Multimedia Expansion Board II (MEB II)
User’s Guide
© 2013-2014 Microchip Technology Inc.
DS70005148B
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-976-7
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS70005148B-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2013-2014 Microchip Technology Inc.
MULTIMEDIA EXPANSION
BOARD II (MEB II) USER’S
GUIDE
Table of Contents
Chapter 1. Introduction
1.1 Kit Contents .................................................................................................. 11
1.2 System Diagram ........................................................................................... 11
1.3 Multimedia Features ..................................................................................... 13
1.4 MEB and MEB II Differences ........................................................................ 17
Chapter 2. Hardware
2.1 Hardware Features ....................................................................................... 19
Appendix A. Board Layout and Schematics
A.1 Board Layout ................................................................................................ 32
A.2 Schematics .................................................................................................. 35
Appendix B. Bill of Materials....................................................................................... 49
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 3
Multimedia Expansion Board II (MEB II) User’s Guide
NOTES:
DS70005148B-page 4
© 2013-2014 Microchip Technology Inc.
MULTIMEDIA EXPANSION BOARD II
(MEB II) USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
Multimedia Expansion Board II (MEB II). Items discussed in this chapter include:
•
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Development Systems Customer Change Notification Service
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the Multimedia Expansion Board II (MEB II) as a
development tool to emulate and debug firmware on a target board. This user’s guide
is composed of the following chapters:
• Chapter 1. “Introduction” provides a brief overview of the starter kit, highlighting
its features and uses.
• Chapter 2. “Hardware” provides the hardware descriptions of the starter kit.
• Appendix A. “Board Layout and Schematics” provides a block diagram, board
layouts, and detailed schematics of the starter kit.
• Appendix B. “Bill of Materials” provides the bill of materials for the components
used in the design and manufacture of the starter kit.
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 5
Multimedia Expansion Board II (MEB II) User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Italic characters
Initial caps
Examples
Referenced books
MPLAB IDE User’s Guide
Emphasized text
...is the only compiler...
A window
the Output window
A dialog
the Settings dialog
A menu selection
select Enable Programmer
Quotes
A field name in a window or
dialog
“Save project before build”
Underlined, italic text with
right angle bracket
A menu path
File>Save
Bold characters
A dialog button
Click OK
A tab
Click the Power tab
Text in angle brackets < >
A key on the keyboard
Press <Enter>, <F1>
Plain Courier New
Sample source code
#define START
Filenames
autoexec.bat
File paths
c:\mcc18\h
Keywords
_asm, _endasm, static
Command-line options
-Opa+, -Opa-
Bit values
0, 1
Constants
0xFF, ‘A’
Italic Courier New
A variable argument
file.o, where file can be any
valid filename
Square brackets [ ]
Optional arguments
mcc18 [options] file
[options]
Curly brackets and pipe
character: { | }
Choice of mutually exclusive
arguments; an OR selection
errorlevel {0|1}
Ellipses...
Replaces repeated text
var_name [, var_name...]
Represents code supplied by
user
void main (void)
{ ...
}
Notes
DS70005148B-page 6
Represents
A Note presents information
that we want to re-emphasize,
either to help you avoid a
common pitfall or to make you
aware of operating differences
between some device family
members. A Note can be in a
box, or when used in a table
or figure, it is located at the
bottom of the table or figure.
Note:
This is a standard
note box.
CAUTION
This is a caution note.
Note 1: This is a note used in a
table.
© 2013-2014 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user’s guide describes how to use the starter kit. The following Microchip
documents are available and recommended as supplemental reference resources.
Release Notes for the Multimedia Expansion Board
For the latest information, Microchip has a dedicated web page for the Multimedia
Expansion Board II (MEB II), which can be accessed at:
http://www.microchip.com/meb2
Family Reference Manual Sections
Family Reference Manual sections are available, which explain the operation of the
PIC32 microcontroller family architecture and peripheral modules. The specifics of
each device family are discussed in the individual family’s device data sheet.
Device Data Sheets
Refer to the appropriate device data sheet for device-specific information and
specifications. These documents may be obtained from the Microchip web site or your
local sales office.
Reference information found in these data sheets includes:
•
•
•
•
Device memory maps
Device pinout and packaging details
Device electrical specifications
List of peripherals included on the devices
PIC32MX Flash Programming Specification (DS60001145)
Refer to this document for information on instruction sets and firmware development.
MPLAB® XC32 C/C++ Compiler User’s Guide (DS50001686)
This document details the use of Microchip’s MPLAB XC32 Compiler for PIC32
microcontrollers to develop 32-bit applications.
