TC7652 Low Noise, Chopper Stabilized Operational Amplifier Features General Description • • • • • • • • The TC7652 is a lower noise version of the TC7650, sacrificing some input specifications (bias current and bandwidth) to achieve a 10x reduction in noise. All the other benefits of the chopper technique are present, (i.e, freedom from offset adjust, drift and reliability problems from external trim components). Like the TC7650, the TC7652 requires only two noncritical external caps for storing the chopped null potentials. There are no significant chopping spikes, internal effects or overrange lockup problems. Low Offset Over Temperature Range: 10V Ultra Low Long Term Drift: 150nV/Month Low Temperature Drift: 100nV/C Low DC Input Bias Current: 15pA High Gain, CMRR and PSRR: 110dB Min Low Input Noise Voltage: 0.2Vp-p (DC to 1Hz) Internally Compensated for Unity Gain Operation Clamp Circuit for Fast Overload Recovery Applications • • • • • Instrumentation Medical Instrumentation Embedded Control Temperature Sensor Amplifier Strain Gage Amplifier Device Selection Table Part Number Package Temperature Range TC7652CPA 8-Pin Plastic DIP 0°C to +70°C TC7652CPD 14-Pin Plastic DIP 0°C to +70°C Package Type 8-Pin DIP CA 1 8 CB -Input 2 +Input 3 7 TC7652CPA VDD 6 Output 5 Output Clamp VSS 4 14-Pin DIP CB 1 14 INT/EXT CA 2 EXT CLK 13 In 12 INT CLK Out NC 3 -Input 4 +Input 5 TC7652CPD 11 VDD 10 Output NC 6 9 Output Clamp VSS 7 8 CRETN NC = No Internal Connection (May Be Used As Input Guard) 2001-2012 Microchip Technology Inc. DS21464C-page 1 TC7652 Functional Block Diagram TC7652 14-Pin DIP Only Output Clamp (Not On "Z" Pinout) Output Clamp Circuit INT/EXT EXT CLK IN CLK OUT Oscillator Main Amplifier A Inputs B Output CB NULL Intermod Comparator B B B CA A NULL Amplifier A CRETN (1) NULL VSS NOTE 1: For 8-pin DIP connect to VSS, or to CRET on "Z" pinout. DS21464C-page 2 2001-2012 Microchip Technology Inc. TC7652 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS* Total Supply Voltage (VDD to VSS) ....................... +18V *Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods my affect device reliability. Input Voltage .................... (VDD +0.3V) to (VSS – 0.3V) Voltage on Oscillator Control Pins...............VDD to VSS Duration of Output Short Circuit .....................Indefinite Current Into Any Pin............................................ 10mA While Operating (Note 1)............................100A Package Power Dissipation (TA < 70°C 8-Pin Plastic DIP ....................................... 730mW 14-Pin Plastic DIP ..................................... 800mW Storage Temperature Range.............. -65°C to +150°C Operating Temperature Range C Device .......................................... 0°C to +70°C I Device......................................... -25°C to +85°C TC7652 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VDD = +5V, VSS = -5V, TA = +25°C, unless otherwise indicated. Symbol Parameter Min Typ Max Units VOS Input Offset Voltage — ±2 ±5 V TCVOS Average Temperature Co-efficient of Input Offset Voltage — 0.01 0.05 V/°C Test Conditions TA = +25°C 0°C < TA < +70°C VOS/DT Offset Voltage vs Time — 150 — nV/mo IBIAS Input Bias Current (CLK On) — — — 30 100 250 100 — 1000 pA TA = +25°C 0°C < TA < +70°C -25°C < TA < +85°C IBIAS Input Bias Current (CLK Off) — — — 15 35 100 30 — 1000 pA TA = +25°C 0°C < TA < +70°C -25°C < TA < +85°C pA IOS Input Offset Current — 25 150 RIN Input Resistance — 1012 — OL Large Signal Voltage Gain 120 150 — dB RL = 10k, VOUT = ±4V VOUT Output Voltage Swing (Note 2) ±4.7 — ±4.85 ±4.95 — — V RL = 10k RL = 100k CMVR Common Mode Voltage Range -4.3 — +3.5 V MRR Common Mode Rejection Ratio 120 140 — dB CMVR = -4.3V to +3.5V PSRR Power Supply 120 140 — dB ±3V to ±8V eN Input Noise Voltage — — 0.2 0.7 1.5 5 VP-P VP-P IN Input Noise Current — 0.01 — pA/ Hz GBW Unity Gain Bandwidth — 0.4 — MHz SR Slew Rate — 1 — Overshoot — 15 — % Operating Supply Range 5 — 16 V VDD, VSS RS = 100, DC to 1Hz DC to 10Hz f= 10Hz V/sec CL = 50pF, RL = 10k Note 1: Limiting input current to 100A is recommended to avoid latch-up problems. Typically 1mA is safe however, this is not guaranteed. 2: Output clamp not connected. See typical characteristics curves for output swing versus clamp current characteristics. 3: See “Output Clamp” under detailed description. 