 S4 TP7 R11a TP8 S5 R12a TP3 8 9 10 11 12 S6 BD4153FV 24 VCAC GND V3_1 V3_IN2 V3_2 V3 IN1 V3AUX SS_V3AUX PERST# PERST_IN# V15 IN2 V15_1 V15 IN1 V15_2 SS_V15 SYSR OC CPUSB# C24 R20 C23a C21 TP11 C20 TP10 18 TP19 17 C17 16 C16 TP9 15 PERST#_DELAY TP20 TP12 19 OC DELAY CPPE# S1 21 TP22 20 V3_AUXIN C23 R23 23 TP13 22 EN SS_V3 VCC TP14 R24 14 13 C14 VCC C13 R18 R15 VCC R10 R11 R12 C10 C11 C12 ■ BD4153FV Evaluation Board Application Components Part No Value Company Parts Name Part No Value Company Parts Name U1 - ROHM BD4153FV C6a - - - R7 10kΩ ROHM MCR03series C7 - - - R10 10kΩ ROHM MCR03series C8 10μF murata GRM21 series R10a 0Ω ROHM MCR03series C10 - - - R11 120kΩ ROHM MCR03series C11 - - - R11a 0Ω ROHM MCR03series C12 - - - R12 120kΩ ROHM MCR03series C13 0.033μF murata GRM18 series R12a 0Ω ROHM MCR03series C14 0.22μF murata GRM21 series R15 10kΩ ROHM MCR03series C16 2200pF murata GRM18 series R18 - - C17 1μF murata GRM21 series R20 0Ω ROHM MCR03series C20 0.1μF murata GRM18 series R23 0Ω ROHM MCR03series C21 1μF murata GRM21 series R24 10Ω ROHM MCR03series C23 0.1μF murata GRM18 series C2 2200pF murata GRM18 series C23a - - - C3 10μF murata GRM21 series C24 0.1μF murata GRM18 series C5 1μF murata GRM21 series C6 0.01μF murata GRM18 series www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 10/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ■ BD4153FV Evaluation Board Layout Silk Screen TOP Layer Mid Layer 1 Mid Layer 2 Bottom Layer www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 11/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Apprication Circuit (Circuit for ExpressCardTM Compliance Checklist) BD4153FV CPPE#(1) CPUSB#(2) 3.3V(3) 3.3Vaux(4) 1.5V(5) PERST#(6) VCC(24pin) CPPE#(11pin) CPUSB#(12pin) V3_IN(21,22pin) 3.3V(7) V3(3,4pin) V3AUX_IN(20pin) 3.3Vaux(8) V3AUX(5pin) V15_IN(17,18pin) 1.5V(9) V15(8,9pin) PERST_IN#(7pin) PERST#(19pin) SysReset#(10) EN(23pin) VCC OC(15pin) OC_Delay(14pin) SYSR(10pin) SS_V3(2pin) SS_V3AUX(6pin) PERST#_Delay(13pin) SS_V15(16pin) GND(1pin) ●About heat loss In designing heat, operate the apparatus within the following conditions. (Because the following temperatures are warranted temperature, be sure to take margin, etc. into account.) 1. Ambient temperature Ta shall be not more than 125°C. 2. Chip junction temperature Tj shall be not more than 150°C. Chip junction temperature Tj can be considered under the following two cases. ①Chip junction temperature Tj is found from IC surface temperature TC under actual application conditions:Tj=TC+θj-c×W ＜Reference value＞ θj-c:SSOP-B24 33℃/W HTSSOP-B24 36℃/W ②Chip junction temperature Tj is found from ambient temperature Ta:Tj=TC+θj-a×W ＜Reference value＞ θj-a:SSOP-B24 243.9℃/W (IC only) 147.1℃/W Single-layer substrate (substrate surface copper foil area: less 3%) θj-a:HTSSOP-B24 113.6℃/W Single-layer substrate (substrate surface copper foil area: less 3%) 73.5℃/W Double-layer substrate 2 (substrate surface copper foil area:15×15mm ) 44.6℃/W Double-layer substrate 2 (substrate surface copper foil area: 70×70mm ) 31.3℃/W Fourth-layer substrate 2 (substrate surface copper foil area: 70×70mm ) Most of heat loss in BD4153FV occurs at the output switch. The power lost is determined by multiplying the on-resistance by the square of output current of each switch. As BD4153EFV employs the power PKG, the thermal derating characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 12/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Equivalent Circuit 2pin<SS_V3> 3,4pin<V3_1,V3_2> VD 5pin<V3AUX> V3_IN SS_V3 6pin<SS_V3AUX> V3AUX_IN SS_V3AUX V3_IN V3AUX VCC V3AUX_IN 7pin<PERST_IN#> 8,9pin<V15_1,V15_2> VCC VCC 10pin<SYSR> SS_V15 V15_IN V15_IN VCC VCC VCC 12pin<CPUSB#> VCC 13pin<PERST#_DELAY> VCC VCC 16pin<SS_V15> 14pin<OC_DELAY> VCC VCC 17,18pin<V15_IN1,V15_IN2> 11pin<CPPE#> VCC VCC 15pin<OC> VCC 19pin<PERST#> 20pin<V3AUX_IN> VCC VCC V15 21,22pin<V3_IN1,V3_IN2> 23pin<EN > VCC V3AUX 24pin<VCC> V3 www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 13/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Note For Use 1.Absolute maximum ratings For the present product, thoroughgoing quality control is carried out, but in the event that applied voltage, working temperature range, and other absolute maximum rating are exceeded, the present product may be destroyed. Because it is unable to identify the short mode, open mode, etc., if any special mode is assumed, which exceeds the absolute maximum rating, physical safety measures are requested to be taken, such as fuses, etc. 2.GND potential Bring the GND terminal potential to the minimum potential in any operating condition. 