MCP39F511 DATA SHEET (12/07/2015) DOWNLOAD

MCP39F511
Power-Monitoring IC with Calculation and Energy Accumulation
Features
Description
• Power Monitoring Accuracy Capable of 0.1%
Error Across 4000:1 Dynamic Range
• Built-In Calculations on Fast 16-Bit Processing
Core
- Active, Reactive, Apparent Power
- True RMS Current, RMS Voltage
- Line Frequency, Power Factor
• 64-bit Wide Import and Export Active Energy
Accumulation Registers
• 64-bit Four Quadrant Reactive Energy
Accumulation Registers
• Signed Active and Reactive Power Outputs
• Dedicated Zero Crossing Detection (ZCD) Pin
Output with Less than 200 µs Latency
• Dedicated PWM Output Pin with Programmable
Frequency and Duty Cycle
• Automatic Event Pin Control through Fast Voltage
Surge Detection Less than 5 ms Delay
• Two Wire Serial Protocol with Selectable Baud
Rate Up to 115.2 kbps using Universal
Asynchronous Receiver/Transmitter (UART)
• Four Independent Registers for Minimum and
Maximum Output Quantity Tracking
• Fast Calibration Routines and Simplified
Command Protocol
• 512 Bytes User-Accessible EEPROM through
Page Read/Write Commands
• Low-Drift Internal Voltage Reference, 10 ppm/°C
Typical
• 28-lead 5x5 QFN Package
• Extended Temperature Range -40°C to +125°C
The MCP39F511 is a highly integrated, complete
single-phase power-monitoring IC designed for
real-time measurement of input power for
AC/DC power supplies, power distribution units,
consumer and industrial applications. It includes
dual-channel Delta-Sigma ADCs, a 16-bit calculation
engine, EEPROM and a flexible 2-wire interface. An
integrated low-drift voltage reference with 10 ppm/°C in
addition to 94.5 dB of SINAD performance on each
measurement channel allows for better than 0.1%
accurate designs across a 4000:1 dynamic range.
Applications
• Power Monitoring for Home Automation
• Industrial Lighting Power Monitoring
• Real-Time Measurement of Input Power for
AC/DC Supplies
• Intelligent Power Distribution Units
 2015 Microchip Technology Inc.
Package Types
ZCD
REFIN+/OUT
MCLR
DVDD
DGND
DGND
DR
MCP39F511
5x5 QFN*
28 27 26 25 24 23 22
21 AGND
EVENT1 1
NC 2
20 AN_IN
NC 3
19 V1+
EP
29
UART_RX 4
COMMONA 5
18 V117 I116 I1+
OSCI 6
15 EVENT2
OSCO 7
PWM
COMMONB
UART_TX
AVDD
RESET
NC
9 10 11 12 13 14
NC
8
*Includes Exposed Thermal Pad (EP);
see Table 3-1.
DS20005393B-page 1
MCP39F511
Functional Block Diagram
I1+
I1-
V1+
V1-
+
PGA
-
+
PGA
-
AN_IN
DS20005393B-page 2
AVDD
AGND
DVDD
DGND
Internal
Oscillator
24-bit Delta-Sigma
Multi-level
Modulator ADC
24-bit Delta-Sigma
Multi-level
Modulator ADC
10-bit SAR
ADC
SINC3
Digital Filter
OSCO
Timing
Generation
SINC3
Digital Filter
OSCI
UART
Serial
Interface
16-BIT
CORE
FLASH
UART_TX
UART_RX
PWM
EVENT1
Calculation
Engine
(CE)
EVENT2
Digital Outputs
ZCD
 2015 Microchip Technology Inc.
MCP39F511
MCP39F511 Typical Application – Single Phase, Two-Wire Application Schematic
10 
1 µF
LOAD
0.1 µF
0.1 µF
AVDD DVDD RESET
1 k
REFIN/OUT+
I1+
+
+3.3V
0.1 µF
33 nF
2 m
-
UART_TX
1 k
to MCU UART
I133 nF
1 k
UART_RX
V1-
to MCU UART
33 nF
MCP39F511
499 k 499 k
(OPTIONAL)
V1+
1 k
33 nF
N.C.
Leave Floating
Connect on PCB
+3.3V
MCP9700A
NC
NC
NC
NC
DR
COMMONA,B
EVENT1
EVENT2
ZCD
AN_IN
PWM
OSCO
4 MHz
OSCI
22 pF
DGND
AGND
22 pF
(OPTIONAL)
+3.3V
0.47 µ F 470
MCP1754
0.01 µF
N
L
DGND
470 µF
AGND
Note 1: The MCP39F511 demonstration board uses a switching power supply, however a low-cost
capacitive-based supply, as shown here, is sufficient for many applications.
2: The external sensing components shown here, a 2 mΩ shunt, two 499 kΩ and 1 kΩ resistors for the
1000:1 voltage divider, are specifically chosen to match the default values for the calibration registers
defined in Section 6.0 “Register Descriptions”. By choosing low-tolerance components of these
values (e.g. 1% tolerance), measurement accuracy in the 2-3% range can be achieved with zero
calibration. See Section 9.0 “MCP39F511 Calibration” for more information.
 2015 Microchip Technology Inc.
DS20005393B-page 3
MCP39F511
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
DVDD .................................................................. -0.3 to +4.5V
AVDD .................................................................. -0.3 to +4.0V
Digital inputs and outputs w.r.t. AGND ............... -0.3V to +4.0V
Analog Inputs (I+,I-,V+,V-) w.r.t. AGND ............... ....-2V to +2V
VREF input w.r.t. AGND ........................ ....-0.6V to AVDD +0.6V
Maximum Current out of DGND pin..............................300 mA
Maximum Current into DVDD pin .................................250 mA
Maximum Output Current Sunk by Digital IO ................25 mA
Maximum Current Sourced by Digital IO.......................25 mA
Storage temperature .....................................-65°C to +150°C
Ambient temperature with power applied......-40°C to +125°C
Soldering temperature of leads (10 seconds) ............. +300°C
ESD on the analog inputs (HBM,MM) .................4.0 kV, 200V
ESD on all other pins (HBM,MM) ........................4.0 kV, 200V
1.1
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operation listings of this specification is
not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Specifications
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = +2.7 to +3.6V, TA = -40°C to +125°C,
MCLK = 4 MHz, PGA GAIN = 1.
Characteristic
Sym.
Min.
Typ.
Max.
Units
Test Conditions
Active Power (Note 1)
P
—
±0.1
—
%
4000:1 Dynamic Range
on Current Channel
(Note 2)
Reactive Power (Note 1)
Q
—
±0.1
—
%
4000:1 Dynamic Range
on Current Channel
(Note 2)
Apparent Power (Note 1)
S
—
±0.1
—
%
4000:1 Dynamic Range
on Current Channel
(Note 2)
Current RMS (Note 1)
IRMS
—
±0.1
—
%
4000:1 Dynamic Range
on Current Channel
(Note 2)
Voltage RMS (Note 1)
VRMS
—
±0.1
—
%
4000:1 Dynamic Range
on Voltage Channel
(Note 2)
Power Measurement
Power Factor (Note 1)

—
±0.1
—
%
Line Frequency (Note 1)
LF
—
±0.1
—
%
Note 1:
2:
Calculated from reading the register values with no averaging, single computation cycle with accumulation interval of 4
line cycles.
Specification by design and characterization; not production tested.
3:
N = Value in the Accumulation Interval Parameter register. The default value of this register is 2 or TCAL = 80 ms for
50 Hz line.
4:
5:
Applies to Voltage Sag and Voltage Surge events only.
Applies to all gains. Offset and gain errors depend on the PGA gain setting. See Section 2.0 “Typical Performance
Curves” for typical performance.
VIN = 1VPP = 353 mVRMS @ 50/60 Hz.
6:
7:
Variation applies to internal clock and UART only. All calculated output quantities are temperature compensated to the
performance listed in the respective specification.
8:
Lower baud rates selectable only on system versions 0xFA14 and later.
DS20005393B-page 4
 2015 Microchip Technology Inc.
MCP39F511
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = +2.7 to +3.6V, TA = -40°C to +125°C,
MCLK = 4 MHz, PGA GAIN = 1.
Characteristic
Sym.
Min.
Typ.
Max.
Units
Test Conditions
2N x (1/fLINE)
—
ms
Note 3
see
—
ms
Note 4
Calibration, Calculation and Event Detection Times
Auto-Calibration Time
tCAL
—
Minimum Time
for Voltage Surge/Sag
Detection
tAC_SASU
—
Section 7.0
24-Bit Delta-Sigma ADC Performance
Analog Input
Absolute Voltage
VIN
-1
—
+1
V
Analog Input
Leakage Current
AIN
—
1
—
nA
Differential Input
Voltage Range
(I1+ – I1-),
(V1+ – V1-)
-600/GAIN
—
+600/GAIN
mV
VOS
-1
—
+1
mV
Offset Error
Offset Error Drift
Gain Error
—
0.5
—
µV/°C
GE
-4
—
+4
%
—
1
—
ppm/°C
ZIN
232
—
—
k
142
—
—
k
G=2
72
—
—
k
G=4
Gain Error Drift
Differential Input
Impedance
Signal-to-Noise
and Distortion Ratio
VREF = 1.2V,
proportional to VREF
SINAD
Note 5
G=1
38
—
—
k
G=8
36
—
—
k
G = 16
33
—
—
k
G = 32
92
94.5
—
dB
Note 6
Total Harmonic Distortion
THD
—
-106.5
-103
dBc
Note 6
Signal-to-Noise Ratio
SNR
92
95
—
dB
Note 6
SFDR
—
111
—
dB
Note 6
Spurious Free
Dynamic Range
Crosstalk
CTALK
—
-122
—
dB
AC Power
Supply Rejection Ratio
AC PSRR
—
-73
—
dB
AVDD and
DVDD = 3.3V + 0.6VPP,
100 Hz, 120 Hz, 1 kHz
DC Power
Supply Rejection Ratio
DC PSRR
—
-73
—
dB
AVDD and DVDD = 3.0 to
3.6V
Note 1:
2:
Calculated from reading the register values with no averaging, single computation cycle with accumulation interval of 4
line cycles.
Specification by design and characterization; not production tested.
3:
N = Value in the Accumulation Interval Parameter register. The default value of this register is 2 or TCAL = 80 ms for
50 Hz line.
4:
5:
Applies to Voltage Sag and Voltage Surge events only.
Applies to all gains. Offset and gain errors depend on the PGA gain setting. See Section 2.0 “Typical Performance
Curves” for typical performance.
VIN = 1VPP = 353 mVRMS @ 50/60 Hz.
6:
7:
Variation applies to internal clock and UART only. All calculated output quantities are temperature compensated to the
performance listed in the respective specification.
8:
Lower baud rates selectable only on system versions 0xFA14 and later.
 2015 Microchip Technology Inc.
DS20005393B-page 5
MCP39F511
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = +2.7 to +3.6V, TA = -40°C to +125°C,
MCLK = 4 MHz, PGA GAIN = 1.
Characteristic
DC Common
Mode Rejection Ratio
Sym.
Min.
Typ.
Max.
Units
DC CMRR
—
-105
—
dB
Test Conditions
VCM varies
from -1V to +1V
10-Bit SAR ADC Performance for Temperature Measurement
Resolution
NR
—
10
—
bits
Absolute Input Voltage
VIN
DGND - 0.3
—
DVDD + 0.3
V
Recommended
Impedance of
Analog Voltage Source
RIN
—
—
2.5
k
Integral Nonlinearity
INL
—
±1
±2
LSb
Differential Nonlinearity
DNL
—
±1
±1.5
LSb
Gain Error
GERR
—
±1
±3
LSb
Offset Error
EOFF
—
±1
±2
LSb
—
fLINE/2N
—
sps
Note 7
See Section 3.2 for
protocol details
Temperature
Measurement Rate
Clock and Timings
UART Baud Rate
UDB
1.2 (8)
—
115.2
kbps
Master Clock
and Crystal Frequency
fMCLK
-2%
4
+2%
MHz
Capacitive Loading
on OSCO pin
COSC2
—
—
15
pF
When an external clock is
used to drive the device
Internal Oscillator
Tolerance
fINT_OSC
—
2
—
%
-40 to +85°C only
(Note 7)
VREF
-2%
1.2
+2%
V
TCVREF
—
10
—
ZOUTVREF
—
2
—
k
AIDDVREF
—
40
—
µA
—
—
10
pF
VREF+
AGND + 1.1V
—
AGND + 1.3V
V
Internal Voltage Reference
Internal Voltage
Reference Tolerance
Temperature Coefficient
Output Impedance
Current, VREF
ppm/°C TA = -40°C to +85°C,
VREFEXT = 0
Voltage Reference Input
Input Capacitance
Absolute Voltage on
VREF+ Pin
Note 1:
2:
Calculated from reading the register values with no averaging, single computation cycle with accumulation interval of 4
line cycles.
Specification by design and characterization; not production tested.
3:
N = Value in the Accumulation Interval Parameter register. The default value of this register is 2 or TCAL = 80 ms for
50 Hz line.
4:
5:
Applies to Voltage Sag and Voltage Surge events only.
Applies to all gains. Offset and gain errors depend on the PGA gain setting. See Section 2.0 “Typical Performance
Curves” for typical performance.