2001-2012 Microchip Technology Inc. DS21464C-page 3 TC7652 TC7652 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VDD = +5V, VSS = -5V, TA = +25°C, unless otherwise indicated. Symbol Parameter Min Typ Max Units — 1 3 mA No Load Internal Chopping Frequency 100 275 — Hz Pins 12 – 14 Open (DIP) Clamp ON Current (Note 3) 25 100 — A RL = 100k Clamp OFF Current (Note 3) — 1 — pA -4V VOUT < +10V IS Supply Current fCH Test Conditions Note 1: Limiting input current to 100A is recommended to avoid latch-up problems. Typically 1mA is safe however, this is not guaranteed. 2: Output clamp not connected. See typical characteristics curves for output swing versus clamp current characteristics. 3: See “Output Clamp” under detailed description. DS21464C-page 4 2001-2012 Microchip Technology Inc. TC7652 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin Number Symbol Description 8-pin DIP 14-pin DIP 1,8 2,1 CA, CB Nulling capacitor pins 2 4 -INPUT Inverting Input 3 5 +INPUT 4 7 VSS 5 9 OUTPUT CLAMP Output Voltage Clamp 6 10 OUTPUT Output 7 11 VDD Positive Power Supply — 3,6 NC No internal connection — 8 — 12 CRETN — 13 EXT CLK IN — 14 INT/EXT Non-inverting Input Negative Power Supply Capacitor current return pin INT CLK OUT Internal Clock Output 2001-2012 Microchip Technology Inc. External Clock Input Select Internal or External Clock DS21464C-page 5 TC7652 3.0 DETAILED DESCRIPTION 3.1 Capacitor Connection FIGURE 3-1: R2 1MΩ Connect the null storage capacitors to the CA and CB pins with a common connection to the CRET pin (14-pin TC7652) or to VSS (8-pin TC7652). When connecting to VSS, avoid injecting load current IR drops into the capacitive circuitry by making this connection directly via a separate wire or PC trace. 3.2 3.3 R1 1kΩ Clock The TC7652 has a 550Hz internal oscillator, which is divided by two before clocking the input chopper switches. The 275Hz chopping frequency is available at INT CLK OUT (Pin 12) on 14-pin devices. In normal operation, INT/EXT (Pin 14), which has an internal pullup, can be left open. An external clock can also be used. To disable the internal clock and use an external one, the INT/EXT pin must be tied to VSS. The external clock signal is then applied to the EXT CLK IN input (Pin 13). An internal divide-by-two provides a 50% switching duty cycle. The capacitors are only charged when EXT CLK IN is high, so a 50% to 80% positive duty cycle is recommended for higher clock frequencies. The external clock can swing between VDD and VSS, with the logic threshold about 2.5V below VDD. The output of the internal oscillator, before the divideby-two circuit, is available at EXT CLK IN when INT/ EXT is high or unconnected. This output can serve as the clock input for a second TC7652 (operating in a master/slave mode), so that both op amps will clock at the same frequency. This prevents clock intermodulation effects when two TC7652's are used in a differential amplifier configuration. DS21464C-page 6 TC7652 + C R Output C 0.1µF Output Clamp In chopper stabilized amplifiers, the output clamp pin reduces overload recovery time. When a connection is made to the inverting input pin (summing junction), a current path is created between that point and the output pin, just before the device output saturates. This prevents uncontrolled differential input voltages and charge build-up on correction storage capacitors. Output swing is reduced. TEST CIRCUIT 0.1µF If the TC7652's output saturates, error voltages on the external capacitors will slow overload recovery. This condition can be avoided if a strobe signal is available. The strobe signal is applied to EXT CLK IN and the overload signal is applied to the amplifier while the strobe is LOW. In this case, neither capacitor will be charged. The low leakage of the capacitor pins allow long measurements to be made within eligible errors (typical capacitor drift is 10V/sec). 4.0 TYPICAL APPLICATIONS 4.1 Component Selection CA and CB (external capacitors)should be in the 0.1F to 1F range. For minimum clock ripple noise, use a 1F capacitor in broad bandwidth circuits. For limited bandwidth applications where clock ripple is filtered out, use a 0.1F capacitor for slightly lower offset voltage. High quality, film type capacitors (polyester or polypropylene) are recommended, although a lower grade ceramic may work in some applications. For quickest settling after initial turn-on, use low dielectric absorption capacitors (e.g., polypropylene). With ceramic capacitors, settling to 1V takes several seconds. 