MPLAB® X IDE User’s Guide (DS50002027)
Consult this document for more information pertaining to the installation and
implementation of the MPLAB X IDE software.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at http://www.microchip.com. This
web site makes files and information easily available to customers. Accessible by most
Internet browsers, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listings
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listings of seminars and events; and listings of Microchip sales
offices, distributors and factory representatives
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 7
Multimedia Expansion Board II (MEB II) User’s Guide
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip web site at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers and other language
tools
• Emulators – The latest information on the Microchip in-circuit emulator, MPLAB
REAL ICE™
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debugger, MPLAB ICD 3
• MPLAB X IDE – The latest information on Microchip MPLAB X IDE, the
Windows® Integrated Development Environment for development systems tools
• Programmers – The latest information on Microchip programmers including the
PICkit™ 3 development programmer
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
DS70005148B-page 8
© 2013-2014 Microchip Technology Inc.
Preface
DOCUMENT REVISION HISTORY
Revision A (November 2013)
This is the initial release of this document.
Revision B (March 2014)
This revision includes the following updates:
• Added item 9 (MPLAB REAL ICE In-Circuit Emulator) to 1.3 “Multimedia
Features”
• Updated Figure 1-3: “Multimedia Expansion Board II (MEB II) Layout
(Bottom)”
• Updated Figure 2-4: “EBI SRAM Memory”
• Updated Figure 2-8: “802.11b/g Transceiver”
• Updated Figure 2-11: “microSD Card Slot”
• Updated Figure 2-14: “Push Button and User Controlled LEDs”
• Updated Figure A-1: “MEB II Layout (Top Assembly)”
• Updated Figure A-2: “MEB II Layout (Bottom Assembly)”
• Updated all schematics (see Figure A-5 through Figure A-20)
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 9
Multimedia Expansion Board II (MEB II) User’s Guide
NOTES:
DS70005148B-page 10
© 2013-2014 Microchip Technology Inc.
MULTIMEDIA EXPANSION
BOARD II (MEB II) USER’S GUIDE
Chapter 1. Introduction
Thank you for purchasing the Microchip Technology Multimedia Expansion Board II
(MEB II). The MEB II is a compact, highly versatile development board, which in
conjunction with a PIC32 starter kit and a display daughter board, provides a system
for developing a wide range of multimedia applications. The MEB II kit includes a 4.3"
WQVGA PCAP touch display daughter board and supports detachable display boards
allowing for a variety of resolutions.
This chapter covers the following topics:
•
•
•
•
1.1
Kit Contents
System Diagram
Multimedia Features
MEB and MEB II Differences
KIT CONTENTS
The Multimedia Expansion Board II (MEB II) contains the following items:
• Multimedia Expansion Board II (MEB II) (Mother Board)
• 4.3" WQVGA Display Board (Daughter Board)
• Multimedia Expansion Board II (MEB II) Information Sheet
Note:
1.2
If you are missing any part of a kit, contact a Microchip sales office for assistance. A list of Microchip offices for sales and service is provided on the
back page of this document.
SYSTEM DIAGRAM
The MEB II system consists of the PIC32 Starter Kit, MEB II mother board, and a
display daughter board (4.3" PCAP touch), as shown in Figure 1-1. MEB II is a mother
board that contains all the necessary components and interfaces to support the
multimedia features. PIC32 starter kit connects to MEB II through a 168-pin
board-to-board connector and contains the PIC32 microcontroller with additional
components (debug, memory, communication etc). Refer to
http://www.microchip.com/meb2 for supported PIC32 Starter Kits and other additional
information. The display daughter board is connected to the MEB II using a 60-pin
board-to-board connector (detachable), providing flexibility to support a variety of
displays.
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 11
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE 1-1:
MEB II SYSTEM DIAGRAM
MEB II System
Starter
Kit with
VGA Camera
Bluetooth®
Wi-Fi
Accelerometer
Temperature
Sensor
microSD
mTouch™ Buttons
DS70005148B-page 12
Display with
PCAP touch
PICtail™ Connector
Starter Kit Connector
24-bit Audio
Display Connector
EBI-SRAM or
EBI-PSRAM
(PIC32)
© 2013-2014 Microchip Technology Inc.
Introduction
1.3
MULTIMEDIA FEATURES
The component layout of the MEB II is shown in Figure 1-2 and Figure 1-3. As mentioned previously, the MEB II kit also includes a 4.3" PCAP touch display board. The
component layout of this board is shown in Figure 1-4 and Figure 1-5.
The top side of the MEB II includes these key features, as shown in Figure 1-2:
1.
2.
3.
4.
5.
