DS8541A 01

®
RT8541/A
90V Boost DC/DC Converter with APD Current Monitor
General Description
Features
The RT8541/A is a constant frequency current mode PWM
step-up DC/DC converter designed to bias avalanche
photodiodes (APD) at high voltage in optical receivers. It
includes a voltage doubler charge pump to significantly
reduce the noise level at output up to 90V. The RT8541A
switching frequency can be adjusted by a resistor while
RT8541 is internally set at 650kHz. The RT8541/A has a
built-in APD current mirror that delivers 1/5 of the APD
current with high accuracy for monitoring the APD current
from 0.25μA to 2.5mA. This current can be used as a
reference to provide a digital programmed output voltage
via the CTRL pin. To protect the optical receiver system,
the RT8541/A provides a built-in adjustable APD current
limit function by sensing a 200mV voltage threshold
between VOUT2 and MONIN pins. Only one resistor is
needed to program the desired current limit. A charge pump
voltage doubler is designed to achieve significantly lower
noise level at the APD comparing to a simple boost
converter type bias circuit.

Integrated Schottky Diodes for Charge Pump
Voltage Doubler

50V, 400mA Internal Switch
High Side Low Noise and Accurate APD Current
Monitor
650kHz Fixed Switching Frequency for RT8541 and
Adjustable Switching Frequency for RT8541A
Wide VIN Range : 2.7V to 16V
Adjustable APD Current Limit with External Resistor
Low Shutdown Current <1μ
μA
Built-In Soft-Start
CTRL Pin Allows Output Adjustment with no Polarity
Inversion
Thin 16-Lead WQFN Package
RoHS Compliant and Halogen Free
The RT8541/A also features a built-in 9ms soft-start
function to eliminate the inrush current during start-up
interval. The RT8541/A provides a low cost optical receiver
solution and can fit in very small PCB area.









Applications
APD Bias
PIN Diode Bias
 Optical Receivers and Modules
 Fiber Optic Network Equipment


The RT8541/A is available in the WQFN-16L 3x3 package.
Simplified Application Circuit
C1
L
VIN
CIN
R5
VOUT
COUT
VOUT1
CFB
C3
RSET
GND
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS8541/A-01 June 2015
R6
C2
VC
FSET
R4
C4
SW
PUMP
VIN RT8541/A
MONIN
CTRL
SHDN
VOUT2
FB
MON
APD
R3
R2
R1
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
1
RT8541/A
Ordering Information
Pin Configurations
RT8541/A
(TOP VIEW)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Adjustable Switching Frequency
Fixed Switching Frequency
MON
NC
FB
CTRL
Package Type
QW : WQFN-16L 3x3 (W-Type)
16 15 14 13
VC
APD
MONIN
VOUT2
1
12
2
11
GND
3
Note :
9
5
RoHS compliant and compatible with the current require-

Suitable for use in SnPb or Pb-free soldering processes.
6
7
8
VOUT1
PUMP
SW
SW
Richtek products are :

