SMP3022-01ETG N1741 REV.-

SMP3022-01ETG
Green Products
Technical Data
Data Sheet N1741 Rev.-
Description
The SMP3022 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide
protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2
international standard ( ± 20kV contact discharge) without performance degradation. The back-to-back
configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading
capacitance makes it ideal for protecting high speed data lines such as HDMI, USB2.0, USB3.0 and eSATA.
Features
•
•
•
•
ESD protection in accordance with:
IEC 61000-4-2 (ESD) ±30kV (air), ±20kV (contact)
IEC 61000-4-5 (lightning) 3A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Low capacitance of 0.35pF @ VR=0V (TYP)
Low leakage current of 100nA at 5.3V(MAX)
Extremely low dynamic resistance (0.7Ω TYP)
Applications
•
•
•
•
•
•
•
•
•
USB 3.0/USB 2.0/MHL
MIPI Camera and Display
HDMI 2.0, DisplayPort 1.3, eSATA
Set Top Boxes, Game Consoles
Smart Phones
External Storage
Ultrabooks, Notebooks
Tablets, eReaders
High Speed Serial Interfaces
Pinout
Functional Block Diagram
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SMP3022-01ETG
Green Products
Technical Data
Data Sheet N1741 Rev.-
Ordering Information:
Device
Package
Packaging Options
P0/P1
Packaging
Speciications
Min. Order
Qty.
SMP3022-01ETG
SOD882
Tape & Reel - 8mm
tape/7” reel
4mm/2mm
EIA RS-481
10000
Absolute Maximum Ratings:
Parameter
Symbol
Value
Unit
Peak Pulse Current (tp=8/20μs)
IPP
3.0
A
Operating Temperature
TOP
-40 to + 125
°C
Peak Pulse Power (tP=8/20μs)
PPK
20
W
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only
rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not
implied.
Thermal Information:
Parameter
Value
Unit
-55 to + 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
Storage Temperature Range
Electrical Characteristics: (TOP=25°C)
Characteristics
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamping Voltage1
Dynamic Resistance2
1
ESD With stand Voltage
Junction Capacitance1
Symbol
VRWM
VBR
ILEAK
VC
RDYN
VESD
CD
Condition
IR=1mA
VR =5.3V
IPP = 1A, tp=8/20μs, Fwd
Min.
6.8
-
Typ.
7.8
<10
-
Max.
5.3
9.0
100
12.0
Units
V
V
nA
V
TLP, tp=100ns, I/O to GND
-
0.7
-
IEC61000-4-2 (Contact)
IEC61000-4-2 (Air)
Reverse Bias=0V, f=1 MHz
±20
±30
-
0.35
0.5
Ω
kV
kV
pF
Note: 1 Parameter is guaranteed by design and/or device characterization.
2 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
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SMP3022-01ETG
Green Products
Technical Data
Data Sheet N1741 Rev.-
Marking Diagram:
Part Name Information
SMP 3022 – 01 E T G
G= Green
T= Tape & Reel
—
Package
E = SOD882
Number of Channels
Series
TVS Diode Arrays
Pulse Waveform
Clamping Voltage vs IPP
Transmission Line Pulsing (TLP) Plot
Capacitance vs. Reverse Bias
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SMP3022-01ETG
Green Products
Technical Data
Data Sheet N1741 Rev.-
Mechanical Dimensions (In mm/Inches):
Symbol
Recommended Soldering Pad Layout
Package
SOD882
JEDEC
MO-236
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.90
1.00
1.10
0.037
0.039
0.041
B
0.50
0.60
0.70
0.022
0.024
0.026
C
0.40
0.50
0.60
0.016
0.020
0.024
0.45
D
0.018
E
0.20
0.25
0.35
0.008
0.010
0.012
F
0.45
0.50
0.55
0.018
0.020
0.022
Embossed Carrier Tape & Reel Speciication — SOD882
Symb
ol
Tape Dimensions
Millimeters
Min
Max
A0
B0
K0
E
F
P0
P1
P2
T
W
Symbol
M
N
W
W1
H
S
K
R
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0.65
1.10
0.50
1.65
3.45
3.90
1.90
1.95
1.95
7.90
0.75
1.20
0.60
1.85
3.55
4.10
2.10
2.05
2.05
8.10
Reel Dimensions
(Size φ178)
Millimeters
Min
Max
177.0
179.0
59.0
61.0
11.0
12.0
8.5
9.5
12.5
13.5
1.9
2.1
10.8
11.2
0.95
1.05
SMP3022-01ETG
Technical Data
Data Sheet N1741 Rev.-
Green Products
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or
any other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC
- Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third
party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and
regulations..
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