PIC24FJ256GA412/GB412 FAMILY PIC24FJ256GA412/GB412 Family Flash Programming Specification 1.0 DEVICE OVERVIEW This document defines the programming specification for the PIC24FJ256GA412/GB412 family of 16-bit microcontrollers with Dual Partition Flash mode functionality. This programming specification is required only for those developing programming support for the following devices: • PIC24FJ256GB412 • PIC24FJ256GA412 • PIC24FJ128GB412 • PIC24FJ128GA412 • PIC24FJ64GB412 • PIC24FJ64GA412 • PIC24FJ256GB410 • PIC24FJ256GA410 • PIC24FJ128GB410 • PIC24FJ128GA410 • PIC24FJ64GB410 • PIC24FJ64GA410 • PIC24FJ256GB406 • PIC24FJ256GA406 • PIC24FJ128GB406 • PIC24FJ128GA406 • PIC24FJ64GB406 • PIC24FJ64GA406 Topics covered include: • • • • • • • • • Section 1.0 “Device Overview” Section 2.0 “Programming Overview” Section 3.0 “Device Programming – ICSP” Section 4.0 “Device Programming – Enhanced ICSP” Section 5.0 “Programming the Programming Executive to Memory” Section 6.0 “The Programming Executive” Section 7.0 “Dual Partition Flash Programming Considerations” Section 9.0 “Checksum Computation” Section 10.0 “AC/DC Characteristics and Timing Requirements” Customers using only one of these devices should use the development tools that already provide support for device programming. 2015 Microchip Technology Inc. DS30010073A-page 1 PIC24FJ256GA412/GB412 FAMILY 2.0 PROGRAMMING OVERVIEW 2.1 These devices require specific connections for programming to take place. These connections include power, VCAP, MCLR and one programming pair (PGEDx/ PGECx). Table 2-1 describes these connections (refer to the specific device data sheet for pin descriptions and power connection requirements). There are two methods of programming that are discussed in this programming specification: • In-Circuit Serial Programming™ (ICSP™) • Enhanced In-Circuit Serial Programming The ICSP programming method is the most direct method to program the device; however, it is also the slower of the two methods. It provides native, low-level programming capability to erase, program and verify the device. 2.2 Power Requirements All PIC24FJ256GA412/GB412 family devices power their core digital logic at a nominal 1.8V. To simplify system design, all devices in the PIC24FJ256GA412/ GB412 family incorporate an on-chip regulator that allows the device to run its core logic from VDD. The Enhanced ICSP protocol uses a faster method that takes advantage of the Programming Executive (PE), as illustrated in Figure 2-1. The PE provides all the necessary functionality to erase, program and verify the chip through a small command set. The command set allows the programmer to program a PIC24FJ256GA412/ GB412 family device without dealing with the low-level programming protocols. FIGURE 2-1: Required Connections The regulator provides power to the core from the other VDD pins. A low-ESR capacitor (such as ceramic or tantalum) must be connected to the VCAP pin (see Table 2-1 and Figure 2-2). This helps to maintain the stability of the regulator. The specifications for core voltage and capacitance are listed in Section 10.0 “AC/ DC Characteristics and Timing Requirements”. PROGRAMMING SYSTEM OVERVIEW FOR ENHANCED ICSP™ FIGURE 2-2: PIC24FJ256GA412/GB412 Programming Executive Programmer CONNECTIONS FOR THE ON-CHIP REGULATOR 3.3V PIC24FJ256GA412/GB412 VDD On-Chip Memory VCAP CEFC (10 µF typ) VSS This programming specification is divided into two major sections that describe the programming methods independently. Section 3.0 “Device Programming – ICSP” describes the ICSP method. Section 4.0 “Device Programming – Enhanced ICSP” describes the Enhanced ICSP method. TABLE 2-1: PINS USED DURING PROGRAMMING Pin Name Pin Type Pin Description MCLR I Programming Enable VDD and AVDD(1) P Power Supply(1) VSS and AVSS(1) P Ground(1) VCAP P On-Chip Voltage Regulator Filter Capacitor PGECx I Programming Pin Pair: Serial Clock PGEDx I/O Programming Pin Pair: Serial Data Legend: I = Input O = Output P = Power Note 1: All power supply and ground pins must be connected, including AVDD and AVSS. It is also recommended to connect the VBAT pin to the battery or VDD during programming. DS30010073A-page 2 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 2.3 Pin Diagrams 2.3.1 All devices in the PIC24FJ256GA412/GB412 family have three separate pairs of programming pins, labeled as PGEC1/PGED1, PGEC2/PGED2 and PGEC3/ PGED3. Any one of these pin pairs may be used for device programming by either ICSP or Enhanced ICSP. Unlike voltage supply and ground pins, it is not necessary to connect all three pin pairs to program the device. However, the programming method must use both pins of the same pair. Figure 2-3 through Figure 2-5 show the pin diagrams for the PIC24FJ256GA412/GB412 family. The pins that are required for programming are listed in Table 2-1 and are indicated in bold text in the figures. Refer to the appropriate device data sheet for complete pin descriptions. FIGURE 2-3: PGECx AND PGEDx PIN PAIRS PIN DIAGRAMS (64-PIN PACKAGES) 49 50 51 52 53 54 55 56 57 59 58 60 61 62 64 64-Pin QFN(1) 63 RE4 RE3 RE2 RE1 RE0 RF1 RF0 VBAT VCAP RD7 RD6 RD5 RD4 RD3 RD2 RD1 64-Pin TQFP 1 RE5 RE6 RE7 RG6 RG7 RG8 MCLR RG9 VSS VDD PGEC3 PGED3 RB3 RB2 PGEC1 PGED1 2 3 48 RC14 47 RC13 46 RD0 RD11 RD10 RD9 4 45 5 44 6 43 7 42 PIC24FJXXXXGA406 8 41 RD8 VSS 40 OSCO/RC15 10 39 OSCI/RC12 11 38 12 37 VDD D+/RG2 13 36 14 35 15 34 16 33 VBUS/RF7 RF3 32 31 30 29 28 27 26 25 24 23 21 22 19 18 17 D-/RG3 VUSB3V3(2) PGEC2 PGED2 AVDD AVSS RB8 RB9 RB10 RB11 VSS VDD RB12 RB13 RB14 RB15 RF4 RF5 20 PIC24FJXXXXGB406 9 Pin Legend: Note 1: 2: Complete Programming Pin Functions 11 PGEC3/SEG2/AN5/C1INA/RP18/RB5 12 PGED3/SEG3/AN4/C1INB/RP28/USBOEN/RB4 15 PGEC1/SEG6/VREF-/CVREF-/AN1/AN1-/RP1/CTED12/RB1 16 PGED1/SEG7/VREF+/CVREF+/DVREF+/AN0/RP0/RB0 17 PGEC2/LCDBIAS3/AN6/RP6/RB6 18 PGED2/SEG63/AN7/RP7/U6TX/RB7 Red indicates pin functions present on PIC24FJXXXXGBXX6 devices only. Bold indicates pins used in device programming; the complete list of functions associated with programming/emulation pins is shown in the accompanying table. It is recommended to connect the metal pad on the bottom of the 64-pin QFN package to VSS. RF6 on PIC24FJXXXXGA406 devices. 2015 Microchip Technology Inc. DS30010073A-page 3 PIC24FJ256GA412/GB412 FAMILY FIGURE 2-4: PIN DIAGRAMS (100-PIN PACKAGE) 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 RE4 RE3 RE2 RG13 RG12 RG14 RE1 RE0 RA7 RA6 RG0 RG1 RF1 RF0 VBAT VCAP RD7 RD6 RD5 RD4 RD13 RD12 RD3 RD2 RD1 100-Pin TQFP RG15 1 75 VSS VDD 2 74 RC14 RE5 3 73 RC13 RE6 4 72 RE7 5 71 RD0 RD11 RC1 6 70 RD10 RC2 7 69 RD9 RC3 8 68 RD8 RC4 9 67 RG6 10 66 RA15 RA14 RG7 11 RG8 12 MCLR 13 RG9 14 VSS 64 VSS OSCO/RC15 63 OSCI/RC12 62 VDD 15 61 RA5 VDD 16 60 RA4 RA0 17 59 RA3 RE8 18 58 RA2 RE9 19 57 D+/RG2 PGEC3 20 56 D-/RG3 PGED3 21 55 VUSB3V3(1) RB3 22 54 VBUS/RF7 RB2 23 RF8 PGEC1 53 24 RF2 PGED1 52 25 51 RF3 65 Pin Legend: Note 1: VSS VDD RD14 RD15 RF4 RF5 PGEC2 PGED2 RA9 RA10 AVDD AVSS RB8 RB9 RB10 RB11 VSS VDD RA1 RF13 RF12 RB12 RB13 RB14 RB15 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 PIC24FJXXXXGA410 PIC24FJXXXXGB410 Complete Programming Pin Functions 20 PGEC3/SEG2/AN5/C1INA/RP18/RB5 21 PGED3/SEG3/AN4/C1INB/RP28/USBOEN/RB4 24 PGEC1/SEG6/VREF-/CVREF-/AN1/AN1-/RP1/CTED12/RB1 25 PGED1/SEG7/VREF+/CVREF+/DVREF+/AN0/RP0/RB0 26 PGEC2/LCDBIAS3/AN6/RP6/RB6 27 PGED2/SEG63/AN7/RP7/U6TX/RB7 Red indicates pin functions present on PIC24FJXXXXGB610 devices only. Bold indicates pins used in device programming; the complete list of functions associated with programming/emulation pins is shown in the accompanying table. RF6 on PIC24FJXXXXGA410devices. DS30010073A-page 4 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY FIGURE 2-5: PIN DIAGRAMS (PIC24FJXXXGA412/GB412 121-PIN PACKAGE) 121-Pin BGA 1 2 3 4 5 6 9 10 11 A RE4 RE3 RG13 RE0 RG0 RF1 RD12 RD2 RD1 B RH1 RG15 RE2 RE1 RA7 RF0 VCAP RD5 RD3 VSS RC14 C RE6 VDD RG12 RG14 RA6 VSS RD7 RD4 RH13 RC13 RD11 D RC1 RE7 RE5 RH2 RJ0 VDD RD6 RD13 RD0 VSS RD10 E RC4 RC3 RG6 RC2 RJ1 RG1 VDD RA15 RD8 RD9 RA14 F MCLR RG8 RG9 RG7 VSS RH15 RH12 VDD RC12 VSS RC15 G RE8 RE9 RA0 RH3 VDD VSS VSS RH11 RA5 RA3 RA4 H PGEC3 PGED3 RH4 RH5 RB10 VDD RH8 J RB3 RB2 PGED2 AVDD RA1 RB12 RH9 K PGEC1 PGED1 RA10 RB8 RF12 RB14 VDD L PGEC2 RA9 AVSS RB9 RF13 RB13 RB15 Pin H1 Legend: Note 1: RH7 RB11 RH6 7 8 VBAT RH14 VBUS/RF7 VUSB3V3(1) D+/RG2 RH10 RA2 RF8 D-/RG3 RD15 RF3 RF2 RD14 RF4 RF5 Complete Programming Pin Functions PGEC3/SEG2/AN5/C1INA/RP18/RB5 H2 PGED3/SEG3/AN4/C1INB/RP28/USBOEN/RB4 K1 PGEC1/SEG6/VREF-/CVREF-/AN1/AN1-/RP1/CTED12/RB1 K2 PGED1/SEG7/VREF+/CVREF+/DVREF+/AN0/RP0/RB0 L1 PGEC2/LCDBIAS3/AN6/RP6/RB6 J3 PGED2/SEG63/AN7/RP7/U6TX/RB7 Red indicates pin functions present on PIC24FJXXXXGB610 (BGA) devices only. Bold indicates pins used in device programming; the complete list of functions associated with programming/emulation pins is shown in the accompanying table. RF6 on PIC24FJXXXXGA412 devices. 2015 Microchip Technology Inc. DS30010073A-page 5 PIC24FJ256GA412/GB412 FAMILY 2.4 Program Memory Write/Erase Requirements The program Flash memory has a specific write/erase requirement that must be adhered to for proper device operation. The rule is that any given word in memory must not be written without first erasing the page in which it is located. Thus, the easiest way to conform to this rule is to write all the data in a programming block within one write cycle. The programming methods specified in this document comply with this requirement. 2.5 Memory Map The program memory map extends from 000000h to FFFFFEh. Code storage is located at the base of the memory map. The last locations of implemented program memory are reserved for the device Configuration bits. Table 2-2 lists the code memory size, the size of the erase blocks and the number of erase blocks present in each device variant. TABLE 2-2: Locations, 800100h through 800BFEh, are reserved for executive code memory. This region stores the PE and the debugging executive, which is used for device programming. This region of memory cannot be used to store user code. See Section 6.0 “The Programming Executive” for more information. Locations, 801380h through 8013FEh, are reserved for the customer OTP data. This area can be used for storing product information, such as serial numbers, system manufacturing dates, manufacturing lot numbers and other application-specific information; it is described in Section 2.6.3 “One-Time-Programmable (OTP) Memory”. Locations, FF0000h and FF0002h, are reserved for the Device ID Word registers. These bits can be used by the programmer to identify which device type is being programmed. They are described in Section 8.0 “Device ID”. The Device ID registers read out normally, even after code protection is applied. Figure 2-6 and Figure 2-7 show the generic memory maps for the devices described in this specification. See the “Memory Organization” chapter in the specific device data sheet for exact memory addresses. PROGRAM MEMORY SIZES AND BOUNDARIES Program Memory Upper Boundary (Instruction Words) Device Write Blocks(1) Erase Blocks(1) 0157FEh(44K) 1376 172 00ABFEh (22K) 00ABFEh (22K) 688 86 0057FEh (11K) 0057FEh (11K) 352 44 Dual Partition Flash Mode Single Partition Flash Mode Active Partition Inactive Partition 02AFFEh (88K) 0157FEh(44K) PIC24FJ128GX4XX 0157FEh(44K) PIC24FJ64GX4XX 00AFFEh (22K) PIC24FJ256GX4XX Note 1: 1 Write Block = 64 Instruction Words; 1 Erase Block = 512 Instruction Words. DS30010073A-page 6 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY FIGURE 2-6: PROGRAM MEMORY MAP FOR SINGLE PARTITION FLASH MODE 000000h User Memory Space User Flash Program Memory Flash Config Words 0xxxFEh(1) 0xxx00h(1) Unimplemented Read ‘0’ Reserved Executive Code Memory Reserved Customer OTP Memory Configuration Memory Space Reserved FBOOT 7FFFFFh 800000h 800100h 800BFEh 800C00h 80137Eh 801380h 8013FEh 801400h 8017FEh 801800h 801802h 801804h Reserved Device Config Registers Reserved Flash Write Latches F7FFFEh F80000h F80026h F80028h F9FFFEh FA0000h FA007Eh FA0080h Reserved DEVID (2) Reserved FEFFFEh FF0000h FF0004h FFFFFFh Legend: Memory areas are not shown to scale. Note 1: Exact boundary addresses are determined by the size of the implemented program memory. See Table 2-2 for details. 