10
17
4
SHDN
VIN
GND
GND
ments of IPC/JEDEC J-STD-020.
WQFN-16L 3x3
MON
FSET
FB
CTRL
RT8541
Marking Information
RT8541GQW
16 15 14 13
8C= : Product Code
8C=YM
DNN
YMDNN : Date Code
VC
APD
MONIN
VOUT2
1
12
2
11
GND
3
9
1G= : Product Code
1G=YM
DNN
YMDNN : Date Code
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
2
6
7
8
VOUT1
PUMP
SW
SW
5
RT8541AGQW
10
17
4
SHDN
VIN
GND
GND
WQFN-16L 3x3
RT8541A
is a registered trademark of Richtek Technology Corporation.
DS8541/A-01 June 2015
RT8541/A
Functional Pin Description
Pin No.
Pin Name
Pin Function
1
VC
Compensation Node for Control Loop.
2
APD
Output for APD. Connect this Pin to the APD Cathode.
3
MONIN
Current Monitor Input Power Pin. An optional resistor between the VOUT2 and
MONIN pins can be used for current limit setting.
4
VOUT2
Voltage Doubler Output Pin. A 50V rated capacitor is needed between this pin
and VOUT1 pin. A resistor divider for output voltage feedback is connected
between this pin and GND pin.
5
VOUT1
6
PUMP
7, 8
SW
Output Pin of Boost Converter. A capacitor is needed between this pin and
GND pin. The trace length from this pin to the capacitor should be minimized.
Charge Pump Pin for Voltage Doubler. Put a 50V capacitor between the SW
and PUMP pins to form a complete voltage doubler with the internal Schottky
diodes.
Switch Node of Boost Converter. Minimize the trace area on this pin to reduce
EMI. A Schottky diode between SW pin (cathode) and GND pin (anode) is
required
Ground. The exposed pad must be soldered to a large PCB and connected to
GND for maximum power dissipation.
9, 10,
17 (Exposed Pad)
GND
11
VIN
12
SHDN
13
CTRL
14
FB
Feedback Input. Connect the pin to the output resistor divider for output voltage
setting.
NC
(RT8541)
No Internal Connection. The switching frequency is set at 650kHz internally.
FSET
(RT8541A)
Oscillator Frequency Setting. Connect a resistor between this pin and GND for
frequency setting.
MON
Output for Current Monitor. It sources a current equal to 20% of the APD
current and converts to a reference voltage through an external resistor.
15
16
Supply Voltage Input. Connect a 1F capacitor from this pin to GND.
Shutdown Control Input. Tie to 2V or higher with a resistor 200k to enable
device.
External Reference Control Input. This allows the FB voltage to follow the
external reference between 0V and 1.2V. Tie this pin higher than 1.5V to use
the internal reference of 1.235V.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS8541/A-01 June 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
3
RT8541/A
Function Block Diagram
VIN
SHDN
SW
PUMP
D3
VOUT2
1.235V
Reference
CTRL
FB
Soft-Start
D1
D2
VOUT1
+
+ A1
Error
Amplifier
R
A2
+
PWM
Comparator
Q1
Q
S
VC
+
Oscillator
Current
Sense
Amplifier
APD
Current
Mirror
APD
MON
MONIN
APD Current
Limit
0.2V
+
GND
FSET
(RT8541A Only)
Operation
The RT8541/A Boost converter uses a constant frequency
current mode control scheme to provide excellent line and
load regulation. Operation can be best understood by
referring to the Functional Diagram. At the start of each
oscillator cycle, the SR latch is set, which turns on the
power switch, Q1. A voltage proportional to the switch
current is added to a stabilizing slope compensation and
the resulting sum is fed into the positive terminal of the
PWM comparator, A2. When this voltage exceeds the
level at the negative input of A2, the SR latch is reset and
the power switch is turned off . The level at the negative
input of A2 is set by the error amplifier A1, and is simply
an amplified version of the difference between the feedback
voltage and the reference voltage of 1.235V, or externally
provided CTRL voltage. In this manner, the error amplifier
sets the correct peak current level to keep the output in
regulation. If the error amplifier's output increases, more
current is delivered to the output; if it decreases, less
current is delivered.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
4
The RT8541/A has an integrated high side APD current
monitor with a 5:1 ratio. The MONIN pin can accept a
supply voltage up to 90V, which is suitable for APD
photodiode applications. The MON pin has an open-circuit
protection feature and is internally clamped to 15V.
If an APD is tied to the APD pin, the current will be mirrored
to the MON pin and converted to a voltage signal by the
resistor between MON and GND pins. This voltage signal
can be used to drive an external control block to adjust
the APD voltage by adjusting the feedback threshold of
Error Amplifier A1 through the CTRL input.
The RT8541/A features a built-in 9ms soft-start function
and provides current limit function with a 0.2V threshold
between VOUT2 and MONIN pins to protect the APD
system. The APD current limit can be adjusted by an
external resistor between the VOUT2 and MONIN pins.
is a registered trademark of Richtek Technology Corporation.
DS8541/A-01 June 2015
RT8541/A
Absolute Maximum Ratings