6.
7.
8.
FIGURE 1-2:
Display daughter board connector (60-pin Hirose board-to-board connector)
mTouch™ buttons
Push Button
Power LED
User LEDs
VGA Camera (OVM7690)
PICtail™ Connector
Analog temperature sensor
MULTIMEDIA EXPANSION BOARD II (MEB II) LAYOUT (TOP VIEW)
7
3
8
4
6
5
2
1
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 13
Multimedia Expansion Board II (MEB II) User’s Guide
The bottom side of the MEB II includes these key features, as shown in Figure 1-3:
1. Regulated 5V and 3.3V power supply for powering the board through a 9-15V DC
Adapter.
2. PIC32 Starter Kit connector (168-pin Hirose board-to-board connector).
3. 24-bit stereo audio codec (AK4953A).
4. Integrated 802.11bg wireless module (MRF24WG0MA).
5. Low-cost Bluetooth® HCI transceiver (BTM805).
6. EBI SRAM memory (IS61WV102416BLL).
7. microSD slot.
8. Analog accelerometer (ADXL325).
9. MPLAB® REAL ICE™ In-Circuit Emulator.
FIGURE 1-3:
MULTIMEDIA EXPANSION BOARD II (MEB II) LAYOUT (BOTTOM VIEW)
5
4
1
3
2
7
6
8
9
DS70005148B-page 14
© 2013-2014 Microchip Technology Inc.
Introduction
The top side of the 4.3" WQVGA PCAP touch display board includes this key feature,
as shown in Figure 1-4: 1) 4.3" WQVGA glass with PCAP touch panel.
FIGURE 1-4:
WQVGA PCAP TOUCH DISPLAY BOARD LAYOUT (TOP VIEW)
1
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 15
Multimedia Expansion Board II (MEB II) User’s Guide
The bottom side of the 4.3" WQVGA PCAP touch display board includes these key
features, as shown in Figure 1-5:
1.
2.
3.
4.
5.
6.
FIGURE 1-5:
60-pin MEB II connector.
Display panel connector.
PCAP touch connector.
Microchip touch controller (MTCH6301).
6-in PCAP touch connector for future use.
PICkit™ Serial Analyzer interface (optional)
WQVGA PCAP TOUCH DISPLAY BOARD LAYOUT (BOTTOM VIEW)
1
6
4
5
3
DS70005148B-page 16
2
© 2013-2014 Microchip Technology Inc.
Introduction
1.4
MEB AND MEB II DIFFERENCES
Table 1-1 describes the differences between the first (MEB) and second (MEB II)
generation boards.
TABLE 1-1:
MEB BOARD DIFFERENCES
Feature
MEB II
MEB
Starter Kit Connector 160-pin Hirose FX10 series board-to-board
connector
132-pin Hirose FX10 series board-to-board
connector
Starter Kit
Refer to: http://www.microchip.com/meb
Refer to: http://www.microchip.com/meb2
Display
Low-Cost Controllerless (LCC) graphics
On-board graphics controller (SSD1926)
60-pin display connector
N/A
Includes a 4.3" WQVGA display with projected 3.2" QVGA display with resistive touch
capacitive touch(MTCH6301)
Supports up to 7" WVGA display through a
connector
External SRAM (EBI) ISSI 2 MB external synchronous RAM
(IS61WV102416BLL-10TLI)
N/A
N/A
VGA Camera
Available on board
N/A
Audio
24-bit audio codec (AK4953A)
24-bit audio codec (WM8731)
Bluetooth®
Low cost Bluetooth™ HCI transceiver
N/A
Wi-Fi
IEEE 802.11b/g (MRF24WG0MA) transceiver IEEE 802.11b (MRF24WB0MA) transceiver
module
module
Accelerometer
ADXL325 3-axis analog accelerometer
BMA150 3-axis digital accelerometer and
temperature sensor
Temperature Sensor
MCP9700T analog temperature sensor
Temperature sensor in BMA150
microSD
Connects to Host CPU on the starter kit
Connects to the graphics controller
mTouch™ Buttons
Two touch buttons; additional touch button
support through a PICtail™ connector
Touch button support through a PICtail™
connector
PICtail™ Connector
Yes
Yes
EEPROM
N/A
128-byte EEPROM (24LC08)
SPI Flash
See Note 1
2 MB SST25VF016 serial Flash
CPLD
See Note 2
Xilinx XC2C64A for port enhancement
N/A
Available
Joystick
Note 1:
2:
Serial Quad Flash support through the PIC32 Starter Kit.
Port enhancement is not necessary due to extended connector and available device pins.
