INTERSIL ISL3156EIUZ

Features
ISL3150E, ISL3152E, ISL3153E,
ISL3155E, ISL3156E, ISL3158E
The ISL315xE are IEC61000 ESD protected, 5V
powered transceivers that meet the RS-485 and RS-422
standards for balanced communication. Driver outputs
and receiver inputs are protected against ±16.5kV ESD
strikes without latch-up.
Transmitters in this family deliver exceptional differential
output voltages (2.4V min), into the RS-485 required
54Ω load, for better noise immunity, or to allow up to
eight 120Ω terminations in “star” topologies.
These devices have very low bus currents so they
present a true “1/8 unit load” to the RS-485 bus. This
allows up to 256 transceivers on the network without
using repeaters.
Receiver (Rx) inputs feature a “Full Fail-Safe” design,
which ensures a logic high Rx output if Rx inputs are
floating, shorted, or on a terminated but undriven bus.
Rx outputs feature high drive levels - typically 28mA @
VOL = 1V (to ease the design of optocoupled isolated
interfaces).
Half duplex (Rx inputs and Tx outputs multiplexed
together) and full duplex pinouts are available. See
Table 1 on page 2 for key features and configurations by
device number.
• High Rx IOL for Opto-Couplers in Isolated Designs
• Hot Plug Circuitry - Tx and Rx Outputs Remain
Three-State During Power-up/Power-down
• True 1/8 Unit Load for up to 256 Devices on the Bus
• High Data Rates . . . . . . . . . . . . . . up to 20Mbps
• Low Quiescent Supply Current . . . . . . . . . 600µA
Ultra Low Shutdown Supply Current . . . . . . 70nA
Applications*(see page 17)
• Utility Meters/Automated Meter Reading Systems
• High Node Count Systems
• PROFIBUS® and Field Bus Networks, and Factory
Automation
• Security Camera Networks
• Building Lighting and Environmental Control Systems
• Industrial/Process Control Networks
Large VOD Delivers Superior
Signal At Cable End For
Enhanced Noise Immunity
140
3
130
120
2
ISL3158E
110
100
OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
Exceptional Tx Drives Up To 8
Terminations While Still
Delivering 1.5V VOD
• High Driver VOD . . . . . . . 2.4V (Min) @ RD = 54Ω
Better Noise Immunity, or Drive Up to 8 Terminations
• ±16.5kV IEC61000 ESD Protection on I/O Bus Pins
• High Transient Overvoltage Tolerance . . . . ±100V
• Full Fail-safe (Open, Short, Terminated) Receivers
90
80
2 TERMS
8 TERMS
70
60
6 TERMS
50
40
1 TERM
30
20
10
0
1
0
-1
STANDARD
1.5V TX
-2
0
July 30, 2009
FN6363.2
1
2
3
4
1.5
DIFFERENTIAL OUTPUT VOLTAGE (V)
1
5
-3
20Mbps, 150’ UTP, DOUBLE 120Ω TERMS
20ns/DIV
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2006-2009 All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
±16.5kV ESD, Large Output Swing, 5V, Full
Fail-Safe, 1/8 Unit Load, RS-485/RS-422
Transceivers
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
TABLE 1. SUMMARY OF FEATURES
HALF/FULL
DUPLEX
DATA
RATE
(Mbps)
SLEWRATE
LIMITED?
HOT
PLUG
#
DEVICES
ON BUS
Rx/Tx
ENABLE?
ISL3150E
Full
0.115
Yes
Yes
256
Yes
600
Yes
10, 14
ISL3152E
Half
0.115
Yes
Yes
256
Yes
600
Yes
8
ISL3153E
Full
1
Yes
Yes
256
Yes
600
Yes
10, 14
ISL3155E
Half
1
Yes
Yes
256
Yes
600
Yes
8
ISL3156E
Full
20
No
Yes
256
Yes
600
Yes
10, 14
ISL3158E
Half
20
No
Yes
256
Yes
600
Yes
8
PART
NUMBER
QUIESCENT LOW POWER
PIN
ICC (µA)
SHUTDOWN? COUNT
Ordering Information
PART NUMBER
TEMP. RANGE
(°C)
PART MARKING
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL3150EIBZ (Notes 1, 3)
3150EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3150EIUZ (Notes 1, 3)
3150Z
-40 to +85
10 Ld MSOP
M10.118
ISL3152EIBZ (Notes 1, 3)
3152EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3152EIPZ (Notes 2, 3)
ISL3152 EIPZ
-40 to +85
8 Ld PDIP
E8.3
ISL3152EIUZ (Notes 1, 3)
3152Z
-40 to +85
8 Ld MSOP
M8.118
ISL3153EIBZ (Notes 1, 3)
3153EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3153EIUZ (Notes 1, 3)
3153Z
-40 to +85
10 Ld MSOP
M10.118
ISL3155EIBZ (Notes 1, 3)
3155EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3155EIUZ (Notes 1, 3)
3155Z
-40 to +85
8 Ld MSOP
M8.118
ISL3156EIBZ (Notes 1, 3)
3156EIBZ
-40 to +85
14 Ld SOIC
M14.15
ISL3156EIUZ (Notes 1, 3)
3156Z
-40 to +85
10 Ld MSOP
M10.118
ISL3158EIBZ (Notes 1, 3)
3158EIBZ
-40 to +85
8 Ld SOIC
M8.15
ISL3158EIUZ (Notes 1, 3)
3158Z
-40 to +85
8 Ld MSOP
M8.118
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in Reflow solder
processing applications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see device information pages for ISL3150E, ISL3152E, ISL3153E, ISL3155E,
ISL3156E and ISL3158E. For more information on MSL please see techbrief TB363.