2015 Microchip Technology Inc. DS30010073A-page 7 PIC24FJ256GA412/GB412 FAMILY FIGURE 2-7: PROGRAM MEMORY MAP FOR DUAL PARTITION FLASH MODES 000000h User Flash Program Memory Active Partition User Memory Space Flash Config Words 0xxxFEh(1) 0xxx00h(1) Unimplemented Read ‘0’ 400000h User Flash Program Memory Inactive Partition Flash Config Words 4xxxFEh(1) 4xxx00h(1) Unimplemented Read ‘0’ Reserved Executive Code Memory Reserved Customer OTP Memory Configuration Memory Space Reserved FBOOT 7FFFFFh 800000h 800100h 800BFEh 800C00h 80137Eh 801380h 8013FEh 801400h 8017FEh 801800h 801802h 801804h Reserved Device Config Registers Reserved Flash Write Latches F7FFFEh F80000h F80026h F80028h F9FFFEh FA0000h FA007Eh FA0080h Reserved DEVID (2) Reserved FEFFFEh FF0000h FF0004h FFFFFFh Legend: Memory areas are not shown to scale. Note 1: Exact boundary addresses are determined by the size of the implemented program memory. See Table 2-2 for details. DS30010073A-page 8 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 2.6 Configuration Bits 2.6.1 2.6.2 OVERVIEW The Configuration bits are stored in the last page location of implemented program memory. These bits can be set or cleared to select various device configurations. There are two types of Configuration bits: system operation bits and code-protect bits. The system operation bits determine the power-on settings for system-level components, such as the oscillator and the Watchdog Timer. The code-protect bits prevent program memory from being read and written. Table 2-3 lists the Configuration register address range for each device in Single and Dual Partition modes. Table 2-4 lists all of the Configuration bits found in the PIC24FJ256GA412/GB412 family devices, as well as their Configuration register locations. Refer to the “Special Features” chapter in the specific device data sheet for the full Configuration register description for a specific device. TABLE 2-3: Configuration Register CODE-PROTECT CONFIGURATION BITS The device implements an intermediate security feature defined by the FSEC register. The Boot Segment (BS) is the higher privilege segment and the General Segment (GS) is the lower privilege segment. The total user code memory can be split into BS or GS. The size of the segments is determined by the BSLIM<12:0> bits. The relative location of the segments within user space does not change, such that BS (if present) occupies the memory area just after the Interrupt Vector Table (IVT) and the GS occupies the space just after the BS (or if the Alternate IVT is enabled, just after it). The Configuration Segment (or CS) is a small segment (less than a page, typically just one row) within user Flash address space. It contains all user configuration data that is loaded by the NVM Controller during the Reset sequence. CONFIGURATION WORD ADDRESSES Single Partition Flash Mode PIC24FJ256GX4XX PIC24FJ128GX4XX PIC24FJ64GX4XX FSEC 02AF80h 015780h 00AF80h FBSLIM 02AF90h 015790h 00AF90h FSIGN 02AF94h 015794h 00AF94h FOSCSEL 02AF98h 015798h 00AF98h FOSC 02AF9Ch 01579Ch 00AF9Ch FWDT 02AFA0h 0157A0h 00AFA0h FPOR 02AFA4h 0157A4h 00AFA4h FICD 02AFA8h 0157A8h 00AFA8h FDS 02AFACh 0157ACh 00AFACh FDEVOPT1 02AFB0h 0157B0h 00AFB0h FBOOT 801800h Dual Partition Flash Modes(1) FSEC(2) 015780/415780h 00AB80/40AB80h 005580/405580h FBSLIM(2) 015790/415790h 00AB90/40AB90h 005590/405590h FSIGN(2) 015794/415794h 00AB94/40AB94h 005594/405594h FOSCSEL 015798/415798h 00AB98/40AB98h 005598/405598h FOSC 01579C/41579Ch 00AB9C/40AB9Ch 00559C/40559Ch FWDT 0157A0/4157A0h 00ABA0/40ABA0h 0055A0/4055A0h FPOR 0157A4/4157A4h 00ABA4/40ABA4h 0055A4/4055A4h FICD 0157A8/4157A8h 00ABA8/40ABA8h 0055A8/4055A8h FDS 0157AC/4157ACh 00ABAC/40ABACh 0055AC/4055ACh FDEVOPT1 0157B0/4157B0h 00ABB0/40ABB0h 0055B0/4055B0h FBTSEQ 0157FC/4157FCh 00ABFC/40ABFCh 0055FC/4055FCh FBOOT Note 1: 2: 801800h Addresses shown for Dual Partition Flash modes are for the Active/Inactive Partitions, respectively. Changes to these Inactive Partition Configuration Words affect how the Active Partition accesses the Inactive Partition. 2015 Microchip Technology Inc. DS30010073A-page 9 PIC24FJ256GA412/GB412 FAMILY TABLE 2-4: CONFIGURATION BITS FOR PIC24FJ256GA412/GB412 FAMILY DEVICES Bit Field Register AIVTDIS FSEC<15> ALTCMPI FDEVOPT1<1> Description Alternate Interrupt Vector Table bit 1 = Disables AIVT; AIVTEN (INTCON2<8>) bit is not available 0 = Enables AIVT; AIVTEN (INTCON2<8> bit is available Alternate Comparator Location Enable bit 1 = C1INC, C2INC and C3INC are on their standard pin locations 0 = C1INC, C2INC and C3INC are on RG9 BOREN<1:0> FPOR<1:0> Brown-out Reset Enable bits 11 = Brown-out Reset is enabled in hardware; SBOREN bit is disabled 10 = Brown-out Reset is enabled only while device is active and is disabled in Sleep; SBOREN bit is disabled 01 = Brown-out Reset is controlled with the SBOREN bit setting 00 = Brown-out Reset is disabled in hardware; SBOREN bit is disabled BSLIM<12:0> FBSLIM<12:0> Boot Segment Code Flash Page Address Limit bits Specifies the last Boot Segment page + 1 (the first page of the General Segment). As this value is inverted, the default unprogrammed value (1FFFh) sets the Boot Segment size to 0. BSS<1:0> FSEC<2:1> BSEN FSEC<3> BTMODE<1:0> BSEQ<11:0> Boot Segment Code Protection Level bits 11 = No protection (other than the BWRP bit) 10 = Standard security 0x = High security Boot Segment Control bit 1 = No Boot Segment is enabled 0 = Boot Segment size is determined by BSLIM<12:0> FBOOT<1:0> Device Partition Flash Mode Configuration bits 11 = Single Partition Flash mode 10 = Dual Partition Flash mode 01 = Protected Dual Partition Flash mode (Partition 1 is write-protected when inactive) 00 = Reserved; do not use FBTSEQ<11:0> Boot Sequence Number bits (Dual Partition Flash modes only) Relative value defining which partition will be active after a device Reset; the partition containing a lower boot number will be active. BTSWP FICD<15> BOOTSWP Instruction Disable bit 1 = BOOTSWP instruction is disabled 0 = BOOTSWP instruction is enabled BWRP FSEC<0> Boot Segment Program Write Protection bit 1 = Boot Segment can be written 0 = Boot Segment is write-protected CSS<2:0> FSEC<11:9> Configuration Segment Code Protection Level bits 111 = No protection (other than the CWRP bit) 110 = Standard security 10x = Enhanced security 0xx = High security CWRP FSEC<8> Configuration Segment Program Write Protection bit 1 = Configuration Segment is not write-protected 0 = Configuration Segment is write-protected DEBUG FIDC<7> Background Debugger Enable bit 1 = Background debugger is disabled 0 = Background debugger is enabled DS30010073A-page 10 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY TABLE 2-4: CONFIGURATION BITS FOR PIC24FJ256GA412/GB412 FAMILY DEVICES (CONTINUED) Bit Field Register Description DSBOREN FDS<6> Deep Sleep Brown-out Reset Enable bit 1 = Deep Sleep BOR is enabled in Deep Sleep mode 0 = Deep Sleep BOR is disabled in Deep Sleep mode (remains active in other Sleep modes) DSSWEN FDS<15> Deep Sleep Software Control Select bit 1 = Deep Sleep operation is enabled and controlled by the DSEN bit 0 = Deep Sleep operation is disabled DSWDTEN FDS<7> Deep Sleep Watchdog Timer Enable bit 1 = Deep Sleep WDT is enabled 0 = Deep Sleep WDT is disabled DSWDTPS<4:0> FDS<4:0> Deep Sleep Watchdog Timer Postscale Select bits 11111 = 1:68,719,476736 (25.7 days) 11110 = 1:34,359,738368(12.8 days) 11101 = 1:17,179,869184 (6.4 days) 11100 = 1:8,589,934592 (77.0 hours) 11011 = 1:4,294,967296 (38.5 hours) 11010 = 1:2,147,483648 (19.2 hours) 11001 = 1:1,073,741824 (9.6 hours) 11000 = 1:536,870912 (4.8 hours) 10111 = 1:268,435456 (2.4 hours) 10110 = 1:134,217728 (72.2 minutes) 10101 = 1:67,108864 (36.1 minutes) 10100 = 1:33,554432 (18.0 minutes) 10011 = 1:16,777216 (9.0 minutes) 10010 = 1:8,388608 (4.5 minutes) 10001 = 1:4,194304 (135.3s) 10000 = 1:2,097152 (67.7s) 01111 = 1:1,048576 (33.825s) 01110 = 1:524288 (16.912s) 01101 = 1:262114 (8.456s) 01100 = 1:131072 (4.228s) 01011 = 1:65536 (2.114s) 01010 = 1:32768 (1.057s) 01001 = 1:16384 (528.5 ms) 01000 = 1:8192 (264.3 ms) 00111 = 1:4096 (132.1 ms) 00110 = 1:2048 (66.1 ms) 00101 = 1:1024 (33 ms) 00100 = 1:512 (16.5 ms) 00011 = 1:256 (8.3 ms) 00010 = 1:128 (4.1 ms) 00001 = 1:64 (2.1 ms) 00000 = 1:32 (1 ms) DSWDTOSC FDS<5> Deep Sleep Watchdog Timer Clock Select bit 1 = Clock source is LPRC 0 = Clock source is SOSC FCKSM<1:0> FOSC<7:6> Clock Switching Mode bits 1x = Clock switching and Fail-Safe Clock Monitor are disabled 01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled 00 = Clock switching and Fail-Safe Clock Monitor are enabled 2015 Microchip Technology Inc. DS30010073A-page 11 PIC24FJ256GA412/GB412 FAMILY TABLE 2-4: CONFIGURATION BITS FOR PIC24FJ256GA412/GB412 FAMILY DEVICES (CONTINUED) Bit Field Register Description FNOSC<2:0> FOSCSEL<2:0> Oscillator Selection bits 111 = Fast RC Oscillator with Postscaler (FRCDIV) 110 = Reserved, do not use 101 = Low-Power RC Oscillator (LPRC) 100 = Secondary Oscillator (SOSC) 011 = Primary Oscillator with PLL (XTPLL, HSPLL, ECPLL) 010 = Primary Oscillator (XT, HS, EC) 001 = Fast RC Oscillator with Divide-by-N with PLL (FRCPLL) 000 = Fast RC Oscillator (FRC) FWDTEN<1:0> FWDT<6:5> Watchdog Timer Enable bits 11 = WDT is enabled 10 = WDT is disabled (control is placed on the SWDTEN bit) 01 = WDT is enabled only while device is active and is disabled in Sleep; SWDTEN bit is disabled 00 = WDT and SWDTEN are disabled FWPSA FWDT<4> Watchdog Timer Prescaler 1 = WDT prescaler ratio of 1:128 0 = WDT prescaler ratio of 1:32 GSS<1:0> FSEC<7:6> General Segment Code Protection Level bits 11 = No protection (other than the GWRP bit) 10 = Standard security 0x = High security GWRP FSEC<5> General Segment Program Write Protection bit 1 = General Segment is not write-protected 0 = General Segment is write-protected IBSEQ<11:0> FBTSEQ<23:12> Inverse Boot Sequence Number bits (Dual Partition Flash modes only) The one’s complement of BSEQ<11:0>; must be calculated by the user. ICS<1:0> FICD<1:0> ICD Communication Channel Select bits 11 = Communicates on PGEC1/PGED1 10 = Communicates on PGEC2/PGED2 01 = Communicates on PGEC3/PGED3 00 = Reserved; do not use IESO FOSCSEL<7> Two-Speed Oscillator Start-up Enable bit 1 = Starts up the device with FRC, then automatically switches to the user-selected oscillator when ready 0 = Starts up the device with the user-selected oscillator source IOL1WAY FOSC<5> Peripheral Pin Select Configuration bit 1 = The IOLOCK bit can be set only once (with unlock sequence). 0 = The IOLOCK bit can be set and cleared as needed (with unlock sequence) JTAGEN FICD<5> JTAG Enable bit 1 = JTAG port is enabled 0 = JTAG port is disabled LPCFG FPOR<2> Retention Voltage Regulator Control Enable bit 1 = Retention feature is not available 0 = Retention feature is available and controlled by RETEN during Sleep OSCIOFNC FOSC<2> CLKO Enable Configuration bit 1 = CLKO output signal is active on the OSCO pin (when primary oscillator is disabled or configured for EC mode) 0 = CLKO output is disabled DS30010073A-page 12 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY TABLE 2-4: CONFIGURATION BITS FOR PIC24FJ256GA412/GB412 FAMILY DEVICES (CONTINUED) Bit Field Register Description PLLMODE<3:0> FOSCSEL<6:3> PLL Frequency Multiplier Select bits 1111 = No PLL is used (PLLEN bit is unavailable) 1110 = 8x PLL is selected 1101 = 6x PLL is selected 1100 = 4x PLL is selected 0111 = 96 MHz USB PLL is selected (input frequency = 48 MHz) 0110 = 96 MHz USB PLL is selected (input frequency = 32 MHz) 0101 = 96 MHz USB PLL is selected (input frequency = 24 MHz) 0100 = 96 MHz USB PLL is selected (input frequency = 20 MHz) 0011 = 96 MHz USB PLL is selected (input frequency = 16 MHz) 0010 = 96 MHz USB PLL is selected (input frequency = 12 MHz) 0001 = 96 MHz USB PLL is selected (input frequency = 8 MHz) 0000 = 96 MHz USB PLL is selected (input frequency = 4 MHz) PLLSS FOSC<4> PLL Secondary Selection Configuration bit This Configuration bit only takes effect when PLL is NOT being used by the system (i.e., selected as the system clock source). 1 = PLL is driven by the primary oscillator 0 = PLL is driven by the FRC oscillator POSCMOD<1:0> FOSC<1:0> Primary Oscillator Configuration bits 11 = Primary oscillator is disabled 10 = HS Oscillator mode is selected (10 MHz-32 MHz) 01 = XT Oscillator mode is selected (3.5 MHz-10 MHz) 00 = EC Oscillator mode is selected RTCBAT FDS<14> VBAT RTCC Operation Select bit 1 = RTCC operation continues when the device is in VBAT mode 0 = RTCC operation stops when the device is in VBAT mode (Reserved) FSIGN<15> Reserved; always maintain as ‘0’ SOSCSEL FOSC<3> SOSC Selection Configuration bit 1 = Crystal (SOSCI/SOSCO) mode 0 = Digital (SCLKI) mode TMPRPIN FDEVOPT1<2> Tamper Pin Disable bit 1 = TMPRN pin function is disabled 0 = TMPRN pin function is enabled WDTCLK<1:0> FWDT<14:13> Watchdog Timer Clock Select bits 11 = Always uses INTOSC/LPRC 10 = Uses FRC when WINDIS = 0, system clock is not INTOSC/LPRC and device is not in Sleep; otherwise, uses INTOSC/LPRC 01 = Uses peripheral clock when system clock is not INTOSC/LPRC and device is not in Sleep; otherwise, uses INTOSC/LPRC 00 = Always use SOSC WDTCMX FWDT<11> WDT Clock MUX Control bit 1 = Enables WDT clock MUX 0 = WDT clock MUX is disabled 2015 Microchip Technology Inc. DS30010073A-page 13 PIC24FJ256GA412/GB412 FAMILY TABLE 2-4: CONFIGURATION BITS FOR PIC24FJ256GA412/GB412 FAMILY DEVICES (CONTINUED) Bit Field Register Description WDTPS<3:0> FWDT<3:0> Watchdog Timer Postscaler bits 1111 = 1:32,768 1110 = 1:16,384 1101 = 1:8,192 1100 = 1:4,096 1011 = 1:2,048 1010 = 1:1,024 1001 = 1:512 1000 = 1:256 0111 = 1:128 0110 = 1:64 0101 = 1:32 0100 = 1:16 0011 = 1:8 0010 = 1:4 0001 = 1:2 0000 = 1:1 WDTWIN<1:0> FWDT<9:8> Watchdog Timer Window Width bits 11 = WDT window is 25% of the WDT period 10 = WDT window is 37.5% of the WDT period 01 = WDT window is 50% of the WDT period 00 = WDT window is 75% of the WDT period WINDIS 2.6.3 FWDT<7> Windowed Watchdog Timer Disable bit 1 = Windowed WDT is disabled 0 = Windowed WDT is enabled ONE-TIME-PROGRAMMABLE (OTP) MEMORY PIC24FJ256GA412/GB412 family devices provide 384 bytes of One-Time Programmable (OTP) memory, located at addresses, 801700h through 8017FEh. This memory can be used for persistent storage of application-specific information that will not be erased by reprogramming the device. This includes many types of information, such as (but not limited to): • • • • • • Application checksums Code revision information Product information Serial numbers System manufacturing dates Manufacturing lot numbers Customer OTP memory may be programmed in any mode, including user RTSP mode, but it cannot be erased. Data is not cleared by a Chip Erase. Do not perform repeated writes on the OTP memory. DS30010073A-page 14 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 3.0 DEVICE PROGRAMMING – ICSP ICSP mode is a special programming protocol that allows you to read and write to device memory. The ICSP mode is the most direct method used to program the device, which is accomplished by applying control codes and instructions serially to the device, using the PGECx and PGEDx pins. ICSP mode also has the ability to read executive memory to determine if the Programming Executive (PE) is present and to write the PE to executive memory if Enhanced ICSP mode will be used. In ICSP mode, the system clock is taken from the PGECx pin, regardless of the device’s Oscillator Configuration bits. All instructions are shifted serially into an internal buffer, then loaded into the Instruction Register (IR) and executed. No program fetching occurs from internal memory. Instructions are fed in 24 bits at a time. PGEDx is used to shift data in, and PGECx is used as both the serial shift clock and the CPU execution clock. Note 1: During ICSP operation, the operating frequency of PGECx must not exceed 5 MHz. 2: ICSP mode is slower than Enhanced ICSP mode for programming. 