The PICDEM™ Lab II Development Board Layout and Schematic Information Sheet Overview Americas Asia/Pacific (Continued) Atlanta - 678-957-9614 Austin - 512-257-3370 Boston - 774-760-0087 Chicago - 630-285-0071 Cleveland - 216-447-0464 Dallas - 972-818-7423 Detroit - 248-848-4000 Houston - 281-894-5983 Indianapolis - 317-773-8323 Los Angeles - 949-462-9523 New York - 631-435-6000 Phoenix - 480-792-7200 Santa Clara - 408-961-6444 Toronto - 905-673-0699 China - Chengdu - 86-28-8665-5511 China - Chongqing - 86-23-8980-9588 China - Donguan - 86-769-8702-9880 China - Hangzhou - 86-571-8792-8115 China - Hong Kong SAR - 852-2943-5100 China - Nanjing- 86-25-8473-2460 China - Qingdao - 86-532-8502-7355 China - Shanghai - 86-21-5407-5533 China - Shenyang - 86-24-2334-2829 China - Shenzhen - 86-755-8864-2200 China - Wuhan - 86-27-5980-5300 China - Xiamen - 86-592-2388138 China - Xian - 86-29-8833-7252 China - Zhuhai - 86-756-3210040 India - Bangalore - 91-80-3090-4444 India - New Delhi - 91-11-4160-8631 India - Pune - 91-20-3019-1500 Japan - Osaka - 81-6-6152-7160 Japan - Tokyo - 81-3-6880-3770 Korea - Daegu - 82-53-744-4301 Korea - Seoul - 82-2-554-7200 Malaysia - Kuala Lumpur - 60-3-6201-9857 Malaysia - Penang - 60-4-227-8870 Philippines - Manila - 63-2-634-9065 Singapore - 65-6334-8870 Taiwan - Hsin Chu - 886-3-5778-366 Taiwan - Kaohsiung - 886-7-213-7828 Taiwan - Taipei - 886-2-2508-8600 Thailand - Bangkok - 66-2-694-1351 Europe Austria - Wels - 43-7242-2244-39 Denmark - Copenhagen - 45-4450-2828 France - Paris - 33-1-69-53-63-20 Germany - Munich - 49-89-627-144-0 Italy - Milan - 39-0331-742611 Netherlands - Drunen - 31-416-690399 Spain - Madrid - 34-91-708-08-90 UK - Wokingham - 44-118-921-5869 Asia/Pacific Australia - Sydney - 61-2-9868-6733 China - Beijing - 86-10-8569-2100 China - Chengdu - 86-28-8665-5511 01/27/15 The PICDEM™ Lab II Development Board Layout and Schematic can be found on the Microchip web site: www.microchip.com/picdemlabII This board provides hardware design flexibility for experimentation through a variety of DIP microcontroller sockets coupled with a solderless breadboard. It also includes two fixed and one variable power supply, plus a USB to Serial/I2C™ converter. Additionally, it features a USB mini-B connector, two open format connectors (one for expansion, one for an LCD module), and a pair of mikroBUS™ host connectors to accommodate a variety of plug-in modules. The PICDEM Lab II is fully compatible with MPLAB® Code Configurator and MPLAB® X v3.05 or later. Board Power-Up On-board power consists of two fixed voltages and one variable voltage. The two fixed voltages are 5.0V and 3.3V and the variable supply can produce 1.2V to 4.5V. All three power supplies can be powered from the 9V barrel connector, the USB voltage from the USB-Serial/I2C™, or supplied via four test points (TP1 and TP2 for 5V, TP3 and TP4 for 3.3V). Using USB power, the 3.3V and 5.0V supplies are limited to 100 mA. Using the 9V supply, both 3.3V and 5.0V are capable of 0.75A. Using external supplies, the board is limited to the external supplies limit, however, a maximum of a 3.0A to 5.0A limit is imposed on the breadboard contacts. Out of the Box Labs A complete selection of parts and wires for four individual labs are included with the PICDEM™ Lab II board: • A Hello World LED Project • An IR Remote Control Link • A Power Converter Project • A Class D Audio Amplifier The lab manuals and additional labs are available on the Microchip web site: www.microchip.com/picdemlabII. Note: Microchip Technology Inc. • 2355 West Chandler Blvd. • Chandler, AZ 85224-6199 www.microchip.com The Microchip name and logo, the Microchip logo, and MPLAB are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies. © 2015, Microchip Technology Incorporated, Printed in the U.S.A. All Rights Reserved. 06/15 DS40001798A The recommended wire diameter for the white breadboard is AWG 22-29. Board Layout The PICDEM™ Lab II Development Board is shown in Figure 1. The 28/40-pin socket, the 8/14/20-pin socket, the 18-pin socket and 8-pin socket are provided for connecting DIP package microcontrollers to the corresponding ICSP™ programming/debugging connectors ICSP4, ICSP3, ICSP2 and ICSP1. Jumpers 2 and 6 control the source of the 3.3V and 5.0V input. The PICDEM™ Lab II Development Board Layout and Schematic Information Sheet If both jumpers connect the center and the top contacts (toward the 9V input), the 3.3V and 5.0V are supplied by a pair of 1A switching regulators driven by the 9V input. If both jumpers connect the center and the right contacts (toward the Click™ board connectors), the 3.3V and 5.0V are supplied by the external power supply test points (TP1/2 5.0V, TP3/4 3.3V; red test points are positive connections and black are negative). If both jumpers connect the center and the bottom contacts, the 3.3V and 5.0V are supplied from the USB-Serial/I2C. The blue potentiometer R7 adjusts the variable power supply voltage and is capable of supplying maximum 100 mA. J4 is a PICkit™ serial style connection for Serial/I2C. This device will enumerate as both an I2C peripheral and a COM port on a PC. Note: A driver is required for the I2C™ operation, which can be downloaded, along with a terminal program, from the Microchip web site: www.microchip.com. FIGURE 1: PICDEM™ LAB II DEVELOPMENT BOARD AND SCHEMATIC USB to I2C™/ Serial ICSP™ Connectors Microcontroller sockets: 40, 28, 20, 18, 14, 8, 6 5.0V & 3.0V Power supplies USB Header Variable voltage control Expansion board connector Power Switch and 9VDC Power connections Power select jumpers mikroBUS™ Host connectors LCD Module Connector An additional USB Mini-B socket J17 is available through connector J22 for microcontrollers capable of supporting a USB interface. Connectors J5 and J8 provide GND, variable voltage, 3.3V, and 5.0V supplies. Two Click™ boards may be loaded into the sockets and wired individually to any of the microcontrollers. Power and ground for the Click™ boards are supplied through existing connections to the sockets. Connectors J9/10 and J11/16 are provided for connecting external boards, LCD modules or wires. Note: Only VSS is connected to the microcontroller DIP sockets, VDD must be supplied from the appropriate power supply voltage, see connectors J5 and J8 above. Additional Recommended Equipment and Software: • • • • • PG164130 PICkit™ 3 Programmer/Debugger DV244005 REAL ICE™ Programmer/Debugger MPLAB® X IDE MCC MPLAB® Code Configurator MPLAB® XC Compilers DS40001798A