(Note 1)
VIN, SHDN, FSET, CTRL, MON ---------------------------------------------------------------------------------------VOUT1, SW ----------------------------------------------------------------------------------------------------------------VOUT2, PUMP, MONIN, APD ------------------------------------------------------------------------------------------FB, VC, FSET --------------------------------------------------------------------------------------------------------------Power Dissipation, PD @ TA = 25°C
16V
50V
90V
5V
WQFN-16L 3x3 ------------------------------------------------------------------------------------------------------------Package Thermal Resistance (Note 2)
WQFN-16L 3x3, θJA -------------------------------------------------------------------------------------------------------WQFN-16L 3x3, θJC ------------------------------------------------------------------------------------------------------Junction Temperature -----------------------------------------------------------------------------------------------------Lead Temperature (Soldering, 10 sec.) -------------------------------------------------------------------------------Storage Temperature Range --------------------------------------------------------------------------------------------ESD Susceptibility (Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------------------MM (Machine Model) ------------------------------------------------------------------------------------------------------
3.33W
Recommended Operating Conditions



30°C/W
7.5°C/W
150°C
260°C
−65°C to 150°C
2kV
200V
(Note 4)
Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ 3V to 12V
Junction Temperature Range --------------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range --------------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 5V, TA = 25°C, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
2.7
--
16
V
1.215
1.235
1.255
V
--
0.025
0.07
%/V
--
30
100
nA
FB = 1.3V, VSHDN = 2V
--
3.3
4
mA
VSHDN = 0V, Not Switching
--
0.1
0.5
A
RSET = NC (RT8541)
--
650
--
RSET = 30k (RT8541A)
--
650
--
fSW = 650kHz
95
--
--
%
320
400
480
mA
Operating Voltage
Feedback Voltage
VFB
Feedback Line Regulation
CTRL = 1.5V
VIN = 3V to 10V
FB Pin Bias Current
Supply Current
IVIN
Shutdown Current
Switching Frequency
fSW
Maximum Duty Cycle
DMAX
Switch Current Limit
ILIM
kHz
Switch VCESAT
ISW = 150mA
--
130
220
mV
Switch Leakage Current
SW = 5V
--
--
2
A
Schottky Forward Voltage
ISCHOTTKY = 150mA
--
720
--
mV
Schottky Reverse Leakage
VOUT1  SW = 50V
--
--
5
A
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS8541/A-01 June 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5
RT8541/A
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
SHDN Voltage High
VIH
2
--
--
V
SHDN Voltage Low
VIL
--
--
0.4
V
SHDN Pin Bias Current
--
1
2
A
Internal Soft-Start Time
--
9
--
ms
VC Threshold Voltage
--
0.7
--
V
IAPD = 250nA, 10V  MONIN  90V
0.18
0.2
0.22
IAPD = 2.5mA, 20V  MONIN  90V
0.18
0.2
0.22
--
15
16
V
APD Current Monitor Gain
GAPD
Monitor Output Voltage Clamp
--
APD Monitor Voltage Drop
MONIN APD at IAPD = 1mA,
MONIN = 90V
--
--
5
V
MONIN Pin Current Limit
Threshold Voltage
APD = 0V, MONIN = 40V
--
200
--
mV
CTRL to FB Offset
CTRL = 0.5V
5