3.1 Overview of the Programming Process Figure 3-1 illustrates the high-level overview of the programming process. After entering ICSP mode, the first action is to Chip Erase program memory. Next, the code memory is programmed, followed by the device Configuration bits. Code memory (including the Configuration bits) is then verified to ensure that programming was successful. Then, the code-protect Configuration bits are programmed, if required. FIGURE 3-1: HIGH-LEVEL ICSP™ PROGRAMMING FLOW Start Enter ICSP™ Perform Chip Erase Program Memory, Configuration Words and User ID Words Verify Program Memory, Configuration Words and User ID Words Program Code-Protect Configuration bits Exit ICSP End 2015 Microchip Technology Inc. DS30010073A-page 15 PIC24FJ256GA412/GB412 FAMILY 3.2 Entering ICSP Mode The key sequence is a specific 32-bit pattern, ‘0100 1101 0100 0011 0100 1000 0101 0001’ (more easily remembered as 4D434851h in hexadecimal). The device will enter Program/Verify mode only if the sequence is valid. The Most Significant bit (MSb) of the most significant nibble must be shifted in first. As illustrated in Figure 3-2, entering ICSP Program/ Verify mode requires three steps: 1. 2. 3. MCLR is briefly driven high and then low (P21).(1) A 32-bit key sequence is clocked into PGEDx. MCLR is then driven high within a specified period of time, ‘P19’, and held. Once the key sequence is complete, VIH must be applied to MCLR and held at that level for as long as Program/Verify mode is to be maintained. An interval time of at least P19, P7 and P1 * 5 must elapse before presenting data on PGEDx. Signals appearing on PGEDx before P7 has elapsed will not be interpreted as valid. Note 1: If a capacitor is present on the MCLR pin, the high time for entering ICSP mode can vary. The programming voltage applied to MCLR is VIH, which is essentially V DD in the case of PIC24FJ256GA412/GB412 family devices. There is no minimum time requirement for holding at VIH. After VIH is removed, an interval of at least P18 must elapse before presenting the key sequence on PGEDx. FIGURE 3-2: P6 P14 On successful entry, the program memory can be accessed and programmed in serial fashion. While in ICSP mode, all unused I/Os are placed in a high-impedance state. ENTERING ICSP™ MODE P21 P19 MCLR VDD PGEDx P7 P1 * 5 VIH VIH Program/Verify Entry Code = 4D434851h 0 b31 1 b30 0 b29 0 b28 1 b27 ... 0 b3 0 b2 0 b1 1 b0 PGECx P18 P1A P1B DS30010073A-page 16 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 3.3 ICSP Operation 3.3.1 After entering into ICSP mode, the CPU is Idle. Execution of the CPU is governed by an internal state machine. A 4-bit control code is clocked in using PGECx and PGEDx, and this control code is used to command the CPU (see Table 3-1). The SIX control code allows execution of assembly instructions. When the SIX code is received, the CPU is suspended for 24 clock cycles as the instruction is then clocked into the internal buffer. Once the instruction is shifted in, the state machine allows it to be executed over the next four clock cycles. While the received instruction is executed, the state machine simultaneously shifts in the next 4-bit command (see Figure 3-3). The SIX control code is used to send instructions to the CPU for execution and the REGOUT control code is used to read data out of the device through the VISI register. TABLE 3-1: Note 1: Coming out of the ICSP entry sequence, the first 4-bit control code is always forced to SIX and a forced NOP instruction is executed by the CPU. Five additional PGECx clocks are needed on start-up, thereby resulting in a 9-bit SIX command instead of the normal 4-bit SIX command. After the forced SIX is clocked in, ICSP operation resumes as normal (the next 24 clock cycles load the first instruction word to the CPU). See Figure 3-4 for details. CPU CONTROL CODES IN ICSP™ MODE 4-Bit Control Code Mnemonic Description 0000 SIX Shift in 24-bit instruction and execute. 0001 REGOUT Shift out the VISI register. N/A 0010-1111 SIX SERIAL INSTRUCTION EXECUTION Reserved. 2: TBLRDH, TBLRDL, TBLWTH and TBLWTL instructions must be followed by a NOP instruction. FIGURE 3-3: SIX SERIAL EXECUTION P1 1 2 3 4 1 2 3 4 5 6 7 8 1 17 18 19 20 21 22 23 24 2 3 4 PGECx P4 P3 P4a P1A P1B P2 PGEDx 0 0 0 0 LSB X X X X X Execute PC – 1, Fetch SIX Control Code X X X X X X X X X MSB 0 24-Bit Instruction Fetch 0 0 0 Execute 24-Bit Instruction, Fetch Next Control Code PGEDx = Input FIGURE 3-4: PROGRAM ENTRY AFTER RESET P1 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 17 18 19 20 21 22 23 24 1 2 3 4 PGECx P4 P3 P4a P1A P1B P2 PGEDx 0 0 0 0 0 0 0 Execute PC – 1, Fetch SIX Control Code 0 0 LSB X X X X X X X X X X 24-Bit Instruction Fetch X X X X MSB 0 0 0 0 Execute 24-bit Instruction, Fetch Next Control Code PGEDx = Input 2015 Microchip Technology Inc. DS30010073A-page 17 PIC24FJ256GA412/GB412 FAMILY 3.3.2 REGOUT SERIAL INSTRUCTION EXECUTION The REGOUT code is unique because the PGEDx pin is an input when the control code is transmitted to the device. However, after the control code is processed, the PGEDx pin becomes an output as the VISI register is shifted out. The REGOUT control code allows for data to be extracted from the device in ICSP mode. It is used to clock the contents of the VISI register out of the device over the PGEDx pin. After the REGOUT control code is received, the CPU is held Idle for eight cycles. After these eight cycles, an additional 16 cycles are required to clock the data out (see Figure 3-5). FIGURE 3-5: Note: The device will latch input PGEDx data on the rising edge of PGECx and will output data on the PGEDx line on the rising edge of PGECx. For all data transmissions, the Least Significant bit (LSb) is transmitted first. REGOUT SERIAL EXECUTION 1 2 3 4 1 2 7 8 1 2 3 4 6 5 11 12 13 14 15 16 1 2 3 4 PGECx P4 PGEDx 1 0 0 0 Execute Previous Instruction, CPU Held in Idle Fetch REGOUT Control Code PGEDx = Input DS30010073A-page 18 P4a P5 LSb 1 2 3 4 ... 10 11 12 13 14 MSb 0 0 0 0 Shift Out VISI Register<15:0> No Execution Takes Place, Fetch Next Control Code PGEDx = Output PGEDx = Input 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 3.4 Flash Memory Programming in ICSP Mode 3.4.1 PROGRAMMING OPERATIONS Flash memory write/erase operations are controlled by the NVMCON register. Programming is performed by setting NVMCON to select the type of erase operation (Table 3-2) or write operation (Table 3-3) and initiating the programming by setting the WR control bit (NVMCON<15>). In ICSP mode, all programming operations are self-timed. There is an internal delay between the user setting the WR control bit and the automatic clearing of the WR control bit when the programming operation is complete. Refer to Section 10.0 “AC/DC Characteristics and Timing Requirements” for detailed information about the delays associated with various programming operations. TABLE 3-2: NVMCON Value STARTING AND STOPPING A PROGRAMMING CYCLE For protection against accidental operations, the erase/ write initiate sequence must be written to the NVMKEY register to allow any erase or program operation to proceed. The two instructions following the start of the programming sequence should be NOPs. To start an erase or write sequence, the following steps must be completed: 1. 2. 3. 4. Write 55h to the NVMKEY register. Write AAh to the NVMKEY register. Set the WR bit in the NVMCON register. Execute three NOP instructions. All erase and write cycles are self-timed. The WR bit should be polled to determine if the erase or write cycle has been completed. NVMCON ERASE OPERATIONS Erase Operation 400Eh Chip Erase user memory (does not erase Device ID, customer OTP or Program Executive memory). 4003h Erase a page of program or executive memory. 4004h Erase user memory and Configuration Words in the Inactive Partition (Dual Partition modes only). TABLE 3-3: NVMCON Value 3.4.2 NVMCON WRITE OPERATIONS Write Operation 4001h Double-word program operation. 4002h Row programming operation. 2015 Microchip Technology Inc. DS30010073A-page 19 PIC24FJ256GA412/GB412 FAMILY 3.5 Erasing Program Memory FIGURE 3-6: The general procedure for erasing user memory is shown in Figure 3-6. The process for Chip Erase, Page Erase and Inactive Partition Erase are all substantially similar, and are described in Table 3-4 through Table 3-6. The last row of the last page of program memory contains the Flash Configuration Words. Before programming these Words, they must be erased. If they are erased with a Page Erase operation, all other rows in the page will also be erased. Users may want to either avoid using the rest of this page for application code, or ensure that the non-configuration data in the CS page is copied before the erase and reprogrammed afterwards. ERASE FLOW Start Set the WREN bit Write Appropriate Value to NVMCON<3:0> Set the WR bit to Initiate Erase The Configuration Read registers can only be loaded as part of the Reset sequence and cannot be modified at any other time. Delay P11 + P10 Time Note 1: Program memory must be erased before writing any data to program memory. End 2: For Page Erase operations, the NVMADRL/H registers must also be loaded with the address of the page to be erased. TABLE 3-4: SERIAL EXECUTION FOR CHIP ERASE Command (Binary) Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Configure the NVMCON register to perform a Chip Erase. 0000 0000 2400E0 883B00 MOV MOV #0x400E, W0 W0, NVMCON MOV MOV MOV MOV BSET NOP NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W0 W0, NVMKEY NVMCON, #WR Step 3: Set the WR bit. 0000 0000 0000 0000 0000 0000 0000 0000 200550 883B30 200AA0 883B30 A8E761 000000 000000 000000 Step 4: Repeat this step to poll the WR bit until it is cleared by hardware. 0000 0000 0000 0000 0000 0001 0000 0000 DS30010073A-page 20 040200 00000 803B02 883C22 000000 <VISI> 000000 060000 GOTO 0x200 NOP MOV NVMCON, W2 MOV W2, VISI NOP Clock out the contents of the VISI register. NOP RETURN 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY TABLE 3-5: SERIAL EXECUTION FOR PAGE ERASE Command (Binary) Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Set the NVMCON register to erase a page. 0000 0000 240030 883B00 MOV MOV #0x4003, W0 W0, NVMCON Step 3: Load the address of the page to be erased into the NVMADR register pair. 0000 0000 0000 0000 200000 883B10 200000 883B20 MOV MOV MOV MOV #PageAddress<15:0>, W0 W0, NVMADR #PageAddress<24:16>, W0 W0, NVMADRU 200550 883B30 200AA0 883B30 A8E761 000000 000000 000000 MOV MOV MOV MOV BSET NOP NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W0 W0, NVMKEY NVMCON, #WR Step 4: Set the WR bit. 0000 0000 0000 0000 0000 0000 0000 0000 Step 5: Repeat this step to poll the WR bit until it is cleared by hardware. 0000 0000 0000 0000 0000 0001 0000 040200 000000 803B02 883C22 000000 <VISI> 000000 GOTO 0x200 NOP MOV NVMCON, W2 MOV W2, VISI NOP Clock out the contents of the VISI register. NOP Step 6: Clear the WREN bit. 0000 0000 200000 883B00 2015 Microchip Technology Inc. MOV MOV NVMCON, W2 W0, NVMCON DS30010073A-page 21 PIC24FJ256GA412/GB412 FAMILY TABLE 3-6: SERIAL EXECUTION FOR INACTIVE PARTITION ERASE Command (Binary) Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Set the NVMCON register to erase a page. 0000 0000 240040 883B00 MOV MOV #0x4004, W0 W0, NVMCON 200550 883B30 200AA0 883B30 A8E761 000000 000000 000000 MOV MOV MOV MOV BSET NOP NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W0 W0, NVMKEY NVMCON, #WR Step 3: Set the WR bit. 0000 0000 0000 0000 0000 0000 0000 0000 Step 4: Repeat this step to poll the WR bit until it is cleared by hardware. 0000 0000 0000 0000 0000 0001 0000 040200 000000 803B02 883C22 000000 <VISI> 000000 GOTO 0x200 NOP MOV NVMCON, W2 MOV W2, VISI NOP Clock out the contents of the VISI register. NOP Step 5: Clear the WREN bit. 0000 0000 DS30010073A-page 22 200000 883B00 MOV MOV NVMCON, W2 W0, NVMCON 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 3.6 Writing Code Memory Two-word writes program code memory with two instruction words at a time. Two words are loaded into the write latches and the Write Pointer is incremented. Next, the write sequence is initiated, and finally, the WR bit is checked for the sequence to be complete. This process continues for all the data to be programmed. For PIC24FJ256GA412/GB412 devices, there are two methods available for writing to code memory: two-word writes using the write latches or 64-word row writes. Figure 3-7 provides a high-level description of the two methods. FIGURE 3-7: Table 3-7 provides an example of ICSP programming for a two-word write operation. PROGRAM CODE MEMORY FLOW Start Configure Device for Writes Using RAM Row Programming Using Two-Word Programming Load 64 Words into Write Latches Load Two Words into Write Latches Initialize Write Pointer with Row Address (DestinationAddress) Increment Write Pointer Initiate Write Sequence and Poll WR bit to be Cleared No All Data Written? No Yes End 2015 Microchip Technology Inc. DS30010073A-page 23 PIC24FJ256GA412/GB412 FAMILY TABLE 3-7: Command (Binary) SERIAL INSTRUCTION EXECUTION FOR PROGRAMMING CODE MEMORY: TWO-WORD LATCH WRITES Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Initialize the TBLPAG register for writing to the latches. 0000 0000 200FAC 8802AC MOV MOV #0xFA, W12 W12, TBLPAG Step 3: Load W0:W2 with the next two packed instruction words to program. 0000 0000 0000 2xxxx0 2xxxx1 2xxxx2 MOV MOV MOV #<LSW0>, W0 #<MSB1:MSB0>, W1 #<LSW1>, W2 Step 4: Set the Read Pointer (W6) and Write Pointer (W7), and load the (next set of) write latches. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 EB0300 000000 EB0380 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 CLR NOP CLR NOP TBLWTL NOP NOP TBLWTH.B NOP NOP TBLWTH.B NOP NOP TBLWTL.W NOP NOP W6 W7 [W6++], [W7] [W6++], [W7++] [W6++], [++W7] [W6++], [W7++] Step 5: Set the NVMADRU/NVMADR register pair to point to the correct address. 