Pin Configurations
ISL3152E, ISL3155E, ISL3158E
(8 LD MSOP, 8 LD SOIC, 8 LD PDIP)
TOP VIEW
RO 1
R
RE 2
DE 3
DI 4
D
ISL3150E, ISL3153E, ISL3156E
(10 LD MSOP)
TOP VIEW
8 VCC
RO 1
7 B/Z
RE 2
6 A/Y
DE 3
5 GND
DI 4
GND 5
2
R
D
10 VCC
ISL3150E, ISL3153E, ISL3156E
(14 LD SOIC)
TOP VIEW
9 A
RO 2
8 B
RE 3
7 Z
DE 4
6 Y
14 VCC
NC 1
DI 5
R
13 NC
12 A
11 B
D
10 Z
GND 6
9 Y
GND 7
8 NC
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Pin Descriptions
PIN
RO
FUNCTION
Receiver output: If A-B ≥ -50mV, RO is high; If A-B ≤ -200mV, RO is low; RO = High if A and B are unconnected
(floating) or shorted.
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when
DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and
output Z low.
GND
Ground connection.
A/Y
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input and non inverting driver
output. Pin is an input if DE = 0; pin is an output if DE = 1.
B/Z
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input and inverting driver output. Pin is
an input if DE = 0; pin is an output if DE = 1.
A
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting receiver input.
B
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting receiver input.
Y
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, non-inverting driver output.
Z
±16.5kV IEC61000 ESD Protected RS-485/RS-422 level, inverting driver output.
VCC
System power supply input (4.5V to 5.5V).
NC
No Connection.
Truth Tables
RECEIVING
INPUTS
TRANSMITTING
INPUTS
OUTPUTS
OUTPUT
RE
DE
Half
Duplex
DE
Full
Duplex
A-B
RO
RE
DE
DI
Z
Y
X
1
1
0
1
0
0
X
≥ -0.05V
1
X
1
0
1
0
0
0
X
≤ -0.2V
0
0
0
X
High-Z
High-Z
0
0
X
1
1
0
X
High-Z*
High-Z*
Inputs
Open/Shorted
1
0
0
X
High-Z*
1
1
1
X
High-Z
NOTE: *Shutdown Mode (See Note 11).
NOTE: *Shutdown Mode (See Note 11).
3
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Typical Operating Circuit
ISL3152E, ISL3155E, ISL3158E
+5V
+5V
+
0.1µF
8
1 RO
8
VCC
VCC
R
D
2 RE
B/Z 7
3 DE
A/Y 6
4 DI
+
0.1µF
RT
RT
DI 4
7
B/Z
DE 3
6
A/Y
RE 2
R
D
GND
GND
5
5
RO 1
ISL3150E, ISL3153E, ISL3156E (SOIC PIN NUMBERS SHOWN)
+5V
+5V
+
0.1µF
14
VCC
2 RO
A 12
R
+
0.1µF
RT
14
9 Y
B 11
VCC
D
10 Z
3 RE
DE 4
RE 3
4 DE
5 DI
DI 5
Z 10
Y 9
D
GND
6, 7
4
RT
11 B
R
12 A
RO 2
GND
6, 7
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Absolute Maximum Ratings
Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . -0.3V to (VCC + 0.3V)
Input/Output Voltages
A/Y, B/Z, A, B, Y, Z . . . . . . . . . . . . . . . . . -9V to +13V
A/Y, B/Z, A, B, Y, Z (Transient Pulse Through 100Ω,
Note 16) . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100V
RO . . . . . . . . . . . . . . . . . . . . . . . -0.3V to (VCC +0.3V)
Short Circuit Duration
Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 5)
Recommended Operating Conditions
θJA (°C/W)
8 Ld SOIC . . . . . . . . . . . . . . . . .
105
8 Ld MSOP, PDIP* . . . . . . . . . . . .
140
10 Ld MSOP . . . . . . . . . . . . . . . .
130
14 Ld SOIC . . . . . . . . . . . . . . . .
130
Maximum Junction Temperature (Plastic Package) . +150°C
Maximum Storage Temperature Range . . -65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
*Pb-free PDIPs can be used for through-hole wave solder
processing only. They are not intended for use in Reflow
solder processing applications.
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V
Temperature Range . . . . . . . . . . . . . . . . -40°C to +85°C
Bus Pin Common Mode Voltage Range . . . . . -7V to +12V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTE:
5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
Electrical Specifications
PARAMETER
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,
TA = +25°C (Note 6). Boldface limits apply over the operating temperature range,
-40°C to +85°C.