VIN = 1VPP = 353 mVRMS @ 50/60 Hz.
6:
7:
Variation applies to internal clock and UART only. All calculated output quantities are temperature compensated to the
performance listed in the respective specification.
8:
Lower baud rates selectable only on system versions 0xFA14 and later.
DS20005393B-page 6
 2015 Microchip Technology Inc.
MCP39F511
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = +2.7 to +3.6V, TA = -40°C to +125°C,
MCLK = 4 MHz, PGA GAIN = 1.
Characteristic
Sym.
Min.
Typ.
Max.
Units
AVDD, DVDD
2.7
—
3.6
V
DVDD Start Voltage
to Ensure Internal
Power-On Reset Signal
VPOR
DGND
—
0.7
V
DVDD Rise Rate to
Ensure Internal
Power-On Reset Signal
SDVDD
0.05
—
—
V/ms
AVDD Start Voltage to
Ensure Internal
Power-On Reset Signal
VPOR
AGND
—
2.1
V
SAVDD
0.042
—
—
V/ms
IDD
—
13
—
mA
Cell Endurance
EPS
100,000
—
—
E/W
Self-Timed
Write Cycle Time
TIWD
—
4
—
ms
Number of Total
Write/Erase Cycles
Before Refresh
RREF
—
10,000,000
—
E/W
TRETDD
40
—
—
years
IDDPD
—
7
—
mA
Test Conditions
Power Specifications
Operating Voltage
AVDD Rise Rate to
Ensure Internal Power On
Reset Signal
Operating Current
0 – 3.3V in 0.1s, 0 – 2.5V
in 60 ms
0 – 2.4V in 50 ms
Data EEPROM Memory
Characteristic Retention
Supply Current during
Programming
Note 1:
2:
Provided no other
specifications are violated
Calculated from reading the register values with no averaging, single computation cycle with accumulation interval of 4
line cycles.
Specification by design and characterization; not production tested.
3:
N = Value in the Accumulation Interval Parameter register. The default value of this register is 2 or TCAL = 80 ms for
50 Hz line.
4:
5:
Applies to Voltage Sag and Voltage Surge events only.
Applies to all gains. Offset and gain errors depend on the PGA gain setting. See Section 2.0 “Typical Performance
Curves” for typical performance.
VIN = 1VPP = 353 mVRMS @ 50/60 Hz.
6:
7:
Variation applies to internal clock and UART only. All calculated output quantities are temperature compensated to the
performance listed in the respective specification.
8:
Lower baud rates selectable only on system versions 0xFA14 and later.
 2015 Microchip Technology Inc.
DS20005393B-page 7
MCP39F511
TABLE 1-2:
SERIAL DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = +2.7 to+ 3.6V,
TA = -40°C to +125°C, MCLK = 4 MHz
Characteristic
Sym.
Min.
High-Level Input Voltage
VIH
0.8 DVDD
Low-Level Input Voltage
VIL
0
High-Level Output Voltage
VOH
3
Low-Level Output Voltage
VOL
—
ILI
—
Input Leakage Current
TABLE 1-3:
Typ.
Max.
Units
Test Conditions
—
DVDD
V
—
0.2 DVDD
V
—
—
V
IOH = -3.0 mA, VDD = 3.6V
—
0.4
V
IOL = 4.0 mA, VDD = 3.6V
—
1
µA
0.050
0.100
Digital Output pins only
(ZCD, PWM, EVENT1,
EVENT2)
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all parameters apply at AVDD, DVDD = +2.7 to +3.6V.
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
36.9
—
°C/W
Conditions
Temperature Ranges
Thermal Package Resistances
Thermal Resistance, 28LD 5x5 QFN
DS20005393B-page 8
 2015 Microchip Technology Inc.
MCP39F511
2.0
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
0.50%
0.40%
0.30%
0.20%
0.10%
0.00%
-0.10%
-0.20%
-0.30%
-0.40%
-0.50%
0.01
0.1
1
10
100
1000
Current Channel Input Amplitude (mVPEAK)
FIGURE 2-1:
Active Power, Gain = 1.
0
fIN = -60 dBFS @ 60 Hz
fD = 3.9 ksps
16384 pt FFT
OSR = 256
-20
-40
Amplitude (dB)
Measurement Error (%)
Note: Unless otherwise indicated, AVDD = +3.3V, DVDD = +3.3V, TA = +25°C, GAIN = 1, VIN = -0.5 dBFS at 60 Hz.
-60
-80
-100
-120
-140
-160
-180
-200
0
200 400 600 800 1000 1200 1400 1600 1800 2000
Frequency (Hz)
FIGURE 2-4:
Spectral Response.
RMS Current, Gain = 1.
1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
1
10
100
1000
10000
-105.8
-105.9
-106.1
-106.2
Total Harmonic Distortion (-dBc)
FIGURE 2-5:
Total HDrmonic Distortion(dBc)
Energy Accumulation Error (%)
FIGURE 2-2:
1000
-106.4
1
10
100
Input Voltage RMS (mVPP)
-106.5
0.1
-106.7
-0.100%
-106.8
-0.050%
-107.0
0.000%
-107.1
0.050%
-107.3
Frequency of Occurrence
RMS Current Error (%)
0.100%
100000
THD Histogram.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
G=1
G=8
-50
-25
0
G=2
G = 16
25
50
75
Temperature (°C)
G=4
G = 32
100
125
150
Energy Accumulation (Watt-Hours)
FIGURE 2-3:
Energy, Gain = 8.
 2015 Microchip Technology Inc.
FIGURE 2-6:
THD vs. Temperature.
DS20005393B-page 9
MCP39F511
Note: Unless otherwise indicated, AVDD = 3.3V, DVDD = 3.3V, TA = +25°C, GAIN = 1, VIN = -0.5 dBFS at 60 Hz.
Frequency of Occurrence
Internal Voltage Reference (V)
1.2008
94.2 94.3 94.5 94.6 94.8 94.9 95.1 95.2 95.4 95.5
Signal-to-Noise and Distortion Ratio (dB)
Signal-to-Noise and Distortion
Ratio (dB)
FIGURE 2-7:
SNR Histogram.
100
90
80
70
60
50
40
30
20
10
0
G=1
G=8
-50
-25
0
FIGURE 2-8:
G=2
G = 16
1.2007
1.2006
1.2005
1.2004
1.2003
1.2002
1.2001
1.2000
1.1999
-50
FIGURE 2-10:
vs. Temperature.
0
50
100
Temperature (C)
150
Internal Voltage Reference
G=4
G = 32
25
50
75 100 125 150
Temperature (°C)
SINAD vs. Temperature.
5
4
Gain Error (%)
3
2
1
0
-1
-2
-3
G=1
G=8
-4
-5
-50
-25
0
25
G=2
G = 16
50
75
G=4
G = 32
100
125
150
Temperature (°C)
FIGURE 2-9:
DS20005393B-page 10
Gain Error vs. Temperature.
 2015 Microchip Technology Inc.
MCP39F511
3.0
PIN DESCRIPTION
The description of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP39F511
5x5 QFN
Symbol
1
EVENT1
2, 3, 8, 9
NC
Function
Event 1 Output pin
No Connect (must be left floating)
4
UART_RX
UART Communication RX pin
5
COMMONA
Common pin A, to be connected to pin 13 (COMMONB)
6
OSCI
Oscillator Crystal Connection pin or External Clock Input pin
7
OSCO
Oscillator Crystal Connection pin
10
RESET
Reset pin for Delta-Sigma ADCs
11
AVDD
12
UART_TX
Analog Power Supply pin
UART Communication TX pin
Common pin B, to be connected to pin 5 (COMMONA)
13
COMMONB
14
PWM
15
EVENT2
16
I1+
Noninverting Current Channel Input for 24-bit  ADC
17
I1-
Inverting Current Channel Input for 24-bit  ADC
18
V1-
Inverting Voltage Channel Input for 24-bit  ADC
Pulse-Width Modulation (PWM) Output pin
Event 2 Output pin
Noninverting Voltage Channel Input for 24-bit  ADC
19
V1+
20
AN_IN
Analog Input for SAR ADC
21
AGND
Analog Ground Pin, return path for internal analog circuitry
22
ZCD
Zero Crossing Detection Output
23
REFIN+/OUT
Noninverting Voltage Reference Input and Internal Reference Output Pin
24, 27
DGND
Digital Ground pin, return path for internal digital circuitry
25
DVDD
Digital Power Supply pin
26
MCLR
Master Clear for device
28
DR
Data Ready (must be left floating)
29
EP
Exposed Thermal Pad (to be connected to pins 24 and 27 (DGND))
 2015 Microchip Technology Inc.
DS20005393B-page 11
MCP39F511
3.1
Event Output Pins (EVENTn)
These digital output pins can be configured to act as
output flags based on various internal raise conditions.
Control is modified through the Event Configuration
register.
3.2
UART Communication Pins
(UART_RX, UART_TX)
The MCP39F511 device contains an asynchronous
full-duplex UART. The UART communication is eight
bits with Start and Stop bit. See Section 4.3 “UART
Settings” for more information.
3.3
Common Pins (COMMONA and B)
COMMONA and COMMONB pins are internal
connections for the MCP39F511. These two pins
should be connected together in the application.
3.4
Oscillator Pins (OSCI/OSCO)
3.8
24-Bit Delta-Sigma ADC
Differential Current Channel
Input Pins (I1+/I1-)
I1- and I1+ are the two fully-differential current-channel
inputs for the Delta-Sigma ADCs.
The linear and specified region of the channels are
dependent on the PGA gain. This region corresponds
to a differential voltage range of ±600 mVPEAK/GAIN
with VREF = 1.2V.
The maximum absolute voltage, with respect to AGND,
for each In+/- input pin is ±1V with no distortion
and ±6V with no breaking after continuous voltage.
3.9
24-Bit Delta-Sigma ADC
Differential Voltage Channel
Inputs (V1-/V1+)
V1- and V1+ are the two fully-differential
voltage-channel inputs for the Delta-Sigma ADCs.
The linear and specified region of the channels are
dependent on the PGA gain. This region corresponds
to a differential voltage range of ±600 mVPEAK/GAIN
with VREF = 1.2V.
OSCI and OSCO provide the master clock for the
device. Appropriate load capacitance should be
connected to these pins for proper operation. An
optional 4 MHz crystal can be connected to these pins.
If a crystal of external clock source is not detected, the
device will clock from the internal 4 MHz oscillator.
The maximum absolute voltage, with respect to AGND,
for each VN+/- input pin is ±1V with no distortion
and ±2V with no breaking after continuous voltage.
3.5
3.10
Reset Pin (RESET)
This pin is active-low and places the Delta-Sigma
ADCs, PGA, internal VREF and other blocks associated
with the analog front-end in a Reset state when pulled
low. This input is Schmitt-triggered.
3.6
Analog Power Supply Pin (AVDD)
AVDD is the power supply pin for the analog circuitry
within the MCP39F511.
This pin requires appropriate bypass capacitors and
should be maintained to +2.7V and +3.6V for specified
operation. It is recommended to use 0.1 µF ceramic
capacitors.
3.7
Pulse Width Modulator (PWM)
This digital output is a dedicated PWM output that can
be controlled through the PWM Frequency and PWM
Duty Cycle registers. See Section 8.0 “Pulse Width
modulation (PWM)” for more information.
DS20005393B-page 12
Analog Input (AN_IN)
This is the input to the analog-to-digital converter that
can be used for temperature measurement and
compensation. If temperature compensation is
required in the application, it is advised to connect the
low-power active thermistor IC MCP9700A to this pin.
If temperature compensation is not required, this can
be used as a general purpose analog-to-digital
converter input.
3.11
Analog Ground Pin (AGND)
AGND is the ground connection to internal analog
circuitry (ADCs, PGA, voltage reference, POR). If an
analog ground pin is available on the PCB, it is
recommended that this pin be tied to that plane.
3.12
Zero Crossing Detection (ZCD)
This digital output pin is the output of the zero crossing
detection circuit of the IC. The output here will be a
logic output with edges that transition at each zero
crossing of the voltage channel input. For more
information see Section 5.13 “Zero Crossing
Detection (ZCD)”.
 2015 Microchip Technology Inc.
MCP39F511
3.13
Noninverting Reference
Input/Internal Reference Output
Pin (REFIN+/OUT)
This pin is the noninverting side of the differential
voltage reference input for the Delta-Sigma ADCs or
the internal voltage reference output.
For optimal performance, bypass capacitances should
be connected between this pin and AGND at all times,
even when the internal voltage reference is used.
However, these capacitors are not mandatory to
ensure proper operation.
3.14
Digital Ground Connection Pins
(DGND)
DGND is the ground connection to internal digital
circuitry (SINC filters, oscillator, serial interface). If a
digital ground plane is available, it is recommended to
tie this pin to the digital plane of the PCB. This plane
should also reference all other digital circuitry in the
system.
3.15
Digital Power Supply Pin (DVDD)
DVDD is the power supply pin for the digital circuitry
within the MCP39F511. This pin requires appropriate
bypass capacitors and should be maintained between
+2.7V and +3.6V for specified operation. It is
recommended to use 0.1 µF ceramic capacitors.