2
12
mV
--
150
--
C
OTP Threshold Temperature
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
6
is a registered trademark of Richtek Technology Corporation.
DS8541/A-01 June 2015
RT8541/A
Typical Application Circuit
L
10µH
VIN
3.3V
C1
0.1µF
7, 8
6
SW
PUMP
11 VIN
RT8541
3
13
MONIN
CTRL
4
R5 200k 12
VOUT2
SHDN
CIN
1µF
On
Off
1
VC
VOUT1
R4
51k
C4
3.3nF
9, 10, 17 (Exposed Pad)
VIN
3.3V
VOUT
COUT 70V (Max.)
0.1µF
CFB
10nF
R2
1M
R1
16.5k
R3
10k
C1
0.1µF
7, 8
6
SW
PUMP
11 VIN
RT8541A
3
13
MONIN
CTRL
4
R5 200k 12
VOUT2
SHDN
CIN
1µF
On
Off
C2
0.47µF
C3
0.47µF
FB 14
16
MON
APD 2
GND
L
10µH
5
R6 100
1
R4
51k
C4
3.3nF
15
VC
VOUT1
FSET
RSET
30k
9, 10, 17 (Exposed Pad)
5
C2
0.47µF
C3
0.47µF
VOUT
COUT 70V (Max.)
0.1µF
CFB
10nF
FB 14
MON 16
APD 2
GND
R6 100
R2
1M
R1
16.5k
R3
10k
Figure 1. 3.3V to 63V/2mA APD Bias Power Supply Application Circuit
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS8541/A-01 June 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
7
RT8541/A
Typical Operating Characteristics
Switching Frequency vs. Input Voltage
Switching Frequency vs. Temperature
700
Switching Frequency (kHz)1
Switching Frequency (kHz) 1
1000
900
800
700
600
500
400
VIN = 3.3V
300
690
680
670
660
650
640
630
620
610
600
-50
-25
0
25
50
75
100
125
3
6
9
18
21.0
Current Monitor Output (µA)1
800
700
600
500
400
300
20.5
20.0
19.5
VIN = 3.3V
IAPD = 0.1mA
19.0
200
-50
-25
0
25
50
75
100
10
125
20
30
40
50
60
70
80
90
MONIN Voltage (V)
Temperature (°C)
MON Current vs. APD Current
Switch Saturation Voltage vs. Switch Current
450
350
300
250
200
150
100
50
VMON = 40V
0
Switch Saturation Voltage (mV)1
400
400
MON Current (µA)
15
Current Monitor Output vs. MONIN Voltage
Switch Current Limit vs. Temperature
900
Switch Current Limit (mA)
12
Input Voltage (V)
Temperature (°C)
350
300
250
200
150
100
50
VIN = 3.3V
0
0
500
1000
1500
APD Current (µA)
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
8
2000
0
100
200
300
400
Switch Current (mA)
is a registered trademark of Richtek Technology Corporation.
DS8541/A-01 June 2015
RT8541/A
FB Voltage vs. Temperature
Switching Frequency vs. Resistor
1.200
Switching Frequency (kHz)1
2000
FB Voltage (V)
1.195
1.190
1.185
1.180
1660
1320
980
640
VIN = 3.3V
1.175
300
-50
-25
0
25
50
75
100
125
10
20
40
50
60
Resistor (Ω)
Temperature (°C)
Efficiency vs. APD Current
Input Watt vs. APD Current
50
0.45
45
0.40
40
0.35
35
Input Watt (W)
Efficiency (%)
30
30
25
20
15
0.30
0.25
0.20
0.15
0.10
10
5
VIN = 3.3V, VOUT = 63V
0
0.05
VIN = 3.3V, VOUT = 63V
0.00
0
0.5
1
1.5
2
2.5
0
0.5
1
1.5
2
APD Current (mA)
APD Current (mA)
FB Voltage vs. CTRL Voltage
Monitor Step Response
2.5
1.4
FB Voltage (V)
1.2
VAPD_ac
(500mV/Div)
1.0
0.8
0.6
VMON_ac
(2V/Div)
0.4
0.2
VIN = 3.3V
IAPD = 2mA, R3 = 10kΩ
0.0
0
0.25
0.5
0.75
1
1.25
1.5
Time (50ns/Div)
CTRL Voltage (V)
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS8541/A-01 June 2015
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
9
RT8541/A
Application Information
Boost Regulator
The RT8541/A is a current mode Boost converter
integrated with a 50V/400mA power switch over a wide
VIN range from 2.8V to 16V. It performs fast transient
responses to support the avalanche photodiodes (APDs)
in optical receivers. The high operation frequency allows