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 17
Multimedia Expansion Board II (MEB II) User’s Guide
NOTES:
DS70005148B-page 18
© 2013-2014 Microchip Technology Inc.
MULTIMEDIA EXPANSION BOARD II
(MEB II) USER’S GUIDE
Chapter 2. Hardware
This chapter describes the hardware features used in the MEB II and the 4.3" WQVGA
PCAP Touch Display Board.
2.1
HARDWARE FEATURES
Note:
2.1.1
Refer to Appendix A. “Board Layout and Schematics” and Appendix
B. “Bill of Materials” for the schematics and manufacturer and part
number information of the hardware components used in the Multimedia
Expansion Board II (MEB II) and the 4.3" WQVGA PCAP Touch Display
Board.
Power Supply
Power can be supplied to the MEB II in two ways: 1) through the DC connector (J3)
located on the MEB II (Figure 2-1), and 2) through the USB on the Starter Kit. By
connecting a 9-15V power supply to the DC connector or the USB device on the Starter
Kit, the MEB II, Display Daughter Board and the Starter Kit will receive the proper
voltages. However, if the application plans to use multiple features of the MEB II, it is
recommended to use a 9V to 15V DC power supply.
FIGURE 2-1:
9V TO 15V DC POWER SUPPLY
CAUTION
When connecting the Multimedia Expansion Board II (MEB II) to a starter kit, do not
have power applied to either the starter kit or the DC power supply. Failure to heed this
caution could result in hardware damage.
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 19
Multimedia Expansion Board II (MEB II) User’s Guide
2.1.2
Starter Kit Connector
The starter kit connector, as shown in Figure 2-2, is a high-speed, 168-pin Hirose FX10
board-to-board connector that is used to connect the MEB II to PIC32 starter kits.
FIGURE 2-2:
STARTER KIT CONNECTOR
CAUTION
When connecting the Multimedia Expansion Board II (MEB II) to a starter kit, do not
have power applied through either the starter kit or the DC power supply. Failure to
heed this caution could result in hardware damage.
After connecting a PIC32 starter kit, applications can be developed and run using the
rich features of the MEB II. Table 2-1 shows the Starter Kit Connector pin and the MEB
II component mapping.
TABLE 2-1:
STARTER KIT CONNECTOR MAPPING
Starter Kit Connector
Pin
Number
1
64
82
94
96
112
117
118
7
68
77
78
103
108
116
131
132
133
134
135
136
137
Signal
SS1
RH3
SDA2
SDI1
REFCLKO1
SCL2
SDO1
SCK1
RB1
EBIWE
RJ3
EBICS2
RB4
RH9
RH13
EBID15
LCD_B7
LCD_R1
EBID3
LCD_R2
EBID2
EBID11
DS70005148B-page 20
MEB II
Pin
Type
O
O
I/O
I
O
I/O
O
O
O
O
O
O
O
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Component
Audio Codec
EBI-SRAM/Display
Description
Left-Right Clock
Audio Power Down
I2C Data
Audio Serial Data Output
External Master Clock Input
Serial Clock
Audio Serial Data Input
Audio Bit Clock
Horizontal Sync.
Pixel Clock
Reset
Chip Select
Data Enable
Vertical Sync
Stand-by
R0
B7
R1
B6
R2
B5
R3
© 2013-2014 Microchip Technology Inc.
Hardware
TABLE 2-1:
STARTER KIT CONNECTOR MAPPING (CONTINUED)
Starter Kit Connector
Pin
Number
Signal
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
13
EBID1
EBID12
EBID0
EBID13
EBID4
EBID14
LCD_B1
LCD_R7
LCD_B0
EBID10
LCD_G7
LCD_G1
EBID9
EBID5
EBID8
EBID6
EBID7
EBIOE
MCLR
110
124
126
92
111
80
86
90
104
106
19
93
27
31
61
63
65
67
73
75
MEB II
Pin
Type
Component
Description
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
EBI-SRAM/Display
B4
R4
B3
R5
B2
R6
B1
R7
B0
G0
G7
G1
G6
G2
G5
G3
G4
Pixel Clock
I/O
O
I/O
I/O
I
I
O
I
O
I/O
I/O
I
O
Touch
RH10
SCL1
SDA1
AN42
AN28
RJ7
RA9
OC5
SDA3
SCL3
INT2
RE8
Touch Controller Reset (System Reset in general)
Touch Wake-up
Serial Clock
Serial Data
Touch Button B1
Touch Button B2
Power Down
Vertical Sync
System Input Clock
Serial Data
Serial Clock
VGA Camera Pixel
Shutdown
EBIA1/RK1
EBIA3/RK2
EBIA16/RK0
EBIA17/RK3
EBIA18/RK4
EBIA19/RK5
EBIA20/RK6
EBIA21/RK7
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
© 2013-2014 Microchip Technology Inc.