4.2 Static Protection Although input diodes static protect all device pins, avoid strong electrostatic fields and discharges that can cause degraded diode junction characteristics and produce increased input-leakage currents. 2001-2012 Microchip Technology Inc. TC7652 4.3 Output Stage/Load Driving with a 1k load), and this lower gain is inconsequential. For wide band, the best frequency response occurs with a load resistor of at least 10k. This produces a 6dB/octave response from 0.1Hz to 2MHz, with phase shifts of less than 2 degrees in the transition region, where the main amplifier takes over from the null amplifier. The output circuit is high impedance (about 18k). With lesser loads, the chopper amplifier behaves somewhat like a transconductance amplifier with an open-loop gain proportional to load resistance. (For example, the open-loop gain is 17dB lower with a 1k. load than with a 10k load.) If the amp is used only for DC, the DC gain is typically greater than 120dB (even FIGURE 4-1: CONNECTION OF INPUT GUARDS Inverting Amplifier Follower R2 R1 Input TC7652 TC7652 - Output + Input + Output Noninverting Amplifier R2 TC7652 Output + R1 Input 4.4 Thermoelectric Effects The thermoelectric (Seebeck) effects in thermocouple junctions of dissimilar metals, alloys, silicon, etc. limit ultra high precision DC amplifiers. Unless all junctions are at the same temperature, thermoelectric voltages around 0.1V/C (up to tens of V/C for some materials) are generated. To realize the low offset voltages of the chopper, avoid temperature gradients. Enclose components to eliminate air movement, especially from power dissipating elements in the system. Where possible, use low thermoelectric co-efficient connections. Keep power supply voltages and power dissipation to a minimum. Use high impedance loads and seek maximum separation from surrounding heat disipating elements. 2001-2012 Microchip Technology Inc. 4.5 Guarding To benefit from TC7652 low input currents, take care assembling printed circuit boards. Clean boards with alcohol or TCE and blow dry with compressed air. To prevent contamination, coat boards with epoxy or silicone rubber. Even if boards are cleaned and coated, leakage currents may occur because input pins are next to pins at supply potentials. To reduce this leakage, use guarding to lower the voltage difference between the inputs and adjacent metal runs. The guard (a conductive ring surrounding inputs) is connected to a low impedance point at about the same voltage as inputs. The guard absorbs leakage currents from high voltage pins. The 14-pin dual-in-line arrangement simplifies guarding. Like the LM108 pin configuration (but unlike the 101A and 741), pins next to inputs are not used. DS21464C-page 7 TC7652 4.6 FIGURE 4-3: Pin Compatibility Where possible, the 8-pin device pinout conforms to such industry standards as the LM101 and LM741. Null storing external capacitors connect to Pins 1 and 8, which are usually for offset null or compensation capacitors. Output clamp (Pin 5) is similarly used. For OP05 and OP07 devices, replacement of the offset null potentiometer (connected between Pins 1 and 8 and VDD by two capacitors from those pins to VSS) provides compatibility. Replacing the compensation capacitor between Pins 1 and 8 by two capacitors to VSS is required. The same operation (with the removal of any connection to Pin 5) works for LM101, A748 and similar parts. Because NC pins provide guarding between input and other pins, the 14-pin device pinout conforms closely to the LM108. Because this device does not use any extra pins and does not provide offset nulling (but requires a compensation capacitor), some layout changes are necessary to convert to the TC7652. 4.7 R2 Input Output + 0.1µF FIGURE 4-4: 0.1µF USING 741 TO BOOST OUTPUT DRIVE CAPABILITY TC7652 +15V + NONINVERTING AMPLIFIER WITH OPTIONAL CLAMP 0.1µF TC7652 Input TC7652 – -7.5V Figures 4-2 and 4-3 show basic inverting and noninverting amplifier circuits using the output clamping circuit to enhance overload recovery performance. The only limitations on replacing other op amps with the TC7652 are supply voltage (±8V maximum) and output drive capability (10k load for full swing). Overcome these limitations with a booster circuit (Figure 4-4) to combine output capabilities of the LM741 (or other standard device) with input capabilities of the TC7652. These two form a composite device, therefore, when adding the feedback network, the monitor loop gains stability. 