TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3022 Series SP3022 Series 0.35pF 20kV Bidirectional Discrete TVS RoHS Pb GREEN The SP3022 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard (±20kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading capacitance makes it ideal for protecting high speed data lines such as HDMI,USB2.0, USB3.0 and eSATA. Features Pinout 0201 Flipchip 1 2 SOD882 1 2 • E SD protection of ±20kV contact discharge, ±30kV air discharge, (IEC61000-4-2) • L ow leakage current of 100nA at 5.3V (MAX) • EFT, IEC61000-4-4, 40A (5/50ns) • Extremely low dynamic resistance (0.7Ω TYP) • L ightning protection, IEC61000-4-5, 3A (tp=8/20µs) • AEC-Q101 qualified (SOD882 package) • Space efficient 0201 and 0402 footprint • Low capacitance of 0.35pF @ VR=0V (TYP) (AEC-Q101 qualified) Functional Block Diagram 1 Applications 2 • USB 3.0/USB 2.0/MHL • Smart Phones • MIPI Camera and Display • External Storage • HDMI 2.0, DisplayPort 1.3, eSATA • Ultrabooks, Notebooks • Set Top Boxes, Game Consoles • High Speed Serial Interfaces • Tablets, eReaders Additional Information Datasheet Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/27/15 Resources Samples SP3022 Description TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3022 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Units Rating Units -55 to 150 °C Peak Pulse Power (tP=8/20µs) 20 W IPP Peak Current (tp=8/20μs) 3.0 A Maximum Junction Temperature 150 °C TOP Operating Temperature °C Maximum Lead Temperature (Soldering 20-40s) 260 °C -40 to 125 SP3021 PPK Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions Min Reverse Breakdown Voltage VBR 1R=1mA Reverse Leakage Current ILEAK VR=5.3V VC IPP=1A, tp=8/20µs, Fwd RDYN TLP, tp=100ns, I/O to GND Clamp Voltage 1 Dynamic Resistance Typ Max Units 5.3 V 7.8 9.0 V <10 100 nA 12.0 V VRWM 2 ESD Withstand Voltage1 VESD 0.7 Ω IEC61000-4-2 (Contact) ±20 kV IEC61000-4-2 (Air) ±30 kV CD Diode Capacitance1 6.8 Reverse Bias=0V 0.35 0.5 pF Note: Parameter is guaranteed by design and/or device characterization. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Pulse Waveform Transmission Line Pulsing(TLP) Plot 22 110% 20 100% 90% 18 80% 16 TLP Current (A) 2 Percent of IPP 1 70% 60% 50% 40% 14 12 10 8 30% 6 20% 4 10% 2 0% 0.0 5.0 10.0 15.0 Time (μs) 20.0 25.0 30.0 0 0 5 10 15 20 25 30 TLP Voltage (V) © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/27/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3022 Series Clamping Voltage vs IPP Capacitance vs. Reverse Bias 0.5 16.0 0.4 12.0 Capacitance (pF) 10.0 8.0 6.0 4.0 0.3 0.2 0.1 2.0 0.0 1.0 1.5 2.0 2.5 SP3022 Clamp Voltage (VC ) 14.0 0.0 3.0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 Bias Voltage (V) Peak Pulse Current-IPP (A) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Lead Plating Sn Time 25°C to peak Temperature (TP) 8 minutes Max. Lead Material Copper Do not exceed 260°C Lead Coplanarity 6µm(max) Substrate material Silicon Body Material Silicon Time Product Characteristics of 0201 Flipchip Product Characteristics of SOD882 Lead Plating Pre-Plated Frame or Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/27/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3022 Series Ordering Information Part Number Package Marking Min. Order Qty. Packaging Option P0/P1 SP3022-01WTG 0201 Flipchip - 10000 Tape & Reel – 8mm tape/7” reel 4mm/2mm EIA RS-481 SP3022-01ETG SOD882 - 10000 Tape & Reel – 8mm tape/7” reel 4mm/2mm EIA RS-481 Part Numbering System Packaging Specification Part Marking System SP 3022 – 01 x T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel SP3022-01WTG Series Number of Channels SP3022-01ETG Package W: 0201 Flipchip E: SOD882 Package Dimensions — 0201 Flipchip 0201 Flipchip A Symbol B 0.30 F 0.28 D E D 0.75 0.19 C *Sizes in mm G Recommended Solder Pad Footprint Millimeters Inches Min Typ Max Min Typ Max A 0.595 0.620 0.645 0.0234 0.0244 0.0254 B 0.295 0.320 0.345 0.0116 0.0126 0.0136 C 0.245 0.275 0.305 0.0096 0.0108 0.0120 D 0.145 0.150 0.155 0.0057 0.0059 0.0061 E 0.245 0.250 0.255 0.0096 0.0098 0.0100 F 0.245 0.250 0.255 0.0096 0.0098 0.0100 G 0.005 0.010 0.015 0.0002 0.0004 0.0006 Package Dimensions — SOD882 Symbol 0.325 0.325 0.650 0.650 0.975 Package SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.95 1.00 1.05 0.037 0.039 0.041 B 0.55 0.60 0.65 0.022 0.024 0.026 C 0.50 0.55 0.60 0.020 0.022 0.024 0.45 D 0.018 E 0.20 0.25 0.30 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 Recommended Soldering Pad Layout © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/27/15 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3022 Series P1 P0 D P2 Symbol Millimeters A0 0.41+/-0.03 E B0 0.70+/-0.03 D ø 1.50 + 0.10 D1 ø 0.20 +/- 0.05 E 1.75+/-0.10 F 3.50+/-0.05 K0 0.38+/-0.03 F W D1 P0 4.00+/-0.10 P1 2.00+/-0.05 P2 2.00+/-0.05 W 8.00 + 0.30 -0.10 T 0.23+/-0.02 T A0 K0 B0 Embossed Carrier Tape & Reel Specification — SOD882 Notes : 1. All dimensions are in millimeters © 2015 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/27/15 Symbol Millimeters A0 0.70+/-0.045 B0 1.10+/-0.045 K0 0.65+/-0.045 F 3.50+/-0.05 P1 2.00+/-0.10 W 8.00 + 0.30 -0.10 SP3022 Embossed Carrier Tape & Reel Specification — 0201 Flipchip