3.16
Data-Ready Pin (DR)
The data-ready pin indicates if a new Delta-Sigma A/D
conversion result is ready to be processed. This pin is
for indication only and should be left floating. After each
conversion is finished, a low pulse will take place on the
data-ready pin to indicate the conversion result is ready
and an interrupt is generated in the calculation engine
(CE). This pulse is synchronous with the line frequency
to ensure an integer number of samples for each line
cycle.
Note:
3.17
This pin is internally connected to the IRQ
of the calculation engine and should be
left floating.
Exposed Thermal Pad (EP)
This pin is the exposed thermal pad. It must be
connected to pin 24 (DGND).
 2015 Microchip Technology Inc.
DS20005393B-page 13
MCP39F511
NOTES:
DS20005393B-page 14
 2015 Microchip Technology Inc.
MCP39F511
4.0
COMMUNICATION PROTOCOL
4.1
After the reception of a communication frame, the
MCP39F511 has three possible responses, which will
be returned with or without data, depending on the
frame received. These responses are either:
The communication protocol for the MCP39F511
device is based on the Simple Sensor Interface (SSI)
protocol. This protocol is used for point-to-point
communication from a single-host MCU to a
single-slave MCP39F511.
• Acknowledge (ACK, 0x06): Frame received with
success, commands understood and commands
executed with success.
• Negative Acknowledge (NAK, 0x15): Frame
received with success, however commands not
executed with success, commands not
understood or some other error in the command
bytes.
• Checksum Fail (CSFAIL, 0x51): Frame received
with success, however the checksum of the frame
did not match the bytes in the frame.
All communication to the device occurs in frames. Each
frame consists of a header byte, the number of bytes in
the frame, command packet (or command packets)
and a checksum. It is important to note that the
maximum number of bytes in either a receive or
transmit frame is 35.
Note:
Device Responses
If a custom communication protocol is
desired, please contact a Microchip sales
office.
Note:
This approach allows for single, secure transmission
from the host processor to the MCP39F511 with either
a single command or multiple commands. No command in a frame is processed until the entire frame is
complete and the checksum and number of bytes are
validated.
The number of bytes in an individual command packet
depend on the specific command. For example, to set
the instruction pointer, three bytes are needed in the
packet: the command byte and two bytes for the
address you want to set to the pointer. The first byte in
a command packet is always the command byte.
There is one unique device ID response
which is used to determine which
MCP39FXXX
device
is
present:
[NAK(0x15) + ID_BYTE]. If the device is
interrogated with 0x5A, i.e. it receives 0x5A
as the first byte instead of the standard
0xA5 first header byte, a special NAK is
returned followed by an ID_BYTE. For the
MCP39F511 the ID_BYTE is 0x01. This
functionality is only present on system versions 0xFA14 and later.
This protocol can also be used to set up transmission
from the MCP39F511 on specific registers. A
predetermined single-wire transmission frame is
defined for one-wire interfaces. The Auto-transmit
mode can be initiated by setting the SINGLE_WIRE bit
in the System Configuration register, allowing for
single-wire communication within the application. See
Section 4.8 “Single-Wire Transmission Mode” for
more information on this communication.
Frame
Header Byte (0xA5) Number of Bytes
Command Packet1 Command Packet2
...Command Packet n
Checksum
Command BYTE1 BYTE2 BYTE N
BYTE0
BYTE N
FIGURE 4-1:
Communication Frame.MCP39F511
 2015 Microchip Technology Inc.
DS20005393B-page 15
MCP39F511
4.2
Checksum
The checksum is generated using simple byte addition
and taking the modulus to find the remainder after
dividing the sum of the entire frame by 256. This operation is done to obtain an 8-bit checksum. All the bytes
of the frame are included in the checksum, including
the header byte and the number of bytes. If a frame
includes multiple command packets, none of the commands will be issued if the frame checksum fails. In this
instance, the MCP39F511 will respond with a CSFAIL
response of 0x51.
On commands that are requesting data back from the
MCP39F511, the frame and checksum are created in
the same way, with the header byte becoming an
Acknowledge (0x06). Communication examples are
given in Section 4.5 “Example Communication
Frames and MCP39F511 Responses”.
4.3
UART Settings
The default baud rate is 115. 2 kbps and can be
changed using the UART bits in the System
Configuration Register. This is only available on
system versions 0xFA14 and later. For previous
versions the baud rate is fixed at 115.2k. Note that the
baud rate is changed at system power-up, so when
changing the baud rate, a Save To Flash command
followed by a power-on cycle is required. The UART
operates in 8-bit mode, plus one start bit and one stop
bit, for a total of 10 bits per byte, as shown in
Figure 4-2.
IDLE
START
D0 D1
D2
FIGURE 4-2:
DS20005393B-page 16
D3 D4
D5
D6 D7
STOP IDLE
UART Transmission, N-8-1.
 2015 Microchip Technology Inc.
MCP39F511
4.4
Command List
The following table is a list of all accepted command
bytes for the MCP39F511. There are 10 possible
accepted commands for the MCP39F511.
TABLE 4-1:
MCP39F511 INSTRUCTION SET
Command
#
Command
Command
ID
Instruction
Parameter
Number
of bytes
Successful
Response
UART_TX
1
Register Read, N bytes
0x4E
Number of bytes
2
ACK, Data,
Checksum
2
Register Write, N bytes
0x4D
Number of bytes
1+N
ACK
3
Set Address Pointer
0x41
ADDRESS
3
ACK
4
Save Registers To Flash
0x53
None
1
ACK
5
Page Read EEPROM
0x42
PAGE
2
ACK, Data,
Checksum
6
Page Write EEPROM
0x50
PAGE
18
ACK
7
Bulk Erase EEPROM
0x4F
None
1
ACK
8
Auto-Calibrate Gain
0x5A
None
Note 1
9
Auto-Calibrate Reactive Gain
0x7A
None
Note 1
Auto-Calibrate Frequency
0x76
None
Note 1
10
Note 1:
4.5
See Section 9.0, MCP39F511 Calibration for more information on calibration.
Example Communication Frames
and MCP39F511 Responses
Tables 4-2 to 4-11 show exact hexadecimal
communication frames as recommended to be sent to
the MCP39F511 from the system MCU. The values
here can be used as direct examples for writing the
code to communicate to the MCP39F511.
TABLE 4-2:
REGISTER READ, N BYTES COMMAND (Note 1)
Byte #
Value
Description
1
0xA5
Header Byte
2
0x08
Number of Bytes in Frame
3
0x41
Command (Set Address Pointer)
4
0x00
Address High
5
0x02
Address Low
6
0x4E
Command (Register Read, N Bytes)
7
0x20
Number of Bytes to Read (32)
8
0x5E
Checksum
Response from MCP39F511
ACK + Number of Bytes (35) + 32 bytes + Checksum
Note 1: This example Register Read, N bytes frame, as it is written here, can be used to poll a subset of the
output data, starting at the top, address 0x02, and reading 32 data bytes back or 35 bytes total in the frame.
 2015 Microchip Technology Inc.
DS20005393B-page 17
MCP39F511
TABLE 4-3:
REGISTER WRITE, N BYTES COMMAND (Note 1)
Byte #
Value
Description
Response from MCP39F511
1
0xA5
2
0x25
Number of Bytes in Frame
3
0x41
Command (Set Address Pointer)
4
0x00
Address High
5
0x82
Address Low
6
0x4D
Command (Register Write, N Bytes)
7
0x14
Number of Bytes to Write (20)
Header Byte
8-36
*Data*
37
Checksum
Data Bytes (20 total data bytes)
Checksum
ACK
Note 1: This Register Write, N Bytes frame, as it is written here, can be used to write the entire set of
calibration target data, starting at the top, address 0x82, and continuing to write until the end of this set of
registers, 20 bytes later. Note these are not the calibration registers, but the calibration targets which need
to be written prior to issuing the auto-calibration target commands. See Section 9.0 “MCP39F511
Calibration” for more information.
TABLE 4-4:
SET ADDRESS POINTER COMMAND (Note 1)
Byte #
Value
Description
Response from MCP39F511
1
0xA5
Header Byte
2
0x06
Number of Bytes in Frame
3
0x41
Command (Set Address Pointer)
4
0x00
Address High
5
0x02
Address Low
6
0xF8
Checksum
ACK
Note 1: The Set Address Pointer command is typically included inside of a frame that includes a read or write
command, as shown in Tables 4-2 and 4-3. There is typically no reason for this command to have its own
frame, but is shown here as an example.
TABLE 4-5:
SAVE TO FLASH COMMAND
Byte #
Value
1
0xA5
Header Byte
2
0x04
Number of Bytes in Frame
3
0x53
Command (Save To Flash)
4
0xFC
Checksum
TABLE 4-6:
Description
Response from MCP39F511
ACK
PAGE READ EEPROM COMMAND
Byte #
Value
Description
1
0xA5
Header Byte
2
0x05
Number of Bytes in Frame
3
0x42
Command (Page Read EEPROM)
4
0x01
Page Number (e.g. 1)
5
0xF8
Checksum
DS20005393B-page 18
Response from MCP39F511
ACK + EEPROM Page Data + Checksum
 2015 Microchip Technology Inc.
MCP39F511
TABLE 4-7:
PAGE WRITE EEPROM COMMAND
Byte #
Value
Description
1
0xA5
Header Byte
2
0x15
Number of Bytes in Frame
3
0x50
Command (Page Write EEPROM)
Page Number (e.g. 1)
4
0x01
5-20
*Data*
21
Checksum
TABLE 4-8:
EEPROM Data (16 bytes/Page)
Checksum
ACK
BULK ERASE EEPROM COMMAND
Byte #
Value
1
0xA5
Header Byte
2
0x04
Number of Bytes in Frame
3
0x4F
Command (Bulk Erase EEPROM)
4
0xF8
Checksum
TABLE 4-9:
Response from MCP39F511
Description
Response from MCP39F511
ACK
AUTO-CALIBRATE GAIN COMMAND
Byte #
Value
Description
1
0xA5
Header Byte
2
0x04
Number of Bytes in Frame
3
0x5A
Command (Auto-Calibrate Gain)
4
0x03
Checksum
Response from MCP39F511
ACK (or NAK if unable to
calibrate)1
Note 1: See Section 9.0 “MCP39F511 Calibration” for more information.
TABLE 4-10:
AUTO-CALIBRATE REACTIVE GAIN COMMAND
Byte #
Value
Description
1
0xA5
Header Byte
2
0x04
Number of Bytes in Frame
3
0x7A
Command (Auto-Calibrate Reactive Gain)
4
0x23
Checksum
Response from MCP39F511
ACK (or NAK if unable to
calibrate)1
Note 1: See Section 9.0 “MCP39F511 Calibration” for more information.
TABLE 4-11:
AUTO-CALIBRATE FREQUENCY COMMAND
Byte #
Value
Description
1
0xA5
Header Byte
2
0x04
Number of Bytes in Frame
3
0x76
Command (Auto-Calibrate Frequency)
4
0x1F
Checksum
Response from MCP39F511
ACK (or NAK if unable to
calibrate)1
Note 1: See Section 9.0 “MCP39F511 Calibration” for more information.
 2015 Microchip Technology Inc.
DS20005393B-page 19
MCP39F511
4.6
4.6.1
Command Descriptions
REGISTER READ, N BYTES (0x4E)
The Register Read, N bytes command returns
the N bytes that follow whatever the current address
pointer is set to. It should typically follow a
Set Address Pointer command and can be used
in conjunction with other read commands. An
Acknowledge, Data and Checksum is the response for
this command. The maximum number of bytes that can
be read with this command is 32. If there are other
read commands within a frame, the maximum number
of bytes that can be read is 32 minus the number of
bytes being read in the frame. With this command, the
data is returned LSB first.
4.6.2
REGISTER WRITE, N BYTES (0x4D)
The Register Write, N bytes command is
followed by N bytes that will be written to whatever the
current address pointer is set to. It should typically
follow a Set Address Pointer command and can
be used in conjunction with other write commands. An
Acknowledge is the response for this command. The
maximum number of bytes that can be written with this
command is 32. If there are other write commands
within a frame, the maximum number of bytes that can
be written is 32 minus the number of bytes being
written in the frame. With this command, the data is
written LSB first.
4.6.3
SET ADDRESS POINTER (0x41)
This command is used to set the address pointer for all
read and write commands. This command is expecting
the address pointer as the command parameter in the
following two bytes, Address High Byte followed by
Address Low Byte. The address pointer is two bytes in
length. If the address pointer is within the acceptable
addresses of the device, an Acknowledge will be
returned.
4.6.4
SAVE REGISTERS TO FLASH (0x53)
The Save Registers To Flash command makes
a copy of all the calibration and configuration registers
to flash. This includes all R/W registers in the register
set. The response to this command is an Acknowledge.
4.6.5
4.6.6
PAGE WRITE EEPROM (0x50)
The Page Write EEPROM command is expecting
17 additional bytes in the command parameters, which
are EEPROM page plus 16 bytes of data. A more
complete description of the memory organization of the
EEPROM can be found in Section 10.0 “EEPROM”
The response to this command is an Acknowledge.
4.6.7
BULK ERASE EEPROM (0x4F)
The Bulk Erase EEPROM command will erase the
entire EEPROM array and return it to a state of 0xFFFF
for each memory location of EEPROM. A more
complete description of the memory organization of the
EEPROM can be found in Section 10.0 “EEPROM”.
The response to this command is Acknowledge.