the use of small components to minimize the thickness
of the optical transceiver.
The output voltage can be adjusted by an external resistive
voltage divider connected to the FB pin. The error amplifier
varies the VC voltage by sensing the FB pin to regulate
the output voltage. For better stability, the slope
compensation signal summed with the current sense
signal will be compared with the VC voltage to determine
the current trip point and duty cycle.
where η is the efficiency of the converter, IIN(MAX) is the
maximum input current. The input peak current can then
be obtained by adding the maximum input current with
half of the inductor ripple current.
IPEAK =1.2 x IIN(MAX)
Note that the saturated current of the inductor must be
greater than IPEAK. The inductance can eventually be
determined according to the following equation :
   VIN    VOUT2  VIN 
2
L=
0.4   VOUT2   IAPD  fSET
2
where fSET is the switching frequency. For better system
performance, a shielded inductor is preferred to avoid EMI
problems.
Switching Frequency
Output Voltage Setting
The RT8541/A regulated output voltage is showed as the
following equation :
VOUT = VFB   1 R1  , where VFB = 1.235V (typ.)
 R2 
The recommended value for R2 should be at least 10kΩ.
Place the resistive voltage divider as close as possible to
the chip to reduce noise sensitivity.
Loop Compensation
The voltage feedback loop can be compensated with an
external compensation network consisting of R4. Choose
R4 to set high frequency integrator gain for fast transient
response and C4 to set the integrator zero to maintain
loop stability. For example, VIN = 3.3V, VOUT2 = 63V, COUT
= 0.22μF, L = 6.8μH, the recommended value for the
compensation network is R4 = 1kΩ and C4 = 3.3nF.
The RT8541A FSET frequency adjust pin allows the user
to program the switching frequency from 100kHz to
1.3MHz for optimized efficiency, performance, and external
component size. For an appropriate RSET resistor value
see Table 1. An external resistor from the FSET pin to
GND is required. Do not leave this pin open. For RT8541
the switching frequency is fixed and set at 650kHz typically.
Table 1. Switching Frequency vs. RSET Value
(1% Resistors)
RSET (k)
Frequency (kHz)
15
1300
20
1000
25
840
30
720
32
650
40
556
Inductor Selection
50
456
The inductance depends on the maximum input current.
As a general rule, the inductor ripple current range is 20%
to 40% of the maximum input current. If 40% is selected
as an example, the inductor current can be calculated
according to the following equation :
60
360
IIN(MAX) =
VOUT  IAPD
  VIN
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
10
is a registered trademark of Richtek Technology Corporation.
DS8541/A-01 June 2015
RT8541/A
Output Capacitor Selection
The output ripple voltage is an important index for
estimating chip performance. This portion consists of two
parts. One is the product of the inductor current with the
ESR of the output capacitor, while the other part is formed
by the charging and discharging process of the output
capacitor. As shown in Figure 1, ΔVOUT2 can be evaluated
based on the ideal energy equalization. According to the
definition of Q, the Q value can be calculated as the
following equation :