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNITS
DC CHARACTERISTICS
Driver Differential VOUT
(No load)
VOD1
Driver Differential VOUT
(Loaded)
VOD2
Full
-
-
VCC
V
RL = 100Ω (RS-422) (Figure 1A)
Full
2.8
3.6
-
V
RL = 54Ω (RS-485) (Figure 1A)
Full
2.4
3.1
VCC
V
RL = 15Ω (Eight 120Ω terminations)
(Note 15)
25
-
1.65
-
V
RL = 60Ω, -7V ≤ VCM ≤ 12V
(Figure 1B)
Full
2.4
3
-
V
Change in Magnitude of
Driver Differential VOUT for
Complementary Output
States
ΔVOD
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
RL = 54Ω or 100Ω (Figure 1A)
Full
-
-
3.15
V
Change in Magnitude of
Driver Common-Mode VOUT
for Complementary Output
States
ΔVOC
RL = 54Ω or 100Ω (Figure 1A)
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
25
-
100
-
mV
Full
-2
-
2
µA
VIN = 12V
Full
-
70
125
µA
VIN = -7V
Full
-75
55
-
µA
DI Input Hysteresis Voltage
VHYS
Logic Input Current
IIN1
DE, DI, RE
Input Current (A, B, A/Y,
B/Z)
IIN2
DE = 0V, VCC = 0V or
5.5V
5
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Electrical Specifications
PARAMETER
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,
TA = +25°C (Note 6). Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
SYMBOL
Output Leakage Current
(Y, Z) (Full Duplex Versions
Only)
IIN3
Output Leakage Current
(Y, Z) in Shutdown Mode
(Full Duplex)
IIN4
IOSD1
Driver Short-Circuit Current,
VO = High or Low
Receiver Differential
Threshold Voltage
VTH
TEST CONDITIONS
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNITS
RE = 0V, DE = 0V,
VCC = 0V or 5.5V
VIN = 12V
Full
-
1
40
µA
VIN = -7V
Full
-40
-9
-
µA
RE = VCC, DE = 0V,
VCC = 0V or 5.5V
VIN = 12V
Full
-
1
20
µA
VIN = -7V
Full
-20
-9
-
µA
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note
8)
Full
-
-
±250
mA
-7V ≤ VCM ≤ 12V
Full
-200
-90
-50
mV
Receiver Input Hysteresis
ΔVTH
VCM = 0V
25
-
20
-
mV
Receiver Output High
Voltage
VOH
IO = -8mA, VID = -50mV
Full
VCC - 1.2
4.3
-
V
Receiver Output Low Voltage
VOL
IO = -8mA, VID = -200mV
Full
-
0.25
0.4
V
Receiver Output Low Current
IOL
VO = 1V, VID = -200mV
Full
20
28
-
mA
Three-State (High
Impedance) Receiver Output
Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-1
0.03
1
µA
RIN
-7V ≤ VCM ≤ 12V
Full
96
160
-
kΩ
0V ≤ VO ≤ VCC
Full
±7
65
±85
mA
Half Duplex Versions, DE = VCC,
RE = X, DI = 0V or VCC
Full
-
650
800
µA
All Versions, DE = 0V, RE = 0V, or Full
Duplex Versions, DE = VCC, RE = X.
DI = 0V or VCC
Full
-
550
700
µA
DE = 0V, RE = VCC, DI = 0V or VCC
Full
-
0.07
3
µA
1/2 Duplex
25
-
±16.5
-
kV
Full Duplex
25
-
±10
-
kV
IEC61000-4-2, Contact Discharge
Method
25
-
±9
-
kV
Human Body Model, From Bus Pins to
GND
25
-
±16.5
-
kV
Human Body Model, per MIL-STD-883
Method 3015
25
-
±7
-
kV
Machine Model
25
-
400
-
V
Receiver Input Resistance
Receiver Short-Circuit
Current
IOSR
SUPPLY CURRENT
No-Load Supply Current
(Note 7)
ICC
Shutdown Supply Current
ISHDN
ESD PERFORMANCE
RS-485 Pins (A, Y, B, Z, A/Y,
B/Z)
IEC61000-4-2,
Air-Gap Discharge
Method
All Pins
6
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Electrical Specifications
PARAMETER
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,
TA = +25°C (Note 6). Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNITS
DRIVER SWITCHING CHARACTERISTICS (115kbps Versions; ISL3150E, ISL3152E)
Driver Differential Output
Delay
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
500
970
1300
ns
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
12
50
ns
Driver Differential Rise or
Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
700
1100
1600
ns
Maximum Data Rate
fMAX
CD = 820pF (Figure 4) (Note 17)
Full
115
2000
-
kbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND
(Figure 3), (Note 9)
Full
-
300
600
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 3), (Note 9)
Full
-
130
500
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 3)
Full
-
50
65
ns
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF, SW = GND
(Figure 3)
Full
-
35
60
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from
Shutdown to Output High
tZH(SHDN)
RL = 500Ω, CL = 100pF, SW = GND
(Figure 3), (Notes 11, 12)
Full
-
-
250
ns
Driver Enable from
Shutdown to Output Low
tZL(SHDN)
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 3), (Notes 11, 12)
Full
-
-
250
ns
DRIVER SWITCHING CHARACTERISTICS (1Mbps Versions; ISL3153E, ISL3155E)
Driver Differential Output
Delay
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
150
270
400
ns
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
3
10
ns
Driver Differential Rise or
Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
150
325
450
ns
Maximum Data Rate
fMAX
CD = 820pF (Figure 4) (Note 17)
Full
1
8
-
Mbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND
(Figure 3), (Note 9)
Full
-
110
200
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 3), (Note 9)
Full
-
60
200
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 3)
Full
-
50
65
ns
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF, SW = GND
(Figure 3)
Full
-
35
60
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from
Shutdown to Output High
tZH(SHDN)
