TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3021 Series SP3021 Series 0.5pF 8kV Bidirectional Discrete TVS RoHS Pb GREEN The SP3021 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard without performance degradation. The back-toback configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features 1 • Low capacitance of 0.5pF @ VR=0V • E SD protection of ±8kV contact discharge, ±15kV air discharge, (IEC61000-4-2) • L ow leakage current of 1μA at 5V • EFT, IEC61000-4-4, 40A (5/50ns) • 0402 small footprint available • L ightning protection, IEC61000-4-5, 2A (tp=8/20µs) Applications 2 • USB 3.0/USB 2.0 • Smart Phones • MHL/MIPI/MDDI • External Storage • HDMI, Display Port, eSATA • Ultrabooks, Notebooks • Tablets, eReaders • Set Top Boxes, Game Consoles Functional Block Diagram USB3.0 Application Example USB Port USB Controller VBUS SP1003 *Packages are shown as transparent 1 D+ 2 IC DSSTX+ SSTXSSRX+ SSRX- Pin 1 Signal Ground Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. SP3021x6 1 Revision: June 4, 2012 SP3021 Series SP3021 Description TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3021 Series Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.0 A TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C Parameter Rating Units -65 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions Min 7.0 VRWM Reverse Breakdown Voltage VBR 1R=1mA Reverse Leakage Current ILEAK VR=5V Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance Typ Units 5.0 V V 1 µA IPP=1A, tp=8/20µs, Fwd 13.1 V IPP=2A, tp=8/20µs, Fwd 14.7 V (VC2-VC1)/(IPP2-IPP1) 1.6 Ω IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV CD 1 Max Reverse Bias=0V 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 1 0.9 0 0.8 Attenuation (dB) Capacitance (pF) 0.7 0.6 0.5 0.4 0.3 -5 -10 -15 -20 0.2 -25 0.1 -30 0 0 1 2 3 4 -35 5 DC Bias (V) 10 Pulse Waveform 100 Frequency (MHz) 1000 Transmission Line Pulsing(TLP) Plot 110% 100% 90% TLP Current (A) Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) TLP Voltage (V) SP3021 Series 2 Revision: June 4, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. SP3021 Thermal Information Absolute Maximum Ratings TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3021 Series Product Characteristics Ordering Information Pre-Plated Frame or Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Part Number Package Marking Min. Order Qty. SP3021-01ETG SOD882 •e 3000 SP3021 Lead Plating Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Part Marking System SP 3021 – 01 E T G Series Number of Channels Critical Zone TL to TP Ramp-up TL TS(max) 25 Part Numbering System Silicon Protection Array (SPATM) Family of TVS Diode Arrays tP TP Temperature Reflow Condition SOD882 G= Green e T= Tape & Reel Package E: SOD882 Pin 1 Indicator 3 Revision: June 4, 2012 Product ID SP3021 Series TVS Diode Arrays (SPA™ Family of Products) Low Capacitance ESD Protection - SP3021 Series Package Dimensions — SOD882 Symbol Package SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.95 1.00 1.05 0.037 0.039 0.041 B 0.55 0.60 0.65 0.022 0.024 0.026 C 0.50 0.55 0.60 0.020 0.022 0.024 0.45 D 0.018 E 0.20 0.25 0.30 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 Recommanded Soldering Pad Layout Embossed Carrier Tape & Reel Specification — SOD882 Symbol Millimeters A0 0.70+/-0.045 B0 1.10+/-0.045 K0 0.65+/-0.045 F 3.50+/-0.05 P1 2.00+/-0.10 W 8.00 + 0.30 -0.10 Notes : 1. All dimensions are in millimeters SP3021 Series 4 Revision: June 4, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.