0000 0000 0000 0000 2xxxx3 2xxxx4 883B13 883B24 MOV MOV MOV MOV #DestinationAddress<15:0>, W3 #DestinationAddress<23:16>, W4 W3, NVMADR W4, NVMADRU Step 6: Set the NVMCON register to program two instruction words. 0000 0000 0000 24001A 883B0A 000000 MOV MOV NOP #0x4001, W10 W10, NVMCON MOV MOV MOV MOV BSET NOP NOP NOP #0x55, W1 W1, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR Step 7: Initiate the write cycle. 0000 0000 0000 0000 0000 0000 0000 0000 200551 883B31 200AA1 883B31 A8E761 000000 000000 000000 DS30010073A-page 24 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY TABLE 3-7: Command (Binary) SERIAL INSTRUCTION EXECUTION FOR PROGRAMMING CODE MEMORY: TWO-WORD LATCH WRITES (CONTINUED) Data (Hex) Description Step 8: Wait for program operation to complete and make sure the WR bit is clear. 0000 0000 0000 0001 0000 0000 0000 — 803B00 883C20 000000 <VISI> 000000 040200 000000 — MOV NVMCON, W0 MOV W0, VISI NOP Clock out the contents of the VISI register. NOP GOTO 0x200 NOP Repeat until the WR bit is clear. Step 9: Repeat Steps 3-8 until all code memory is programmed. Step 10: Clear the WREN bit. 0000 0000 803B02 883B00 2015 Microchip Technology Inc. MOV MOV NVMCON, W2 W0, NVMCON DS30010073A-page 25 PIC24FJ256GA412/GB412 FAMILY Row writes program one row (64 instruction words) at a time. First, the Table Pointer is initialized to point to the program latches and data is written into them with Table Writes. Next, the Write Pointer is initialized (NVMADRU and NVMADR register pair) with the row address (DestinationAddress). Finally, the write sequence is initiated and the WR bit is checked for the row programming to be complete. This process is repeated for all data to be programmed. Table 3-8 shows the ICSP programming details for row writes. FIGURE 3-8: To minimize programming time, the data to be programmed is stored in the W0:W5 registers in a packed data format (Figure 3-8). This is the same packed format used by the PE. See Section 6.2.2 “Packed Data Format” for additional information. TABLE 3-8: PACKED INSTRUCTION WORD STORAGE IN W0:W5 15 7 LSW0 W0 W1 MSB1 MSB0 W2 LSW1 W3 LSW2 W4 0 MSB3 W5 MSB2 LSW3 SERIAL INSTRUCTION EXECUTION FOR PROGRAMMING CODE MEMORY: ROW WRITES Command (Binary) Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Set the NVMCON register to program 64 instruction words. 0000 0000 240020 883B00 MOV MOV #0X4002, W0 W0, NVMCON Step 3: Initialize the TBLPAG register for writing to the latches. 0000 0000 200FAC 8802AC MOV MOV #0xFA, W12 W12, TBLPAG Step 4: Load W0:W5 with the next 4 instruction words to program. 0000 0000 0000 0000 0000 0000 DS30010073A-page 26 2xxxx0 2xxxx1 2xxxx2 2xxxx3 2xxxx4 2xxxx5 MOV MOV MOV MOV MOV MOV #<LSW0>, W0 #<MSB1:MSB0>, W1 #<LSW1>, W2 #<LSW2>, W3 #<MSB3:MSB2>, W4 #<LSW3>, W5 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY TABLE 3-8: Command (Binary) SERIAL INSTRUCTION EXECUTION FOR PROGRAMMING CODE MEMORY: ROW WRITES (CONTINUED) Data (Hex) Description Step 5: Set the Read Pointer (W6) and load the (next set of) write latches. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 EB0300 000000 EB0380 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 CLR NOP CLR NOP TBLWTL NOP NOP TBLWTH.B NOP NOP TBLWTH.B NOP NOP TBLWTL NOP NOP TBLWTL NOP NOP TBLWTH.B NOP NOP TBLWTH.B NOP NOP TBLWTL NOP NOP W6 W7 [W6++], [W7] [W6++], [W7++] [W6++], [++W7] [W6++], [W7++] [W6++], [W7] [W6++], [W7++] [W6++], [++W7] [W6++], [W7++] Step 6: Repeat Steps 4 and 5, for a total of 16 times, to load the write latches with 64 instructions. Step 7: Set the NVMADRU/NVMADR register pair to point to the correct address. 0000 0000 0000 0000 2xxxx3 2xxxx4 883B13 883B24 MOV MOV MOV MOV #DestinationAddress<15:0>, W3 #DestinationAddress<23:16>, W4 W3, NVMADR W4, NVMADRU Step 8: Execute the WR bit unlock sequence and initiate the write cycle. 0000 0000 0000 0000 0000 0000 0000 0000 200550 883B30 200AA0 883B30 A8E761 000000 000000 000000 MOV MOV MOV MOV BSET NOP NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W0 W0, NVMKEY NVMCON, #WR Step 9: Repeat this step to poll the WR bit until it is cleared by hardware. 0000 0000 0000 0000 0000 0001 0000 040200 000000 803B02 883C22 000000 <VISI> 000000 2015 Microchip Technology Inc. GOTO 0x200 NOP MOV NVMCON, W2 MOV W2, VISI NOP Clock out the contents of the VISI register. NOP DS30010073A-page 27 PIC24FJ256GA412/GB412 FAMILY TABLE 3-8: SERIAL INSTRUCTION EXECUTION FOR PROGRAMMING CODE MEMORY: ROW WRITES (CONTINUED) Command (Binary) Data (Hex) Description Step 10: Reset the device’s internal Program Counter. 0000 0000 040200 000000 GOTO NOP 0x200 Step 11: Repeat Steps 3 through 9 until all code memory is programmed. Step 12: Clear the WREN bit. 0000 0000 DS30010073A-page 28 803B02 883B00 MOV MOV NVMCON, W2 W0, NVMCON 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 3.7 Writing Configuration Bits The procedure for writing Configuration bits is similar to the procedure for writing code memory. Table 3-9 shows the ICSP programming details for writing the Configuration bits. For all Configuration Words, except FBTSEQ, only the lower two bytes of the Word contain configuration data; the upper byte is unused. It is recommended that the upper byte be programmed with FFFFh, as indicated in Step 3 (see Table 3-9). FBTSEQ (implemented only in Dual Partition modes) uses all 24 bits of the program memory’s width to store the Boot Sequence Number bits, BSEQ<11:0> (FBTSEQ<11:0>), and their one’s complement, IBSEQ<11:0> (FBTSEQ<23:12>). To change the values of the Configuration bits once they have been programmed, the device must be erased, as described in Section 3.5 “Erasing Program Memory”, and reprogrammed to the desired value. Note that it is only possible to program a Configuration bit from ‘1’ to ‘0’ to enable code protection; it is not possible to program it from ‘0’ to ‘1’. The Flash page on which the Configuration Segment resides is shared with the General Segment. To erase and rewrite the Configuration bits, the entire page must be erased. To avoid losing data held in the General Segment: 1. 2. 3. Copy the page to RAM. Update the RAM copy with the Configuration bit values. Write back the data to the Flash page. new Alternatively, avoid use of the portion of this Flash page used by the General Segment. TABLE 3-9: Command (Binary) SERIAL INSTRUCTION EXECUTION FOR PROGRAMMING CONFIGURATION WORDS: TWO-WORD LATCH WRITES Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Initialize the TBLPAG register for writing to the latches. 0000 0000 200FAC 8802AC MOV MOV #0xFA, W12 W12, TBLPAG Step 3: Load W0:W1 with the next two Configuration Words to program. 0000 — 0000 0000 2xxxx0 — 2xxxx1 2FFFF2 MOV #<LSW0>, W0 Upper word is 0xFFFF for all Configuration Words except FBTSEQ. MOV #<MSB1:MSB0>, W1 MOV #<LSW1>, W2 Step 4: Set the Read Pointer (W6) and Write Pointer (W7), and load the (next set of) write latches. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 EB0300 000000 EB0380 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 2015 Microchip Technology Inc. CLR NOP CLR NOP TBLWTL NOP NOP TBLWTH.B NOP NOP TBLWTH.B NOP NOP TBLWTL.W NOP NOP W6 W7 [W6++], [W7] [W6++], [W7++] [W6++], [++W7] [W6++], [W7++] DS30010073A-page 29 PIC24FJ256GA412/GB412 FAMILY TABLE 3-9: Command (Binary) SERIAL INSTRUCTION EXECUTION FOR PROGRAMMING CONFIGURATION WORDS: TWO-WORD LATCH WRITES (CONTINUED) Data (Hex) Description Step 5: Set the NVMADRU/NVMADR register pair to point to the correct address. 0000 0000 0000 0000 2xxxx3 2xxxx4 883B13 883B24 MOV MOV MOV MOV #DestinationAddress<15:0>, W3 #DestinationAddress<23:16>, W4 W3, NVMADR W4, NVMADRU Step 6: Set the NVMCON register to program two instruction words. 0000 0000 0000 24001A 883B0A 000000 MOV MOV NOP #0x4001, W10 W10, NVMCON MOV MOV MOV MOV BSET NOP NOP NOP #0x55, W1 W1, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR Step 7: Initiate the write cycle. 0000 0000 0000 0000 0000 0000 0000 0000 200551 883B31 200AA1 883B31 A8E761 000000 000000 000000 Step 8: Wait for program operation to complete and make sure the WR bit is clear. 0000 0000 0000 0001 0000 0000 0000 — 803B00 883C20 000000 <VISI> 000000 040200 000000 — MOV NVMCON, W0 MOV W0, VISI NOP Clock out the contents of the VISI register. NOP GOTO 0x200 NOP Repeat until the WR bit is clear. Step 9: Repeat Steps 3-8 until all code memory is programmed. Step 10: Clear the WREN bit. 0000 0000 803B02 883B00 DS30010073A-page 30 MOV MOV NVMCON, W2 W0, NVMCON 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 3.8 Reading Code Memory 3.9 Reading from code memory is performed by executing a series of TBLRD instructions and clocking out the data using the REGOUT command. Table 3-10 shows the ICSP programming details for reading code memory. Reading Configuration Words The procedure for reading Configuration Words is identical to the procedure for reading code memory, shown in Table 3-10. Since there are multiple Configuration Words, they are read one at a time. To minimize reading time, the same packed data format that the PE uses is utilized. See Section 6.2 “Programming Executive Commands” for more details on the packed data format. TABLE 3-10: Command (Binary) SERIAL INSTRUCTION EXECUTION FOR READING CODE MEMORY Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Initialize the Write Pointer (W7) to point to the VISI register. 0000 0000 207847 000000 MOV NOP #VISI, W7 Step 3: Initialize the TBLPAG register and the Read Pointer (W6) for the TBLRD instruction. 0000 0000 0000 200xx0 8802A0 2xxxx6 MOV MOV MOV #<SourceAddress23:16>, W0 W0, TBLPAG #<SourceAddress15:0>, W6 Step 4: Read and clock out the contents of the next two locations of code memory, through the VISI register, using the REGOUT command. 0000 0000 0000 0001 0000 0000 0000 0000 0000 0000 0000 0001 0000 0000 0000 0000 0001 0000 BA0B96 000000 000000 <VISI> 000000 BADBB6 000000 000000 BAD3D6 000000 000000 <VISI> 000000 BA0BB6 000000 000000 <VISI> 000000 TBLRDL [W6], [W7] NOP NOP Clock out the contents of the VISI register. NOP TBLRDH.B [W6++], [W7++] NOP NOP TBLRDH.B [++W6], [W7--] NOP NOP Clock out the contents of the VISI register. NOP TBLRDL [W6++], [W7] NOP NOP Clock out the contents of the VISI register. NOP Step 5: Reset the device’s internal Program Counter. 0000 0000 040200 000000 GOTO NOP 0x200 Step 6: Repeat Steps 3 through 5 until all desired code memory is read (note that “Reset the device’s internal Program Counter” will be Step 5). 2015 Microchip Technology Inc. DS30010073A-page 31 PIC24FJ256GA412/GB412 FAMILY 3.10 Verify Code Memory and Configuration Bits The verify step involves reading back the code memory space and comparing it against the copy held in the programmer’s buffer. The Configuration Words are verified with the rest of the code. The verify process is illustrated in Figure 3-9. The lower word of the instruction is read, and then the lower byte of the upper word is read and compared against the instruction stored in the programmer’s buffer. Refer to Section 3.8 “Reading Code Memory” for implementation details of reading code memory. Note: Because the Configuration bytes include the device code protection bit, code memory should be verified immediately after writing if the code protection is to be enabled. This is because the device will not be readable or verifiable if a device Reset occurs after the code-protect bit has been cleared. 3.11 Exiting ICSP Mode Exiting Program/Verify mode is done by removing VIH from MCLR, as illustrated in Figure 3-10. The only requirement for exit is that an interval, P16, should elapse between the last clock, and program signals on PGECx and PGEDx, before removing VIH. FIGURE 3-10: EXITING ICSP™ MODE P16 P17 VIH MCLR VDD VIH PGEDx PGECx PGEDx = Input FIGURE 3-9: VERIFY CODE MEMORY FLOW Start Set TBLPTR = 0 Read Low Word with Post-Increment Read High Byte with Post-Increment Does Instruction Word = Expected Data? No Yes No All Code Memory Verified? Yes End DS30010073A-page 32 Failure Report Error 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 4.0 DEVICE PROGRAMMING – ENHANCED ICSP This section discusses programming the device through Enhanced ICSP and the Programming Executive (PE). The PE resides in executive memory (separate from code memory) and is executed when Enhanced ICSP Programming mode is entered. The PE provides the mechanism for the programmer (host device) to program and verify the PIC24FJ256GA412/ GB412 family devices, using a simple command set and communication protocol. There are several basic functions provided by the PE: • • • • Read Memory Erase Memory Program Memory Blank Check The PE performs the low-level tasks required for erasing, programming and verifying a device. This allows the programmer to program the device by issuing the appropriate commands and data. A detailed description for each command is provided in Section 6.2 “Programming Executive Commands”. Note: The PE uses the device’s data RAM for variable storage and program execution. After running the PE, no assumptions should be made about the contents of data RAM. 4.1 Overview of the Programming Process Figure 4-1 shows the high-level overview of the programming process. First, it must be determined if the PE is present in executive memory, and then, Enhanced ICSP mode is entered. The program memory is then erased, and the program memory and Configuration Words are programmed and verified. Last, the code-protect Configuration bits are programmed (if required) and Enhanced ICSP mode is exited. FIGURE 4-1: HIGH-LEVEL ENHANCED ICSP™ PROGRAMMING FLOW Start Confirm Presence of Programming Executive Enter Enhanced ICSP™ mode Erase Program Memory Program Memory, Configuration Words and User ID Words Verify Program Memory, Configuration Words and User ID Words Program Code-Protect Configuration bits Exit Enhanced ICSP End 2015 Microchip Technology Inc. DS30010073A-page 33 PIC24FJ256GA412/GB412 FAMILY 4.2 Confirming the Presence of the