RL = 500Ω, CL = 100pF, SW = GND
(Figure 3), (Notes 11, 12)
Full
-
-
250
ns
Driver Enable from
Shutdown to Output Low
tZL(SHDN)
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 3), (Notes 11, 12)
Full
-
-
250
ns
7
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Electrical Specifications
PARAMETER
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,
TA = +25°C (Note 6). Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
SYMBOL
TEST CONDITIONS
TEMP
MIN
(°C) (Note 14)
TYP
MAX
(Note 14) UNITS
DRIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E)
Driver Differential Output
Delay
tPLH, tPHL
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
21
30
ns
Driver Differential Output
Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
0.2
3
ns
Driver Differential Rise or Fall
Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
12
16
ns
Maximum Data Rate
fMAX
CD = 470pF (Figure 4) (Note 17)
Full
20
55
-
Mbps
Driver Enable to Output High
tZH
RL = 500Ω, CL = 100pF, SW = GND
(Figure 3), (Note 9)
Full
-
30
45
ns
Driver Enable to Output Low
tZL
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 3), (Note 9)
Full
-
28
45
ns
Driver Disable from Output
Low
tLZ
RL = 500Ω, CL = 15pF, SW = VCC
(Figure 3)
Full
-
50
65
ns
Driver Disable from Output
High
tHZ
RL = 500Ω, CL = 15pF, SW = GND
(Figure 3)
Full
-
38
60
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Driver Enable from
Shutdown to Output High
tZH(SHDN)
RL = 500Ω, CL = 100pF, SW = GND
(Figure 3), (Notes 11, 12)
Full
-
-
200
ns
Driver Enable from
Shutdown to Output Low
tZL(SHDN)
RL = 500Ω, CL = 100pF, SW = VCC
(Figure 3), (Notes 11, 12)
Full
-
-
200
ns
RECEIVER SWITCHING CHARACTERISTICS (115kbps and 1Mbps Versions; ISL3150E through ISL3155E)
(Figure 5) (Note 17)
Full
1
12
-
Mbps
tPLH, tPHL
(Figure 5)
Full
-
100
150
ns
tSKD
(Figure 5)
Full
-
4
10
ns
Maximum Data Rate
Receiver Input to Output
Delay
fMAX
Receiver Skew | tPLH - tPHL |
Receiver Enable to Output
Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 6), (Note 10)
Full
-
9
20
ns
Receiver Enable to Output
High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 6), (Note 10)
Full
-
7
20
ns
Receiver Disable from
Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 6)
Full
-
8
15
ns
Receiver Disable from
Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 6)
Full
-
8
15
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Receiver Enable from
Shutdown to Output High
tZH(SHDN)
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 6), (Notes 11, 13)
Full
-
-
200
ns
Receiver Enable from
Shutdown to Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 6), (Notes 11, 13)
Full
-
-
200
ns
RECEIVER SWITCHING CHARACTERISTICS (20Mbps Versions; ISL3156E, ISL3158E)
Maximum Data Rate
Receiver Input to Output
Delay
fMAX
tPLH, tPHL
8
(Figure 5) (Note 17)
Full
20
30
-
Mbps
(Figure 5)
Full
-
33
45
ns
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Electrical Specifications
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V,
TA = +25°C (Note 6). Boldface limits apply over the operating temperature range,
-40°C to +85°C. (Continued)
PARAMETER
SYMBOL
Receiver Skew | tPLH - tPHL |
tSKD
TEMP
MIN
(°C) (Note 14)
TEST CONDITIONS
TYP
MAX
(Note 14) UNITS
(Figure 5)
Full
-
2.5
5
ns
Receiver Enable to Output
Low
tZL
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 6), (Note 10)
Full
-
8
15
ns
Receiver Enable to Output
High
tZH
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 6), (Note 10)
Full
-
7
15
ns
Receiver Disable from
Output Low
tLZ
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 6)
Full
-
8
15
ns
Receiver Disable from
Output High
tHZ
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 6)
Full
-
8
15
ns
(Note 11)
Full
60
160
600
ns
Time to Shutdown
tSHDN
Receiver Enable from
Shutdown to Output High
tZH(SHDN)
RL = 1kΩ, CL = 15pF, SW = GND
(Figure 6), (Notes 11, 13)
Full
-
-
200
ns
Receiver Enable from
Shutdown to Output Low
tZL(SHDN)
RL = 1kΩ, CL = 15pF, SW = VCC
(Figure 6), (Notes 11, 13)
Full
-
-
200
ns
NOTES:
6. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground
unless otherwise specified.
7. Supply current specification is valid for loaded drivers when DE = 0V.
8. Applies to peak current. See “Typical Performance Curves” beginning on page 14 for more information.
9. Keep RE = 0 to prevent the device from entering SHDN.
10. The RE signal high time must be short enough (typically <100ns) to prevent the device from entering SHDN.
11. Transceivers are put into shutdown by bringing RE high and DE low. If the inputs are in this state for less than 60ns, the parts
are guaranteed not to enter shutdown. If the inputs are in this state for at least 600ns, the parts are guaranteed to have entered
shutdown. See “Low Power Shutdown Mode” on page 13.
12. Keep RE = VCC, and set the DE signal low time >600ns to ensure that the device enters SHDN.
13. Set the RE signal high time >600ns to ensure that the device enters SHDN.
14. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established
by characterization and are not production tested.