mTouch button
VGA Camera
VGA Camera
Regulator
EBI-SRAM/
VGA Camera
Address 1/VGA Camera Data 1
Address 3/VGA Camera Data 2
Address 16/VGA Camera Data 0
Address 17/VGA Camera Data 3
Address 17/VGA Camera Data 4
Address 17/VGA Camera Data 5
Address 17/VGA Camera Data 6
Address 17/VGA Camera Data 7
DS70005148B-page 21
Multimedia Expansion Board II (MEB II) User’s Guide
TABLE 2-1:
STARTER KIT CONNECTOR MAPPING (CONTINUED)
Starter Kit Connector
Pin
Number
Signal
25
29
33
35
37
43
47
49
51
53
55
57
59
79
81
83
14
85
89
105
95
EBIA0
EBIA2
EBIA4
EBIA5
EBIA6
EBIA7
EBIA9
EBIA10
EBIA11
EBIA12
EBIA13
EBIA14
EBIA15
EBIA23
EBIBS0
EBIBS1
INT0
RH14
SDI4
SDO4
SS4
120
114
87
107
122
91
88
119
121
123
23
163
164
165
166
167
168
76
4
113
62
115
92
84
RJ0
SCK4
SCK2
RB2
U2RTS
U2CTS
U2TX
AN6
AN7
AN8
AN23
SD_DATA3/SD_CD
SD_DATA2
SD_DATA1
SD_DATA0
SD_CLK
SD_CMD
RJ5
RA0
RH0
RH2
RH1
RH6
RH11
DS70005148B-page 22
MEB II
Pin
Type
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
I
O
I
O
O
O
I/O
I
O
O
I/O
O
O
O
O
I
I/O
I/O
I/O
I/O
O
O
I
O
O
O
O
O
O
Component
EBI-SRAM
Wi-Fi
Bluetooth
Accelerometer
Temperature Sensor
microSD
Description
Address 0
Address 2
Address 4
Address 5
Address 6
Address 7
Address 9
Address 10
Address 11
Address 12
Address 13
Address 14
Address 15
Sleep Enable
Bank Select 0 (Lower Bank)
Bank Select 1 (Upper Bank)
Wi-Fi Interrupt
Sleep
Serial Data Out
Serial Data In
Chip Select
Reset
Serial Clock
Serial Transmit
Regulator Enable
Request-to-Send
Serial Clear-to-Send
Serial Receive/mTouch Button Analog Channel
X-axis Out
Y-axis Out
Z-axis Out
Temp. Sense channel
Data 3/Card Detect
Data 2
Data 1
Data 0
Clock
Command
Mechanical Card Detect
Fire Button
LED1
LED2
LED3
LED4
LED5
© 2013-2014 Microchip Technology Inc.
Hardware
2.1.3
Display Connector
The MEB II supports display on a separate daughter card through a 60-pin Hirose DF12
board-to-board display connector, as shown in Figure 2-3.
FIGURE 2-3:
DISPLAY CONNECTOR
CAUTION
When connecting the Multimedia Expansion Board II (MEB II) to a starter kit or to the
display daughter board, do not have power applied through either the starter kit or the
DC power supply. Failure to heed this caution could result in hardware damage.
The MEB II supports a variety of displays through the daughter board and the kit
includes a 4.3" WQVGA Projected Capacitive (PCAP) Touch display. Refer to
2.1.15 “4.3” WQVGA PCAP Touch Display Daughter Board” for additional details.
Table 2-2 shows the display connector functional mapping.
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 23
Multimedia Expansion Board II (MEB II) User’s Guide
TABLE 2-2:
DISPLAY CONNECTOR
Display Connector
Pin Number
DS70005148B-page 24
Signal
Pin Type
9
G4
I/O
10
G0
I/O
Description
Display RGB Data
11
G5
I/O
12
G1
I/O
13
G6
I/O
14
G2
I/O
15
G7
I/O
16
G3
I/O
17
R0
I/O
18
B0
I/O
19
R1
I/O
20
B1
I/O
21
R2
I/O
22
B2
I/O
23
R3
I/O
24
B3
I/O
25
R4
I/O
26
B4
I/O
31
R5
I/O
32
B5
I/O
33
R6
I/O
34
B6
I/O
35
R7
I/O
36
B7
I/O
37
PCLK
I/O
Display Pixel Clock
38
STBYB
I/O
Display Stand-by
39
VSYNC
I/O
Display Vertical Sync
40
HSYNC
I/O
Display Horizontal Sync
41
DE
I/O
Display Data Enable
42
CS
I/O
Display Chip Select
43
INT
I/O
Touch interrupt
44
SCL
I/O
Touch Serial Clock
45
WAKE
I/O
Touch Wake
46
SDA
I/O
Touch Serial Data
47
BLEN
I/O
Display Backlight Enable
48
RESET
I/O
Display Reset
55
MCLR
I/O
System Reset
© 2013-2014 Microchip Technology Inc.