Programming Executive Before programming, the programmer must confirm that the PE is stored in executive memory. The procedure for this task is illustrated in Figure 4-2. First, ICSP mode is entered. Then, the unique Application ID Word, stored in executive memory, is read. If the Application ID has the value, E0h, the Programming Executive is resident in memory and the device can be programmed. However, if the Application ID Word is not present, the PE must be programmed to executive code memory using the method described in Section 5.0 “Programming the Programming Executive to Memory”. Section 3.0 “Device Programming – ICSP” describes the ICSP programming method. Section 4.3 “Reading the Application ID Word” describes the procedure for reading the Application ID Word in ICSP mode. FIGURE 4-2: CONFIRMING PRESENCE OF PROGRAMMING EXECUTIVE Start Enter ICSP™ mode Check the Application ID by Reading Address 800BFEh Is Content = E0h? Yes No Prog. Executive must be Programmed Exit ICSP mode Enter Enhanced ICSP mode Sanity Check End DS30010073A-page 34 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 4.3 Reading the Application ID Word The Application ID Word is stored at address, 800FF0h, in executive code memory. To read this memory location, you must use the SIX control code to move this program memory location to the VISI register. Then, the REGOUT control code must be used to clock the contents of the VISI register out of the device. The corresponding control and instruction codes that must be serially transmitted to the device to perform this operation are shown in Table 4-1. TABLE 4-1: Command (Binary) If the Application ID has the value, 0Eh, the Programming Executive is resident in memory and the device can be programmed using the mechanism described in this section. However, if the Application ID has any other value, the PE is not resident in memory; it must be loaded to memory before the device can be programmed. The procedure for loading the PE to memory is described in Section 5.0 “Programming the Programming Executive to Memory”. SERIAL INSTRUCTION EXECUTION FOR READING THE APPLICATION ID WORD Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Initialize the TBLPAG register and the Read Pointer (W0) for the TBLRD instruction. 0000 0000 0000 0000 0000 0000 0000 0000 0000 200800 8802A0 20FF00 207841 000000 BA0890 000000 000000 000000 MOV MOV MOV MOV NOP TBLRDL NOP NOP NOP #0x80, W0 W0, TBLPAG #0xFF0, W0 #VISI, W1 [W0], [W1] Step 3: Output the VISI register using the REGOUT command. 0001 <VISI> 2015 Microchip Technology Inc. Clock out the contents of the VISI register. DS30010073A-page 35 PIC24FJ256GA412/GB412 FAMILY 4.4 Entering Enhanced ICSP Mode As illustrated in Figure 4-3, entering Enhanced ICSP Program/Verify mode requires three steps: 1. 2. 3. The MCLR pin is briefly driven high and then low. A 32-bit key sequence is clocked into PGEDx. MCLR is then driven high within a specified period of time and held. The programming voltage applied to MCLR is VIH, which is essentially VDD in PIC24FJ256GA412/GB412 family devices. There is no minimum time requirement for holding at VIH. After VIH is removed, an interval of at least P18 must elapse before presenting the key sequence on PGEDx. The key sequence is a specific 32-bit pattern, ‘0100 1101 0100 0011 0100 1000 0101 0000’ (more easily remembered as 4D434850h in hexadecimal format). The device will enter Program/Verify mode only if the key sequence is valid. The Most Significant bit (MSb) of the most significant nibble must be shifted in first. On successful entry, the program memory can be accessed and programmed in serial fashion. While in the Program/Verify mode, all unused I/Os are placed in the high-impedance state. 4.5 Blank Check The term, “Blank Check”, implies verifying that the device has been successfully erased and has no programmed memory locations. A blank or erased memory location is always read as ‘1’. The Device ID registers (FF0000h:FF0002h) can be ignored by the Blank Check, since this region stores device information that cannot be erased. Additionally, all unimplemented memory space should be ignored by the Blank Check. The QBLANK command is used for the Blank Check. It determines if the code memory is erased by testing these memory regions. A ‘BLANK’ or ‘NOT BLANK’ response is returned. If it is determined that the device is not blank, it must be erased before attempting to program the chip. Once the key sequence is complete, VIH must be applied to MCLR and held at that level for as long as Program/Verify mode is to be maintained. An interval time of at least P19, P7 and P1 * 5 must elapse before presenting data on PGEDx. Signals appearing on PGEDx before P7 has elapsed will not be interpreted as valid. FIGURE 4-3: P6 P14 ENTERING ENHANCED ICSP™ MODE P21 P19 MCLR VDD PGEDx P7 P1 * 5 VIH VIH Program/Verify Entry Code = 4D434850h 0 b31 1 b30 0 b29 0 b28 1 ... b27 0 b3 0 b2 0 b1 0 b0 PGECx P18 DS30010073A-page 36 P1A P1B 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 4.6 4.6.1 Code Memory Programming PROGRAMMING METHODOLOGY There are two commands that can be used for programming code memory when utilizing the PE. The PROG2W command programs and verifies two 24-bit instruction words into the program memory, starting at the address specified. The second and faster command, PROGP, allows up to 64 instruction words (each 24 bits) to be programmed and verified into program memory, starting at the address specified. See Section 6.0 “The Programming Executive” for a full description of each of these commands. FIGURE 4-4: Figure 4-4 and Figure 4-5 show the programming methodology for the PROG2W and PROGP commands. In both instances, 87552 instruction words of the device are programmed. Note: If a bootloader needs to be programmed, its code must not be programmed into the first page of code memory. For example, if a bootloader located at address, 200h, attempts to erase the first page, it would inadvertently erase itself. Instead, program the bootloader into the second page (e.g., 400h). FIGURE 4-5: FLOWCHART FOR DOUBLE-WORD PROGRAMMING FLOWCHART FOR MULTIPLE WORD PROGRAMMING Start Start BaseAddress = 0h RemainingCmds = 684 BaseAddress = 0h RemainingCmds = 43776 Send PROGP Command to Program BaseAddress Send PROG2W Command to Program BaseAddress Is PROG2W Response PASS? Is PROGP response PASS? No Yes Yes RemainingCmds = RemainingCmds – 1 RemainingCmds = RemainingCmds – 1 BaseAddress = BaseAddress + 100h BaseAddress = BaseAddress + 04h No No No Is RemainingCmds ‘0’? Yes Yes End 2015 Microchip Technology Inc. Is RemainingCmds ‘0’? Failure Report Error End Failure Report Error DS30010073A-page 37 PIC24FJ256GA412/GB412 FAMILY 4.7 Configuration Bit Programming 4.8 Programming Verification Configuration bits are programmed one at a time using the PROG2W command. This command specifies the configuration data and address. When Configuration bits are programmed, any unimplemented bits must be programmed with a ‘1’. After code memory is programmed, the contents of memory can be verified to ensure that programming was successful. Verification requires code memory to be read back and compared against the copy held in the programmer’s buffer. Multiple PROG2W commands are required to program all Configuration bits. A flowchart for Configuration bit programming is shown in Figure 4-6. The READP command can be used to read back all the programmed code memory and Configuration Words. FIGURE 4-6: CONFIGURATION BIT PROGRAMMING FLOW Alternatively, you can have the programmer perform the verification after the entire device is programmed using a checksum computation. See Section 9.0 “Checksum Computation” for more information on calculating the checksum. Start 4.9 Exiting Enhanced ICSP Mode Exiting Program/Verify mode is done by removing VIH from MCLR, as illustrated in Figure 4-7. The only requirement for exit is that an interval, P16, should elapse between the last clock, and program signals on PGECx and PGEDx before removing VIH. Send PROG2W Command Is PROG2W Response PASS? FIGURE 4-7: No EXITING ENHANCED ICSP™ MODE P16 P17 VIH Yes MCLR ConfigAddress = ConfigAddress + 04h No Last Configuration Byte? VDD VIH PGEDx Yes End Failure Report Error PGECx PGEDx = Input DS30010073A-page 38 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 5.0 Note: 5.1 PROGRAMMING THE PROGRAMMING EXECUTIVE TO MEMORY The Programming Executive (PE) can be obtained from each device page on the Microchip web site: www.microchip.com. Overview 5.2 Erasing Executive Memory Executive memory is erased by a series of Page Erase operations, as shown in Figure 5-2. This consists of several cycles of setting NVMCON to 400Eh, executing the programming cycle and repeating these steps for each page of executive memory. Table 5-1 illustrates the ICSP programming process for Chip Erasing memory. Note: If it is determined that the PE is not present in executive memory (as described in Section 4.2 “Confirming the Presence of the Programming Executive”), the PE must be programmed to executive memory. The PE must always be erased before it is programmed, as shown in Figure 5-1. FIGURE 5-2: Figure 5-1 shows the high-level process of programming the PE into executive memory. First, ICSP mode must be entered, and executive memory and user memory are erased; then, the PE is programmed and verified. Finally, ICSP mode is exited. FIGURE 5-1: PAGE ERASE FLOW Start i=4 Address = 800000h HIGH-LEVEL PROGRAMMING EXECUTIVE PROGRAM FLOW Start Write 4003h to NVMCON Set WR bit to Initiate Erase Address = Address + 512 Enter ICSP™ mode Delay P11 + P10 Erase Memory i=i–1 Program the Programming Executive Read/Verify the Programming Executive N i = 0? Y Exit ICSP mode End End 2015 Microchip Technology Inc. DS30010073A-page 39 PIC24FJ256GA412/GB412 FAMILY TABLE 5-1: SERIAL INSTRUCTION EXECUTION FOR ERASING EXECUTIVE MEMORY Command (Binary) Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 0000 000000 040200 000000 000000 NOP GOTO NOP NOP 0x200 Step 2: Set the NVMCON register to erase a page. 0000 0000 240030 883B00 MOV MOV #0x4003, W0 W0, NVMCON Step 3: Load the address of the page to be erased into the NVMADR register pair. 0000 0000 0000 0000 200004 883B14 200800 883B20 MOV MOV MOV MOV #0000, W4 W4, NVMADR #0080, W0 W0, NVMADRU MOV MOV MOV MOV BSET NOP NOP NOP #0x55, W0 W0, NVMKEY #0xAA, W0 W0, NVMKEY NVMCON, #WR Step 4: Set the WR bit. 0000 0000 0000 0000 0000 0000 0000 0000 200550 883B30 200AA0 883B30 A8E761 000000 000000 000000 Step 5: Repeat this step to poll the WR bit until it is cleared by hardware. 0000 0000 0000 0000 0000 0001 0000 040200 000000 803B02 883C22 000000 <VISI> 000000 GOTO 0x200 NOP MOV NVMCON, W2 MOV W2, VISI NOP Clock out the contents of the VISI register. NOP Step 6: Increment W4 by 1024 (400h). 0000 0000 0000 204003 418204 883B24 MOV ADD MOV #0x400, W3 W3, W4, W4 W4, NVMADRU Step 7: Repeat Steps 4-6 until the entire test memory has been erased. Step 8: Clear the WREN bit. 0000 0000 803B02 883B00 DS30010073A-page 40 MOV MOV NVMCON, W2 W0, NVMCON 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 5.3 Program the Programming Executive Storing the PE to executive memory is similar to normal programming of code memory. The executive memory must first be erased, and then programmed, using either two-word writes (two instruction words) or row writes (64 instruction words). The control flow for both methods is identical to that for programming code memory, as shown in Figure 3-7. TABLE 5-2: Command (Binary) Table 5-2 and Table 5-3 illustrate the ICSP programming processes for PE memory. To minimize programming time, the same packed data format that the PE uses is utilized. See Section 6.2 “Programming Executive Commands” for more details on the packed data format. PROGRAMMING THE PROGRAMMING EXECUTIVE (TWO-WORD LATCH WRITES) Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Initialize the TBLPAG register for writing to the latches. 0000 0000 200FAC 8802AC MOV MOV #0xFA, W12 W12, TBLPAG Step 3: Load W0:W2 with the next two packed instruction words to program. 0000 0000 0000 2xxxx0 2xxxx1 2xxxx2 MOV MOV MOV #<LSW0>, W0 #<MSB1:MSB0>, W1 #<LSW1>, W2 Step 4: Set the Read Pointer (W6) and the Write Pointer (W7), and load the write latches. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 EB0300 000000 EB0380 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 CLR NOP CLR NOP TBLWTL NOP NOP TBLWTH.B NOP NOP TBLWTH.B NOP NOP TBLWTL.W NOP NOP W6 W7 [W6++], [W7] [W6++], [W7++] [W6++], [++W7] [W6++], [W7++] Step 5: Set the NVMADRU/NVMADR register pair to point to the correct row. 0000 0000 0000 0000 2xxxx3 2xxxx4 883B13 883B24 MOV MOV MOV MOV #DestinationAddress<15:0>, W3 #DestinationAddress<23:16>, W4 W3, NVMADR W4, NVMADRU Step 6: Set the NVMCON register to program two instruction words. 0000 0000 0000 0000 0000 24001A 000000 883B0A 000000 000000 2015 Microchip Technology Inc. MOV NOP MOV NOP NOP #0x4001, W10 W10, NVMCON DS30010073A-page 41 PIC24FJ256GA412/GB412 FAMILY TABLE 5-2: PROGRAMMING THE PROGRAMMING EXECUTIVE (TWO-WORD LATCH WRITES) (CONTINUED) Command (Binary) Data (Hex) Description Step 7: Initiate the write cycle. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 200551 883B31 200AA1 883B31 A8E761 000000 000000 000000 000000 000000 MOV MOV MOV MOV BSET NOP NOP NOP NOP NOP #0x55, W1 W1, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR Step 8: Wait for program operation to complete and make sure the WR bit is clear. 0000 0000 0000 0000 0000 0001 0000 0000 0000 — 000000 803B00 000000 883C20 000000 <VISI> 000000 040200 000000 — NOP MOV NVMCON, W0 NOP MOV W0, VISI NOP Clock out the contents of the VISI register. NOP GOTO 0x200 NOP Repeat until the WR bit is clear. Step 9: Repeat Steps 3-8 until all code memory is programmed. Step 10: Clear the WREN bit. 0000 0000 803B02 883B00 DS30010073A-page 42 MOV MOV NVMCON, W2 W0, NVMCON 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY TABLE 5-3: Command (Binary) PROGRAMMING THE PROGRAMMING EXECUTIVE (ROW WRITES) Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Set the NVMCON register to program 64 instruction words. 