4.6.8
AUTO-CALIBRATE GAIN (0x5A)
The Auto-Calibrate Gain command initiates the
single-point calibration that is all that is typically
required for the system. This command calibrates the
RMS current, RMS voltage and Active power based on
the target values written in the corresponding registers.
See Section 9.0 “MCP39F511 Calibration” for more
information on device calibration. The response to this
command is Acknowledge.
4.6.9
AUTO-CALIBRATE REACTIVE
POWER GAIN (0X7A)
The Auto-Calibrate Reactive Gain command
initiates a single-point calibration to match the
measured Reactive power to the target Reactive
power. This is typically done at PF = 0.5. See section
Section 9.0 “MCP39F511 Calibration” for more
information on device calibration.
4.6.10
AUTO-CALIBRATE FREQUENCY
(0x76)
For applications not using an external crystal and
running the MCP39F511 off the internal oscillator, a
gain calibration to the line frequency indication is
required. The Gain Line Frequency register is set such
that the frequency indication matches what is set in the
Line Frequency Reference register. See Section 9.0
“MCP39F511 Calibration” for more information on
device calibration.
PAGE READ EEPROM (0x42)
The Page Read EEPROM command returns 16 bytes
of data that are stored in an individual page on the
MCP39F511. A more complete description of the memory organization of the EEPROM can be found in
Section 10.0 “EEPROM”. This command is expecting
the EEPROM page as the command parameter or the
following byte. The response to this command is an
Acknowledge, 16-bytes of data and CRC Checksum.
DS20005393B-page 20
 2015 Microchip Technology Inc.
MCP39F511
4.7
Notation for Register Types
The following notation has been adopted for describing
the various registers used in the MCP39F511:
TABLE 4-12:
Notation
SHORT-HAND NOTATION
FOR REGISTER TYPES
Description
u64
Unsigned, 64-bit register
u32
Unsigned, 32-bit register
s32
Signed, 32-bit register
u16
Unsigned, 16-bit register
s16
Signed, 16-bit register
b32
32-bit register containing discrete
Boolean bit settings
4.8
Single-Wire Transmission Mode
In Single-Wire Transmission mode, at the end of each
computation cycle, the device automatically transmits a
frame of power data. This allows for single-wire communication after the device has been configured.
The single-wire transmission frame consists of
20 bytes: three Header Bytes, one Checksum and
16 bytes of power data (including RMS current, RMS
voltage, Active Power, Reactive Power and Line
Frequency).
TABLE 4-13:
#
Byte
1
HEADERBYTE (0xAB)
2
HEADERBYTE2 (0xCD)
3
HEADERBYTE3 (0xEF)
4
CURRENT RMS – Byte 0
5
CURRENT RMS – Byte 1
6
CURRENT RMS – Byte 2
7
CURRENT RMS – Byte 3
8
VOLTAGE RMS – Byte 0
9
VOLTAGE RMS – Byte 1
10
ACTIVE POWER – Byte 0
11
ACTIVE POWER – Byte 1
12
ACTIVE POWER – Byte 2
13
ACTIVE POWER – Byte 3
14
REACTIVE POWER – Byte 0
15
REACTIVE POWER – Byte 1
16
REACTIVE POWER – Byte 2
17
REACTIVE POWER – Byte 3
18
LINE FREQUENCY – Byte 0
19
LINE FREQUENCY – Byte 1
20
CHECKSUM
2:
 2015 Microchip Technology Inc.
SINGLE-WIRE
TRANSMISSION FRAME
(Note 2)
For custom single-wire transmission
packets, contact a Microchip sales office.
DS20005393B-page 21
MCP39F511
NOTES:
DS20005393B-page 22
 2015 Microchip Technology Inc.
MCP39F511
5.0
CALCULATION ENGINE (CE)
DESCRIPTION
5.1
Computation Cycle Overview
The MCP39F511 uses a coherent sampling algorithm
to phase lock the sampling rate to the line frequency
with an integer number of samples per line cycle, and
reports all power output quantities at a 2N number of
line cycles. This is defined as a computation cycle and
is dependent on the line frequency, so any change in
the line frequency will change the update rate of the
power outputs.
5.2
Accumulation Interval Parameter
The accumulation interval is defined as an 2N number
of line cycles, where N is the value in the Accumulation
Interval Parameter register.
5.3
For DC applications, offset can be removed by using
the DC Offset Current register. To compensate for any
external phase error between the current and voltage
channels, the Phase Compensation register can be
used.
See Section 9.0 “MCP39F511 Calibration” for more
information on device calibration.
5.4
RMS Current and RMS Voltage
The MCP39F511 device provides true RMS
measurements. The MCP39F511 device has two
simultaneous sampling 24-bit A/D converters for the
current and voltage measurements. The root mean
square calculations are performed on 2N current and
voltage samples, where N is defined by the register
Accumulation Interval Parameter.
EQUATION 5-1:
Raw Voltage and Currents Signal
Conditioning
I1+
+
PGA
-
I1-
24-bit  ADC
Multi-Level
Modulator
SINC3
Digital Filter
The first set of signal conditioning that occurs inside the
MCP39F511 is shown in Figure 5-1. All conditions set
in this diagram effect all of the output registers (RMS
current, RMS voltage, Active power, Reactive power,
Apparent power, etc.). The gain of the PGA, the
Shutdown and Reset status of the 24-bit ADCs are all
controlled through the System Configuration Register.
CHANNEL I1
RMS CURRENT AND
VOLTAGE
N
2 –1

I RMS =
+
N
2 –1
 in 
2
n=0
----------------------------N
2


V RMS =
 vn 
2
n=0
-----------------------------N
2
HPF 1
i
+
DCOffsetCurrent:s16
SystemConfiguration:b32
+
PGA
-
V1+
V1-
24-bit  ADC
Multi-Level
Modulator
SINC3
Digital Filter
PhaseCompensation:s16

HPF 1
v
CHANNEL V1
Note
1:
FIGURE 5-1:
High-Pass Filters (HPFs) are automatically disabled in the absence of an AC signal on the voltage channel.
Channel I1 and V1 Signal Flow.
 2015 Microchip Technology Inc.
DS20005393B-page 23
MCP39F511
Range:b32
X
i
2N-1
0 ÷ 2
ACCU

N
+
X
÷2RANGE
CurrentRMS:u32
+
GainCurrentRMS:u16
OffsetCurrentRMS:s32
X
ApparentPower:u32
GainVoltageRMS:u16
X
v
2N-1
0 ÷ 2
N
X
ACCU
÷2RANGE
VoltageRMS:u16
Range:b32
FIGURE 5-2:
5.5
RMS Current and Voltage Calculation Signal Flow.
Power and Energy
The MCP39F511 offers signed power numbers for
Active and Reactive power, import and export registers
for active energy, and four-quadrant Reactive power
measurement. For this device, import power or energy
is considered positive (power or energy being
consumed by the load), and export power or energy is
considered negative (power or energy being delivered
by the load). The following figure represents the
measurements obtained by the MCP39F511.
Import Reactive Power
Consume, Inductive
Generate, Inductive
-P, +Q
Quadrant II
Quadrant I
+P, +Q
S
Q

P
Import Active Power
Export Active Power
Quadrant III
Generate, Capacitive
Quadrant IV
Consume, Capacitive
+P, -Q
-P, -Q
Export Reactive Power
FIGURE 5-3:
DS20005393B-page 24
The Power Circle and Triangle (S = Apparent, P = Active, Q = Reactive).
 2015 Microchip Technology Inc.
MCP39F511
5.6
Energy Accumulation
Energy accumulation for all four energy registers
(import/export, active/reactive) occurs at the end of
each computation cycle, if the energy accumulation
has been turned on. See Section 6.3 “System Status
Register” on the energy control register. A no-load
threshold test is done to make sure the measured
energy is not below the no-load threshold, if it is above,
the accumulation occurs with a default energy
resolution of 1mWh for all of the energy registers.
5.6.1
For scaling of the Apparent power indication, the calculation engine uses the register Apparent Power Divisor.
This is described in the following register operations,
per Equation 5-3.
EQUATION 5-3:
CurrentRMS  VoltageRMS
S = --------------------------------------------------------------------ApparentPowerDivisor
10
5.8
NO-LOAD THRESHOLD
APPARENT POWER (S)
Active Power (P)
The no-load threshold is set by modifying the value in
the No-Load Threshold register. The unit for this
register is power with a default resolution of 0.01W. The
default value is 100 or 1.00W. Any power that is below
1W will not be accumulated into any of the energy
registers.
The MCP39F511 has two simultaneous sampling A/D
converters. For the Active power calculation, the
instantaneous current and instantaneous voltages are
multiplied together to create instantaneous power.
This instantaneous power is then converted to Active
power by averaging or calculating the DC component.
5.7
Equation 5-4 controls the number of samples used in
this accumulation prior to updating the Active Power
output register.
Apparent Power (S)
This 32-bit register is the output register for the final
Apparent power indication. It is the product of RMS
current and RMS voltage as shown in Equation 5-2.
EQUATION 5-2:
APPARENT POWER (S)
S = I RMS  VRMS
Please note that although this register is unsigned, the
direction of the Active power (import or export) can be
determined by the Active Power Sign bit located in the
System Status Register.
EQUATION 5-4:
ACTIVE POWER
1
P = ------N
2
N
k=2 –1

Vk  Ik
k=0
GainActivePower:u16
i
Range:b32
X
0 ÷ 2
ACCU
N
+

X
÷2RANGE
ActivePower:u32
+
OffsetActivePower:s32
v
FIGURE 5-4:
2N-1
Active Power Calculation Signal Flow.
 2015 Microchip Technology Inc.
DS20005393B-page 25
MCP39F511
5.9
Please note that although this register is unsigned, the
direction of the power can be determined by the
reactive power sign bit in the system status register.
Power Factor (PF)
Power factor is calculated by the ratio of P to S or
Active power divided by Apparent power.
EQUATION 5-5:
POWER FACTOR
P
PF = --S
The Power Factor Reading is stored in a signed 16-bit
register (Power Factor). This register is a signed, 2's
complement register with the MSB representing the
polarity of the power factor. A positive power factor
means Active power is being imported, negative power
factor represents export Active power. The sign of the
reactive power component is used to tell if the current
is lagging the voltage, with a positive sign meaning an
inductive load, and a negative sign meaning capacitive.
Each LSB is then equivalent to a weight of 2-15. A
maximum register value of 0x7FFF corresponds to a
power factor of 1. The minimum register value of
0x8000 corresponds to a power factor of -1.
5.10
Reactive Power (Q)
In the MCP39F511, Reactive Power is calculated using
a 90 degree phase shift in the voltage channel. The
same accumulation principles apply as with active
power where ACCU acts as the accumulator. Any light
load or residual power can be removed by using the
Offset Reactive Power register. Gain is corrected by
the Gain Reactive Power register. The final output is an
unsigned 32-bit value located in the Reactive Power
register.
GainReactivePower:u16
i
HPF
Range1,2:b32
X
v
FIGURE 5-5:
DS20005393B-page 26
2N-1
0 ÷ 2
N
ACCU1
+
-

X
÷2RANGE
ReactivePower:u32
OffsetReactivePower:s32
HPF (+90deg.)
Reactive Power Calculation Signal Flow.
 2015 Microchip Technology Inc.
MCP39F511
5.11
10-Bit Analog Input
The least 10 significant bits of the 16-bit Analog Input
register contain the output of the 10-bit ADC. The
conversion rate of the analog input occurs once every
computation cycle.
The Thermistor Voltage can be used for temperature
compensation of the calculation engine. See
Section 9.7 “Temperature Compensation” for more
information.
MCP9700
10-bit
ADC
AnalogInput:u16
5.13
Zero Crossing Detection (ZCD)
The zero crossing detection block generates a
logic pulse output on the ZCD pin that is coherent with
the zero crossing of the input AC signal present on
voltage input pins (V1+, V1-). The ZCD pin can be
enabled and disabled by the corresponding bit in the
System Configuration Register register. When
enabled, this produces a square wave with a frequency
that is equivalent to that of the AC signal present on the
voltage input. Figure 5-7 represents the signal on the
ZCD pin superimposed with the AC signal present on
the voltage input in this mode.
<200 µs
FIGURE 5-6:
Using an Analog
Out-Temperature Sensor for Automatic
Temperature Compensation.
5.12
Minimum and Maximum
Recordings
The MCP39F511 has the ability to record minimum and
maximum outputs and keep them in a total of four
registers (two minimum and two maximum) based on
the value of address pointers located in the four
registers listed in this section.
A minimum and maximum test is done after each
calculation interval. If the current measurement value
of the value directed to by the pointer is smaller or
larger than the value in the Minimum or Maximum
register, the record is updated appropriately.
FIGURE 5-7:
Zero Crossing Detection
Operation (Noninverted, Nonpulse).
A second mode is available that produces a 100 µs
pulse at each zero crossing, at a frequency that is twice
that of the AC signal present on the voltage input,
shown in Figure 5-8.
<200 µs
The registers are:
• MinMaxPointer1 → MinimumRecord1,
Maximum-Record1
• MinMaxPointer2 → MinimumRecord2,
Maximum-Record2
Only the Output Quantity register addresses can be
tracked by the Min/Max pointers. Output Quantity
registers are defined as those from Voltage RMS to
Apparent Power (addresses 0x0006 to 0x001A). All
other addresses will be ignored by the calculation
engine.