Hardware
2.1.4
EBI SRAM Memory (Optional)
The MEB II includes an External Bus Interface (EBI) routed to support both
asynchronous SRAM and pseudo-SRAM memories. By default, these memories are
not populated on the board and users can populate them as needed. The interface is
routed considering both ISSI SRAM (IS61WV51216BLL-10TLI) and pseudo-SRAM
(IS66WVE4M16BLL-70BLI) memories, as shown in Figure 2-4.
FIGURE 2-4:
2.1.5
EBI SRAM MEMORY
VGA Camera Sensor
The MEB II includes an Omnivision OVM7690 VGA camera sensor with an active array
size of 640 x 480 (VGA resolution), as shown in Figure 2-5. The PIC32 microcontroller
uses the I2C interface to control the sensor and the sensor communicates the image
data through an 8-bit (DATA7-DATA0) data bus.
FIGURE 2-5:
© 2013-2014 Microchip Technology Inc.
VGA CAMERA SENSOR
DS70005148B-page 25
Multimedia Expansion Board II (MEB II) User’s Guide
2.1.6
24-bit Audio Codec
The MEB II includes an Asahi Kasei AKM4953A 24-bit audio codec for high-quality
audio, as shown in Figure 2-6. The AK4953A is low power consumption 24-bit stereo
codec with a microphone, headphone, and speaker amplifiers, which is suitable for
portable applications with a recording/playback function. The I2C interface of the audio
codec is used by the PIC32 device for control and the I2S interface is used for audio.
FIGURE 2-6:
2.1.7
24-BIT AUDIO CODEC
Bluetooth® HCI Transceiver
The Flaircomm BTM805 Bluetooth® Host Control Interface (HCI) module is included in
the MEB II, adding Bluetooth capability, as shown in Figure 2-7. The PIC32
microcontroller communicates with the Bluetooth module through the UART interface.
FIGURE 2-7:
Note:
DS70005148B-page 26
BLUETOOTH® TRANSCEIVER
In an application, since Bluetooth and microSD share the same pins on the
board, only one can be used at any given time.
© 2013-2014 Microchip Technology Inc.
Hardware
2.1.8
802.11b/g Wireless Transceiver
The MEB II includes 802.11b/g wireless connectivity through the Microchip
MRF24WG0MA device, as shown in Figure 2-8. The PIC32 microcontroller uses the
SPI bus interface to communicate to the wireless module.
FIGURE 2-8:
2.1.9
802.11b/g TRANSCEIVER
Accelerometer
The MEB II includes an Analog Devices ADXL325BCPZ analog 3-axis accelerometer,
as shown in Figure 2-9. The ADXL325 is a small, low power, 3-axis accelerometer with
signal conditioned voltage outputs that measures acceleration with a minimum fullscale range of ±5g. The accelerometer uses three analog channels from the PIC32
microcontroller for the three axes (x, y and z).
FIGURE 2-9:
© 2013-2014 Microchip Technology Inc.
ACCELEROMETER
DS70005148B-page 27
Multimedia Expansion Board II (MEB II) User’s Guide
2.1.10
Temperature Sensor
The MEB II includes a Microchip MCP9700T analog temperature sensor, as shown in
Figure 2-10. The MCP9700T uses one analog channel on the PIC32 microcontroller.
The MCP9700 Linear Active Thermistor™ IC is an analog temperature sensor that converts temperature to an analog voltage. The MCP9700 provides a low-cost solution for
applications that require measurement of a relative change of temperature with ±1°C
accuracy at room temperature.
FIGURE 2-10:
2.1.11
TEMPERATURE SENSOR
microSD Card Slot
The MEB II includes a microSD card slot that interfaces to the PIC32 microcontroller
through an SD Interface, as shown in Figure 2-11.
FIGURE 2-11:
Note:
2.1.12
microSD CARD SLOT
In an application, since Bluetooth and microSD share the same pins on the
board, only one can be used at any given time.