Q = 1   IIN  1 IL  IAPD    IIN  1 IL  IAPD  
2 
2
2
 

VIN
1
= COUT  VOUT2


VOUT2 fSET
where fSET is the switching frequency, and ΔIL is the
inductor ripple current. Bring COUT to the left side to
estimate the value of ΔVOUT2 according to the following
equation :
D  IAPD
VOUT2 =
  COUT  fSET
where D is the duty cycle and η is the Boost converter
efficiency. Finally, taking ESR into account, the overall
output ripple voltage can be determined by the following
equation :
D  IOUT
VOUT = IIN  ESR 
  COUT  fOSC
For applications with out voltage less than 45V, intermediate
output pin VOUT1 can directly serve as the output pin.
Typically use a 2μF capacitor for output voltage less than
25V and 1μF capacitor for output voltage between 25V
and 45V. When output voltage goes beyond 45V, a charge
pump must be formed with cascaded 0.47μF capacitors
C1 and C2 at the output nodes. A typical 0.1μF capacitor
is used as the flying capacitor CFLY to form the charge
pump. Always use a capacitor with sufficient voltage rating.
Either ceramic or solid tantalum capacitors may be used
for the input decoupling capacitor, which should be placed
as close as possible to the RT8541. A 1μF capacitor is
sufficient for most applications.
Input Capacitor Selection
Low ESR ceramic capacitors are recommended for input
capacitor applications. Low ESR will effectively reduce
the input voltage ripple caused by switching operation. A
10μF capacitor is sufficient for most applications.
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
DS8541/A-01 June 2015
Nevertheless, this value can be decreased for lower output
current requirement. Another consideration is the voltage
rating of the input capacitor which must be greater than
the maximum input voltage.
APD Current Monitor
The power supply switching noise associated with a
switching power supply can interfere with the photodiode
DC measurement. To suppress this noise, a 0.1μF
capacitor is recommended at APD pin. An additional output
low-pass filter, a 10k resistor and a 10nF capacitor in
parallel at MON pin might limit the measurement accuracy
of low level signals. For applications requiring fast current
monitor response time, a RC low-pass filter at MONIN pin
is used to replace the 0.1μF capacitor at APD pin to reduce
the power supply noise and other wide band noise.
APD Short Current Protection
In some applications, a long cable or wire is used to
connect the RT8541/A to APD. When APD is shorted to
GND, APD pin voltage might ring below ground and damage
the internal circuitry. To prevent damage from short-circuit
event, a 100Ω resistor must be added between MONIN
and VOUT2 pins. The APD short current is 200mV/R6.
For a typical 2mA short current protection of APD, the R6
should be set at 100Ω.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WQFN-16L 3x3 package, the thermal resistance, θJA, is
30°C/W on a standard JEDEC 51-7 four-layer thermal test
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
11
RT8541/A
board. The maximum power dissipation at TA = 25°C can
be calculated by the following formula :
Layout Considerations
PCB layout is very important for designing switching power
converter circuits. The following layout guides should be
strictly followed for best performance of the RT8541/A.
P D(MAX) = (125°C − 25°C) / (30°C/W) = 3.33W for
WQFN-16L 3x3 package
Maximum Power Dissipation (W)1
The maximum power dissipation depends on the operating
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 2 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.

Place L and C1 as close as possible to the SW and
PUMP pin. The trace should be as short and wide as
possible.

The compensation circuit should be kept away from
the power loops and should be shielded with a ground
trace to prevent any noise coupling. Place the
compensation components as close as possible to VC
pin.

The exposed pad of the chip should be connected to
ground plane for thermal consideration.
3.5
Four-Layer PCB
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
25
50
75
100
125
Ambient Temperature (°C)
C4
R1
R4
VC
APD
MONIN
VOUT2
CFB
R2
R6
C2
GND
C3
Place these
Components as
close as possible
16 15 14 13
1
12
2
11
GND
3
10
17
4
9
5
6
7
SHDN
VIN
GND
GND
C1
R5
Schottky diode
must be located
close to SW and
GND pins as
much as possible.
8
VOUT1
PUMP
SW
SW
FB
To MCU
MON
FSET
FB
CTRL
Locate the Compensation
components to VC pin as
close as possible
RSET
GND
To MCU
Figure 2. Derating Curve of Maximum Power Dissipation
CIN
Input capacitor
must be Placed
as close to the
IC as possible.
L
VIN
Figure 3. PCB Layout Guide
Copyright © 2015 Richtek Technology Corporation. All rights reserved.
www.richtek.com
12
is a registered trademark of Richtek Technology Corporation.
DS8541/A-01 June 2015
RT8541/A
Outline Dimension
D
SEE DETAIL A
D2
L
1
E
E2
e
b
A
A1
1
1
2
2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
A3
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Symbol
Dimensions In Millimeters
Dimensions In Inches
Min
Max
Min
Max
A
0.700
0.800
0.028
0.031
A1
0.000
0.050
0.000
0.002
A3
0.175
0.250
0.007
0.010
b
0.180
0.300
0.007
0.012
D
2.950
3.050
0.116
0.120
D2
1.300
1.750
0.051
0.069
E
2.950
3.050
0.116
0.120
E2
1.300
1.750
0.051
0.069
e
L
0.500
0.350
0.020
0.450
0.014
0.018
W-Type 16L QFN 3x3 Package
Richtek Technology Corporation
14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
DS8541/A-01 June 2015
www.richtek.com
13