15. See Figure 8 for more information, and for performance over-temperature.
16. Tested according to TIA/EIA-485-A, Section 4.2.6 (±100V for 15µs at a 1% duty cycle).
17. Limits established by characterization and are not production tested.
Test Circuits and Waveforms
VCC
RL/2
DE
DI
VCC
Z
DI
VOD
D
375Ω
DE
Z
VOD
D
Y
Y
RL/2
FIGURE 1A. VOD AND VOC
RL = 60Ω
VCM
-7V TO +12V
375Ω
VOC
FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
9
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Test Circuits and Waveforms (Continued)
3V
DI
1.5V
1.5V
0V
tPHL
tPLH
CL = 100pF
DE
VCC
OUT (Z)
VOH
OUT (Y)
VOL
Z
DI
RDIFF
D
Y
90%
DIFF OUT (Y - Z)
10%
CL = 100pF
SIGNAL
GENERATOR
+VOD
90%
10%
tR
-VOD
tF
SKEW = |tPLH - tPHL|
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2A. TEST CIRCUIT
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
Z
DI
500Ω
D
SIGNAL
GENERATOR
VCC
SW
Y
GND
CL
3V
DE
NOTE 10
1.5V
1.5V
0V
tZH, tZH(SHDN)
PARAMETER OUTPUT
RE
DI
SW
CL
(pF)
tHZ
Y/Z
X
1/0
GND
15
tLZ
Y/Z
X
0/1
VCC
15
tZH
Y/Z
0 (Note 9)
1/0
GND
100
tZL
Y/Z
0 (Note 9)
0/1
VCC
100
tZH(SHDN)
Y/Z
1 (Note 12)
1/0
GND
100
tZL(SHDN)
Y/Z
1 (Note 12)
0/1
VCC
100
NOTE 10
OUTPUT HIGH
tHZ
VOH - 0.5V
2.3V
OUT (Y, Z)
VOH
0V
tZL, tZL(SHDN)
tLZ
NOTE 10
VCC
OUT (Y, Z)
2.3V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3A. TEST CIRCUIT
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
VCC
3V
DE
+
Z
DI
60Ω
D
CD
Y
DI
0V
VOD
-
DIFF OUT (Y - Z)
SIGNAL
GENERATOR
FIGURE 4A. TEST CIRCUIT
+VOD
-VOD
0V
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER DATA RATE
10
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Test Circuits and Waveforms (Continued)
+1.5V
RE
0V
15pF
B
R
A
A
0V
0V
RO
-1.5V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
1.5V
RO
1.5V
0V
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5A. TEST CIRCUIT
FIGURE 5. RECEIVER PROPAGATION DELAY AND DATA RATE
RE
GND
B
A
R
1kΩ
RO
SIGNAL
GENERATOR
15pF
VCC
SW
NOTE 10
GND
RE
3V
1.5V
1.5V
0V
PARAMETER
DE
A
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH (Note 10)
0
+1.5V
GND
tZL (Note 10)
0
-1.5V
VCC
tZH(SHDN) (Note 13)
0
+1.5V
GND
tZL(SHDN) (Note 13)
0
-1.5V
VCC
FIGURE 6A. TEST CIRCUIT
tZH, tZH(SHDN)
NOTE 10
tHZ
OUTPUT HIGH
VOH - 0.5V
1.5V
RO
VOH
0V
tZL, tZL(SHDN)
tLZ
NOTE 10
RO
VCC
1.5V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES
11
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Receiver (Rx) Features
These devices utilize a differential input receiver for
maximum noise immunity and common mode rejection.
Input sensitivity is better than ±200mV, as required by
the RS-422 and RS-485 specifications.
Rx outputs feature high drive levels (typically 28mA @
VOL = 1V) to ease the design of optically coupled
isolated interfaces.
Receiver input resistance of 96kΩ surpasses the RS-422
specification of 4kΩ, and is eight times the RS-485 “Unit
Load (UL)” requirement of 12kΩ minimum. Thus, these
products are known as “one-eighth UL” transceivers, and
there can be up to 256 of these devices on a network
while still complying with the RS-485 loading
specification.
Rx inputs function with common mode voltages as great
as ±7V outside the power supplies (i.e., +12V and -7V),
making them ideal for long networks where induced
voltages are a realistic concern.
All the receivers include a “full fail-safe” function that
guarantees a high level receiver output if the receiver
inputs are unconnected (floating), shorted together, or
connected to a terminated bus with all the transmitters
disabled.
Receivers easily meet the data rates supported by the
corresponding driver, and all receiver outputs are
three-statable via the active low RE input.
Driver (Tx) Features
The RS-485/RS-422 driver is a differential output device
that delivers at least 2.4V across a 54Ω load (RS-485),
and at least 2.8V across a 100Ω load (RS-422). The
drivers feature low propagation delay skew to maximize
bit width, and to minimize EMI, and all drivers are
three-statable via the active high DE input.
12
The ISL315xE driver design delivers larger differential
output voltages (VOD) than the RS-485 standard
requires, or than most RS-485 transmitters can deliver.
The minimum ±2.4V VOD guarantees at least ±900mV
more noise immunity than networks built using standard
1.5V VOD transmitters.
Another advantage of the large VOD is the ability to drive
more than two bus terminations, which allows for
utilizing the ISL315xE in “star” and other
multi-terminated, “nonstandard” network topologies.
Figure 8, details the transmitter’s VOD vs IOUT
characteristic, and includes load lines for six (20Ω) and
eight (15Ω) 120Ω terminations. The figure shows that
the driver typically delivers 1.65/1.5V into 6/8
terminations, even at the worst case temperature of
+85°C. The RS-485 standard requires a minimum 1.5V
VOD into two terminations, but the ISL315xE delivers
RS-485 voltage levels with 3x to 4x the number of
terminations.