Touch Buttons
The MEB II includes two touch buttons that use the Microchip mTouch™ technology,
as shown in Figure 2-12. These two touch buttons are interfaced to the PIC32 through
two analog channels.
FIGURE 2-12:
DS70005148B-page 28
TOUCH BUTTONS
© 2013-2014 Microchip Technology Inc.
Hardware
2.1.13
PICtail™ Connector
The MEB II includes an I/O expansion slot, which enables the use of several of Microchip's PICtail™ daughter boards, as shown in Figure 2-13. For more information on
how to interface to the board, as not all daughter boards are compatible, refer to the
specific PICtail daughter board schematic.
FIGURE 2-13:
2.1.14
PICtail™ CONNECTOR
Push Button and User Controlled LEDs
The MEB II includes one power LED, five user-controlled LEDs, and one Push Button,
as shown in Figure 2-14.
FIGURE 2-14:
2.1.15
PUSH BUTTON AND USER CONTROLLED LEDS
4.3” WQVGA PCAP Touch Display Daughter Board
The 4.3" WQVGA PCAP touch display daughter board includes a 4.3" WQVGA display
and a Microchip MTCH6301 touch controller to support the PCAP touch screen overlay
on the display. The daughter board connects to the MEB II Development Board through
a 60-pin board-to-board connector. Refer to 1.3 “Multimedia Features” for additional
information on the display daughter board component layout. Figure 2-15 shows the
display connector.
FIGURE 2-15:
© 2013-2014 Microchip Technology Inc.
DISPLAY PANEL CONNECTOR AND BACKLIGHT CIRCUIT
DS70005148B-page 29
Multimedia Expansion Board II (MEB II) User’s Guide
2.1.16
MTCH6301 Touch Controller
The MTCH6301 is a turn-key PCAP controller that allows easy integration of multitouch and gestures to create a rich user interface. The MTCH6301 supports up to 13
receive (RX) and 18 transmit (TX) channels, and sensor sizes up to 4.3". The
MTCH6301 communicates with the PIC32 microcontroller through a serial I2C bus and
an interrupt, as shown in Figure 2-16.
FIGURE 2-16:
DS70005148B-page 30
MTCH6301 TOUCH CONTROLLER
© 2013-2014 Microchip Technology Inc.
MULTIMEDIA EXPANSION BOARD II
(MEB II) USER’S GUIDE
Appendix A. Board Layout and Schematics
This appendix provides examples of the board layout and component schematics for
the Multimedia Expansion Board II (MEB II) and includes the following figures:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Figure A-1: “MEB II Layout (Top Assembly)”
Figure A-2: “MEB II Layout (Bottom Assembly)”
Figure A-3: “4.3” WQVGA PCAP Touch Board Layout (Top Assembly)”
Figure A-4: “4.3” WQVGA PCAP Touch Board Layout (bottom Assembly)”
Figure A-5: “Power Supply”
Figure A-6: “Starter Kit Connector”
Figure A-7: “Display connector”
Figure A-8: “EBI SRAM Memory”
Figure A-9: “VGA Camera Sensor and 2.8V Regulator”
Figure A-10: “24-bit Audio Codec”
Figure A-11: “Bluetooth® Transceiver”
Figure A-12: “802.11b/g Transceiver”
Figure A-13: “Accelerometer”
Figure A-14: “Temperature Sensor”
Figure A-15: “microSD Card Slot”
Figure A-16: “Touch Buttons”
Figure A-17: “PICtail™ Connector”
Figure A-18: “Push Button and User Controlled LEDs”
Figure A-19: “Display Panel Connector and Backlight Circuit”