0000 0000 240020 883B00 MOV MOV #0x4002, W0 W0, NVMCON Step 3: Initialize the TBLPAG register for writing to the latches. 0000 0000 200FAC 8802AC MOV MOV #0xFA, W12 W12, TBLPAG Step 4: Load W0:W5 with the next 4 instruction words to program. 0000 0000 0000 0000 0000 0000 2xxxx0 2xxxx1 2xxxx2 2xxxx3 2xxxx4 2xxxx5 MOV MOV MOV MOV MOV MOV #<LSW0>, W0 #<MSB1:MSB0>, W1 #<LSW1>, W2 #<LSW2>, W3 #<MSB3:MSB2>, W4 #<LSW3>, W5 Step 5: Set the Read Pointer (W6) and load the (next set of) write latches. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 EB0300 000000 EB0380 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 BB0BB6 000000 000000 BBDBB6 000000 000000 BBEBB6 000000 000000 BB1BB6 000000 000000 CLR NOP CLR NOP TBLWTL NOP NOP TBLWTH.B NOP NOP TBLWTL NOP NOP TBLWTL NOP NOP TBLWTH.B NOP NOP TBLWTH.B NOP NOP TBLWTL NOP NOP W6 W7 [W6++], [W7] [W6++], [++W7] [W6++], [W7++] [W6++], [W7] [W6++], [W7++] [W6++], [++W7] [W6++], [W7++] Step 6: Repeat Steps 4 and 5, for a total of 16 times, to load the write latches with 64 instructions. Step 7: Set the NVMADRU/NVMADR register pair to point to the correct address. 0000 0000 0000 0000 2xxxx3 2xxxx4 883B13 883B24 2015 Microchip Technology Inc. MOV MOV MOV MOV #DestinationAddress<15:0>, W3 #DestinationAddress<23:16>, W4 W3, NVMADR W4, NVMADRU DS30010073A-page 43 PIC24FJ256GA412/GB412 FAMILY TABLE 5-3: PROGRAMMING THE PROGRAMMING EXECUTIVE (ROW WRITES) (CONTINUED) Command (Binary) Data (Hex) Description Step 8: Execute the WR bit unlock sequence and initiate the write cycle. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 200551 883B31 200AA1 883B31 A8E761 000000 000000 000000 000000 000000 MOV MOV MOV MOV BSET NOP NOP NOP NOP NOP #0x55, W1 W1, NVMKEY #0xAA, W1 W1, NVMKEY NVMCON, #WR Step 9: Repeat this step to poll the WR bit until it is cleared by hardware. 0000 0000 0000 0000 0000 0001 0000 040200 000000 803B00 883C20 000000 <VISI> 000000 GOTO 0x200 NOP MOV NVMCON, W0 MOV W0, VISI NOP Clock out the contents of the VISI register. NOP Step 10: Reset the device’s internal Program Counter. 0000 0000 040200 000000 GOTO NOP 0x200 Step 11: Repeat Steps 3 through 9 until all code memory is programmed. Step 12: Clear the WREN bit. 0000 0000 803B02 883B00 DS30010073A-page 44 MOV MOV NVMCON, W2 W0, NVMCON 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 5.4 Reading Executive Memory To minimize reading time, the same packed data format that the PE uses is utilized. See Section 6.2 “Programming Executive Commands” for more details on the packed data format. Reading from executive memory is performed by executing a series of TBLRD instructions and clocking out the data using the REGOUT command. Table 5-4 shows the ICSP programming details for reading executive memory. TABLE 5-4: Command (Binary) SERIAL EXECUTION FOR READING EXECUTIVE MEMORY Data (Hex) Description Step 1: Exit the Reset vector. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 2: Initialize the TBLPAG register and the Read Pointer (W6) for the TBLRD instruction. 0000 0000 0000 200xx0 8802A0 2xxxx6 MOV MOV MOV #<SourceAddress23:16>, W0 W0, TBLPAG #<SourceAddress15:0>, W6 Step 3: Initialize the Write Pointer (W7) and store the next four locations of code memory in W0:W5. 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 EB0380 000000 BA1B96 000000 000000 BADBB6 000000 000000 BADBD6 000000 000000 BA1BB6 000000 000000 BA1B96 000000 000000 BADBB6 000000 000000 BADBD6 000000 000000 BA0BB6 000000 000000 2015 Microchip Technology Inc. CLR NOP TBLRDL NOP NOP TBLRDH.B NOP NOP TBLRDH.B NOP NOP TBLRDL NOP NOP TBLRDL NOP NOP TBLRDH.B NOP NOP TBLRDH.B NOP NOP TBLRDL NOP NOP W7 [W6], [W7++] [W6++], [W7++] [++W6], [W7++] [W6++], [W7++] [W6], [W7++] [W6++], [W7++] [++W6], [W7++] [W6++], [W7] DS30010073A-page 45 PIC24FJ256GA412/GB412 FAMILY TABLE 5-4: SERIAL EXECUTION FOR READING EXECUTIVE MEMORY (CONTINUED) Command (Binary) Data (Hex) Description Step 4: Output W0:W5 using the VISI register and the REGOUT command. 0000 0000 0001 0000 0000 0000 0001 0000 0000 0000 0001 0000 0000 0000 0001 0000 0000 0000 0001 0000 0000 0000 0001 0000 883C20 000000 <VISI> 000000 883C21 000000 <VISI> 000000 883C22 000000 <VISI> 000000 883C23 000000 <VISI> 000000 883C24 000000 <VISI> 000000 883C25 000000 <VISI> 000000 MOV W0, VISI NOP Clock out the contents of the VISI register. NOP MOV W1, VISI NOP Clock out the contents of the VISI register. NOP MOV W2, VISI NOP Clock out the contents of the VISI register. NOP MOV W3, VISI NOP Clock out the contents of the VISI register. NOP MOV W4, VISI NOP Clock out the contents of the VISI register. NOP MOV W5, VISI NOP Clock out the contents of the VISI register. NOP Step 5: Reset the device’s internal Program Counter. 0000 0000 0000 000000 040200 000000 NOP GOTO NOP 0x200 Step 6: Repeat Steps 3 through 5 until all desired code memory is read (note that “Reset the device’s internal Program Counter” will be Step 5). DS30010073A-page 46 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 5.5 Verify Programming Executive FIGURE 5-3: The verify step involves reading back the executive memory space and comparing it against the copy held in the programmer’s buffer. VERIFY PROGRAMMING EXECUTIVE MEMORY FLOW Start The verify process is illustrated in Figure 5-3. The lower word of the instruction is read, and then the lower byte of the upper word is read and compared against the instruction stored in the programmer’s buffer. Refer to Section 5.4 “Reading Executive Memory” for implementation details of reading executive memory. Set TBLPTR = 0 Read Low Word with Post-Increment Read High Byte with Post-Increment Does Instruction Word = Expected Data? No Yes No All Executive Memory Verified? Yes End 2015 Microchip Technology Inc. Failure Report Error DS30010073A-page 47 PIC24FJ256GA412/GB412 FAMILY 6.0 THE PROGRAMMING EXECUTIVE 6.1 Programming Executive Communication FIGURE 6-1: P1 1 The programmer and PE have a master-slave relationship, where the programmer is the master programming device and the PE is the slave. 4 5 6 11 12 13 14 15 16 P3 P2 PGEDx MSb 14 13 12 11 ... 5 4 3 2 1 LSb After the PE has processed the command, it brings PGEDx low (P9b) to indicate to the programmer that the response is available to be clocked out. The programmer can begin to clock out the response after a maximum wait (P9b) and it must provide the necessary amount of clock pulses to receive the entire response from the PE. After the entire response is clocked out, the programmer should terminate the clock on PGECx until it is time to send another command to the PE. This protocol is illustrated in Figure 6-2. The ICSP/Enhanced ICSP interface is a 2-wire SPI, implemented using the PGECx and PGEDx pins. The PGECx pin is used as a clock input pin and the clock source must be provided by the programmer. The PGEDx pin is used for sending command data to and receiving response data from the PE. 6.1.2 SPI RATE In Enhanced ICSP mode, PIC24FJ256GA412/GB412 family devices operate from the Fast Internal RC Oscillator (FRC), which has a nominal frequency of 8 MHz. This oscillator frequency yields an effective system clock frequency of 4 MHz. To ensure that the programmer does not clock too fast, it is recommended that a 2 MHz clock be provided by the programmer. For Enhanced ICSP, all serial data is transmitted on the falling edge of PGECx and latched on the rising edge of PGECx. All data transmissions are sent to the MSb first using 16-bit mode (see Figure 6-1). Since a 2-wire SPI is used, and data transmissions are bidirectional, a simple protocol is used to control the direction of PGEDx. When the programmer completes a command transmission, it releases the PGEDx line and allows the PE to drive this line high. The PE keeps the PGEDx line high to indicate that it is processing the command. FIGURE 6-2: 3 P1B COMMUNICATION INTERFACE AND PROTOCOL Note: 2 PGECx P1A All communication is initiated by the programmer in the form of a command. Only one command at a time can be sent to the PE. In turn, the PE only sends one response to the programmer after receiving and processing a command. The PE command set is described in Section 6.2 “Programming Executive Commands”. The response set is described in Section 6.3 “Programming Executive Responses”. 6.1.1 PROGRAMMING EXECUTIVE SERIAL TIMING PROGRAMMING EXECUTIVE – PROGRAMMER COMMUNICATION PROTOCOL Host Transmits Last Command Word 1 2 Programming Executive Processes Command 15 16 Host Clocks Out Response 1 2 15 16 1 2 15 16 PGECx PGEDx MSB X X X LSB P8 PGECx = Input PGEDx = Input Note 1: 1 0 P9a P9b PGECx = Input (Idle) PGEDx = Output MSB X X X LSB MSB X X X LSB PGECx = Input PGEDx = Output A delay of 25 ms is required between commands. DS30010073A-page 48 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 6.1.3 TIME-OUTS 6.2.1 The PE uses no Watchdog Timer or time-out for transmitting responses to the programmer. If the programmer does not follow the flow control mechanism, using PGECx as described in Section 6.1.1 “Communication Interface and Protocol”, it is possible that the PE will behave unexpectedly while trying to send a response to the programmer. Since the PE has no time-out, it is imperative that the programmer correctly follow the described communication protocol. As a safety measure, the programmer should use the command time-outs identified in Table 6-1. If the command time-out expires, the programmer should reset the PE and start programming the device again. 6.2 FIGURE 6-3: 15 COMMAND FORMAT 12 11 0 Opcode Length Command Data First Word (if required) • • Command Data Last Word (if required) The PE command set is shown in Table 6-1. This table contains the opcode, mnemonic, length, time-out and description for each command. Functional details on each command are provided in the command descriptions (Section 6.2.4 “Command Descriptions”). Opcode All PE commands have a general format, consisting of a 16-bit header and any required data for the command (see Figure 6-3). The 16-bit header consists of a 4-bit opcode field, which is used to identify the command, followed by a 12-bit command length field. Programming Executive Commands TABLE 6-1: COMMAND FORMAT The command opcode must match one of those in the command set. Any command that is received which does not match the list in Table 6-1 will return a “NACK” response (see Section 6.3.1.1 “Opcode Field”). The command length is represented in 16-bit words since the SPI operates in 16-bit mode. The PE uses the command length field to determine the number of words to read from the SPI port. If the value of this field is incorrect, the command will not be properly received by the PE. PROGRAMMING EXECUTIVE COMMAND SET Mnemonic Length (16-bit words) Time-Out Description 0x0 SCHECK 1 1 ms Sanity check. 0x1 READC 3 1 ms Read an 8-bit word from the specified Configuration register or Device ID register. 0x2 READP 4 1 ms/row Read ‘N’ 24-bit instruction words of primary Flash memory, starting from the specified address. 0x3 PROG2W 6 5 ms Program a double instruction word of code memory at the specified address and verify. 0x4 Reserved N/A N/A This command is reserved; it will return a NACK. 0x5 PROGP 99 5 ms Program 64 words of program memory at the specified starting address, then verify. 0x6 Reserved N/A N/A 0x7 ERASEB 1 125 ms 0x8 Reserved 0x9 ERASEP 0xA Reserved 0xB QVER 0xC CRCP 0xD Reserved 0xE QBLANK 2015 Microchip Technology Inc. N/A N/A 3 25 ms This command is reserved; it will return a NACK. Chip Erase the device. This command is reserved; it will return a NACK. Command to erase a page. N/A N/A This command is reserved; it will return a NACK. 1 1 ms Query the PE software version. 5 1s N/A N/A 5 700 ms Performs a CRC-16 on the specified range of memory. This command is reserved; it will return a NACK. Query to check whether the code memory is blank. DS30010073A-page 49 PIC24FJ256GA412/GB412 FAMILY 6.2.2 PACKED DATA FORMAT 6.2.4 When 24-bit instruction words are transferred across the 16-bit SPI interface, they are packed to conserve space using the format illustrated in Figure 6-4. This format minimizes traffic over the SPI and provides the PE with data that is properly aligned for performing Table Write operations. FIGURE 6-4: 15 PACKED INSTRUCTION WORD FORMAT 8 7 0 LSW1 MSB2 MSB1 LSW2 LSWx: Least Significant 16 bits of instruction word MSBx: Most Significant Byte of instruction word Note: 6.2.3 When the number of instruction words transferred is odd, MSB2 is zero and LSW2 cannot be transmitted. PROGRAMMING EXECUTIVE ERROR HANDLING The PE will “NACK” all unsupported commands. Additionally, due to the memory constraints of the PE, no checking is performed on the data contained in the programmer command. It is the responsibility of the programmer to command the PE with valid command arguments or the programming operation may fail. Additional information on error handling is provided in Section 6.3.1.3 “QE_Code Field”. DS30010073A-page 50 COMMAND DESCRIPTIONS All commands supported by the PE are described in Section 6.2.4.1 “SCHECK Command” through Section 6.2.4.10 “QBLANK Command”. 6.2.4.1 SCHECK Command 15 12 11 0 Opcode Length Table 6-2 shows the description for the SCHECK command. TABLE 6-2: COMMAND DESCRIPTION Field Description Opcode 0x0 Length 0x1 The SCHECK command instructs the PE to do nothing but generate a response. This command is used as a “Sanity Check” to verify that the PE is operational. Expected Response (2 words): 0x1000 0x0002h Note: This instruction is not required for programming, but is provided for development purposes only. 