Hot Plug Function
When a piece of equipment powers up, there is a period
of time where the processor or ASIC driving the RS-485
control lines (DE, RE) is unable to ensure that the
RS-485 Tx and Rx outputs are kept disabled. If the
equipment is connected to the bus, a driver activating
prematurely during power-up may crash the bus. To
avoid this scenario, the ISL315xE devices incorporate a
“Hot Plug” function. Circuitry monitoring VCC ensures
that, during power-up and power-down, the Tx and Rx
outputs remain disabled, regardless of the state of DE
and RE, if VCC is less than ~3.4V. This gives the
processor/ASIC a chance to stabilize and drive the
RS-485 control lines to the proper states.
DE, DI = VCC
RE = GND
5.0
3.5V
3.3V
2.5
VCC
VCC (V)
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the
driver outputs and receiver inputs withstand signals that
range from +12V to -7V. RS-422 and RS-485 are
intended for runs as long as 4000’, so the wide CMR is
necessary to handle ground potential differences, as well
as voltages induced in the cable by external fields.
HIGH VOD IMPROVES NOISE IMMUNITY AND
FLEXIBILITY
0
5.0
RL = 1kΩ
2.5
0
A/Y
ISL315xE
RL = 1kΩ
RO
ISL315xE
TIME (40µs/DIV)
5.0
2.5
0
RECEIVER OUTPUT (V)
RS-485 and RS-422 are differential (balanced) data
transmission standards used for long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a
point-to-multipoint (multidrop) standard, which allows
only one driver and up to 10 (assuming one unit load
devices) receivers on each bus. RS-485 is a true
multipoint standard, which allows up to 32 one unit load
devices (any combination of drivers and receivers) on
each bus. To allow for multipoint operation, the RS-485
specification requires that drivers must handle bus
contention without sustaining any damage.
The 115kbps and 1Mbps driver outputs are slew rate
limited to minimize EMI, and to minimize reflections in
unterminated or improperly terminated networks.
Outputs of the ISL3156E and ISL3158E drivers are not
limited, so faster output transition times allow data rates
of at least 20Mbps.
DRIVER Y OUTPUT (V)
Application Information
FIGURE 7. HOT PLUG PERFORMANCE (ISL315xE) vs
ISL83088E WITHOUT HOT PLUG
CIRCUITRY
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
ESD Protection
All pins on these devices include class 3 (>7kV)
Human Body Model (HBM) ESD protection structures,
but the RS-485 pins (driver outputs and receiver
inputs) incorporate advanced structures allowing
them to survive ESD events in excess of ±16.5kV
HBM and ±16.5kV (1/2 duplex) IEC61000-4-2. The
RS-485 pins are particularly vulnerable to ESD strikes
because they typically connect to an exposed port on
the exterior of the finished product. Simply touching
the port pins, or connecting a cable, can cause an
ESD event that might destroy unprotected ICs. These
new ESD structures protect the device whether or not
it is powered up, and without degrading the RS-485
common mode range of -7V to +12V. This built-in
ESD protection eliminates the need for board level
protection structures (e.g., transient suppression
diodes), and the associated, undesirable capacitive
load they present.
IEC61000-4-2 Testing
The IEC61000 test method applies to finished
equipment, rather than to an individual IC. Therefore,
the pins most likely to suffer an ESD event are those that
are exposed to the outside world (the RS-485 pins in this
case), and the IC is tested in its typical application
configuration (power applied) rather than testing each
pin-to-pin combination. The IEC61000 standard’s lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe
than the HBM test. The extra ESD protection built into
this device’s RS-485 pins allows the design of equipment
meeting level 4 criteria without the need for additional
board level protection on the RS-485 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward
the IC pin until the voltage arcs to it. The current
waveform delivered to the IC pin depends on approach
speed, humidity, temperature, etc., so it is difficult to
obtain repeatable results. The ISL315xE 1/2 duplex
RS-485 pins withstand ±16.5kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and
predictable test, but equipment limits prevent testing
devices at voltages higher than ±9kV. The RS-485 pins of
all the ISL315xE versions survive ±9kV contact
discharges.
Data Rate, Cables, and Terminations
RS-485/RS-422 are intended for network lengths up to
4000’, but the maximum system data rate decreases as
the transmission length increases. Devices operating at
20Mbps are limited to lengths less than 100’, while the
115kbps versions can operate at full data rates with
lengths of several 1000’.
13
Twisted pair is the cable of choice for RS-485/RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
differential receivers in these ICs.
Proper termination is imperative, when using the 20Mbps
devices, to minimize reflections. Short networks using
the 115kbps versions need not be terminated, but,
terminations are recommended unless power dissipation
is an overriding concern.
In point-to-point, or point-to-multipoint (single driver on
bus) networks, the main cable should be terminated in
its characteristic impedance (typically 120Ω) at the end
farthest from the driver. In multi-receiver applications,
stubs connecting receivers to the main cable should be
kept as short as possible. Multipoint (multi-driver)
systems require that the main cable be terminated in its
characteristic impedance at both ends. Stubs connecting
a transceiver to the main cable should be kept as short
as possible.
Built-In Driver Overload Protection
As stated previously, the RS-485 specification requires
that drivers survive worst case bus contentions
undamaged. These devices meet this requirement via
driver output short circuit current limits, and on-chip
thermal shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current
never exceeds the RS-485 specification, even at the
common mode voltage range extremes.
In the event of a major short circuit condition, devices
also include a thermal shutdown feature that disables the
drivers whenever the die temperature becomes
excessive. This eliminates the power dissipation, allowing
the die to cool. The drivers automatically re-enable after
the die temperature drops about 15°C. If the contention
persists, the thermal shutdown/re-enable cycle repeats
until the fault is cleared. Receivers stay operational
during thermal shutdown.
