14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide © 2006 Microchip Technology Inc. DS51597A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and Zena are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2006, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51597A-page ii © 2006 Microchip Technology Inc. 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 1 Chapter 1. Product Overview ........................................................................................ 5 1.1 Introduction ..................................................................................................... 5 1.2 What is the 14-Pin SOIC/DIP/TSSOP Evaluation Board? .............................. 5 1.3 What the 14-Pin SOIC/DIP/TSSOP Evaluation Board Kit Includes ................ 5 Chapter 2. Installation and Operation .......................................................................... 7 2.1 Introduction ..................................................................................................... 7 2.2 Features ......................................................................................................... 7 2.3 Getting Started ............................................................................................... 8 2.4 14-Pin SOIC/DIP/TSSOP Evaluation Board Description .............................. 13 Appendix A. Schematic and Layouts ......................................................................... 17 A.1 Introduction .................................................................................................. 17 A.2 Schematics and PCB Layout ....................................................................... 17 Appendix B. Bill Of Materials (BOM) .......................................................................... 27 Appendix C. Microchip Analog and Interface Device Compatibility ....................... 29 C.1 Introduction .................................................................................................. 29 Worldwide Sales and Service .................................................................................... 32 © 2006 Microchip Technology Inc. DS51597A-page iii 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide NOTES: DS51597A-page iv © 2006 Microchip Technology Inc. 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. INTRODUCTION This chapter contains general information that will be useful to know before using the 14-Pin SOIC/DIP/TSSOP Evaluation Board. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in this Guide Recommended Reading The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the 14-Pin SOIC/DIP/TSSOP Evaluation Board. The manual layout is as follows: • Chapter 1. “Product Overview” – Important information about the 14-Pin SOIC/DIP/TSSOP Evaluation Board. • Chapter 2. “Installation and Operation” – Includes instructions on how to get started with this evaluation board. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the 14-Pin SOIC/DIP/TSSOP Evaluation Board. • Appendix B. “Bill Of Materials (BOM)” – Lists the parts that can be installed onto the 14-Pin SOIC/DIP/TSSOP Evaluation Board. • Appendix C. “Microchip Analog and Interface Device Compatibility” – Documents the Microchip Analog & Interface devices that are footprint compatible with this PCB. © 2006 Microchip Technology Inc. DS51597A-page 1 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Represents Referenced books Emphasized text Examples MPLAB® IDE User’s Guide ...is the only compiler... RECOMMENDED READING This blank PCB is generic and can be used with any Microchip device that is offered in one of the following 14-pin packages: • SOIC • DIP • TSSOP For more information regarding devices available in these 14-pin packages, please refer to the Microchip web site at www.microchip.com. THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives DS51597A-page 2 © 2006 Microchip Technology Inc. Preface CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com DOCUMENT REVISION HISTORY Revision A (January 2006) • Initial Release of this Document. © 2006 Microchip Technology Inc. DS51597A-page 3 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide NOTES: DS51597A-page 4 © 2006 Microchip Technology Inc. 