8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide © 2005 Microchip Technology Inc. DS51544A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS51544A-page ii © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Table of Contents Preface ........................................................................................................................... 1 Chapter 1. Product Overview ........................................................................................ 5 1.1 Introduction ..................................................................................................... 5 1.2 What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? .................... 5 1.3 What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit Includes ...... 5 Chapter 2. Installation and Operation .......................................................................... 7 2.1 Introduction ..................................................................................................... 7 2.2 Features ......................................................................................................... 7 2.3 Getting Started ............................................................................................... 8 2.4 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Description .................... 12 Appendix A. Schematic and Layouts ......................................................................... 19 A.1 Introduction .................................................................................................. 19 A.2 Schematics and PCB Layout ....................................................................... 19 Appendix B. Bill of Materials (BOM)........................................................................... 27 Appendix C. Microchip Analog and Interface Device Compatability ...................... 29 C.1 Introduction .................................................................................................. 29 Appendix D. Rev. 1 PCB Errata................................................................................... 35 D.1 Introduction .................................................................................................. 35 D.2 Rev 1 PCB Issues ........................................................................................ 35 Worldwide Sales and Service .................................................................................... 38 © 2005 Microchip Technology Inc. DS51544A-page iii 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page iv © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE on-line help. Select the Help menu, and then Topics to open a list of available on-line help files. INTRODUCTION This chapter contains general information that will be useful to know before using the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in this Guide Recommended Reading The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. The manual layout is as follows: • Chapter 1. “Product Overview” – Important information about the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. • Chapter 2. “Installation and Operation” – Includes instructions on how to get started with this evaluation board. • Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. • Appendix C. “Microchip Analog and Interface Device Compatibility” – Documents the Microchip Analog & Interface devices that are footprint compatable with this PCB. • Appendix D. “Rev. 1 PCB Errata” – Describes the PCB Errata for the Revision 1 board. © 2005 Microchip Technology Inc. DS51544A-page 1 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Represents Referenced books Emphasized text Examples MPLAB® IDE User’s Guide ...is the only compiler... RECOMMENDED READING This blank PCB is generic and can be used with any Microchip device that is offered in one of the following 8-pin packages: • • • • SOIC DIP MSOP TSSOP For more information regarding devices available in these 8-pin packages, please refer to the Microchip web site at www.microchip.com. THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives DS51544A-page 2 © 2005 Microchip Technology Inc. Preface CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com In addition, there is a Development Systems Information Line which lists the latest versions of Microchip's development systems software products. This line also provides information on how customers can receive currently available upgrade kits. The Development Systems Information Line numbers are: 1-800-755-2345 – United States and most of Canada 1-480-792-7302 – Other International Locations DOCUMENT REVISION HISTORY Revision A (March 2005) • Initial Release of this Document. © 2005 Microchip Technology Inc. DS51544A-page 3 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page 4 © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Chapter 1. Product Overview 1.1 INTRODUCTION This chapter provides an overview of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board and covers the following topics: • What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? • What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes 1.2 WHAT IS THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD? The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board allows the system designer to quickly evaluate the operation of Microchip Technology’s devices in any of the following 8-pin packages: • • • • SOIC DIP MSOP TSSOP Some of the Microchip family of devices that can be evaluated in the PCB include: • • • • • • • • • • • • • • • • • 1.3 A/D Converters (ADCs) (ADCs) Battery Chargers Comparators D/A Converters (DACs) (DACs) DC-to-DC Converters Digital Potentiometers (Digi-Pots) Fan Controllers Integrated Devices Interface Devices Linear Regulators Operational Amplifiers (Op Amps) Power MOSFET Drivers Programmable Gain Amplifiers (PGAs)s (PGAs) Switching Regulators Temperature Sensors Voltage Supervisors and Voltage Detectors PICmicro® Microcontrollers WHAT THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD KIT INCLUDES This 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit includes: • Three 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCBs • 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide (DS51544) (Electronic version on CD) © 2005 Microchip Technology Inc. DS51544A-page 5 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page 6 © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Chapter 2. Installation and Operation 2.1 INTRODUCTION This blank Printed Circuit Board (PCB) allows any 8-pin device in the following four package types to be installed: 1. 2. 3. 4. SOIC-8 PDIP-8 MSOP-8 TSSOP-8 This board is generic so that any device may be installed. Refer to the device data sheet, however, for suitability of device evaluation. As well as the device, other desired passive components (resistors and capacitors) and connection posts may be installed. This allows the board to evaluate a minimum configuration for the device. Also, this allows the device to be easily jumpered into an existing system. 2.2 FEATURES The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has the following features: • Connection terminals may be either through-hole or surface-mount • Four 8-pin package footprints supported: - SOIC - DIP - MSOP - TSSOP • Footprints for optional passive components for: - Power supply filtering - Device bypass capacitor - Output filtering - Output pull-up resistor - Output pull-down resistor - Output loading resistor - Output series resistor - Up to four additional passive components • Silk-screen area to write specifics of implemented circuit (on back of PCB), such as TC1232 4.75V, (to indicate that the device is the TC1232 with the 4.75V trip point) • PICmicro® MCU Baseline Flash Microcontroller Programmer (BFMP) Header • Can be used for SOIC-8, MSOP-8, TSSOP-8 to DIP-8 converter © 2005 Microchip Technology Inc. DS51544A-page 7 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.3 GETTING STARTED The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout. This evaluation board supports the following Microchip device families: • • • • • • • • • • • • • • • • • A/D Converters (ADCs) (ADCs) Battery Chargers Comparators