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 6.2.4.2 15 READC Command 12 11 6.2.4.3 8 7 Opcode 0 15 12 11 8 7 Opcode Length N READP Command N Addr_MSB Reserved Addr_LS Table 6-3 shows the description for the READC command. TABLE 6-3: COMMAND DESCRIPTION Field Description 0 Length Addr_MSB Addr_LS Table 6-4 shows the description for the READP command. TABLE 6-4: COMMAND DESCRIPTION Field Description Opcode 0x1 Length 0x3 Opcode 0x2 N Number of 8-bit Configuration registers or Device ID registers to read (maximum of 256) Length 0x4 N Number of 24-bit instructions to read (maximum of 32768) Addr_MSB MSB of 24-bit source address. Reserved 0x0 Addr_LS Least Significant 16 bits of 24-bit source address Addr_MSB MSB of 24-bit source address Addr_LS Least Significant 16 bits of 24-bit source address The READC command instructs the PE to read N Configuration registers or Device ID registers, starting from the 24-bit address specified by Addr_MSB and Addr_LS. This command can only be used to read 8-bit or 16-bit data. When this command is used to read Configuration registers, the upper byte in every data word returned by the PE is 0x00 and the lower byte contains the Configuration register value. Expected Response (4 + 3 * (N – 1)/2 words for N odd): 0x1100 Expected Response (2 + 3 * N/2 words for N even): 0x1200 2 + 3 * N/2 Least Significant Program Memory Word 1 2+N Configuration register or Device ID Register 1 ... Configuration register or Device ID Register N Note: The READP command instructs the PE to read N 24-bit words of code memory, starting from the 24-bit address specified by Addr_MSB and Addr_LS. This command can only be used to read 24-bit data. All data returned in response to this command uses the packed data format described in Section 6.2.2 “Packed Data Format”. Reading unimplemented memory will cause the PE to reset. To prevent this from occurring, ensure that only memory locations present on a particular device are accessed. ... Least Significant Data Word N Expected Response (4 + 3 * (N – 1)/2 words for N odd): 0x1200 4 + 3 * (N – 1)/2 Least Significant Program Memory Word 1 ... MSB of Program Memory Word N (zero-padded) Note: 2015 Microchip Technology Inc. Reading unimplemented memory will cause the PE to reset. To prevent this from occurring, ensure that only memory locations present on a particular device are accessed. DS30010073A-page 51 PIC24FJ256GA412/GB412 FAMILY 6.2.4.4 PROG2W Command 15 12 11 6.2.4.5 8 7 Opcode 0 15 12 11 8 7 Opcode Length Reserved PROGP Command Reserved Addr_MSB D_1 DataL_LS D_2 DataL_MSB ... DataH_LS Table 6-5 shows the description for the PROG2W command. TABLE 6-5: COMMAND DESCRIPTION Field Description Opcode 0x3 Length 0x6 Addr_MSB Addr_LS Addr_LS DataH_MSB 0 Length D_N Table 6-6 shows the description for the PROGP command. TABLE 6-6: COMMAND DESCRIPTION Field Description Opcode 0x5 DataL_MSB MSB of 24-bit data for low instruction word Length 0x63 Reserved 0x0 DataH_MSB MSB of 24-bit data for high instruction word Addr_MSB MSB of 24-bit destination address Addr_LS Least Significant 16 bits of 24-bit destination address Addr_MSB MSB of 24-bit destination address Addr_LS Least Significant 16 bits of 24-bit destination address D_1 16-bit Data Word 1 DataL_LS Least Significant 16 bits of 24-bit data for low instruction word D_2 16-bit Data Word 2 ... 16-bit Data Word 3 through 95 DataH_LS Least Significant 16 bits of 24-bit data for high instruction word D_96 16-bit Data Word 96 The PROG2W command instructs the PE to program two instruction words of code memory (6 bytes) to the specified memory address. After the words have been programmed to code memory, the PE verifies the programmed data against the data in the command. Expected Response (2 words): 0x1300 0x0002 The PROGP command instructs the PE to program one row of code memory (128 instruction words) to the specified memory address. Programming begins with the row address specified in the command. The destination address should be a multiple of 0x100. The data to program the memory, located in command words, D_1 through D_96, must be arranged using the packed instruction word format illustrated in Figure 6-4. After all data has been programmed to code memory, the PE verifies the programmed data against the data in the command. Expected Response (2 words): 0x1500 0x0002 Note: DS30010073A-page 52 Refer to Table 2-2 for code memory size information. 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 6.2.4.6 ERASEB Command 15 12 11 6.2.4.8 8 7 0 Opcode Table 6-7 shows the description for the ERASEB command. COMMAND DESCRIPTION Field Description Opcode 0x7 Length 0x1 12 11 0 Opcode Length TABLE 6-7: 15 QVER Command Length Table 6-9 shows the description for the QVER command. TABLE 6-9: COMMAND DESCRIPTION Field The ERASEB command instructs the PE to perform a Chip Erase (i.e., erase all of the primary Flash memory, executive memory and code-protect bits). Expected Response (2 words): 0x1700 Description Opcode 0xB Length 0x1 The QVER command queries the version of the PE software stored in test memory. The “version.revision” information is returned in the response’s QE_Code, using a single byte with the following format: main version in upper nibble and revision in the lower nibble (i.e., 0x23 means Version 2.3 of PE software). Expected Response (2 words): 0x0002 0x1BMN (where “MN” stands for version M.N) 0x0002 6.2.4.7 ERASEP Command 15 12 11 8 7 Opcode 0 Length Addr_MSB NUM_PAGES Addr_LS Table 6-6 shows the description for the ERASEP command. TABLE 6-8: COMMAND DESCRIPTION Field Description Opcode 0x9 Length 0x3 NUM_PAGES Up to 255 Addr_MSB Most Significant Byte of the 24-bit address Addr_LS Least Significant 16 bits of the 24-bit address The ERASEP command instructs the PE to Page Erase [NUM_PAGES] of code memory. The code memory must be erased at an “even” 1024 instruction words address boundary Expected Response (2 words): 0x1900 0x0002 2015 Microchip Technology Inc. DS30010073A-page 53 PIC24FJ256GA412/GB412 FAMILY 6.2.4.9 CRCP Command 15 12 11 6.2.4.10 8 7 Opcode 0 Length Reserved 15 12 11 0 Opcode Length Reserved Addr_MSB Reserved Reserved Size_LSW Table 6-11 shows the description for the CRCP command. COMMAND DESCRIPTION Description Addr_MSB Addr_LSW Size_MSB Field Size_MSB Size_LSW Addr_LSW TABLE 6-10: QBLANK Command Table 6-11 shows the description for the QBLANK command. TABLE 6-11: COMMAND DESCRIPTION Field Description Opcode 0xE Length 0x5 Size Length of program memory to check (in 24-bit words) + Addr_MS Opcode Ch Length 5h Addr_MSB Most Significant Byte of 24-bit address Addr_MSB Addr_LSW Least Significant 16 bits of 24-bit address Most Significant Byte of the 24-bit address Addr_LSW Size Number of 24-bit locations (address range divided by 2) Least Significant 16 bits of the 24-bit address The CRCP command performs a CRC-16 on the range of memory specified. This command can substitute for a full chip verify. Data is shifted in a packed method, as demonstrated in Figure 6-4: byte-wise, Least Significant Byte (LSB) first. Example: The QBLANK command queries the PE to determine if the contents of code memory are blank (contains all ‘1’s). The size of code memory to check must be specified in the command. The Blank Check for code memory begins at [Addr] and advances toward larger addresses for the specified number of instruction words. CRC-CCITT-16 with test data of “123456789” becomes 29B1h QBLANK returns a QE_Code of F0h if the specified code memory is blank; otherwise, QBLANK returns a QE_Code of 0Fh. Expected Response (3 words): Expected Response (2 words for blank device): QE_Code: 0x1C00 0x1EF0 Length: 0x0003 0x0002 CRC Value: 0xXXXX Expected Response (2 words for non-blank device): 0x1E0F 0x0002 Note: DS30010073A-page 54 The QBLANK command does not check the system operation Configuration bits since these bits are not set to ‘1’ when a Chip Erase is performed. 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 6.3 Programming Executive Responses Table 6-13 shows the description of the response format. The PE sends a response to the programmer for each command that it receives. The response indicates if the command was processed correctly. It includes any required response data or error data. TABLE 6-13: Field RESPONSE FORMAT DESCRIPTION Description The PE response set is shown in Table 6-12. This table contains the opcode, mnemonic and description for each response. The response format is described in Section 6.3.1 “Response Format”. Opcode Response opcode. Last_Cmd Programmer command that generated the response. QE_Code Query code or error code. TABLE 6-12: Length Response length in 16-bit words (includes 2 header words). D_1 First 16-bit data word (if applicable). D_N Last 16-bit data word (if applicable). Opcode PROGRAMMING EXECUTIVE RESPONSE OPCODES Mnemonic 0x1 PASS Description Command successfully processed. 6.3.1.1 0x2 FAIL Command unsuccessfully processed. 0x3 NACK Command not known. 6.3.1 RESPONSE FORMAT All PE responses have a general format, consisting of a two-word header and any required data for the command. 15 12 11 Opcode 8 7 Last_Cmd 0 QE_Code Length D_1 (if applicable) Opcode Field The opcode is a 4-bit field in the first word of the response. The opcode indicates how the command was processed (see Table 6-12). If the command was processed successfully, the response opcode is PASS. If there was an error in processing the command, the response opcode is FAIL and the QE_Code indicates the reason for the failure. If the command sent to the PE is not identified, the PE returns a NACK response. 6.3.1.2 Last_Cmd Field The Last_Cmd is a 4-bit field in the first word of the response and indicates the command that the PE processed. Since the PE can only process one command at a time, this field is technically not required. However, it can be used to verify that the PE correctly received the command that the programmer transmitted. ... D_N (if applicable) 2015 Microchip Technology Inc. DS30010073A-page 55 PIC24FJ256GA412/GB412 FAMILY 6.3.1.3 QE_Code Field 6.3.1.4 Response Length The QE_Code is a byte in the first word of the response. This byte is used to return data for query commands and error codes for all other commands. The response length indicates the length of the PE’s response in 16-bit words. This field includes the 2 words of the response header. When the PE processes one of the two query commands (QBLANK or QVER), the returned opcode is always PASS and the QE_Code holds the query response data. The format of the QE_Code for both queries is shown in Table 6-14. With the exception of the response for the read commands, the length of each response is only 2 words. TABLE 6-14: QE_Code FOR QUERIES Query QE_Code QBLANK 0x0F = Code memory is NOT blank 0xF0 = Code memory is blank QVER 0xMN, where PE Software Version = M.N (i.e., 0x32 means Software Version 3.2). The response to the READP commands uses the packed instruction word format described in Section 6.2.2 “Packed Data Format”. When reading an odd number of program memory words (N odd), the response to the READP command is (3 * (N + 1)/2 + 2) words. When reading an even number of program memory words (N even), the response to the READP command is (3 * N/2 + 2) words. When the PE processes any command other than a query, the QE_Code represents an error code. Supported error codes are shown in Table 6-15. If a command is successfully processed, the returned QE_Code is set to 0x0, which indicates that there is no error in the command processing. If the verify of the programming for the PROGW command fails, the QE_Code is set to 0x1. For all other PE errors, the QE_Code is 0x02. TABLE 6-15: QE_Code FOR NON-QUERY COMMANDS QE_Code Description 0x0 No error 0x1 Verify failed 0x2 Other error DS30010073A-page 56 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 7.0 DUAL PARTITION FLASH PROGRAMMING CONSIDERATIONS The PIC24FJ256GA412/GB412 family of devices supports a Single Partition Flash mode and two Dual Partition Flash modes. The Dual Partition modes allow the device to be programmed with two separate applications to facilitate bootloading or to allow an application to be programmed at run time without stalling the CPU. The part’s Partition Flash mode is determined by the BTMODE<1:0> bits in the FBOOT Configuration register (Table 7-1). The device will automatically check FBOOT on Reset and determine the appropriate Partition Flash mode. TABLE 7-1: FBOOT<1:0> 7.1 PARTITION FLASH MODE SELECT Partition Flash Mode 00 Reserved 01 Protected Dual Partition Flash mode 10 Dual Partition Flash mode 11 Single Partition Flash mode (default) Dual Partition Flash Memory Organization In the Dual Partition Flash modes, the device’s memory is divided evenly into two physical sections, known as Partition 1 and Partition 2. Each of these partitions contains its own program memory and Configuration Words. During program execution, the code on only one of these partitions is executed; this is the Active Partition. The other partition, or the Inactive Partition, is not used, but can be programmed. The Active Partition is always mapped to logical address, 000000h, while the Inactive Partition will always be mapped to logical address, 400000h. Note that even when the code partitions are switched between Active and Inactive Partitions by the user, the address of the Active Partition will still be 000000h, and the address of the Inactive Partition will still be at 400000h. boot sequence number is corrupted, the device will use the partition without a corrupted boot sequence number as the Active Partition. The user can also change which partition is active at run time using the BOOTSWP instruction. Issuing a BOOTSWP instruction does not affect which partition will be the Active Partition after a Reset. Figure 7-1 demonstrates how the relationship between Partitions 1 and 2, shown in red and blue respectively, and the Active and Inactive Partitions are affected by reprogramming the boot sequence number or issuing a BOOTSWP instruction. The P2ACTIV bit (NVMCON<10>) can be used to determine which physical partition is the Active Partition. If P2ACTIV = 1, Partition 2 is active; if P2ACTIV = 0, Partition 1 is active. 