Low Power Shutdown Mode
These CMOS transceivers all use a fraction of the power
required by their bipolar counterparts, but they also
include a shutdown feature that reduces the already low
quiescent ICC to a 70nA trickle. These devices enter
shutdown whenever the receiver and driver are
simultaneously disabled (RE = VCC and DE = GND)
for a period of at least 600ns. Disabling both the driver
and the receiver for less than 60ns guarantees that the
transceiver will not enter shutdown.
Note that receiver and driver enable times increase when
the transceiver enables from shutdown. Refer to Notes 9,
10, 11, 12 and 13, at the end of the “Electrical
Specification” table on page 9, for more information.
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
VCC = 5V, TA = +25°C; Unless Otherwise Specified.
DRIVER OUTPUT CURRENT (mA)
140
130
120
+25°C
+85°C
110
100
90
80
70
60
RD = 54Ω
RD = 15Ω
RD = 20Ω
50
40
RD = 100Ω
30
20
10
0
0
1
2
3
4
DIFFERENTIAL OUTPUT VOLTAGE (V)
DIFFERENTIAL OUTPUT VOLTAGE (V)
Typical Performance Curves
3.6
RDIFF = 100Ω
3.5
3.4
3.3
3.2
3.1
RDIFF = 54Ω
3.0
2.9
-40
5
-25
50
75
85
660
150
640
DE = VCC, RE = X
Y OR Z = LOW
620
50
600
ICC (µA)
100
0
-50
580
560
540
-100
DE = GND, RE = GND
Y OR Z = HIGH
-150
520
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
500
-40
12
-25
0
25
TEMPERATURE (°C)
50
75
85
FIGURE 11. SUPPLY CURRENT vs TEMPERATURE
FIGURE 10. DRIVER OUTPUT CURRENT vs SHORT
CIRCUIT VOLTAGE
4
1010
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
1005
PROPAGATION DELAY (ns)
25
FIGURE 9. DRIVER DIFFERENTIAL OUTPUT VOLTAGE
vs TEMPERATURE
200
-200
-7 -6
0
TEMPERATURE (°C)
FIGURE 8. DRIVER OUTPUT CURRENT vs
DIFFERENTIAL OUTPUT VOLTAGE
OUTPUT CURRENT (mA)
3.7
5
1000
6
SKEW (ns)
995
990
985
tPLH
980
975
9
11
965
960
-40
8
10
tPHL
970
7
-25
0
50
25
TEMPERATURE (°C)
75
85
FIGURE 12. DRIVER DIFFERENTIAL PROPAGATION
DELAY vs TEMPERATURE (ISL3150E,
ISL3152E)
14
12
-40
-25
0
25
50
TEMPERATURE (°C)
75
85
FIGURE 13. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3150E, ISL3152E)
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Typical Performance Curves
VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued)
290
1.0
1.5
286
284
SKEW (ns)
282
280
278
2.0
2.5
276
274
3.0
272
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
270
-40
-25
25
0
50
TEMPERATURE (°C)
75
3.5
-40
85
FIGURE 14. DRIVER DIFFERENTIAL PROPAGATION
DELAY vs TEMPERATURE (ISL3153E,
ISL3155E)
50
75
85
0.10
0.12
23
0.14
22
SKEW (ns)
0.16
21
20
0.18
0.20
0.22
19
0.24
18
0.26
17
-40
-25
25
0
50
TEMPERATURE (°C)
75
85
RDIFF = 54Ω, CL = 100pF
5
DI
0
5
RO
0
5
4
B/Z
3
2
A/Y
1
TIME (1μs/DIV)
FIGURE 18. DRIVER AND RECEIVER WAVEFORMS,
(ISL3150E, ISL3152E)
15
DRIVER INPUT (V)
FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION
DELAY vs TEMPERATURE (ISL3156E,
ISL3158E)
|CROSS PT. OF Y↑ AND Z↓ - CROSS PT. OF Y↓ AND Z↑|
0.28
-40
-25
0
25
50
75 85
TEMPERATURE (°C)
FIGURE 17. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3156E, ISL3158E)
DRIVER OUTPUT (V) RECEIVER OUTPUT (V)
PROPAGATION DELAY (ns)
0
25
TEMPERATURE (°C)
FIGURE 15. DRIVER DIFFERENTIAL SKEW vs
TEMPERATURE (ISL3153E, ISL3155E)
24
DRIVER OUTPUT (V) RECEIVER OUTPUT (V)
-25
RDIFF = 54Ω, CL = 100pF
5
DI
0
5
RO
0
DRIVER INPUT (V)
PROPAGATION DELAY (ns)
288
5
4
B/Z
3
2
A/Y
1
TIME (400ns/DIV)
FIGURE 19. DRIVER AND RECEIVER WAVEFORMS,
(ISL3153E, ISL3155E)
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
5
DI
0
5
RO
0
5
4
B/Z
3
2
A/Y
60
RECEIVER OUTPUT CURRENT (mA)
RDIFF = 54Ω, CL = 100pF
VCC = 5V, TA = +25°C; Unless Otherwise Specified. (Continued)
DRIVER INPUT (V)
DRIVER OUTPUT (V) RECEIVER OUTPUT (V)
Typical Performance Curves
VOL, +25°C
50
VOL, +85°C
40
30
VOH, +25°C
20
VOH, +85°C
10
0
1
TIME (20ns/DIV)
FIGURE 20. DRIVER AND RECEIVER WAVEFORMS,
(ISL3156E, ISL3158E)
0
1
2
3
4
RECEIVER OUTPUT VOLTAGE (V)
5
FIGURE 21. RECEIVER OUTPUT CURRENT vs
RECEIVER OUTPUT VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
530
PROCESS:
Si Gate BiCMOS
16
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to
web to make sure you have the latest Rev.
