Datasheet

TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3022 Series
SP3022 Series 0.35pF 20kV Bidirectional Discrete TVS
RoHS Pb GREEN
The SP3022 includes back-to-back TVS diodes fabricated
in a proprietary silicon avalanche technology to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes up to the
maximum level specified in the IEC61000-4-2 international
standard (±20kV contact discharge) without performance
degradation. The back-to-back configuration provides
symmetrical ESD protection for data lines when AC signals
are present and the low loading capacitance makes it ideal
for protecting high speed data lines such as HDMI,USB2.0,
USB3.0 and eSATA.
Features
Pinout
0201 Flipchip
1
2
SOD882
1
2
• E
SD protection of ±20kV
contact discharge,
±30kV air discharge,
(IEC61000-4-2)
• L
ow leakage current of
100nA at 5.3V (MAX)
• EFT, IEC61000-4-4, 40A
(5/50ns)
• Extremely low dynamic
resistance (0.7Ω TYP)
• L
ightning protection,
IEC61000-4-5, 3A
(tp=8/20µs)
• AEC-Q101 qualified
(SOD882 package)
• Space efficient 0201 and
0402 footprint
• Low capacitance of
0.35pF @ VR=0V (TYP)
(AEC-Q101 qualified)
Functional Block Diagram
1
Applications
2
• USB 3.0/USB 2.0/MHL
• Smart Phones
• MIPI Camera and Display
• External Storage
• HDMI 2.0, DisplayPort
1.3, eSATA
• Ultrabooks, Notebooks
• Set Top Boxes, Game
Consoles
• High Speed Serial
Interfaces
• Tablets, eReaders
Additional Information
Datasheet
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/27/15
Resources
Samples
SP3022
Description
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3022 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Parameter
Units
Rating
Units
-55 to 150
°C
Peak Pulse Power (tP=8/20µs)
20
W
IPP
Peak Current (tp=8/20μs)
3.0
A
Maximum Junction Temperature
150
°C
TOP
Operating Temperature
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
-40 to 125
SP3021
PPK
Storage Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
Min
Reverse Breakdown Voltage
VBR
1R=1mA
Reverse Leakage Current
ILEAK
VR=5.3V
VC
IPP=1A, tp=8/20µs, Fwd
RDYN
TLP, tp=100ns, I/O to GND
Clamp Voltage
1
Dynamic Resistance
Typ
Max
Units
5.3
V
7.8
9.0
V
<10
100
nA
12.0
V
VRWM
2
ESD Withstand Voltage1
VESD
0.7
Ω
IEC61000-4-2 (Contact)
±20
kV
IEC61000-4-2 (Air)
±30
kV
CD
Diode Capacitance1
6.8
Reverse Bias=0V
0.35
0.5
pF
Note:
Parameter is guaranteed by design and/or device characterization.
Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
Pulse Waveform
Transmission Line Pulsing(TLP) Plot
22
110%
20
100%
90%
18
80%
16
TLP Current (A)
2
Percent of IPP
1
70%
60%
50%
40%
14
12
10
8
30%
6
20%
4
10%
2
0%
0.0
5.0
10.0
15.0
Time (μs)
20.0
25.0
30.0
0
0
5
10
15
20
25
30
TLP Voltage (V)
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/27/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3022 Series
Clamping Voltage vs IPP
Capacitance vs. Reverse Bias
0.5
16.0
0.4
12.0
Capacitance (pF)
10.0
8.0
6.0
4.0
0.3
0.2
0.1
2.0
0.0
1.0
1.5
2.0
2.5
SP3022
Clamp Voltage (VC )
14.0
0.0
3.0
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
3
3.3
Bias Voltage (V)
Peak Pulse Current-IPP (A)
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
25
tS
time to peak temperature
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Lead Plating
Sn
Time 25°C to peak Temperature (TP)
8 minutes Max.
Lead Material
Copper
Do not exceed
260°C
Lead Coplanarity
6µm(max)
Substrate material
Silicon
Body Material
Silicon
Time
Product Characteristics of 0201 Flipchip
Product Characteristics of SOD882
Lead Plating
Pre-Plated Frame or Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/27/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3022 Series
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
Packaging Option
P0/P1
SP3022-01WTG
0201 Flipchip
-
10000
Tape & Reel – 8mm tape/7” reel
4mm/2mm
EIA RS-481
SP3022-01ETG
SOD882
-
10000
Tape & Reel – 8mm tape/7” reel
4mm/2mm
EIA RS-481
Part Numbering System
Packaging Specification
Part Marking System
SP 3022 – 01 x T G
TVS Diode Arrays
(SPA® Diodes)
G= Green
T= Tape & Reel
SP3022-01WTG
Series
Number of
Channels
SP3022-01ETG
Package
W: 0201 Flipchip
E: SOD882
Package Dimensions — 0201 Flipchip
0201 Flipchip
A
Symbol
B
0.30
F
0.28
D
E
D
0.75
0.19
C
*Sizes in mm
G
Recommended Solder Pad Footprint
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.595
0.620
0.645
0.0234
0.0244
0.0254
B
0.295
0.320
0.345
0.0116
0.0126
0.0136
C
0.245
0.275
0.305
0.0096
0.0108
0.0120
D
0.145
0.150
0.155
0.0057
0.0059
0.0061
E
0.245
0.250
0.255
0.0096
0.0098
0.0100
F
0.245
0.250
0.255
0.0096
0.0098
0.0100
G
0.005
0.010
0.015
0.0002
0.0004
0.0006
Package Dimensions — SOD882
Symbol
0.325
0.325
0.650
0.650
0.975
Package
SOD882
JEDEC
MO-236
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.95
1.00
1.05
0.037
0.039
0.041
B
0.55
0.60
0.65
0.022
0.024
0.026
C
0.50
0.55
0.60
0.020
0.022
0.024
0.45
D
0.018
E
0.20
0.25
0.30
0.008
0.010
0.012
F
0.45
0.50
0.55
0.018
0.020
0.022
Recommended Soldering Pad Layout
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/27/15
TVS Diode Arrays (SPA® Diodes)
Low Capacitance ESD Protection - SP3022 Series
P1
P0
D
P2
Symbol
Millimeters
A0
0.41+/-0.03
E
B0
0.70+/-0.03
D
ø 1.50 + 0.10
D1
ø 0.20 +/- 0.05
E
1.75+/-0.10
F
3.50+/-0.05
K0
0.38+/-0.03
F
W
D1
P0
4.00+/-0.10
P1
2.00+/-0.05
P2
2.00+/-0.05
W
8.00 + 0.30 -0.10
T
0.23+/-0.02
T
A0
K0
B0
Embossed Carrier Tape & Reel Specification — SOD882
Notes :
1. All dimensions are in millimeters
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 05/27/15
Symbol
Millimeters
A0
0.70+/-0.045
B0
1.10+/-0.045
K0
0.65+/-0.045
F
3.50+/-0.05
P1
2.00+/-0.10
W
8.00 + 0.30 -0.10
SP3022
Embossed Carrier Tape & Reel Specification — 0201 Flipchip