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the 14-Pin SOIC/DIP/TSSOP Evaluation Board and covers the following topics: • What is the 14-Pin SOIC/DIP/TSSOP Evaluation Board? • What the 14-Pin SOIC/DIP/TSSOP Evaluation Board kit includes 1.2 WHAT IS THE 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD? The 14-Pin SOIC/DIP/TSSOP Evaluation Board allows the system designer to quickly evaluate the operation of Microchip Technology’s devices in any of the following 14-pin packages: • SOIC • DIP • TSSOP Some of the Microchip’s family of devices that can be evaluated in the PCB include: • • • • • • • • • • • • • • • • • 1.3 A/D Converters (ADCs) Battery Chargers Comparators D/A Converters (DACs) DC-to-DC Converters Digital Potentiometers (Digi-Pots) Fan Controllers Integrated Devices Interface Devices Linear Regulators Operational Amplifiers (Op Amps) Power MOSFET Drivers Programmable Gain Amplifiers (PGAs) Switching Regulators Temperature Sensors Voltage Supervisors and Voltage Detectors PICmicro® Microcontrollers WHAT THE 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD KIT INCLUDES This 14-Pin SOIC/DIP/TSSOP Evaluation Board Kit includes: • Five 14-Pin SOIC/DIP/TSSOP Evaluation Board Printed Circuit Boards (PCBs) • 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide (Electronic version on CD) © 2006 Microchip Technology Inc. DS51597A-page 5 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide NOTES: DS51597A-page 6 © 2006 Microchip Technology Inc. 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION This blank Printed Circuit Board allows any 14-pin device in the following four package types to be installed: 1. SOIC-14 2. PDIP-14 3. TSSOP-14 This board is generic so that any device may be installed. Refer to the device data sheet, however, for suitability of device evaluation. As well as the device, other desired passive components (resistors and capacitors) and connection posts may be installed. This allows the board to evaluate a minimum configuration for the device. Also, this allows the device to easily be jumpered into an existing system. 2.2 FEATURES The 14-Pin SOIC/DIP/TSSOP Evaluation Board has the following features: • Connection terminals may be either through-hole or surface-mount • Three 14-pin package footprints supported: - SOIC - DIP - TSSOP • Footprints for optional passive components and other devices for: - Power supply filtering - Device bypass capacitor - Output filtering - Output pull-up resistor - Output pull-down resistor - Output loading resistor - Output series resistor - Up to four additional passive components - Jumper Headers - SOT-23-6 • Silk-screen area to write specifics of implemented circuit (on back of PCB), such as MCP2120 (to indicate that the device is MCP2120) • PICmicro® MCU Baseline Flash Microcontroller Programmer (BFMP) Header • Can be used for SOIC-14, TSSOP-14 to DIP-14 converter © 2006 Microchip Technology Inc. DS51597A-page 7 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide 2.3 GETTING STARTED The 14-Pin SOIC/DIP/TSSOP Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout. Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2 and U4) is tied together. These pins are then connected with pad “n” of the PCB (through a circuit). This circuit allows each pin to individually have any of the following: a pull-up resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor. Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering capacitor (C1). There may be cases where some additonal passive components are desired for the evaluation circuit. The PCB has four 805 footprints that are not connected (labled P1, P2, P3 and P4) and can easily be jumpered into the desired circuit. DS51597A-page 8 © 2006 Microchip Technology Inc. M Installation and Operation FIGURE 2-1: 14-Pin SOIC/DIP/TSSOP Evaluation Board Circuit (Page 1). © 2006 Microchip Technology Inc. DS51597A-page 9 M 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE 2-2: DS51597A-page 10 14-Pin SOIC/DIP/TSSOP Evaluation Board Circuit (Page 2) © 2006 Microchip Technology Inc. Installation and Operation 2.3.1 The Hardware Figure 2-3 shows the layout of the 14-Pin SOIC/DIP/TSSOP Evaluation Board. This is a small four-layer board (3.55" x 1.79" (9.02 mm x 4.55 mm)). There are sixteen connection points/pads that can use either through-hole or surface-mount connector posts. The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS is connected to the PCB ground plane. All the passive components that are connected to VDD or VSS are connected to either the power plane or ground plane. The fourteen remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to pin 1). Each pad has four passive components associated with them: a pull-up resistor (R2x), a pull-down resistor (R3x), an in-line resistor (R1x) and a filtering/load capacitor (C1x). The “x” is an alpha character that corresponds to a particular pad (A to P). As an example, Pad 5’s pull-up resistor is R2E. The green area of Figure 2-3 