Please note that the 64-bit energy registers can not be
tracked through the Minimum and Maximum Recording
registers.
FIGURE 5-8:
Zero Crossing Detection
Operation (Noninverted, Pulsed).
Switching modes is done by setting the corresponding
bit in the System Configuration Register. In addition,
either the toggling of this pin, or the pulse, can be
inverted. The ZCD Inversion bit is also in the System
Configuration register.
There are two bits in the System Configuration register
that can be used to modify the zero crossing. The zero
crossing output can be inverted by setting the Inversion
bit, or the zero crossing can be a 100 µs pulse at each
zero crossing, by setting the Pulse bit.
Note that a low-pass filter is included in the signal path
that allows the zero crossing detection circuit to
filter out the fundamental frequency. An internal
compensation circuit is then used to gain back the
phase delay introduced by the low-pass filter resulting
in a latency of less than 200 µs.
 2015 Microchip Technology Inc.
DS20005393B-page 27
MCP39F511
NOTES:
DS20005393B-page 28
 2015 Microchip Technology Inc.
MCP39F511
6.0
REGISTER DESCRIPTIONS
6.1
Complete Register Map
The following table describes the registers for the MCP39F511 device.
TABLE 6-1:
Address
MCP39F511 REGISTER MAP
Register Name
Section
Number
Read/
Write
Data
Type
Description
Output Registers
0x0000
Instruction Pointer
6.2
R
u16
Address pointer for read or write commands
0x0002
System Status
6.3
R
b16
System Status Register
0x0004
System Version
6.3
R
u16
System version date code information for
MCP39F511, set at the Microchip factory;
format YMDD
0x0006
Voltage RMS
5.4
R
u16
RMS Voltage output
0x0008
Line Frequency
9.6
R
u16
Line Frequency output
0x000A
Analog Input Voltage
5.11
R
u16
Output of the 10-bit SAR ADC
0x000C
Power Factor
5.9
R
s16
Power Factor output
0x000E
Current RMS
5.4
R
u32
RMS Current output
0x0012
Active Power (Note 1)
5.8
R
u32
Active Power output
0x0016
Reactive Power (Note 1)
5.10
R
u32
Reactive Power output
0x001A
Apparent Power
5.7
R
u32
Apparent Power output
0x001E
Import Active Energy
Counter
5.6
R
u64
Accumulator for Active Energy, Import
0x0026
Export Active Energy
Counter
5.6
R
u64
Accumulator for Active Energy, Export
0x002E
Import Reactive Energy
Counter
5.6
R
u64
Accumulator for Reactive Energy, Import
0x0036
Export Reactive Energy
Counter
5.6
R
u64
Accumulator for Reactive Energy, Export
0x003E
Minimum Record 1
5.12
R
u32
Minimum Value of the Output Quantity
Address in Min/Max Pointer 1 Register
0x0042
Minimum Record 2
5.12
R
u32
Minimum Value of the Output Quantity
Address in Min/Max Pointer 2 Register
0x0046
Reserved
—
R
u32
Reserved
0x004A
Reserved
—
R
u32
Reserved
0x004E
Maximum Record 1
5.12
R
u32
Maximum Value of the Output Quantity
Address in Min/Max Pointer 1 Register
0x0052
Maximum Record 2
5.12
R
u32
Maximum Value of the Output Quantity
Address in Min/Max Pointer 2 Register
0x0056
Reserved
—
R
u32
Reserved
0x005A
Reserved
—
R
u32
Reserved
Note 1:
2:
3:
The registers are unsigned, however their sign is kept as a separate bit in the System Status Register.
These registers are reserved for EMI filter compensation when necessary for power supply monitoring.
They may require specific adjustment depending on PSU parameters, please contact the local Microchip
office for further support.
The Overtemperature event is only available on system versions 0xFA14 and later.
 2015 Microchip Technology Inc.
DS20005393B-page 29
MCP39F511
TABLE 6-1:
Address
MCP39F511 REGISTER MAP (CONTINUED)
Register Name
Section
Number
Read/
Write
Data
Type
Description
Calibration Registers
0x005E
Calibration Register
Delimiter
9.8
R/W
u16
May be used to initiate loading of the default
calibration coefficients at start-up
0x0060
Gain Current RMS
9.3.1
R/W
u16
Gain Calibration Factor for RMS Current
0x0062
Gain Voltage RMS
9.3.1
R/W
u16
Gain Calibration Factor for RMS Voltage
0x0064
Gain Active Power
9.3.1
R/W
u16
Gain Calibration Factor for Active Power
0x0066
Gain Reactive Power
9.3
R/W
u16
Gain Calibration Factor for Reactive Power
0x0068
Offset Current RMS
9.5.1
R/W
s32
Offset Calibration Factor for RMS Current
0x006C
Offset Active Power
9.5.1
R/W
s32
Offset Calibration Factor for Active Power
0x0070
Offset Reactive Power
9.5.1
R/W
s32
Offset Calibration Factor for Reactive Power
0x0074
DC Offset Current
9.5.2
R/W
s16
Offset Calibration Factor for DC Current
0x0076
Phase Compensation
9.4
R/W
s16
Phase Compensation
0x0078
Apparent Power Divisor
5.7
R/W
u16
Number of Digits for apparent power divisor to
match IRMS and VRMS resolution
Design Configuration Registers
0x007A
System Configuration
6.5
R/W
b32
Control for device configuration, including
ADC configuration
0x007E
Event Configuration
7.0
R/W
b16
Settings for the Event pins including Relay
Control
0x0082
Range
6.6
R/W
b32
Scaling factor for Outputs
0x0086
Calibration Current
9.3.1
R/W
u32
Target Current to be used during single-point
calibration
0x008A
Calibration Voltage
9.3.1
R/W
u16
Target Voltage to be used during single-point
calibration
0x008C
Calibration Power Active
9.3.1
R/W
u32
Target Active Power to be used during
single-point calibration
0x0090
Calibration Power Reactive
9.3.1
R/W
u32
Target Active Power to be used during
single-point calibration
0x0094
Line Frequency Reference
9.6.1
R/W
u16
Reference Value for the nominal line
frequency
0x0096
Reserved
—
—
u32
Reserved
0x009A
Reserved
—
—
u32
Reserved
0x009E
Accumulation Interval
Parameter
5.10
R/W
u16
N for 2N number of line cycles to be used
during a single computation cycle
0x00A0
Voltage Sag Limit
7.2.2
R/W
u16
RMS Voltage threshold at which an event flag
is recorded
0x00A2
Voltage Surge Limit
7.2.2
R/W
u16
RMS Voltage threshold at which an event flag
is recorded
0x00A4
Overcurrent Limit
7.2
R/W
u32
RMS Current threshold at which an event flag
is recorded
0x00A8
Overpower Limit
7.2
R/W
u32
Active Power Limit at which an event flag is
recorded
Note 1:
2:
3:
The registers are unsigned, however their sign is kept as a separate bit in the System Status Register.
These registers are reserved for EMI filter compensation when necessary for power supply monitoring.
They may require specific adjustment depending on PSU parameters, please contact the local Microchip
office for further support.
The Overtemperature event is only available on system versions 0xFA14 and later.
DS20005393B-page 30
 2015 Microchip Technology Inc.
MCP39F511
TABLE 6-1:
Address
MCP39F511 REGISTER MAP (CONTINUED)
Register Name
Section
Number
Read/
Write
Data
Type
Description
EMI Filter Compensation Registers (Note 2)
0x00AC
Reserved
—
R
u16
Reserved
0x00AE
Reserved
—
R
u16
Reserved
0x00B0
Reserved
—
R
u16
Reserved
0x00B2
Reserved
—
R
u16
Reserved
0x00B4
Reserved
—
R
u16
Reserved
0x00B6
Reserved
—
R
u16
Reserved
0x00B8
Reserved
—
R
u16
Reserved
0x00BA
Reserved
—
R
u16
Reserved
0x00BC
Reserved
—
R
u16
Reserved
0x00BE
Reserved
—
R
u16
Reserved
0x00C0
Reserved
—
R
u16
Reserved
0x00C2
Reserved
—
R
u16
Reserved
0x00C4
Reserved
—
R
u16
Reserved
Temperature Compensation and Peripheral Control Registers
0x00C6
Temperature Compensation
for Frequency
9.7
R/W
u16
Correction factor for compensating the line
frequency indication overtemperature
0x00C8
Temperature Compensation
for Current
9.7
R/W
u16
Correction factor for compensating the Current
RMS indication overtemperature
0x00CA
Temperature Compensation
for Power
9.7
R/W
u16
Correction factor for compensating the active
power indication overtemperature
0x00CC
Ambient Temperature
Reference Voltage
9.7
R/W
u16
Register for storing the reference temperature
during calibration
0x00CE
PWM Period
8.2
R/W
u16
Input register controlling PWM Period
0x00D0
PWM Duty Cycle
8.3
R/W
u16
Input register controlling PWM Duty Cycle
—
—
u16
Reserved
5.12
R/W
u16
Address Pointer for Min/Max 1 Outputs
0x00D2
Reserved
0x00D4
MinMaxPointer1
0x00D6
MinMaxPointer2
5.12
R/W
u16
Address Pointer for Min/Max 2 Outputs
0x00D8
Overtemperature Limit
(Note 3)
7.2.1
R/W
u16
Limit at which an Overtemperature event flag
is recorded
0x00DA
Reserved
—
R
u16
Reserved
0x00DC
Energy Control
5.6
R/W
u16
Input register for reset/start of Energy
Accumulation
0x00DE
PWM Control
8.1
R/W
u16
Input register for PWM On/Off and other PWM
Controls
0x00E0
No Load Threshold
5.6.1
R/W
u16
No Load Threshold for Energy Counting
Note 1:
2:
3:
The registers are unsigned, however their sign is kept as a separate bit in the System Status Register.
These registers are reserved for EMI filter compensation when necessary for power supply monitoring.
They may require specific adjustment depending on PSU parameters, please contact the local Microchip
office for further support.
The Overtemperature event is only available on system versions 0xFA14 and later.
 2015 Microchip Technology Inc.
DS20005393B-page 31
MCP39F511
6.2
Address Pointer Register
This unsigned 16-bit register contains the address to
which all read and write instructions occur. This register
is only written through the Set Address Pointer
command and is otherwise outside the writable range
of register addresses.
6.3
System Status Register
The System Status register is a read-only register and
can be used to detect the various states of pin levels as
defined in Register 6-1.
REGISTER 6-1:
SYSTEM STATUS REGISTER
U-0
U-0
U-0
U-0
R-x
R-x
U-0
U-0
—
—
—
—
EVENT2
EVENT1
—
—
bit 15
bit 8
U-0
R-x
R-x
R-x
R-x
R-x
R-x
R-x
—
OVERTEMP
SIGN_PR
SIGN_PA
OVERPOW
OVERCUR
VSURGE
VSAG
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 15-12
Unimplemented: Read as ‘0’
bit 11
EVENT2: State of Event2 Detection algorithm. This bit is latched and must be cleared.
1 = Event 2 has occurred
0 = Event 2 has not occurred
bit 10
EVENT1: State of Event1 Detection algorithm. This bit is latched and must be cleared.
1 = Event 1 has occurred
0 = Event 1 has not occurred
bit 9-7
Unimplemented: Read as ‘0’
bit 6
OVERTEMP: State of the Overtemperature Detection Algorithm
1 = Overtemperature Threshold has been broken
0 = Overtemperature Threshold has not been broken
bit 5
SIGN_PR: Sign of Reactive Power
1 = Reactive Power is positive, inductive and is in quadrants 1,2
0 = Reactive Power is negative, is capacitive and is in quadrants 3,4
bit 4
SIGN_PA: Sign of Active Power (import/export sign of active power)
1 = Active Power is positive (import) and is in quadrants 1,4
0 = Active Power is negative (export) and is in quadrants 2,3
bit 3
OVERPOW: State of Overpower detection algorithm. An Overpower event has occurred in the system.
1 = Overpower threshold has been broken
0 = Overpower threshold has not been broken
bit 2
OVERCUR: State of the Overcurrent detection algorithm. An Overcurrent event has occurred in the
system.
1 = Overcurrent threshold has been broken
0 = Overcurrent threshold has not been broken
bit 1
VSURGE: State of Voltage Surge Detection algorithm. This bit is latched and must be cleared.
1 = Surge threshold has been broken
0 = Surge threshold has not been broken
DS20005393B-page 32
 2015 Microchip Technology Inc.
MCP39F511
REGISTER 6-1:
bit 0
6.4
SYSTEM STATUS REGISTER
VSAG: State of Voltage Sag Detection algorithm. This bit is latched and must be cleared.
1 = Sag threshold has been broken
0 = Sag threshold has not been broken
System Version Register
The System Version register is hard-coded by
Microchip Technology Incorporated and contains
calculation engine date code information. The
System Version register is a date code in the YMDD
format, with year and month in hex, day in decimal (e.g.
0xFA14 = 2015, October 14th).