D/A Converters (DACs) (DACs) DC-to-DC Converters Digital Potentiometers (Digi-Pots) Fan Controllers Integrated Devices Interface Devices Linear Regulators Operational Amplifiers (Op Amps) Power MOSFET Drivers Programmable Gain Amplifiers (PGAs)s (PGAs) Switching Regulators Temperature Sensors Voltage Supervisors and Voltage Detectors PICmicro Microcontrollers Figure 2-1 shows the evaluation board circuit. Pin “n” of each device (U1, U2, U3 and U4) are tied together. These pins are then connected with pad “n” of the PCB (through a circuit). This circuit allows each pin to individually have any of the following: a pull-up resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor. Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering capacitor (C1). There may be cases where some additonal passive components are desired for the evaluation circuit. The PCB has four 805 footprints that are not connected (labled P1, P2, P3 and P4) and can easily be jumpered into the desired circuit. DS51544A-page 8 © 2005 Microchip Technology Inc. Installation and Operation (3) PAD1 R1A* R2A* R2H* R3A* R3H* C1H* C1A* (3) PAD2 R1B* R2B* R2G* R3B* R3G* C1B* 1 8 2 7 3 6 4 R2C* (3) PAD3 R1C* UX 5 R2F* R3F* R3C* R3E* C2 (2) C1D* To power plane C1 (2) To ground plane VDD VSS VDD C3 (2) FIGURE 2-1: R1E* (3) PAD5 C1E* VSS P1 (1) TP11 TP13 TP12 P2 (1) TP14 P3 (1) TP15 TP17 * Note 1: 2: 3: PAD6 R2E* R3D* VSS R1F* (3) C1F* R2D* VDD R1G* (3) PAD7 C1G* C1C* (3) PAD4 R1D* R1H* (3) PAD8 TP16 P4 (1) TP18 Optional components, circuit-dependent. Can be any passive component (R, C, ...) that fits onto a 805 surface-mount footprint. Optional power/device filtering capacitors. When installing this component, ensure to cut the trace between the two pads of the device. 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Circuit. © 2005 Microchip Technology Inc. DS51544A-page 9 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.3.1 The Hardware Figure 2-2 shows the layout of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. This is a small four-layer board (1.5" x 2" (38.1 mm x 50.8 mm)). There are ten connection points/pads that can use either through-hole or surface-mount connector posts. The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS is connected to the PCB ground plane. All the passive components that are connected to VDD or VSS are connected to either the power plane or ground plane. The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to pin 1). Each pad has four passive components associated with them: a pull-up resistor, a pull-down resistor, an in-line resistor and a filtering/load capacitor. The pull-up resistor is always R2X, the pull-down resistor is R3X, the in-line resistor is R1X and the filtering/load capacitor is C1X. The “X” is an alpha character that corresponds to a particular pad (A to H). As an example, Pad 5’s pull-up resistor is R2E. The green area of Figure 2-2 shows the silk-screen on the bottom layer of the PCB. This is where the details of the implemented circuit can be written. Capacitor C1 is the power supply filtering capacitor. Capacitors C2 and C3 are bypass capacitors that may be required to be installed, depending on the device selected and the system requirements (such as the noise present on the power supply). Table 2-1 describes the components. A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash Microcontroller Programmer (BFMP) interface. For additional information, refer to Section 2.4.5 “Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1)”. FIGURE 2-2: DS51544A-page 10 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout. © 2005 Microchip Technology Inc. Installation and Operation TABLE 2-1: OPTIONAL PASSIVE COMPONENTS Device C1 Comment Power supply bypass capacitor C2, C3 Device Filtering capacitor C1A, C1B C1C, C1D, C1E, C1F, C1G, C1H Output filter capacitor R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H In-line resistance of device output R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H Pull-up resistor R3A, R3B, R3C, R3D, R3E, R3F, R3G, R3H Pull-down resistor P1, P2, P3, P4 Optional Passive Components © 2005 Microchip Technology Inc. DS51544A-page 11 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.4 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible in the type of device evaluation that can be implemented. The following sections describe each element of this evaluation board in further detail. Refer to Figure 2-3. 