shows the silk-screen on the bottom layer of the PCB. This is where the details of the implemented circuit can be written. Capacitor C1 is the power supply filtering capacitor. Capacitors C2 and C3 are bypass capacitors that may be required to be installed, depending on the device selected and the system requirements (such as the noise present on the power supply). Table 2-1 describes the components. A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash Microcontroller Programmer (BFMP) interface. For additional information, refer to Section 2.4.5 “Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1)”. FIGURE 2-3: © 2006 Microchip Technology Inc. 14-Pin SOIC/DIP/TSSOP Evaluation Board Layout. DS51597A-page 11 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide TABLE 2-1: OPTIONAL PASSIVE COMPONENTS Device C2 DS51597A-page 12 Comment Power supply bypass capacitor C3, C4 Device filtering capacitor C1A, C1B, C1C, C1D, C1E, C1F, C1G, C1H, C1J, C1K, C1L, C1M, C1N, C1P Output filter capacitor R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H, R1J, R1K, R1L, R1M, R1N, R1P In-line resistance of device output R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H, R2J, R2K, R2L, R2M, R2N, R2P Pull-up resistor R3A, R3B, R3C, R3D, R3E, R3F, R3G, R3H, R3J, R3K, R3L, R3M, R3N, R3P Pull-down resistor P1, P2, P3, P4, P5, P6, P7, P8 Optional passive components U1 14-pin DIP footprint U2 14-pin SOIC footprint U3 6-pin SOT-23 footprint U4 14-pin TSSOP footprint H1 BFMP Header Interface J1, J2 3-pin Header for jumper connections J3, J4, J5, J6 2-pin Header for jumper connections S1, S2 Switch footprint © 2006 Microchip Technology Inc. Installation and Operation 2.4 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD DESCRIPTION The 14-Pin SOIC/DIP/TSSOP Evaluation Board PCB is designed to be flexible in the type of device evaluation that can be implemented. The following sections describe each element of this evaluation board in further detail. Refer to Figure 2-4. 2.4.1 Power and Ground The 14-Pin SOIC/DIP/TSSOP Evaluation Board has a VDD pad and a VSS pad. These pads can have connection posts installed that allow easy connection to the power (VDD) and ground (VSS) planes. The layout allows either through-hole or surface-mount connectors. The power and ground planes are connected to the appropriate passive components on the PCB (such as power plane to R2X and ground plane to R3X and C1X). 2.4.2 PCB PADs For each package pin (pins 1 to 14), there is a PCB pad (pads 1 to 14). The device will have some power pins (VDD) and some ground pins (VSS). To ease connections on the PCB, vias to the power and ground plane have been installed close to each PCB pad. This allows any pad to be connected to the power or ground plane, so when power is connected to the VDD and VSS pads, the power is connected to the appropriate device pin. Jumpering to VSS FIGURE 2-4: © 2006 Microchip Technology Inc. Jumpering to VDD Jumpering the PCB pad to either VDD or VSS. DS51597A-page 13 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide 2.4.3 Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3, P1, P2, P3 and P4) The footprints for these components are present to allow maximum flexibility in the use of this PCB to evaluate a wide range of 14-pin SOIC, DIP and TSSOP devices. The purpose of these components may vary depending on the device under evaluation and how it is to be used in the desired circuit. Refer to the device data sheet for the recommended components that should be used when evaluating that device. • Component R1X allows an in-line resistor that can be installed between the device pin and the PCB pad. This may be required when interfacing this PCB to other circuits. • Component R2X allows a pull-up resistor to be installed for the device pin. • Component R3X allows a pull-down resistor to be installed for the device pin. • Component C1X allows a capacitive load/filter to be installed for the device pin. • Component C2 allows a power supply filtering capacitor to be installed. • Components C3 and C4 allow a device filtering capacitor to be installed. • Components P1, P2, P3, P4, P5, P6, P7 and P8 are not connected and give a footprint (805 surface-mount) for a passive component (resistor, capacitor, etc.) to be installed and jumpered into the PCB circuit. This allows for the evaluation of some simple device circuits to be implemented on this PCB. 2.4.4 Installing Resistor R1X Resistor R1X is shorted by default. Therefore, if resistor R1X is to be installed, the trace across the component must be cut before it is installed (see Figure 2-5). While evaluating