6.5
System Configuration Register
The System Configuration register contains bits for the
following control:
•
•
•
•
•
PGA setting
ADC Reset State
ADC Shutdown State
Voltage Reference Trim
Single Wire Auto-Transmission
TABLE 6-2:
PGA CONFIGURATION
SETTING (Note 1)
Gain
PGA_CHn<2:0>
Gain
(V/V)
Gain
(dB)
VIN Range
(V)
0
0
0
1
0
±0.6
0
0
1
2
6
±0.3
0
1
0
4
12
±0.15
0
1
1
8
18
±0.075
1
0
0
16
24
±0.0375
1
0
1
32
30
±0.01875
Note 1:
This table is defined with VREF = 1.2V.
The two undefined settings, 110 and 111
are G=1.
These options are described in the following sections.
6.5.1
PROGRAMMABLE GAIN
AMPLIFIERS (PGA)
The two Programmable Gain Amplifiers (PGAs) reside
at the front-end of each 24-bit Delta-Sigma ADC. They
have two functions:
• translate the common mode of the input from
AGND to an internal level between AGND and AVDD
• amplify the input differential signal
The translation of the common mode does not change
the differential signal but enters the common mode so
that the input signal can be properly amplified.
The PGA block can be used to amplify very low signals,
but the differential input range of the Delta-Sigma
modulator must not be exceeded. The PGA is
controlled by the PGA_CHn<2:0> bits in Register 6-2
the System Configuration register. Table 6-2
represents the gain settings for the PGAs.
 2015 Microchip Technology Inc.
DS20005393B-page 33
MCP39F511
6.5.2
24-BIT ADC RESET MODE
(SOFT RESET MODE)
24-bit ADC Reset mode (also called Soft Reset) can
only be entered through setting high the
RESET<1:0> bits in the System Configuration Register
register. This mode is defined as the condition where
the converters are active but their output is forced to ‘0’.
6.5.3
ADC SHUTDOWN MODE
ADC Shutdown mode is defined as a state where the
converters and their biases are OFF, consuming only
leakage current. When the Shutdown bit is reset to ‘0’,
the analog biases will be enabled, as well as the clock
and the digital circuitry.
Each converter can be placed in Shutdown mode
independently. This mode is only available through
programming of the SHUTDOWN<1:0> bits in the
System Configuration Register register.
6.5.4
VREF TEMPERATURE
COMPENSATION
If desired, the user can calibrate out the temperature
drift for ultra-low VREF drift.
The internal voltage reference comprises a proprietary
circuit and algorithm to compensate first-order and
second-order
temperature
coefficients.
The
compensation allows very low temperature coefficients
(typically 10 ppm/°C) on the entire range of
temperatures from -40°C to +125°C. This temperature
coefficient varies from part to part.
The temperature coefficient can be adjusted on each
part through the System Configuration Register
register. The default value of this register is set to 0x42.
The typical variation of the temperature coefficient of
the internal voltage reference, with respect to
VREFCAL register code, is shown in Figure 6-1.
60
VREF Drift (ppm)
50
40
30
20
10
0
0
64
128
192
VREFCAL Register Trim Code (decimal)
FIGURE 6-1:
Trimcode Chart.
DS20005393B-page 34
256
VREF Tempco vs. VREFCAL
 2015 Microchip Technology Inc.
MCP39F511
REGISTER 6-2:
SYSTEM CONFIGURATION REGISTER
U-0
U-0
—
—
R/W-0
R/W-1
R/W-1
R/W-0
PGA_CH1<2:0>
R/W-1
R/W-1
PGA_CH0<2:0>
bit 31
R/W-0
bit 24
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-1
R/W-0
VREFCAL<7:0>
bit 23
R/W-1
bit 16
R/W-1
R/W-1
UART<2:0>1
R/W-0
R/W-0
R/W-0
U-0
R/W-0
ZCD_INV
ZCD_PULS
ZCD_OUTPUT_DIS
—
SINGLE_WIRE
bit 15
R/W-0
bit 8
R/W-0
TEMPCOMP
R/W-0
RESET<1:0>
R/W-0
R/W-0
SHUTDOWN<1:0>
R/W-0
U-0
U-0
VREFEXT
—
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 31-30
Unimplemented: Read as ‘0’
bit 29-27
PGA_CH1 <2:0>: PGA Setting for the current channel.
111 = Reserved (Gain = 1)
110 = Reserved (Gain = 1)
101 = Gain is 32
100 = Gain is 16
011 = Gain is 8 (Default)
010 = Gain is 4
001 = Gain is 2
000 = Gain is 1
bit 26-24
PGA_CH0 <2:0>: PGA Setting for the voltage channel.
111 = Reserved (Gain = 1)
110 = Reserved (Gain = 1)
101 = Gain is 32
100 = Gain is 16
011 = Gain is 8 (Default)
010 = Gain is 4
001 = Gain is 2
000 = Gain is 1
bit 23-16
VREFCAL<n>: Internal voltage reference temperature coefficient register value (See Section 6.5.4
“VREF Temperature Compensation” for complete description)
bit 15-13
UART<2:0>: UART Baud Rate bits (Note 1)
111 = 1200
110 = 2400
101 = 4800
100 = 9600
011 = 19200
010 = 38400
001 = 57600
000 = 115200 (Default)
 2015 Microchip Technology Inc.
DS20005393B-page 35
MCP39F511
REGISTER 6-2:
SYSTEM CONFIGURATION REGISTER (CONTINUED)
bit 12
ZCD_INV: Zero Crossing Detection Output Inverse
1 = ZCD is inverted
0 = ZCD is not inverted (Default)
bit 11
ZCD_PULS: Zero Crossing Detection Pulse mode
1 = ZCD output is 100 µs pulses on zero crossings
0 = ZCD Output changes logic state on zero crossings (Default)
bit 10
ZCD_OUTPUT_DIS: Disable the Zero Crossing output pin
1 = ZCD output is disabled
0 = ZCD output is enabled (Default)
bit 9
Unimplemented: Read as ‘0’
bit 8
SINGLE_WIRE: Single-Wire Enable bit
1 = Single-wire transmission is enabled
0 = Single-wire transmission is disabled (Default)
bit 7
TEMPCOMP: Temperature-Compensation Enable bit
1 = Temperature compensation is enabled
0 = Temperature compensation is disabled (Default)
bit 6-5
RESET <1:0>: Reset mode setting for ADCs
11 = Both I1 and V1 are in Reset mode
10 = V1 ADC is in Reset mode
01 = I1 ADC is in Reset mode
00 = Neither ADC is in Reset mode (Default)
bit 4-3
SHUTDOWN <1:0>: Shutdown mode setting for ADCs
11 = Both I1 and V1 are in Shutdown
10 = V1 ADC is in Shutdown
01 = I1 ADC is in Shutdown
00 = Neither ADC is in Shutdown (Default)
bit 2
VREFEXT: Internal Voltage Reference Shutdown Control
1 = Internal Voltage Reference Disabled
0 = Internal Voltage Reference Enabled (Default)
bit 1-0
Note 1:
Unimplemented: Read as ‘0’
The UART Baud Rate bits are only available on system version 0xFA14 and later. Previous versions have
the baud rate fixed at 115200. The baud rate is only changed at system power-up, so a Save To Flash
command is required after changing the baud rate.
REGISTER 6-3:
ENERGY ACCUMULATION CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
—
—
—
—
—
—
—
ENRG_CNTRL
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bits 15-1
Unimplemented: Read as ‘0‘
bit 0
ENRG_CNTRL: Energy Accumulation Control bit
1 = Energy is ON and all registers are accumulating
0 = Energy accumulation is turned off and all energy accumulation registers are reset to 0 (Default)
DS20005393B-page 36
 2015 Microchip Technology Inc.
MCP39F511
6.6
Range Register
The Range register is a 32-bit register that contains the
number of right-bit shifts for the following outputs,
divided into separate bytes defined below:
• RMS Current
• RMS Voltage
• Power (Active, Reactive, Apparent)
Note that the Power Range Byte operates across both
the active and reactive output registers and sets the
same scale.
The purpose of this register is two-fold: the number of
right-bit shifting (division by 2RANGE) must be:
• high enough to prevent overflow in the output register,
• low enough to allow for the desired output resolution.
It is the user’s responsibility to set this register correctly
to ensure proper output operation for a given meter
design.
For further information and example usage, see
Section 9.3 “Single-Point Gain Calibrations at
Unity Power Factor”.
.
REGISTER 6-4:
RANGE REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 31
bit 24
R/W-0
R/W-0
R/W-0
R/W-1
R/W-0
R/W-0
R/W-1
R/W-1
POWER<7:0>
bit 23
bit 16
R/W-0
R/W-0
R/W-0
R/W-0
R/W-1
R/W-1
R/W-0
R/W-0
CURRENT<7:0>
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-1
R/W-0
R/W-0
R/W-1
R/W-0
VOLTAGE<7:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 31-24
Unimplemented: Read as ‘0’
bit 23-16
POWER<7:0>: Sets the number of right-bit shifts for the Active and Reactive Power output registers
bit 15-8
CURRENT<7:0>: Sets the number of right-bit shifts for the Current RMS output register
bit 7-0
VOLTAGE<7:0>: Sets the number of right-bit shifts for the Voltage RMS output register
 2015 Microchip Technology Inc.
DS20005393B-page 37
MCP39F511
NOTES:
DS20005393B-page 38
 2015 Microchip Technology Inc.
MCP39F511
7.0
EVENT OUTPUT PINS/EVENT
CONFIGURATION REGISTER
7.1
Event Pins
The MCP39F511 device has two event pins that can be
configured in three possible configurations. These
configurations are:
1.
2.
No event is mapped to the pin
Voltage Surge, Voltage Sag, Overcurrent, Overtemperature or Overpower event is mapped to
the pin. More than one event can be mapped to
the same pin.
Manual control of two pins, independently
3.
These three configurations allow for the control of
external interrupts or hardware that is dependent on
the measured power, current or voltage. The Event
Configuration Register below describes how these
events and pins can be configured.
Note:
7.2
If an event is mapped to a pin, manual
control of the respective pin is not possible.
To enable manual control, no event has to
be mapped to the pin.
Limits
There are five limit registers associated with these
events:
• Overtemperature limit. The overtemperature
event is only available on system versions
0xFA14 and later.
• Voltage Sag limit
• Voltage Surge limit
• Overcurrent limit
• Overpower limit
7.2.2
VOLTAGE SAG AND VOLTAGE
SURGE DETECTION
The event alarms for Voltage Sag and Voltage Surge
work differently compared to the Overcurrent and Overpower events, which are tested against every computation cycle. These two event alarms are designed to
provide a much faster interrupt if the condition occurs.
Note that neither of these two events have a respective
Hold register associated with them, since the detection
time is less than one line cycle.
The calculation engine keeps track of a trailing mean
square of the input voltage, as defined by the following
equation:
EQUATION 7-1:
2
2  f LINE
V SA = -------------------------- 
f SAMPLE
0

Vn
f SAMPLE
n = – -------------------------- – 1
2  f LINE
Therefore, at each data-ready occurrence, the value of
VSA is compared to the programmable threshold set in
the Voltage Sag Limit register and Voltage Surge Limit
register to determine if a flag should be set. If either of
these events are masked to either the Event1 or
Event2 pin, a logic-high interrupt will be given on these
pins.
The Sag or Surge events can be used to quickly
determine if a power failure has occurred in the system.
Each of these limits are compared to the respective
output registers of voltage, current and power. It is
recommended that they have the same unit for
comparison, e.g. 0.1V, or 0.01W.
7.2.1
OVERTEMPERATURE LIMIT
The Overtemperature Limit register is compared to the
10-bit SAR output (analog input voltage register) and is
a number between 0 and 1023.
When the threshold has been passed the
corresponding event flags and event pins (if mapped)
will be set.