2.4.1 Power and Ground The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad. These pads can have connection posts installed that allows easy connection to the power (VDD) and ground (VSS) planes. The layout allows either through-hole or surface-mount connectors. The power and ground planes are connected to the appropriate passive components on the PCB (such as power plane to R2X and ground plane to R3X and C1X). 2.4.2 PCB PADs For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will have some power pins (VDD) and some ground pins (VSS). To ease connections on the PCB, vias to the power and ground plane have been installed close to each PCB pad. This allows any pad to be connected to the power or ground plane, so when power is connected to the VDD and VSS pads, the power is connected to the appropriate device pin. Jumpering to VSS FIGURE 2-3: Jumpering to VDD Jumpering the PCB pad to either VDD or VSS. Revision 1 of this PCB has an issue that these vias are not connected to the desired power and ground planes (they are open). For additional information, refer to Appendix D. “Rev. 1 PCB Errata”. DS51544A-page 12 © 2005 Microchip Technology Inc. Installation and Operation 2.4.3 Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3, P1, P2, P3 and P4) The footprints for these components are present to allow maximum flexibility in the use of this PCB to evaluate a wide range of SOT-23-3 devices. The purpose of these components may vary depending on the device under evaluation and how it is to be used in the desired circuit. Refer to the device data sheet for the recommended components that should be used when evaluating that device. • Component R1X allows an in-line resistor that can be installed between the device pin and the PCB pad. This may be required when interfacing this PCB to other circuits • Component R2X allows a pull-up resistor to be installed for the device pin • Component R3X allows a pull-down resistor to be installed for the device pin • Component C1X allows a capacitive load/filter to be installed for the device pin • Component C1 allows a power supply filtering capacitor to be installed • Components C2 and C3 allows a device filtering capacitor to be installed • Components P1, P2, P3, and P4 are not connected and give a footprint (805 surface-mount) for a passive component (resistor, capacitor, etc.) to be installed and jumpered into the PCB circuit. This allows for the evaluation of some simple device circuits to be implemented on this PCB 2.4.4 Installing Resistor R1X Resistor R1X is shorted by default. Therefore, if resistor R1X is to be installed, the trace across the component must be cut before it is installed (see Figure 2-4). While evaluating a device, it may be desireable to see the signals on both sides of this resistor. A test point is available so that both signals may be monitored. This test point is the avenue between components R3X and C1X (see Figure 2-4). This trace must be cut before resistor R1X can be installed Test point FIGURE 2-4: © 2005 Microchip Technology Inc. Test point when resistor R1X is installed. DS51544A-page 13 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide 2.4.5 Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1) The BFMP interface allows a PICmicro MCU device to be programmed with programmers that support this interface, such as the BFMP programmer (part number PG164101). The PCB supports two device pinouts. The default pinout already has the traces connected to the appropriate PICmicro MCU pins. The optional pinout requires three PCB traces to be cut and then three connections to be made (see Figure 2-5). TABLE 2-2: BFMP HEADER SIGNALS AND PICMICRO MCU PINS Pin Number BFMP Header Signal Default Pinout Optional Pinout (1) Comment CLK 6 4 ICSP™ Clock DT 7 5 