a device, it may be desireable to see the signals on both sides of this resistor. A test point is available so that both signals may be monitored. This test point is the avenue between components R3x and C1x (see Figure 2-5). Test point This trace must be cut before resistor R1X can be installed FIGURE 2-5: DS51597A-page 14 Test point when resistor R1X is installed. © 2006 Microchip Technology Inc. Installation and Operation 2.4.5 Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1) The BFMP interface allows a PICmicro MCU device to be programmed with programmers that support this interface, such as the BFMP programmer (part number PG164101). TABLE 2-2: BFMP HEADER SIGNALS AND PICMICRO MCU PINS BFMP Header Signal Name Number 14-pin PICmicro® MCU Comment Pin Number — 1 — CLK 2 12 ICSP™ Clock ICSP Data DT 3 13 VSS 4 14 VDD 5 1 VPP 6 4 © 2006 Microchip Technology Inc. ICSP Programming Voltage DS51597A-page 15 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide 2.4.6 The PCB as a SOIC-14 or TSSOP-14 to DIP-14 Socket Converter There may be occasions when it is desirable to convert the footprint of the device to that of a DIP package. This allows the device to be installed into an existing DIP socket. Two 1x7 row pins need to be installed into the PCB’s DIP footprint when the device is installed into the appropriate package footprint. This allows the PCB to convert the SOIC-14 or TSSOP-14 footprints to a 300-mil DIP-14 footprint. 2.4.7 Evaluating a Digital Potentiomenter Device 2.4.7.1 DIGITAL POTENTIOMENTER The following digital potentiometers are supported by this evaluation board. TABLE 2-3: Device DS51597A-page 16 14-PIN DIGITAL POTENTIOMETERS SOIC DIP TSSOP MCP42010 Yes Yes Yes MCP42050 Yes Yes Yes MCP42100 Yes Yes Yes Comment © 2006 Microchip Technology Inc. 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the schematics and layouts for the 14-Pin SOIC/DIP/TSSOP Evaluation Board. Diagrams included in this appendix: • • • • • • • A.2 Board Schematic - Digital Circuitry Board – Top Layer + Bottom Layer + Silk-Screen Board – Top Layer + Silk-Screen Board – Bottom Layer Board – Power Plane Board – Ground Plane Board – Component Layer SCHEMATICS AND PCB LAYOUT Figure A-4 shows the schematic of the 14-Pin SOIC/DIP/TSSOP Evaluation Board. Figure A-2 shows the layout for the top layer of the 14-Pin SOIC/DIP/TSSOP Evaluation Board. The layer order is shown in Figure A-1. Top Layer Ground Layer Power Layer Bottom Layer FIGURE A-1: © 2006 Microchip Technology Inc. Layer Order. DS51597A-page 17 M 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-2: DS51597A-page 18 Board Schematic - Digital Circuitry (Page 1). © 2006 Microchip Technology Inc. M Schematic and Layouts FIGURE A-3: Board Schematic - Digital Circuitry (Page 2). © 2006 Microchip Technology Inc. DS51597A-page 19 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-4: DS51597A-page 20 Board Layout – Top Layer + Bottom Layer + Silk-Screen. © 2006 Microchip Technology Inc. Schematic and Layouts FIGURE A-5: Board Layout – Top Layer + Silk-Screen. © 2006 Microchip Technology Inc. DS51597A-page 21 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-6: DS51597A-page 22 Board Layout – Bottom Layer. © 2006 Microchip Technology Inc. Schematic and Layouts FIGURE A-7: Board Layout – Power Plane. © 2006 Microchip Technology Inc. DS51597A-page 23 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-8: DS51597A-page 24 Board Layout – Ground Plane. © 2006 Microchip Technology Inc. Schematic and Layouts FIGURE A-9: Board Layout – Component Layer. © 2006 Microchip Technology Inc. DS51597A-page 25 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide FIGURE A-10: DS51597A-page 26 Board Layout – Bottom Silk. © 2006 Microchip Technology Inc. 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Appendix B. Bill Of Materials (BOM) TABLE B-1: Qty BILL OF MATERIALS Reference Description 1 PCB 103-00094 SOT23 Evaluation Board PCB 0 U1 DIP-14 Device 0 U2 SOIC-14 Device 0 U3 SOT-23-6 Device 0 U4 TSSOP-14 Device 0 C2, C3, C4 0 0 Device Power Supply Bypass Capacitor Surface-mount (805 package) (Optional - Application-dependent) C1A, C1B, C1C, C1D, Output Filer Capacitor C1E, C1F, C1G, C1H, Surface-mount (805 package) C1J, C1K, C1L, C1M, (Optional - Application-dependent) C1N, C1P R1A, R1B, R1C, R1D, Output inline resistor R1E, R1F, R1G, R1H, Surface-mount (805 package) R1J, R1K, R1L, R1M, (Optional - Application-dependent) R1N, R1P R2A, R2B, R2C, R2D, Output Pull-up resistor R2E, R2F, R2G, R2H, Surface-mount (805 package) R2J, R2K, R2L, R2M, (Optional - Application-dependent) R2N, R2P R3A, R3B, R3C, R3D, Output