 2015 Microchip Technology Inc.
DS20005393B-page 39
MCP39F511
REGISTER 7-1:
EVENT CONFIGURATION REGISTER
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
OVERTEMP_PIN21
OVERTEMP_PIN11
OVERTEMP_CL1,2
OVERTEMP_LA1
OVERTEMP_TST1
bit 31
bit 24
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
OVERPOW_PIN2
OVERCUR_PIN2
VSURGE_PIN
2
VSAG_PIN2
OVERPOW_PIN1
OVERCUR_PIN1
VSURGE_PIN1
VSAG_PIN1
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
—
OVERCUR_CL2
OVERPOW_CL2
VSUR_CL2
VSAG_CL2
bit 23
bit 16
bit 15
bit 8
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
VSUR_LA
VSAG_LA
OVERPOW_LA
OVERCUR_LA
VSUR_TST
VSAG_TST
OVERPOW_TST
OVERCUR_TST
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bits 31-29
Unimplemented: Read as ‘0’
bit 28
OVERTEMP_PIN2: Event pin 2 operation for the Overtemperature event (Note 1)
1 = Event mapped to Event2 pin only
0 = Event not mapped to a pin (Default)
bit 27
OVERTEMP_PIN1: Event pin 1 operation for the Overtemperature event (Note 1)
1 = Event mapped to Event1 pin only
0 = Event not mapped to a pin (Default)
bit 26
OVERTEMP_CL: Reset or clear bit for the Overtemperature event (Notes 1, 2)
1 = Event is cleared
0 = Event is not cleared (Default)
bit 25
OVERTEMP_LA: Latching control of the Overtemperature event (Note 1)
1 = Event is latched and needs to be cleared to be reset
0 = Event does not latch (Default)
bit 24
OVERTEMP_TST: Test control of the Overtemperature event (Note 1)
1 = Simulated event is turned on
0 = Simulated event is turned off (Default)
bit 23
OVERPOW_PIN2: Event pin 2 operation for the Overpower event
1 = Event mapped to Event2 pin only
0 = Event not mapped to a pin (Default)
bit 22
OVERCUR_PIN2: Event pin 2 operation for the Overcurrent event
1 = Event mapped to Event2 pin only
0 = Event not mapped to a pin (Default)
bit 21
VSURGE_PIN2: Event pin 2 operation for the Voltage Surge event
1 = Event mapped to Event2 pin only
0 = Event not mapped to a pin (Default)
bit 20
VSAG_PIN2: Event pin 2 operation for the Voltage Sag event
1 = Event mapped to Event2 pin only
0 = Event not mapped to a pin (Default)
DS20005393B-page 40
 2015 Microchip Technology Inc.
MCP39F511
REGISTER 7-1:
EVENT CONFIGURATION REGISTER (CONTINUED)
bit 19
OVERPOW_PIN1: Event pin 1 operation for the Overpower event
1 = Event mapped to Event1 pin only
0 = Event not mapped to a pin (Default)
bit 18
OVERCUR_PIN1: Event pin 1 operation for the Overcurrent event
1 = Event mapped to Event1 pin only
0 = Event not mapped to a pin (Default)
bit 17
VSURGE_PIN1: Event pin 1 operation for the Voltage Surge event
1 = Event mapped to Event1 pin only
0 = Event not mapped to a pin (Default)
bit 16
VSAG_PIN1: Event pin 1 operation for the Voltage Sag event
1 = Event mapped to Event1 pin only
0 = Event not mapped to a pin (Default)
bits 15-12
Unimplemented: Read as ‘0’
bit 11
OVERCUR_CL: Reset or clear bit for the Overcurrent event (Note 2)
1 = Event is cleared
0 = Event is not cleared (Default)
bit 10
OVERPOW_CL: Reset or clear bit for the Overpower event (Note 2)
1 = Event is cleared
0 = Event is not cleared (Default)
bit 9
VSUR_CL: Reset or clear bit for the Voltage Surge event (Note 2)
1 = Event is cleared
0 = Event is not cleared (Default)
bit 8
VSAG_CL: Reset or clear bit for the Voltage Sag event (Note 2)
1 = Event is cleared
0 = Event is not cleared (Default)
bit 7
VSUR_LA: Latching control of the Voltage Surge event
1 = Event is latched and needs to be cleared
0 = Event does not latch (Default)
bit 6
VSAG_LA: Latching control of the Voltage Sag event
1 = Event is latched and needs to be cleared
0 = Event does not latch (Default)
bit 5
OVERPOW_LA: Latching control of the Overpower event
1 = Event is latched and needs to be cleared
0 = Event does not latch (Default)
bit 4
OVERCUR_LA: Latching control of the Overcurrent event
1 = Event is latched and needs to be cleared
0 = Event does not latch (Default)
bit 3
VSUR_TST: Test control of the Voltage Surge event
1 = Simulated event is turned on
0 = Simulated event is turned off (Default)
bit 2
VSAG_TST: Test control of the Voltage Sag event
1 = Simulated event is turned on
0 = Simulated event is turned off (Default)
bit 1
OVERPOW_TST: Test control of the Overpower event
1 = Simulated event is turned on
0 = Simulated event is turned off (Default)
bit 0
OVERCUR_TST: Test control of the Overcurrent event
1 = Simulated event is turned on
0 = Simulated event is turned off (Default)
Note 1:
2:
The Overtemperature event bits (28-24) are only available on system versions 0xFA14 and later.
Writing a 1 to the Clear bit clears the event, either real or simulated through test bits, and then returns to a
state of 0.
 2015 Microchip Technology Inc.
DS20005393B-page 41
MCP39F511
NOTES:
DS20005393B-page 42
 2015 Microchip Technology Inc.
MCP39F511
8.0
PULSE WIDTH MODULATION
(PWM)
in the register, and the prescaler value is represented
by the least two significant bits. These two values
together create the PWM Period; see Figure 8-1.
8.1
Overview
The 10-bit PWM Duty Cycle is controlled by a 16-bit
register where the most eight significant bits are the 8
MSB and the 2 LSB, corresponding to the 2 LSBs of the
10-bit value.
The PWM output pin gives up to a 10-bit resolution of a
pulse width modulated signal. The PWM output is controlled by an internal timer inside the MCP39F511,
FTIMER described in this section, with a base frequency
of 16 MHz. The base period is defined as PTIMER and
is 1/[16 MHz]. This 16 MHz time base is fixed due to the
4 MHz internal oscillator or 4 MHz external crystal.
The output of the PWM is active only when the PWM
Control register has a value of 0x0001. The PWM output is turned off when the register has a value of
0x0000.
The PWM output (Figure 8-2) has a time base (period)
and a time that the output stays high (duty cycle). The
frequency of the PWM is the inverse of the period
(1/period).
There are two registers that control the PWM output,
PWM Period and PWM Duty Cycle.
The 8-bit PWM Period is controlled by a 16-bit register
that contains the period bits and also the prescaler bits.
The PWM Period bits are the most significant eight bits
An example of the register’s values are shown here
with 255 for PWM Frequency (8-bit value) and 1023 for
the Duty cycle (10-bit value), prescaler set to divide by
16 (1:0).
Period
Prescaler
255
PWM PERIOD
(8-bit)
11 1 1 1 1 1 1 0 0 0 0 00 1 0
PWM Period Register
MSB
LSB
1023
PWM DUTY
(10-bit)
1 1 1 1 1 1 11 0 0 00 0 0 1 1
PWM Duty Cycle Register
FIGURE 8-1:
PWM Period and
Duty-Cycle Registers.
Period
Duty Cycle
FIGURE 8-2:
PWM Output.
 2015 Microchip Technology Inc.
DS20005393B-page 43
MCP39F511
8.2
PWM Period
The PWM period is specified by writing the PWM
Period bits of the PWM Period register. The PWM
period can be calculated using the following formula:
Equation 8-1:
PWM Period = [(PWM_Frequency) + 1] × 2 × PTIMER × (Prescale Value)
The PWM Period is defined as 1/[PWM Frequency].
When PTIMER is equal to PWM Period, the following
two events occur on the next increment cycle:
• the PWM timer is cleared
• the PWM pin is set. Exception: If the PWM Duty
Cycle equals 0%, the PWM pin will not be set.
8.3
PWM Duty Cycle
The PWM duty cycle is specified by writing to the PWM
Duty-Cycle register. Up to 10-bit resolution is available.
The PWM Duty-Cycle register contains the eight MSbs
and the two LSbs. The following equations are used to
calculate the PWM duty cycle as a percentage or as
time:
EQUATION 8-1:
PWM Duty Cycle (%) = (PWM_DUTY CYCLE>)/(4 × PWM_FREQUENCY)
PWM Duty Cycle (time in s) = (PWM_DUTY_CYCLE) × PWM_TIMER_PERIOD/2 × (Prescale Value)
PWM Duty Cycle can be written to at any time, but the
duty-cycle value is not latched until after a period is
complete.
The PWM registers and a two-bit internal latch are
used to double-buffer the PWM duty cycle. This
double-buffering is essential for glitch-less PWM
operation.
The maximum PWM resolution (bits) for a given PWM
frequency is shown in Equation 8-2.
EQUATION 8-2:
MAXIMUM PWM
RESOLUTION BASED ON
A FUNCTION OF PWM
FREQUENCY
2  F TIMER
log  --------------------------
F PWM
PWM Resolution (max)= --------------------------------------- bits
log  2 
Note:
If the PWM duty cycle value is longer than
the PWM period, the PWM pin will not be
cleared.
DS20005393B-page 44
 2015 Microchip Technology Inc.
MCP39F511
TABLE 8-2:
EXAMPLE PWM FREQUENCIES AND RESOLUTIONS
WITH PWM_TIMER_FREQ = 16 MHz (DEFAULT)
PWM Frequency
Timer Prescaler
PWM Frequency Value
Maximum Resolution (bits)
REGISTER 8-1:
R/W-0
1.95 kHz
31.25 kHz
62.5 kHz
125 kHz
2.67 MHz
4 MHz
16
1
1
1
1
1
FFh
FFh
7Fh
3Fh
02h
01h
10
10
9
4
3
2
R/W-1
R/W-1
PWM PERIOD REGISTER
R/W-0
R/W-1
R/W-1
R/W-1
R/W-1
PWM_P<7:0>
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
R/W-0
R/W-0
PRE<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
PWM_P<7:0>: 8-bit PWM period value
bit 7-2
Unimplemented: Read as ‘0‘
bit 1-0
PRE<1:0>: PWM Prescaler
11 = Unused
10 = 1:16
01 = 1:4
00 = 1:1 (Default)
REGISTER 8-2:
R/W-0
x = Bit is unknown
PWM DUTY-CYCLE REGISTER
R/W-0
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
DUTY<9:2>
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
R/W-0
R/W-0
DUTY<1:0>
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 15-8
DUTY<9:2>: Upper 8 bits of 10-bit duty-cycle value
bit 7-2
Unimplemented: Read as ‘0‘
bit 1-0
DUTY<1:0>: Lower 2 bits of 10-bit duty-cycle value
 2015 Microchip Technology Inc.
x = Bit is unknown
DS20005393B-page 45
MCP39F511
REGISTER 8-3:
PWM CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
—
—
bit 15
bit 8
U-0
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
—
—
—
—
—
—
—
PWM_CNTRL
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bits 15-1
Unimplemented: Read as ‘0‘
bit 0
PWM_CNTRL: PWM Control
1 = PWM is turned on
0 = PWM is turned off (Default)
DS20005393B-page 46
x = Bit is unknown
 2015 Microchip Technology Inc.
MCP39F511
9.0
MCP39F511 CALIBRATION
9.1
Overview
Calibration compensates for ADC gain error,
component tolerances and overall noise in the system.
The device provides an on-chip calibration algorithm
that allows simple system calibration to be performed
quickly. The excellent analog performance of the
A/D converters on the MCP39F511 allows for a
single-point calibration and a single calibration
command to achieve accurate measurements.
Calibration can be done by either using the predefined
auto-calibration commands, or by writing directly to the
calibration registers. If additional calibration points are
required (AC offset, Phase Compensation, DC offset),
the corresponding calibration registers are available to
the user and will be described separately in this
section.
9.2
Calibration Order
The proper steps for calibration need to be maintained.
If the device has an external temperature sensor
attached, temperature calibration should be done first
by reading the value from the Thermistor Voltage
register and copying the value by writing to the Ambient
Temperature Reference Voltage register.
The single-point gain calibration at unity power factor
should be performed next.
If nonunity displacement power factor measurements
are a concern, then the next step should be Phase
calibration, followed by Reactive Power Gain
calibration.
Here is a summary on the order of calibration steps:
1.
Transfer of the ambient temperature value
during calibration to the Ambient Temperature
Calibration
register
for
temperature
compensation (optional)
Line Frequency Calibration
Gain Calibration at PF = 1
Phase Calibration at PF  1 (optional)
Reactive Gain Calibration at PF  1(optional)
2.
3.
4.
5.
Note:
9.3
Only needed if temperature compensation
is required. On system versions 0xFA14
and later this register transfer is done automatically.
Setting the gain registers to properly produce the
desired outputs can be done manually by writing to the
appropriate register. The alternative method is to use
the auto-calibration commands described in this
section.
9.3.1
USING THE AUTO-CALIBRATION
GAIN COMMAND
By applying stable reference voltages and currents that
are equivalent to the values that reside in the target
Calibration Current, Calibration Voltage and Calibration
Active Power registers, the Auto-Calibration
Gain command can then be issued to the device.
After a successful calibration (response = ACK), a
Save Registers to Flash command can then be
issued to save the calibration constants calculated by
the device.
The following registers are set when the
Auto-Calibration Gain command is issued:
• Gain Current RMS
• Gain Voltage RMS
• Gain Active Power
When this command is issued, the MCP39F511
attempts to match the expected values to the measured values for all three output quantities by changing
the gain register based on the following formula:
EQUATION 9-1:
GAIN
NEW
= GAIN
Expected
 -------------------------OLD Measured
The same formula applies for Voltage RMS, Current
RMS and Active power. Since the gain registers for all
three quantities are 16-bit numbers, the ratio of the
expected value to the measured value (which can be
modified by changing the Range register) and the
previous gain must be such that the equation yields a
valid number. Here the limits are set to be from 25,000
to 65,535. A new gain within this range for all three
limits will return an ACK for a successful calibration,
otherwise the command returns a NAK for a failed
calibration attempt.
It is the user’s responsibility to ensure that the proper
range settings, PGA settings and hardware design
settings are correct to allow for successful calibration
using this command.
Single-Point Gain Calibrations at
Unity Power Factor
When using the device in AC mode with the high-pass
filters turned on, most offset errors are removed and
only a single-point gain calibration is required.