3.Thermal design Consider allowable loss (Pd) under actual working condition and carry out thermal design with sufficient margin provided. 4.Terminal-to-terminal short-circuit and erroneous mounting When the present IC is mounted to a printed circuit board, take utmost care to direction of IC and displacement. In the event that the IC is mounted erroneously, IC may be destroyed. In the event of short-circuit caused by foreign matter that enters in a clearance between outputs or output and power-GND, the IC may be destroyed. 5.Operation in strong electromagnetic field The use of the present IC in the strong electromagnetic field may result in maloperation, to which care must be taken. 6.Built-in thermal shutdown protection circuit The present IC incorporates a thermal shutdown protection circuit (TSD circuit). The working temperature is 175°C (standard value) and has a -15°C (standard value) hysteresis width. When the IC chip temperature rises and the TSD circuit operates, the output terminal is brought to the OFF state. The built-in thermal shutdown protection circuit (TSD circuit) is first and foremost intended for interrupt IC from thermal runaway, and is not intended to protect and warrant the IC. Consequently, never attempt to continuously use the IC after this circuit is activated or to use the circuit with the activation of the circuit premised. 7.Capacitor across output and GND In the event a large capacitor is connected across output and GND, when Vcc and VIN are short-circuited with 0V or GND for some kind of reasons, current charged in the capacitor flows into the output and may destroy the IC. Use a capacitor smaller than 1000 μF between output and GND. 8.Inspection by set substrate In the event a capacitor is connected to a pin with low impedance at the time of inspection with a set substrate, there is a fear of applying stress to the IC. Therefore, be sure to discharge electricity for every process. As electrostatic measures, provide grounding in the assembly process, and take utmost care in transportation and storage. Furthermore, when the set substrate is connected to a jig in the inspection process, be sure to turn OFF power supply to connect the jig and be sure to turn OFF power supply to remove the jig. 9.IC terminal input + The present IC is a monolithic IC and has a P substrate and P isolation between elements. With this P layer and N layer of each element, PN junction is formed, and when the potential relation is GND>terminal A>terminal B, PN junction works as a diode, and terminal B>GND terminal A, PN junction operates as a parasitic transistor. The parasitic element is inevitably formed because of the IC construction. The operation of the parasitic element gives rise to mutual interference between circuits and results in malfunction, and eventually, breakdown. Consequently, take utmost care not to use the IC to operate the parasitic element such as applying voltage lower than GND (P substrate) to the input terminal. Resistor NPN Transistor Structure (NPN) （PIN A） （PIN B） B E C Parasitic diode GND N P+ P+ P P P+ N GND （PIN B） P+ N N N P substrate （PIN A） N Parasitic diode GND C N B E P substrate Parasitic diode GND GND Nearby other device Parasitic diode www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 14/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note 10. GND wiring pattern If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for GND wiring pattern of component externally connected, pay special attention not to cause undesirable change to it. 11. Electrical characteristics The electrical characteristics in the Specifications may vary depending on ambient temperature, power supply voltage, circuit(s) externally applied, and/or other conditions. It is therefore requested to carefully check them including transient characteristics. 12. Capacitors to be applied to the input terminals The capacitors to be applied to the input terminals (VCC, V3_IN, V3AUX_IN and V15_IN) are used to lower the output impedance of the power supply to be connected. An increase in the output impedance of the power supply may result in destabilization of input voltages (VCC, V3_IN, V3AUX_IN and V15_IN). It is recommended to use a low ESR capacitor with less temperature coefficient (change in capacitance vs. change in temperature), 0.1 μF more or less for VCC and V3AUX_IN while 1 μF more or less for V3_IN and V15_IN, but it must be thoroughly checked at the temperature and with the load of the range expected to use because it significantly depends on the characteristics of the input power supply to be used and the conductor pattern of the pc board. 