Pull-down resistor R3E, R3F, R3G, R3H, Surface-mount (805 package) R3J, R3K, R3L, R3M, (Optional - Application-dependent) R3N, R3P P1, P2, P3, P4, P5, Passive component (not connected) that can P6, P7, P8 be “blue wired” into the desired circuit. The device layout supports the 805 package. (Optional - Application-dependent) H1 BFMP Header (6-pin, 100 mil spacing) J1, J2 1x3 Jumper Stakes (male) 0 J3, J4, J5, J6 1x2 Jumper Stakes (male) 0 PAD1, PAD2, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, PAD9, PAD10, PAD11, PAD12, PAD13, PAD14, VDD, VSS Through-hole connectors 0 0 0 0 0 © 2006 Microchip Technology Inc. Manufacturer Part Number Microchip Technology Inc. Microchip Technology Inc. Microchip Technology Inc. Microchip Technology Inc. Microchip Technology Inc. — 103-00094 User-specified User-specified User-specified User-specified User-specified — User-specified — User-specified — User-specified — User-specified — — — Jameco ValuePro Jameco ValuePro Keystone Electronics® — 7000-1x35G 7000-1x25G 5012 DS51597A-page 27 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide TABLE B-1: Qty 0 0 BILL OF MATERIALS (CONTINUED) Reference PAD1, PAD2, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, PAD9, PAD10, PAD11, PAD12, PAD13, PAD14, VDD, VSS S1, S2 DS51597A-page 28 Description Manufacturer Part Number Surface-mount connectors Keystone Electronics® 5016 Surface Mount Switch Panasonic® EVQ-PJS04K © 2006 Microchip Technology Inc. 14-PIN SOIC/DIP/TSSOP EVALUATION BOARD USER’S GUIDE Appendix C. Microchip Analog and Interface Device Compatibility C.1 INTRODUCTION This appendix documents the Microchip Analog and Interface devices that are footprint compatible with the 14-Pin SOIC/DIP/TSSOP Evaluation Board. The Analog and Interface devices currently fall into the following catagories: • • • • • • • • • • • • • • • • A/D Converters (ADCs) Battery Chargers Comparators D/A Converters (DACs) DC-to-DC Converters Digital Potentiometers (Digi-Pots) Fan Controllers Integrated Devices Interface Devices Linear Regulators Operational Amplifiers (Op Amps) Power MOSFET Drivers Programmable Gain Amplifiers (PGAs) Switching Regulators Temperature Sensors Voltage Supervisors and Voltage Detectors Table C-1 shows the Microchip Analog and Interface devices that are currently supported. As new devices become available, this PCB may be able to support them. Please check the device data sheet to verify if the device is available in one of the package types supported by this PCB. © 2006 Microchip Technology Inc. DS51597A-page 29 14-Pin SOIC/DIP/TSSOP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY(1, 2) SOIC DIP TSSOP Comment Digital Potentiometer MCP42010 Yes Yes — MCP42050 Yes Yes — MCP42100 Yes Yes — Operational Amplifiers (Op Amps) MCP604 Yes Yes Yes MCP609 Yes Yes Yes MCP619 Yes Yes Yes MCP6004 Yes Yes Yes MCP6024 Yes Yes Yes MCP6044 Yes Yes Yes MCP6144 Yes Yes Yes MCP6234 Yes Yes Yes MCP6244 Yes Yes Yes MCP6274 Yes Yes Yes MCP6284 Yes Yes Yes MCP6294 Yes Yes Yes TC7650CPD — Yes — TC7652CPD — Yes — Programmable Gain Amplifiers (PGAs) MCP6S26 Yes Yes Yes MCP6544 Yes Yes Yes MCP6549 Yes Yes Yes Comparators Voltage-to-Frequency TC9400 Yes Yes — TC9401 — Yes — TC9402 — Yes — Power MOSFET Drivers TC4467 — Yes — TC4468 — Yes — TC4469 — Yes — A/D Converters (ADCs) MCP3004 Yes Yes Yes MCP3204 Yes Yes Yes MCP3302 Yes Yes Yes — Yes — Yes Yes Yes — — Yes TC520A D/A Converters (DACs) MCP4922 Battery Chargers PS810 Note 1: 2: DS51597A-page 30 Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value. Installation of PCB capacitor C1 recommended. See data sheet for recommended value. © 2006 Microchip Technology Inc. Microchip Analog and Interface Device Compatibility TABLE C-1: ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY(1, 2) (CONTINUED) Device SOIC DIP TSSOP MCP2120 Yes Yes — MCP25020 Yes Yes — MCP25025 Yes Yes — MCP25050 Yes Yes — MCP25055 Yes Yes — PIC16F505 Yes Yes Yes PIC16F630 Yes Yes Yes PIC16F636 Yes Yes Yes PIC16F676 Yes Yes Yes PIC16F684 Yes Yes Yes PIC16F688 Yes Yes Yes Comment Interface Devices ® PICmicro MCU’s Voltage Supervisors and Voltage Detectors None — — — — — — — — — — — — — — — — — — — — — — — — — — Switching Regulator None — DC-to-DC Converters None Linear Regulators None Voltage References None Temperature Sensors None Fan Controllers None Integrated Devices None PWM Controllers None Note 1: 2: © 2006 Microchip Technology Inc. Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value. Installation of PCB capacitor C1 recommended. See data sheet for recommended value. 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