 2015 Microchip Technology Inc.
DS20005393B-page 47
MCP39F511
9.3.2
EXAMPLE OF RANGE SELECTION
FOR VALID CALIBRATION
In this example, the user applies a calibration current
of 1A to an uncalibrated system. The indicated value
in the Current RMS register is 2300 with the system's
specific shunt value, PGA gain, etc. The user expects
to see a value of 1000 in the Current RMS register
when 1A current is applied, meaning 1.000A with
1 mA resolution. Other given values are:
• the existing value for Gain Current RMS is 33480
• the existing value for Range is 12
By using Equation 9-1, the calculation for GainNEW
yields:
EQUATION 9-2:
GAIN
NEW
= GAIN
OLD
Expected
Measured
1000
2300
 --------------------------- = 33480  ------------ = 14556
14556  25 000
issue. The best approach is to choose a range value
that places the new gain in the middle of the bounds of
the gain registers described above.
In a second example, when applying 1A, the user
expects an output of 1.0000A with 0.1 mA resolution.
The example is starting with the same initial values:
EQUATION 9-4:
Expected
10000
GAIN NEW = GAIN OLD  --------------------------- = 33480  --------------- = 145565
Measured
2300
145565  65535
The GainNEW is much larger than the 16-bit limit of
65535, so fewer right-bit shifts must be introduced to
get the measured value closer to the expected value.
The user needs to compute the number of bit shifts
that will give a value lower than 65535. To estimate
this number:
EQUATION 9-5:
When using the Auto-Calibration Gain command, the result would be a failed calibration or a NAK
returned form the MCP39F511, because the resulting
GainNEW is less than 25,000.
The solution is to use the Range register to bring the
measured value closer to the expected value, such
that a new gain value can be calculated within the
limits specified above.
The Range register specifies the number of right-bit
shifts (equivalent to divisions by 2) after the
multiplication with the Gain Current RMS register.
Refer to Section 5.0 “Calculation Engine (CE)
Description” for information on the Range register.
Incrementing the Range register by 1 unit, an additional right-bit shift or ÷2 is included in the calculation.
Increasing the current range from 12 to 13 yields the
new measured Current RMS register value of 2300/2
= 1150. The expected (1000) and measured (1150)
are much closer now, so the expected new gain
should be within the limits:
145565
------------------ = 2.2
65535
2.2 rounds to the closest integer value of 2. The range
value changes to 12 – 2 = 10; there are 2 less right-bit
shifts.
The new measured value will be 2300 x 22 = 9200.
EQUATION 9-6:
Expected
10000
GAIN NEW = GAIN OLD  --------------------------- = 33480  --------------- = 36391
Measured
9200
25 000  36391  65535
The resulting new gain is within the limits and the
device successfully calibrates Current RMS and
returns an ACK.
EQUATION 9-3:
GAIN
NEW
= GAIN
OLD
Expected
Measured
1000
1150
 --------------------------- = 33480  ------------ = 29113
25 000  29113  65535
The resulting new gain is within the limits and the
device successfully calibrates Current RMS and
returns an ACK.
Notice that the range can be set to 14 and the resulting new gain will still be within limits
(GainNEW = 58226). However, since this gain value is
close to the limit of the 16-bit Gain register, variations
from system to system (component tolerances, etc.)
might create a scenario where the calibration is not
successful on some units and there would be a yield
DS20005393B-page 48
 2015 Microchip Technology Inc.
MCP39F511
9.4
Calibrating the Phase
Compensation Register
Phase compensation is provided to adjust for any
phase delay between the current and voltage path.
This procedure requires sinusoidal current and voltage
waveforms, with a significant phase shift between
them, and significant amplitudes. The recommended
displacement power factor for calibration is 0.5. The
procedure for calculating the phase compensation
register is as follows:
1.
Determine what the difference is between the
angle corresponding to the measured power
factor (PFMEAS) and the angle corresponding to
the expected power factor (PFEXP), in degrees.
EQUATION 9-7:
Value in PowerFactor Register
PF MEAS = --------------------------------------------------------------------------32768
180
ANGLEMEAS    = acos  PF MEAS   ---------

180
ANGLE EXP    = acos  PF EXP   ---------

2.
Convert this from degrees to the resolution
provided in Equation 9-8:
EQUATION 9-8:
 =  ANGLE MEAS – ANGLE EXP   40
3.
Combine this additional phase compensation to
whatever value is currently in the phase
compensation, and update the register.
Equation 9-9 should be computed in terms of an
8-bit 2's complement-signed value. The 8-bit
result is placed in the least significant byte of the
16-bit Phase Compensation register.
EQUATION 9-9:
PhaseCompensation NEW = PhaseCompensation OLD + 
Based on Equation 9-9, the maximum angle in degrees
that can be compensated is approximately ±3.2
degrees. If a larger phase shift is required, contact your
local Microchip sales office.
9.5
Offset/No-Load Calibrations
During offset calibrations, it is recommended that no
line voltage or current be applied to the system. The
system should be in a no-load condition.
9.5.1
AC OFFSET CALIBRATION
There are three registers associated with the AC Offset
Calibration:
• Offset Current RMS
• Offset Active Power
• Offset Reactive Power
When computing the AC offset values, the respective
gain and range registers should be taken into
consideration according to the block diagrams in
Figures 5-2 and 5-4.
After
a
successful
offset
calibration,
a
Save Registers to Flash command can then be
issued to save the calibration constants calculated by
the device.
9.5.2
DC OFFSET CALIBRATION
In DC applications, the high-pass filter on the current
and voltage channels is turned off. To remove any
residual DC value on the current, the DCOffsetCurrent
register adds to the A/D conversion immediately after
the ADC and prior to any other function.
9.6
Calibrating the Line Frequency
Register
The Line Frequency register contains a 16-bit number
with a value equivalent to the input-line frequency as it
is measured on the voltage channel. When in
DC mode, this calculation is turned off and the register
will be equal to zero.
The measurement of the line frequency is only valid
from 45 to 65 Hz.
9.6.1
USING THE AUTO-CALIBRATE
FREQUENCY COMMAND
By applying a stable reference voltage with a constant
line frequency that is equivalent to the value that
resides in the Line Frequency Ref, the
Auto-Calibrate Frequency command can then
be issued to the device.
After a successful calibration (response = ACK), a
Save Registers to Flash command can then be
issued to save the calibration constants calculated by
the device.
The
following
register
is
set
when
the
Auto-Calibrate Frequency command is issued:
• Gain Line Frequency
Note that the command is only required when running
off the internal oscillator. The formula used to calculate
the new gain is shown in Equation 9-1.
 2015 Microchip Technology Inc.
DS20005393B-page 49
MCP39F511
9.7
Temperature Compensation
MCP39F511 measures the indication of the
temperature sensor and uses the value to compensate
the temperature variation of the shunt resistance and
the frequency of the internal RC oscillator.
The same formula applies for Line Frequency, Current
RMS, Active Power and Reactive Power. The
temperature compensation coefficient depends on the
16-bit signed integer value of the corresponding
compensation register.
9.8
Retrieving Factory Default
Calibration Values
After user calibration and a Save
to
Flash
command has been issued, it is possible to retrieve the
factory default calibration values. This can be done by
writing 0xA5A5 to the calibration delimiter register,
issuing a Save to Flash, and then resetting the part.
This procedure will retrieve all factory-default
calibration values and will remain in this state until
calibration has been performed again, and a
Save to Flash command has been issued.
EQUATION 9-10:
y = x   1 + c   T – T CAL  
TemperatureCompensation Register
c = ----------------------------------------------------------------------------------------------M
2
Where:
x = Uncompensated Output (corresponding to
Line Frequency, Current RMS, Active Power
and Reactive Power)
y = Compensated Output
c = Temperature
Compensation
Coefficient
(depending on the shunt's Temperature
Coefficient of Resistance or on the internal RC
oscillator temperature frequency drift). There
are three registers one for Line Frequency
compensation, one for Current compensation,
and one for power compensation (Active and
Reactive)
T =
Thermistor Voltage (in 10-bit ADC units)
TCAL = Ambient Temperature Reference Voltage. It
should be set at the beginning of the
calibration procedure, by reading the
thermistor voltage and writing its value to the
ambient temperature reference voltage
register.
M = 26 (for Line Frequency compensation)
= 27 (for Current, Active Power and Reactive
Power)
At the calibration temperature, the effect of the compensation coefficients is minimal. The coefficients need
to be tuned when the difference between the calibration
temperature and the device temperature is significant.
It is recommended to use the default values as starting
points.
DS20005393B-page 50
 2015 Microchip Technology Inc.
MCP39F511
10.0
There are three commands that support access to the
EEPROM array.
EEPROM
The data EEPROM is organized as 16-bit wide memory. Each word is directly addressable, and is readable
and writable across the entire VDD range. The
MCP39F511 has 256 16-bit words of EEPROM that is
organized in 32 pages for a total of 512 bytes.
TABLE 10-1:
• EEPROM Page Read (0x42)
• EEPROM Page Write (0x50)
• EEPROM Bulk Erase (0x4F)
EXAMPLE EEPROM COMMANDS AND DEVICE RESPONSE
Command
Command ID BYTE 0
Page Read EEPROM
0x42
PAGE
2
ACK, Data, Checksum
Page Write EEPROM
0x50
PAGE + 16 BYTES OF DATA
18
ACK
Bulk Erase EEPROM
0x4F
None
1
ACK
TABLE 10-2:
Page
BYTE 1-N
# Bytes Successful Response
MCP39F511 EEPROM ORGANIZATION
00
02
04
06
08
0A
0C
0E
0
0000
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
1
0010
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
2
0020
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
3
0030
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
4
0040
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
5
0050
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
6
0060
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
7
0070
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
8
0080
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
9
0090
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
10
00A0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
11
00B0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
12
00C0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
13
00D0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
14
00E0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
15
00F0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
16
0100
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
17
0110
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
18
0120
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
19
0130
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
20
0140
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
21
0150
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
22
0160
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
23
0170
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
24
0180
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
25
0190
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
26
01A0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
27
01B0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
28
01C0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
29
01D0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
30
01E0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
31
01F0
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
FFFF
 2015 Microchip Technology Inc.
DS20005393B-page 51
MCP39F511
NOTES:
DS20005393B-page 52
 2015 Microchip Technology Inc.
MCP39F511
11.0
PACKAGING INFORMATION
11.1
Package Marking Information
28-Lead QFN (5x5x0.9 mm)
PIN 1
Example
PIN 1
39F511
-E/MQ e
^^3
020
1545256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2015 Microchip Technology Inc.
DS20005393B-page 53
MCP39F511
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
NOTE 1
1
2
E
(DATUM B)
(DATUM A)
2X
0.10 C
2X
TOP VIEW
0.10 C
0.10 C
C
SEATING
PLANE
A1
A
28X
A3
SIDE VIEW
0.08 C
0.10
C A B
D2
0.10
C A B
E2
28X K
2
1
NOTE 1
N
28X L
e
BOTTOM VIEW
28X b
0.10
0.05
C A B
C
Microchip Technology Drawing C04-140C Sheet 1 of 2
DS20005393B-page 54
 2015 Microchip Technology Inc.
MCP39F511
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x0.9 mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Standoff
A1
Contact Thickness
A3
E
Overall Width
Exposed Pad Width
E2
Overall Length
D
D2
Exposed Pad Length
b
Contact Width
Contact Length
L
Contact-to-Exposed Pad
K
MIN
0.80
0.00
3.15
3.15
0.18
0.35
0.20
MILLIMETERS
NOM
28
0.50 BSC
0.90
0.02
0.20 REF
5.00 BSC
3.25
5.00 BSC
3.25
0.25
0.40
-
MAX
1.00
0.05
3.35
3.35
0.30
0.45
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-140C Sheet 2 of 2
 2015 Microchip Technology Inc.
DS20005393B-page 55
MCP39F511
28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern
With 0.55 mm Contact Length
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Microchip Technology Drawing C04-2140A
DS20005393B-page 56
 2015 Microchip Technology Inc.
MCP39F511
APPENDIX A:
REVISION HISTORY
Revision B (December 2015)
The following is the list of modifications:
• Document conforms to system version 0xFA14
• Overtemperature event added
• Selectable baud rate bits added to Register 6-2:
System Configuration Register
• Various typographical edits
Revision A (March 2015)
• Original release of this document
 2015 Microchip Technology Inc.
DS20005393B-page 57
MCP39F511
NOTES:
DS20005393B-page 58
 2015 Microchip Technology Inc.
MCP39F511
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
[X](1)
X
Tape and Temperature
Reel
Range
Device:
/XX
Package
Examples:
a) MCP39F511-E/MQ:
Extended temperature,
28LD 5x5 QFN package
b) MCP39F511T-E/MQ:
Tape and Reel,
Extended temperature,
28LD 5x5 QFN package
MCP39F511: Power-Monitoring IC with Calculation and
Energy Accumulation
Tape and Reel Option: Blank = Standard packaging (tube or tray)
T
= Tape and Reel (1)
Temperature Range:
E
= -40°C to +125°C
Package:
MQ = Plastic Quad Flat, No Lead Package – 5x5x0.9 mm
body (QFN), 28-lead
 2015 Microchip Technology Inc.
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is used for ordering purposes and is not
printed on the device package. Check with
your Microchip sales office for package
availability for the Tape and Reel option.
DS20005393B-page 59
MCP39F511
NOTES:
 2015 Microchip Technology Inc.
DS20005393B-page 60
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0068-4
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005393B-page 61
Worldwide Sales and Service
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Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
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