7.2 Erase Operations with Dual Partition Flash PIC24FJ256GA412/GB412 family devices support three erase operations: Chip Erase, Inactive Partition Erase and Page Erase. A Chip Erase operation erases all of user memory, including the Flash Configuration Words and the FBOOT Configuration register. This resets the Partition Flash mode of the device to its default, Single Partition Flash mode. Chip Erase is not available during run-time operation. An Inactive Partition Erase operation can be executed at run time from the Active Partition. It will erase all user memory and Flash Configuration Words in the Inactive Partition. Note that the Inactive Partition Erase command is only functional when the device is in one of the Dual Partition modes and permitted by the device’s code protection settings. Since the Flash Configuration Words reside in the last locations of user program space, they may be erased using a Chip Erase, an Inactive Partition Erase or a Page Erase that targets the last page of user Flash memory. Note that a Page Erase of the Configuration Words page may also erase the last lines of user code, which will need to be restored. See Section 3.7 “Writing Configuration Bits” for more information. The Boot Sequence Configuration Words (FBTSEQ) determine whether Partition 1 or Partition 2 will be active after Reset. If the part is operating in Dual Partition mode, the partition with the lower boot sequence number will operate as the Active Partition (FBTSEQ is unused in Single Partition mode). The partitions can be switched between Active and Inactive by reprogramming their boot sequence numbers, but the Active Partition will not change until a device Reset is performed. If both boot sequence numbers are the same, or if both are corrupted, the part will use Partition 1 as the Active Partition. If only one 2015 Microchip Technology Inc. DS30010073A-page 57 PIC24FJ256GA412/GB412 FAMILY FIGURE 7-1: RELATIONSHIP BETWEEN PARTITIONS 1 AND 2 AND ACTIVE/INACTIVE PARTITIONS 000000h Partition 1 000000h 000000h Partition 2 Partition 1 Active Partition BSEQ = 10 BOOTSWP Instruction 400000h Partition 2 BSEQ = 10 BSEQ = 15 400000h Reset 400000h Partition 1 Partition 2 Inactive Partition BSEQ = 15 000000h Partition 1 BSEQ = 15 BSEQ = 10 000000h 000000h Partition 1 Partition 2 Active Partition BSEQ = 10 Reset Reprogram BSEQ 400000h Partition 2 BSEQ = 5 BSEQ = 10 400000h Partition 2 400000h Partition 1 Inactive Partition BSEQ = 15 DS30010073A-page 58 BSEQ = 5 BSEQ = 10 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 7.3 Dual Partition Configuration Words In Dual Partition modes, each partition has its own set of Flash Configuration Words. The full set of Configuration registers in the Active Partition is used to determine the device’s configuration; the Configuration Words in the Inactive Partition are used to determine the device’s configuration when that partition becomes active. However, some of the Configuration registers in the Inactive Partition (FSEC, FBSLIM and FSIGN) may be used to determine how the Active Partition is able or allowed to access the Inactive Partition. 7.4 When programming a PIC24FJ256GA412/GB412 family device with multiple applications, the following sequence of steps is recommended to program the device correctly. 1. 2. 3. 4. 5. 2015 Microchip Technology Inc. Programming in Dual Partition Flash Mode Perform a Chip Erase on the device. Program the FBOOT register to one of the Dual Partition modes, then reset the device to put it in Dual Partition Flash mode. At this point, the device’s program memory is functionally divided into two partitions. Program the first application (including its boot sequence number and Configuration Words) into the Active Partition at address, 000000h. Program the second application, its boot sequence number and its Configuration Words into the Inactive Partition at address, 400000h. Finally, perform a device Reset. The Active/ Inactive Partitions may switch at this point, depending on the values that the user used for the boot sequence numbers for each application. DS30010073A-page 59 PIC24FJ256GA412/GB412 FAMILY 8.0 DEVICE ID TABLE 8-1: The Device ID region of memory can be used to determine variant and manufacturing information about the chip. This region of memory is read-only and can be read when code protection is enabled. The DEVID register (FF0000h) identifies the specific part number of the device, while DEVREV (FF0002h) shows the silicon revision level. Table 8-1 lists the identification information for each device. Table 8-2 shows the Device ID registers and Table 8-3 describes the bit field of each register. TABLE 8-2: Address Device DEVID PIC24FJ64GA406 6100h PIC24FJ64GA410 6101h PIC24FJ64GA412 6102h PIC24FJ64GB406 6104h PIC24FJ64GB410 6105h PIC24FJ64GB412 6106h PIC24FJ128GA406 6108h PIC24FJ128GA410 6109h PIC24FJ128GA412 610Ah PIC24FJ128GB406 610Ch PIC24FJ128GB410 610Dh PIC24FJ128GB412 610Eh PIC24FJ256GA406 6110h PIC24FJ256GA410 6111h PIC24FJ256GA412 6112h PIC24FJ256GB406 6114h PIC24FJ256GB410 6115h PIC24FJ256GB412 6116h PIC24FJ256GA412/GB412 FAMILY DEVICE ID REGISTERS Bit Name FF0000h DEVID FF0002h DEVREV TABLE 8-3: DEVICE IDs 15 14 13 12 11 10 9 8 7 6 5 FAMID<7:0> 4 3 2 1 0 DEV<7:0> — REV<3:0> DEVICE ID BIT FIELD DESCRIPTIONS Bit Field Register Description FAMID<7:0> DEVID Encodes the family ID of the device. DEV<7:0> DEVID Encodes the individual ID of the device. REV<3:0> DEVREV Encodes the sequential (numerical) revision identifier of the device. DS30010073A-page 60 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 9.0 CHECKSUM COMPUTATION Checksums for devices are 16 bits in size. The checksum is calculated by summing the following: • Contents of code memory locations • Contents of Flash Configuration Words All memory locations, including Configuration Words, are summed by adding all three bytes of each memory address. Since the configuration memory space in these devices is Flash-based, the erased value of all memory bits, except FSIGN, is a ‘1’. The FSIGN Configuration Word is the only register that uses a mask value. Certain Configuration bits will be reserved and these bits may require a ‘0’ or a ‘1’ to be written in order for the device to operate properly. There is no error checking in either hardware or in MPLAB® X IDE to prevent the user from improperly programming these bits. The device checksum is calculated based on the contents of the Hex file, even if the reserved bits are incorrectly programmed. These devices use a Dual Partition Flash memory, whose behavior is controlled by the FBOOT register. Table 9-2 shows a Single Partition set of checksums and Table 9-3 shows a Dual Partition set of checksums. The difference in the two is the inclusion of a second FSIGN register in Dual Partition mode and the values for FBOOT; this will alter the computed checksum. The entire Flash-based Configuration Word area is used when computing the checksum, with the exception of the Configuration Word, FBTSEQ. FBTSEQ is not used in the checksum calculation since it can be altered by a bootloader. The checksum is computed “bytewise”, with the final result truncated to 16 bits. In the PIC24 architecture, each Flash memory address contains two bytes (if an even address) or one byte (if an odd address, since the upper byte is implemented and is always 0x00). When computing the checksum, both the upper and lower bytes of the word at a given address should be added to the running sum separately as bytes, instead of as a single 16-bit word. 2015 Microchip Technology Inc. For example, in a program that contains two words with contents such as: Contents at address 0x0000 = 0xABCD Contents at address 0x0001 = 0x00EF The checksum over the [0x0000:0x0001] region is: 0xCD + 0xAB + 0xEF + 0x00 = 0x0267. The CFGB block checksum is also a “bytewise” sum of all contents of the configuration block address region, and is computed identically to the PROG region, with the exception of the FSIGN Configuration Word. The FSIGN Configuration Word contains a reserved bit that should be AND masked out and excluded during the checksum computation. TABLE 9-1: CONFIGURATION BIT MASKS FOR ALL DEVICES Mask Value Default Reset Value FSEC FFFFh FFFFh FBSLIM FFFFh FFFFh Register FSIGN 7FFFh 7FFFh FOSCSEL FFFFh FFFFh FOSC FFFFh FFFFh FWDT FFFFh FFFFh FPOR FFFFh FFFFh FICD FFFFh FFFFh FDS FFFFh FFFFh FDEVOPT FFFFh FFFFh FBTSEQ FFFFFFh FFFFFFh FBOOT FFFFh FFFFh DS30010073A-page 61 PIC24FJ256GA412/GB412 FAMILY TABLE 9-2: CHECKSUM COMPUTATION (SINGLE PARTITION) Read Code Protection Device PIC24FJ256GB412 PIC24FJ128GB412 PIC24FJ64GB412 Disabled Checksum Computation PROG[0:2AF7F] + CFGB[2AF80:2AFFF] Enabled 0 Disabled PROG[0:1577F] + CFGB[15780:157FF] Enabled 0 Disabled PROG[0:AF7F] + CFGB[AF80:AFFF] Enabled 0 Erased Value Value with 0xAAAAAA at 0x0 and Last Code Address F780h(1) F582h(1) 0000h 0000h FB80h(1) F982h(1) 0000h 0000h F780h(1) F582h(1) 0000h 0000h Legend: PROG[a:b]= Program memory byte sum of locations, a to b inclusive (all 3 bytes of code memory) CFGB[c:d] = Configuration memory byte sum of locations, c to d inclusive, with FSIGN masked (FSIGN & 7FFFF) Note 1: For the checksum computation example, the Configuration bits are set to the default configuration values after erasing the part. TABLE 9-3: CHECKSUM COMPUTATION (DUAL PARTITION) Device Read Code Protection Checksum Computation Disabled PROG[0:1577F] + CFGB[15780:157FF] + PROG[400000:41577F] + CFGB[415780:4157FF] Enabled 0 PIC24FJ256GB412 Disabled PROG[0:AA7F] + CFGB[AA80:ABFF] + PROG[400000:40AA7F] + CFGB[40AA80:40ABFF] Enabled 0 PIC24FJ128GB412 Disabled PROG[0:577F] + CFGB[5780:57FF] + PROG[400000:40577F] + CFGB[405780:4057FF] Enabled 0 PIC24FJ64GB412 Value with Erased 0xAAAAAA at 0x0 Value and Last Code Address F700h(1) F304h(1) 0000h 0000h FB00h(1) F704h(1) 0000h 0000h F700h(1) F304h(1) 0000h 0000h Legend: PROG[a:b] = Program memory byte sum of locations, a to b inclusive (all 3 bytes of code memory) CFGB[c:d] = Configuration memory byte sum of locations, c to d inclusive, with FSIGN masked (FSIGN & 7FFFF) Note 1: For the checksum computation example, the Configuration bits are set to the default configuration values after erasing the part. DS30010073A-page 62 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY 10.0 AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS Table 10-1 lists the AC/DC characteristics and timing requirements. TABLE 10-1: AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS Standard Operating Conditions Operating Temperature: -40ºC to +85ºC. Programming at +25ºC is recommended. Param. Symbol No. Characteristic Min. Max. Units — — V Conditions D111 VDD Supply Voltage During Programming D113 IDDP Supply Current During Programming — — mA See Note 2 D114 IPEAK Instantaneous Peak Current During Start-up — — mA See Note 2 D031 VIL Input Low Voltage — — V See Note 2 D041 VIH Input High Voltage — — V See Note 2 D080 VOL Output Low Voltage — — V See Note 2 D090 VOH Output High Voltage — — V See Note 2 D012 CIO Capacitive Loading on I/O Pin (PGEDx) — — pF See Note 2 P1 TPGC Serial Clock (PGECx) Period (ICSP™) 200 — ns P1 TPGC Serial Clock (PGECx) Period (Enhanced ICSP) 500 — ns P1A TPGCL Serial Clock (PGECx) Low Time (ICSP) 80 — ns P1A TPGCL Serial Clock (PGECx) Low Time (Enhanced ICSP) 200 — ns P1B TPGCH Serial Clock (PGECx) High Time (ICSP) 80 — ns P1B TPGCH Serial Clock (PGECx) High Time (Enhanced ICSP) 200 — ns ns P2 TSET1 Input Data Setup Time to Serial Clock 15 — P3 THLD1 Input Data Hold Time from PGECx 15 — ns P4 TDLY1 Delay Between 4-Bit Command and Command Operand 40 — ns P4A TDLY1A Delay Between Command Operand and Next 4-Bit Command 40 — ns P5 TDLY2 Delay Between Last PGECx of Command to First PGECx of Read of Data Word 20 — ns P6 TSET2 VDD Setup Time to MCLR 100 — ns P7 THLD2 Input Data Hold Time from MCLR 50 — ms P8 TDLY3 Delay Between Last PGECx of Command Byte to PGEDx by PE 12 — s Note 1: 2: 3: See Note 1 and Note 2 VDD must also be supplied to the AVDD pins during programming. AVDD and AVSS should always be within ±0.3V of VDD and VSS, respectively. Time depends on the FRC accuracy and the value of the FRC Oscillator Tuning register. Refer to the “Electrical Characteristics” chapter in the specific device data sheet. This time applies to Program Memory Words, Configuration Words and User ID Words. 2015 Microchip Technology Inc. DS30010073A-page 63 PIC24FJ256GA412/GB412 FAMILY TABLE 10-1: AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS (CONTINUED) Standard Operating Conditions Operating Temperature: -40ºC to +85ºC. Programming at +25ºC is recommended. Param. Symbol No. Characteristic Min. Max. Units Conditions P9A TDLY4 PE Command Processing Time 10 — s P9B TDLY5 Delay Between PGEDx by PE to PGEDx, Released by PE 15 23 s P10 TDLY6 PGECx Low Time After Programming 400 — ns P11 TDLY7 Chip Erase Time 18 27 ms P12 TDLY8 Page Erase Time 18 27 ms See Note 2 P13 TDLY9 Double-Word Programming Time 18 — s See Note 2 and Note 3 P14 TR MCLR Rise Time to Enter ICSP mode — 1.0 s P15 TVALID Data Out Valid from PGECx 10 — ns P16 TDLY10 Delay Between Last PGECx and MCLR P17 THLD3 MCLR to VDD P18 TKEY1 P19 TKEY2 P21 TMCLRH MCLR High Time Note 1: 2: 3: 0 — s 100 — ns Delay from First MCLR to First PGECx for Key Sequence on PGEDx 1 — ms Delay from Last PGECx for Key Sequence on PGEDx to Second MCLR 25 — ns — 500 s VDD must also be supplied to the AVDD pins during programming. AVDD and AVSS should always be within ±0.3V of VDD and VSS, respectively. Time depends on the FRC accuracy and the value of the FRC Oscillator Tuning register. Refer to the “Electrical Characteristics” chapter in the specific device data sheet. This time applies to Program Memory Words, Configuration Words and User ID Words. DS30010073A-page 64 2015 Microchip Technology Inc. PIC24FJ256GA412/GB412 FAMILY APPENDIX A: REVISION HISTORY Revision A (February 2015) Original version of this document. 2015 Microchip Technology Inc. DS30010073A-page 65 PIC24FJ256GA412/GB412 FAMILY NOTES: DS30010073A-page 66 2015 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63277-108-7 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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