DATE
REVISION
CHANGE
6/30/09
FN6363.2
Converted to New Intersil Template. Rev 2 Changes are as follows:
Page 1 - Introduction was reworded in order to fit graphs. Features Section by listing only key
features. Added performance graphs.
Page 2 - Updated Ordering information by numbering all notes and referencing them on each
part. Added MSL Note as new standard with linked parts to device info page. Updated Pinout
name to Pin Configurations with Pin Descriptions following on page 3.
Page 5 - Added Boldface limit verbiage in Elect. spec table and bolded Min and Max over-temp
limits.
Page 17 - Added Revision History and Products information with all links included.
1/17/08
FN6363.1
Added 8 Ld PDIP to ordering information, POD and Thermal resistance. Applied Intersil
Standards as follows: Updated ordering information with Notes for tape and reel reference,
pb-free PDIP and lead finish. Added pb-free reflow link and pb-free note to Thermal
Information. Added E8.3 POD.
2/20/07
FN6363.0
Cosmetic edit to the ISL315xE data sheet, no rev, no date change, no formal per Denise
Scarborough. Removed both commas in this sentence in the first paragraph: "Each driver
output, and receiver input, is protected against ±16.5kV ESD strikes without latch-up."
12/14/06
FN6363.0
Initial Release to web
Products
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Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones,
handheld products, and notebooks. Intersil's product families address power management and analog signal
processing functions. Go to www.intersil.com/products for a complete list of Intersil product families.
*For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device
information page on intersil.com: ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff
FITs are available from our website at http://rel.intersil.com/reports/search.php
17
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Mini Small Outline Plastic Packages (MSOP)
N
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
INCHES
E
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
A
SEATING
PLANE -C-
A2
A1
b
-He
D
0.10 (0.004)
4X θ
L1
SEATING
PLANE
C
0.20 (0.008)
C
a
CL
E1
C D
MAX
MIN
MAX
NOTES
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
0.026 BSC
-B-
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
0.037 REF
N
C
0.20 (0.008)
MIN
A
L1
-A-
SIDE VIEW
SYMBOL
e
L
MILLIMETERS
0.95 REF
8
R
0.003
R1
0
α
-
8
-
0.07
0.003
-
5o
15o
0o
6o
7
-
-
0.07
-
-
5o
15o
-
0o
6o
Rev. 2 01/03
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums -A -H- .
and - B - to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
18
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Mini Small Outline Plastic Packages (MSOP)
N
M10.118 (JEDEC MO-187BA)
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
E
INCHES
SYMBOL
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
A
SEATING
PLANE -C-
A2
A1
b
-He
D
0.10 (0.004)
4X θ
L
SEATING
PLANE
C
-A0.20 (0.008)
C
C
a
SIDE VIEW
CL
E1
0.20 (0.008)
C D
-B-
END VIEW
MILLIMETERS
MAX
MIN
MAX
NOTES
A
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.007
0.011
0.18
0.27
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
e
L1
MIN
0.020 BSC
0.50 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
L1
0.037 REF
0.95 REF
-
N
10
10
7
R
0.003
-
0.07
-
-
R1
0.003
-
0.07
-
-
θ
5o
15o
5o
15o
-
α
0o
6o
0o
6o
Rev. 0 12/02
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Datums -A -H- .
and - B -
to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only
19
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Small Outline Plastic Packages (SOIC)
M14.15 (JEDEC MS-012-AB ISSUE C)
N
INDEX
AREA
H
0.25(0.010) M
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
α
e
A1
B
0.25(0.010) M
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.3367
0.3444
8.55
8.75
3
E
0.1497
0.1574
3.80
4.00
4
e
C
0.10(0.004)
B S
0.050 BSC
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
NOTES:
MILLIMETERS
α
14
0o
14
8o
0o
7
8o
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
20
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Dual-In-Line Plastic Packages (PDIP)
E8.3 (JEDEC MS-001-BA ISSUE D)
N
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
E1
INDEX
AREA
1 2 3
INCHES
N/2
-B-
-AD
E
BASE
PLANE
-C-
SEATING
PLANE
A2
A
L
D1
e
B1
D1
A1
eC
B
0.010 (0.25) M
C A B S
MILLIMETERS
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
C
L
B1
0.045
0.070
1.15
1.77
8, 10
eA
C
0.008
0.014
0.204
C
D
0.355
0.400
9.01
eB
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
eA
0.300 BSC
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
eB
-
L
0.115
5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and eA are measured with the leads constrained to be perpendicular to datum -C- .
5
D1
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
0.355
10.16
N
8
2.54 BSC
7.62 BSC
0.430
-
0.150
2.93
8
6
10.92
7
3.81
4
9
Rev. 0 12/93
7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
21
FN6363.2
July 30, 2009
ISL3150E, ISL3152E, ISL3153E, ISL3155E, ISL3156E, ISL3158E
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
SYMBOL
-B-
1
2
3
L
SEATING PLANE
-A-
A
D
h x 45°
-C-
e
A1
B
0.25(0.010) M
C
0.10(0.004)
C A M
MIN
MAX
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
α
B S
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
NOTES:
MILLIMETERS
8
0°
8
8°
0°
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
7
8°
Rev. 1 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
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at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by
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22
FN6363.2
July 30, 2009