0.1µF Clamp R1 Some Applications FIGURE 4-2: INVERTING AMPLIFIER WITH OPTIONAL CLAMP + 741 + In – Out – -7.5V -15V 0.1 µF 0.1 µF 10kΩ Figure 4-5 shows the clamp circuit of a zero offset comparator. Because the clamp circuit requires the inverting input to follow the input signal, problems with a chopper stabilized op amp are avoided. The threshold input must tolerate the output clamp current VIN/R without disrupting other parts of the system. Figure 4-6 shows how the TC7652 can offset null high slew rate and wideband amplifiers. Mixing the TC7652 with circuits operating at ±15V requires a lower supply voltage divider with the TC7660 voltage converter circuit operated "backwards." Figure 4-7 shows an approximate connection. Output – Clamp R3 R2 FIGURE 4-5: LOW OFFSET COMPARATOR 0.1µF R1 0.1µF TC7652 VIN + VOUT – Clamp VTH 200kΩ to 2mΩ DS21464C-page 8 2001-2012 Microchip Technology Inc. TC7652 FIGURE 4-6: 1437 OFFSET NULLED BY TC7652 TC7652 + – 22kΩ 22kΩ + Out In – FIGURE 4-7: Fast Amplifier SPLITTING +15V WITH THE 7660 AT >95% EFFICIENCY 2 8 +15V TC7660 3 10µF +7.5V 10µF 4 6 5 0V 1MW 2001-2012 Microchip Technology Inc. DS21464C-page 9 TC7652 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Supply Current vs ± Supply Voltage 1400 Output Resistance vs Output Voltage 0.1mA -5.0 OUTPUT VOLTAGE (V) 1200 SUPPLY CURRENT (µA) Positive Clamp Current 1 mA 1000 800 600 400 CLAMP CURRENT 5.0 SINK -4.0 SOURCE 0.01mA 1µA 0.1µA 0.01µA 1nA 0.1nA 200 0.01nA -3.0 0 2 3 4 5 6 7 ± SUPPLY VOLTAGE (V) 8 100 Negative Clamp Current 1M 1pA 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 OUTPUT VOLTAGE (V) Noise at 0.1Hz to 100Hz Noise at 0.1Hz to 10Hz 1k 10k 100k OUTPUT RESISTANCE (W) 1mA 2 µV/DIV 1µA 1 µV/DIV CLAMP CURRENT 0.1mA 0.01mA 0.1µA 0.01µA 1nA 0.1nA 0.01nA 1 sec/DIV 1 sec/DIV Slew Rate Noise at 0.1Hz to 1Hz Phase Gain (Bode Plot)* 60 GAIN GAIN (dB) 0.5V/DIV 1 µV/DIV 40 30 20 10 +240 +180 50 PHASE +120 +60 0 -60 PHASE (deg) 1pA 4.0 4.1 4.2 4.3 4.4 4.5 4.6 4.7 4.8 4.9 5.0 OUTPUT VOLTAGE (V) -120 0 -180 -10 -20 1 sec/DIV DS21464C-page 10 5 µsec/DIV 1 10 100 1k 10k 100k 1M FREQUENCY (Hz) *NOTE: ±5V, ±2.5V supplies; no load to 10k load. 2001-2012 Microchip Technology Inc. TC7652 Input Offset Voltage vs Common Mode Voltage 4.0 INPUT OFFSET VOLTAGE (µV) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 -6 -4 -2 0 2 4 COMMON MODE VOLTAGE (V) 2001-2012 Microchip Technology Inc. DS21464C-page 11 TC7652 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Package marking information not available at this time. DS21464C-page 12 2001-2012 Microchip Technology Inc. TC7652 6.2 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 8-Pin Plastic DIP PIN 1 .260 (6.60) .240 (6.10) .045 (1.14) .030 (0.76) .070 (1.78) .040 (1.02) .310 (7.87) .290 (7.37) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .110 (2.79) .090 (2.29) .015 (0.38) .008 (0.20) 3˚MIN. .400 (10.16) .310 (7.87) .022 (0.56) .015 (0.38) Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 14-Pin PDIP (Narrow) PIN 1 .260 (6.60) .240 (6.10) .310 (7.87) .290 (7.37) .770 (19.56) .745 (18.92) .200 (5.08) .140 (3.56) .040 (1.02) .020 (0.51) .150 (3.81) .115 (2.92) .015 (0.38) .008 (0.20) 3˚MIN. .400 (10.16) .310 (7.87) .110 (2.79) .090 (2.29) .070 (1.78) .045 (1.14) .022 (0.56) .015 (0.38) Dimensions: inches (mm) 2001-2012 Microchip Technology Inc. DS21464C-page 13 TC7652 7.0 REVISION HISTORY Revision C (December 2012) Added a note to each package outline drawing. DS21464C-page 14 2001-2012 Microchip Technology Inc. TC7652 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2001-2012 Microchip Technology Inc. DS21464C-page 15 TC7652 NOTES: DS21464C-page 16 2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768419 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21464C-page 17 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-213-7828 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS21464C-page 18 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 11/29/12 2001-2012 Microchip Technology Inc.