13. Capacitors to be applied to the output terminals To the output terminals (V3, V3_AUX, and V15), the output capacitors should be connected between the respective output terminal and GND. It is recommended to use a low ESR capacitor with less temperature coefficient, 1 μF more or less for V3 and V15 terminals while 1μF more or less for V3_AUX, but it must be thoroughly checked at the temperature and with the load of the range expected to use because it significantly depends on the temperature and the load conditions. 14. Not of a radiation-resistant design. 15. .Allowable loss Pd With respect to the allowable loss, the thermal derating characteristics are shown in the Exhibit, which we hope would be used as a good-rule-of-thumb. Should the IC be used in such a manner to exceed the allowable loss, reduction of current capacity due to chip temperature rise, and other degraded properties inherent to the IC would result. You are strongly urged to use the IC within the allowable loss. 16. In the event that load containing a large inductance component is connected to the output terminal, and generation of back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode. OUTPUT PIN 17. Operating ranges If it is within the operating ranges, certain circuit functions and operations are warranted in the working ambient temperature range. With respect to characteristic values, it is unable to warrant standard values of electric characteristics but there are no sudden variations in characteristic values within these ranges. 18. We are certain that examples of applied circuit diagrams are recommendable, but you are requested to thoroughly confirm the characteristics before using the IC.In addition, when the IC is used with the external circuit changed, decide the IC with sufficient margin providedwhile consideration is being given not only to static characteristics but also variations of external parts and our IC including transient 19. Wiring to the input terminals (V3 IN, V3AUX IN, and V15 IN) and output terminals (V3, V3AUX and V15) of built-in FET should be carried out with special care. Unnecessarily long and/or thin conductors used in wiring may result in degradation of characteristics including decrease in output voltage. 20. Heatsink Heatsink is connected to SUB, which should be short-circuited to GND. Solder the heatsink to a pc board properly, which offers lower thermal resistance. www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 15/17 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Power Dissipation ◎BD4153FV ◎BD4153EFV [W] [W] 1.4 5 Mounted on board 70mm×70mm×1.6mm Glass-epoxy PCB θj-a=122.0℃/W 1.2 measure：TH-156（Kuwano-Denki） measure condition：Rohm Standard Board PCB size：70mm×70mm×1.6mmt (PCB with Thermal Via) ④4.0W 4 1.025W PCB①：Single-layer substrate （substrate surface copper foil area:0mm×0mm） PCB②：Double-layer substrate （substrate surface copper foil area:15mm×15mm） PCB③：Double-layer substrate （substrate surface copper foil area:70mm×70mm） PCB④：Fourth-layer substrate （substrate surface copper foil area:70mm×70mm） Without heat sink. θj-a=158.7℃/W 0.787W 0.8 Power Dissipation (Pd) Power Dissipation (Pd) 1.0 0.6 100℃ 0.4 0.2 3 ③2.8W 2 PCB①：θja=113.6℃/W PCB②：θja=43.5℃/W PCB③：θja=44.6℃/W PCB④：θja=31.3℃/W ②1.7W ①1.1W 1 0 0 25 50 75 100 125 Ambient Temperature (Ta) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 150 [℃] 0 25 50 75 100 125 Ambient Temperature (Ta) 16/17 150 [℃] 2010.04 - Rev.B BD4153FV,BD4153EFV Technical Note ●Ordering part number B D 4 Part Number 1 5 3 F Part Number V - Package FV : SSOP-B24 EFV : HTSSOP-B24 E 2 Packaging and forming specification E2: Embossed tape and reel (SSOP-B24/ HTSSOP-B24) SSOP-B24 <Tape and Reel information> 7.8 ± 0.2 (MAX 8.15 include BURR) 13 Tape Embossed carrier tape Quantity 2000pcs Direction of feed 0.3Min. 5.6 ± 0.2 7.6 ± 0.3 24 1 E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 12 0.1 1.15 ± 0.1 0.15 ± 0.1 0.1 0.65 0.22 ± 0.1 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. HTSSOP-B24 <Tape and Reel information> 7.8±0.1 (MAX 8.15 include BURR) (5.0) 0.325 1.0±0.2 0.53±0.15 (3.4) 1 Tape Embossed carrier tape (with dry pack) Quantity 2000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 12 1PIN MARK +0.05 0.17 -0.03 S 0.08±0.05 0.85±0.05 1.0MAX 13 5.6±0.1 7.6±0.2 24 +6° 4° −4° 0.65 0.08 S +0.05 0.24 -0.04 0.08 1pin M Reel (Unit : mm) www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. 17/17 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2010.04 - Rev.B Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A