ICSP Data VPP 4 8 Note 1: Requires PCB traces to be cut and then jumpered. Required “Cuts” and “Jumpers” for Optional PICmicro® MCU pinout FIGURE 2-5: BFMP Header and Connections Top-Layer Traces FIGURE 2-6: DS51544A-page 14 Bottom-Layer Traces PCB Traces (Top and Bottom Layers). © 2005 Microchip Technology Inc. Installation and Operation 2.4.6 The PCB as a SOIC-8, MSOP-8, or TSSOP-8 to DIP-8 Socket Converter There may be occasions when it is desireable to convert the footprint of the device to that of a DIP package. This allows the device to be installed into an exsisting DIP socket. Two 1x4 row pins need to be installed into the PCB’s DIP footprint when the device is installed into the appropriate package footprint. This allows the PCB to convert the SOIC-8, MSOP-8 or TSSOP-8 footprints to a 300-mil DIP-8 footprint. 2.4.7 Evaluating a Voltage Supervisor or Voltage Detector Device 2.4.7.1 VOLTAGE SUPERVISORS The following voltage supervisor is supported by this evaluation board. TABLE 2-3: Device 8-PIN VOLTAGE SUPERVISOR SOIC DIP MSOP TSSOP Yes Yes — — TC1232 2.4.7.2 Comment TESTING THE VOLTAGE SUPERVISORS TRIP POINT OPERATION When evaluating a voltage supervisor/voltage detector device, a minimum set of test equipment should be available. Table 2-4 shows the recommended test equipment. TABLE 2-4: TEST EQUIPMENT Hardware Connect to: Comment Variable Power Supply VDD, VSS This allows the voltage to the SOT23 Evaluation Board to be varied so the device output can be monitored. Arbitrary Waveform Generator VDD, VSS This is similar to a variable power supply, but allows programmability into the input signal that the device will be subjected to. This also allows a particular waveform to be repeated (such as a 60 Hz sine wave that varies from 1V to 5V). Digital Multi-Meter (D.M.M.) VOUT (1) Used to indicate the output state (low or high) of the voltage supervisor/voltage detector. Oscilloscope VOUT (1) Allows the device conditions and response to be evaluated due to the ability to capture this information. This is useful for faster signals and cases where small spikes need to be detected. Test Light (LED) VOUT (1) Used to visually indicate the output state (low or high) of the voltage supervisor/voltage detector. Ensure that the current requirements of this LED can be supplied by the device’s output pin. Note 1: © 2005 Microchip Technology Inc. The pad connection to connect to the VOUT or RST pin will be dependent on the device and the footprint option used. DS51544A-page 15 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide A typical system that would be used to evaluate the voltage supervisor/voltage detector device is shown in Figure 2-7. This also shows an example input and output waveform for a voltage supervisor/voltage detector device. SOT-23-5/6 Evaluation Board PCB PCB Pad R2 Variable Power Supply or Arbitrary Waveform Generator Voltage Supervisor or Voltage Detector Oscilloscope R1 C1 R3 Test Point Arbitrary Waveform Generator Output Test Point or VOUT Device VDD out of valid operating range. Output voltage may be indeterminate. FIGURE 2-7: DS51544A-page 16 Evaluation System. © 2005 Microchip Technology Inc. Installation and Operation 2.4.8 Example Op Amp Circuits This section shows how the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board could be used to evaluate op amp circuits. The first circuit is for the MCP601 and is shown in Figure 2-8. Figure 2-9 shows which components on the PCB would be installed and how the “unconnected” passive components would be jumpered into the circuit. The second circuit is for the MCP6021 and is shown in Figure 2-10. Figure 2-11 shows which components on the PCB would be installed and how the “unconnected” passive components would be jumpered into the circuit. C (P1) R1C R2 C1C R2 is connected to pad 2 (not installed on PCB) FIGURE 2-8: 3 + 7 2 – 4 Op Amp Circuit #1 (MCP601). PAD1 PAD8 PAD2 PAD7 External to PCB Trace is cut, resistor is installed R2 1 8 2 7 3 6 4 PAD3 6 U1 5 R1C PAD6 C1C P1 PAD4 R1D To power plane VDD PAD5 C2 VSS VDD C1 To ground plane VSS FIGURE 2-9: PCB Connections for Op Amp Circuit #1 (MCP601). © 2005 Microchip Technology Inc. DS51544A-page 17 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide R1C 3 + 7 2 – 4 R3C R (P1) R1B FIGURE 2-10: 6 Op Amp Circuit #2 (MCP6021). PAD1 PAD8 Trace is cut, resistor is installed PAD2 R1B* PAD7 Trace is cut, resistor is installed 1 8 2 7 3 6 4 PAD3 R1C* 5 U1 R3C* PAD6 P1 PAD4 PAD5 C2 To power plane VDD VSS VDD C1 To ground plane VSS FIGURE 2-11: DS51544A-page 18 PCB Op Amp Circuit #2 (MCP6021). © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix A. Schematic and Layouts A.1 INTRODUCTION This appendix contains the schematics and layouts for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Diagrams included in this appendix: • • • • • • • A.2 Board Schematic - Digital Circuitry Board – Top Layer + Bottom Layer + Silk-Screen Board – Top Layer + Silk-Screen Board – Bottom Layer Board – Power Plane Board – Ground Plane Board – Component Layer SCHEMATICS AND PCB LAYOUT Figure A-3 shows the schematic of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Figure A-2 shows the layout for the top layer of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. The layer order is shown in Figure A-1. Top Layer Ground Layer Power Layer Bottom Layer FIGURE A-1: © 2005 Microchip Technology Inc. Layer Order. DS51544A-page 19 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-2: DS51544A-page 20 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Schematic. © 2005 Microchip Technology Inc. Schematic and Layouts FIGURE A-3: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout – Top Layer + Bottom Layer + Silk-Screen. © 2005 Microchip Technology Inc. DS51544A-page 21 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-4: DS51544A-page 22 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Top Layer + Silk-Screen. © 2005 Microchip Technology Inc. Schematic and Layouts FIGURE A-5: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Bottom Layer. © 2005 Microchip Technology Inc. DS51544A-page 23 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-6: DS51544A-page 24 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Power Plane © 2005 Microchip Technology Inc. Schematic and Layouts FIGURE A-7: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Ground Plane. © 2005 Microchip Technology Inc. DS51544A-page 25 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide FIGURE A-8: DS51544A-page 26 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Component Layer. © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: Qty BILL OF MATERIALS Reference Description 1 PCB 103-00050 SOT23 Evaluation Board PCB 0 U1 SOIC-8 Device 0 U2 MSOP-8 Device 0 U3 DIP-8 Device 0 U4 TSSOP-8 Device 0 C1, C2, C3 0 0 0 0 0 0 0 0 Device Power Supply Bypass Capacitor Surface-mount (805 package) (Optional - Application-dependent) C1A, C1B, C1C, Output Filer Capacitor C1D, C1E, C1F, Surface-mount (805 package) C1G, C1H (Optional - Application-dependent) Output inline resistor R1A, R1B, R1C, R1D, R1E, R1F, Surface-mount (805 package) R1G, R1H (Optional - Application-dependent) R2A, R2B, R2C, Output Pull-up resistor R2D, R2E, R2F, Surface-mount (805 package) R2G, R2H (Optional - Application-dependent) R3A, R3B, R3C, Output Pull-down resistor R3D, R3E, R3F, Surface-mount (805 package) R3G, R3H (Optional - Application-dependent) P1, P2, P3, P4 Passive component (not connected) that can be “blue wired” into the desired circuit. The device layout supports the 805 package. (Optional - Application-dependent) J1 BFMP Header (6-pin, 100 mil spacing) PAD1, PAD2, PAD3, Through-hole connector(s) for PAD1, PAD2, PAD4, PAD5, PAD6, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, VDD, VSS PAD7, PAD8, VDD, VSS PAD1, PAD2, PAD3, Surface-mount connector(s) for PAD1, PAD2, PAD4, PAD5, PAD6, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, VDD, PAD7, PAD8, VSS VDD, VSS © 2005 Microchip Technology Inc. Manufacturer Part Number Microchip Technology Inc. Microchip Technology Inc. Microchip Technology Inc. Microchip Technology Inc. Microchip Technology Inc. — 103-00060 User-specified User-specified User-specified User-specified User-specified — User-specified — User-specified — User-specified — User-specified — Keystone Electronics® — 5012 Keystone Electronics® 5016 DS51544A-page 27 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide NOTES: DS51544A-page 28 © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix C. Microchip Analog and Interface Device Compatibility C.1 INTRODUCTION This appendix documents the Michrochip Analog and Interface devices that are footprint compatible with this PCB. The Analog and Interface devices currently fall into the following catagories: • • • • • • • • • • • • • • • • A/D Converters (ADCs) (ADCs) Battery Chargers Comparators D/A Converters (DACs) (DACs) DC-to-DC Converters Digital Potentiometers (Digi-Pots) Fan Controllers Integrated Devices Interface Devices Linear Regulators Operational Amplifiers (Op Amps) Power MOSFET Drivers Programmable Gain Amplifiers (PGAs)s (PGAs) Switching Regulators Temperature Sensors Voltage Supervisors and Voltage Detectors Table C-1 shows the Michrochip Analog and Interface devices that are currently supported. As new devices become available, this PCB may be able to support them. Please check the device data sheet to verify if the device is available in one of the package types supported by this PCB. © 2005 Microchip Technology Inc. DS51544A-page 29 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Voltage Supervisors and Voltage Detectors TC1232 Yes Yes — — Digital Potentiometer MCP4021 Yes — Yes — MCP41010 Yes Yes — — MCP41050 Yes Yes — — MCP41100 Yes Yes — — Switching Regulator MCP1601 — — Yes — MCP1612 — — Yes — MCP1630 — — Yes — MCP1650 — — Yes — MCP1651 — — Yes — MCP1652 — — Yes — — DC-to-DC Converters MCP1252 — — Yes MCP1253 — — Yes — Yes Yes — — TC682 TC962 Yes Yes — — TC1044S Yes Yes — — TC1121 Yes Yes Yes — TC1142 — — Yes — TC7660 Yes Yes — — TC7660B Yes Yes — — TC7660H Yes Yes — — TC7660S Yes Yes — — TCM680 Yes Yes — — Linear Regulators MCP1726 Yes — — — TC1107 Yes — Yes — TC1173 Yes — Yes — TC1174 Yes — Yes — TC1263 Yes — — — TC1265 Yes — — — TC1266 Yes — Yes — TC1268 Yes — — — TC1269 — — Yes — TC1300 — — Yes — TC1301A — — Yes — TC1301B — — Yes — TC1302A — — Yes — TC1302B — — Yes — — — Yes — TC1306 Note 1: 2: DS51544A-page 30 Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value. Installation of PCB capacitor C1 recommended. See data sheet for recommended value. © 2005 Microchip Technology Inc. Microchip Analog and Interface Device Compatibility TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Operational Amplifiers (Op Amps) MCP601 Yes Yes — Yes Note 2 MCP602 Yes Yes — Yes Note 2 Note 2 MCP603 Yes Yes — Yes MCP606 Yes Yes — Yes MCP607 Yes Yes — Yes MCP608 Yes Yes — Yes MCP616 Yes Yes Yes — MCP617 Yes Yes Yes — MCP618 Yes Yes Yes — MCP6001 Yes Yes Yes — MCP6004 Yes Yes Yes — MCP6021 Yes Yes — Yes Note 2 MCP6022 Yes Yes — Yes Note 2 Note 2 MCP6023 Yes Yes — Yes MCP6041 Yes Yes Yes — MCP6042 Yes Yes Yes — MCP6043 Yes Yes Yes — MCP6141 Yes Yes Yes — MCP6142 Yes Yes Yes — MCP6143 Yes Yes Yes — MCP6231 Yes Yes Yes — MCP6232 Yes Yes Yes — MCP6241 Yes Yes Yes — MCP6242 Yes Yes Yes — MCP6271 Yes Yes Yes — Note 2 MCP6272 Yes Yes Yes — Note 2 MCP6273 Yes Yes Yes — Note 2 MCP6275 Yes Yes Yes — Note 2 MCP6281 Yes Yes Yes — Note 2 MCP6282 Yes Yes Yes — Note 2 MCP6283 Yes Yes Yes — Note 2 MCP6285 Yes Yes Yes — Note 2 MCP6291 Yes Yes Yes — Note 2 MCP6292 Yes Yes Yes — Note 2 MCP6293 Yes Yes Yes — Note 2 MCP6295 Yes Yes Yes — Note 2 TC913 — Yes — — TC1029 Yes Yes Yes — TC7650 — Yes — — — Yes — — TC7652 Note 1: 2: © 2005 Microchip Technology Inc. Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value. Installation of PCB capacitor C1 recommended. See data sheet for recommended value. DS51544A-page 31 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Programmable Gain Amplifiers (PGAs) MCP6S21 Yes Yes Yes — Note 2 MCP6S22 Yes Yes Yes — Note 2 MCP6S91 Yes Yes Yes — Note 2 MCP6S92 Yes Yes Yes — Note 2 Power MOSFET Drivers TC1410 Yes Yes Yes — TC1410N Yes Yes Yes — TC1411 Yes Yes Yes — TC1411N Yes Yes Yes — TC1426 Yes Yes — — TC1427 Yes Yes — — TC1428 Yes Yes — — TC4403 — Yes — — TC4426A Yes Yes — — TC4427A Yes Yes — — TC4428A Yes Yes — — TC4426 Yes Yes Yes — TC4427 Yes Yes Yes — TC4428 Yes Yes Yes — TC426 Yes Yes — — TC427 Yes Yes — — TC428 Yes Yes — — TC4404 Yes Yes — — TC4405 Yes Yes — — TC1412 Yes Yes Yes — TC1412N Yes Yes Yes — TC1413 Yes Yes Yes — TC1413N Yes Yes Yes — TC4423 — Yes — — TC4424 — Yes — — TC4425 — Yes — — TC429 Yes Yes — — TC4420 Yes Yes — — TC4429 Yes Yes — — TC4421 — Yes — — TC4422 — Yes — — TC4626 — Yes — — TC4627 — Yes — — TC4431 Yes Yes — — Yes Yes — — TC4432 Note 1: 2: DS51544A-page 32 Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value. Installation of PCB capacitor C1 recommended. See data sheet for recommended value. © 2005 Microchip Technology Inc. Microchip Analog and Interface Device Compatibility TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP MCP6541 Yes Yes Yes — MCP6542 Yes Yes Yes — MCP6543 Yes Yes Yes — MCP6546 Yes Yes Yes — MCP6547 Yes Yes Yes — Comment Comparators MCP6548 Yes Yes Yes — TC1025 Yes Yes Yes — TC1028 — — Yes — TC1031 — — Yes — TC1040 — — Yes — TC1041 Yes — Yes — A/D Converters (ADCs) MCP3001 Yes Yes — Yes MCP3002 Yes Yes — Yes MCP3201 Yes Yes — Yes MCP3202 Yes Yes — Yes MCP3301 Yes Yes Yes — TC3400 Yes Yes — — D/A Converters (DACs) MCP4821 Yes Yes Yes — MCP4822 Yes Yes Yes — MCP4921 Yes Yes Yes — TC1320 Yes — Yes — Yes — Yes — TC1321 Note 1: 2: © 2005 Microchip Technology Inc. Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value. Installation of PCB capacitor C1 recommended. See data sheet for recommended value. DS51544A-page 33 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide TABLE C-1: Device ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY SOIC DIP MSOP TSSOP Comment Temperature Sensors MCP9801 Yes — Yes — MCP9803 Yes — Yes — TC72 — — Yes — TCN75 Yes — Yes — TC620 Yes Yes — — TC621 Yes Yes — — TC622 Yes Yes — — TC623 Yes Yes — — TC624 Yes Yes — — Fan Controllers TC642 Yes Yes Yes — TC642B Yes Yes Yes — TC646 Yes Yes Yes — TC646B Yes Yes Yes — TC647 Yes Yes Yes — TC647B Yes Yes Yes — TC648 Yes Yes Yes — TC648B Yes Yes Yes — TC649 Yes Yes Yes — TC649B Yes Yes Yes — TC650 — — Yes — TC651 — — Yes — TC652 — — Yes — TC653 — — Yes — MCP7344 — — Yes — MCP73827 — — Yes — MCP73828 — — Yes — MCP73843 — — Yes — Yes Yes Yes — MCP201 Yes Yes — — MCP2122 Yes Yes — — Yes Yes — — Battery Chargers Integrated Devices TC1026C Interface Devices MCP2551 Note 1: 2: DS51544A-page 34 Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value. Installation of PCB capacitor C1 recommended. See data sheet for recommended value. © 2005 Microchip Technology Inc. 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD USER’S GUIDE Appendix D. Rev. 1 PCB Errata D.1 INTRODUCTION This appendix documents the issues with the Rev 1 PCB. The Rev 2 PCB fixes these issues. D.2 REV 1 PCB ISSUES There are two issues with the Rev 1 PCB. These are: 1. VDD and VSS vias near each pad are No Connects (they should have been connected to the appropriate power or ground plane). See Figure D-1 shows the location of these vias that are No Connects. Figure D-3 shows alternate connections that can be made. 2. The silk-screen on the bottom layer was not processed. This was anly intended for indicating the circuit of the board. This can be done with a sticky label. Figure D-2 shows how to determine the PCB revision. Although these vias were intended to be connected to either the VDD or VSS plane (as indicated), they are actually no connects. Rev 2 of the board addresses this. FIGURE D-1: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber - Top Layer + Silk-Screen. © 2005 Microchip Technology Inc. DS51544A-page 35 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide This indicates a Rev 1 PCB FIGURE D-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Revision Marking (Gerber – Bottom Layer) DS51544A-page 36 © 2005 Microchip Technology Inc. Rev. 1 PCB Errata Figure D-3 shows how the pad can be connected to either the VDD or VSS plane of the PCB. Jumpering to VSS FIGURE D-3: © 2005 Microchip Technology Inc. Jumpering to VDD Alternate Jumpering the PCB pad to either VSS or VDD. 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