Figure A-20: “Touch Controller”
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 31
Multimedia Expansion Board II (MEB II) User’s Guide
A.1
BOARD LAYOUT
FIGURE A-1:
DS70005148B-page 32
MEB II LAYOUT (TOP ASSEMBLY)
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-2:
MEB II LAYOUT (BOTTOM ASSEMBLY)
FIGURE A-3:
4.3” WQVGA PCAP TOUCH BOARD LAYOUT (TOP ASSEMBLY)
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 33
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-4:
DS70005148B-page 34
4.3” WQVGA PCAP TOUCH BOARD LAYOUT (BOTTOM ASSEMBLY)
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
A.2
SCHEMATICS
FIGURE A-5:
POWER SUPPLY
C55
0.022uF
10
U4
11
9
6
7
VIN
EN
NC
SW
SW
SW
FB
12
EP
GND
PG
LPS4018-472M
4.7uH
13
R1
0R
C66
22uF
C67
22uF
16
5
NC
4
17
VIN
PGND
C57
16V
10uF
BOOST
3
C56
16V
10uF
+5V
L1
1
R35
DNP
R17
8
10K
GND
15
J3
D1
SW
14
2
VIN
SGND
3
2
MCP16322T-500E/NG
+9V
1
PGND
+9V
GND
GND
GND
3V Power Supply
+5V
+3.3V
U5
1
C58
16V
10uF
C1
0.1uF
2
4
VIN
VOUT
3
GND
TAB(GND)
MCP1826S-3302E/DB
C49
2.2uF
10V
GND
GND
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 35
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-6:
STARTER KIT CONNECTOR
J1
RB0/CAM_LDO_SHDN
LCD_HSYNC
GND
+5V
MCLR
INT2/CAM_PCLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
21
AN23/TEMP_SENSE
EBIA0
RK1/CAM_DATA1/EBIA1
EBIA2
RK2/CAM_DATA2/EBIA3
EBIA4
EBIA5
EBIA6
GND
+3.3V
EBIA7
EBIA8
EBIA9
EBIA10
EBIA11
EBIA12
EBIA13
EBIA14
EBIA15
RK0/CAM_DATA0/EBIA16
RK3/CAM_DATA3/EBIA17
RK4/CAM_DATA4/EBIA18
RK5/CAM_DATA5/EBIA19
GND
+3.3V
RK6/CAM_DATA6/EBIA20
RK7/CAM_DATA7/EBIA21
LCD_RESET
EBIBS0
EBIBS1
RH14/WIFI_SLEEP
AN14/SCK2/U2RX/BT_TX
SD12/SDI4/WIFI_SDO
AN12/SDO2/U2CTS/BT_RTS
INT1/TOUCH_INT
SS4/WIFI_CS
+3.3V
GND
LCD_DE
AN3/SDO4/WIFI_SDI
BT_VREG_EN
LCD_VSYNC/RA9
AN28/RA10
RH0/LED1
RH1/LED3
AN5/SDO1/AUDIO_SDTI
AN6/ACCEL_XOUT
AN7/ACCEL_YOUT
AN8/ACCEL_ZOUT
+3.3V
GND
LCD_R0/EBID15
LCD_R1
LCD_R2
LCD_R3/EBID11
LCD_R4/EBID12
LCD_R5/EBID13
LCD_R6/EBID14
LCD_R7
LCD_G0/EBID10
LCD_G1
LCD_G2/EBID5
LCD_G3/EBID6
EBIOE/LCD_PCLK
+5V
GND
SD_DATA3/SD_CD
SD_DATA1
SD_CLK
DS70005148B-page 36
23
25
FX10A-168S-SV
SS1/AUDIO_LRCK
OC1/LCD_BLEN
RA1/ CAM_HREF
RA0/PUSH_BUTTON
PGD2
J10
+3.3V
PGC2
MCLR
GND
PGD2
PGC2
+5V
GND
INT0/WIFI_INT
1
2
3
4
5
6
RJLSE6206101T
20
22
24
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
GND
+3.3V
RH2/LED2
RH3/AUDIO_PDN
EBIWE/LCD_PCLK
GND
+3.3V
EBICS0
+3.3V
RJ5/CD
EBICS2/LCD_CS
R23
1.1K
CAM_PWDN
SDA2/AUDIO_SDA
RH11/LED5
CAM_VSYNC
SCK3/U2TX/BT_RX
OC5/CAM_XVCLK/SS3
RH6/LED4/AN42
AN32/SDI1/AUDIO_SDTO
+3.3V
REFCLKO1/AUDIO_MCKI
R38
1.1K
+3.3V
GND
+3.3V
CAM_SDA
R37
1.1K
SS2
CAM_SCL
+3.3V
R24
1.1K
TOUCH_WAKE
SCL2/AUDIO_SCL
SCK4/WIFI_SCK/SDI3
+3.3V
LCD_STBYB
SCK1/AUDIO_BICK
RJ0/WIFI_RESET
U2RTS/BT_CTS
R25
1.1K
R26
1.1K
SCL1/TOUCH_SCL
SDA1/TOUCH_SDA
+3.3V
GND
LCD_B7
LCD_B6/EBID3
LCD_B5/EBID2
LCD_B4/EBID1
LCD_B3/EBID0
LCD_B2/EBID4
LCD_B1
LCD_B0
LCD_G7
LCD_G6/EBID9
LCD_G5/EBID8
LCD_G4/EBID7
+5V
GND
SD_DATA2
SD_CMD
SD_DATA0
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
J4
GND
+3.3V
LCD_G4/EBID7
LCD_G5/EBID8
LCD_G6/EBID9
LCD_G7
LCD_R0/EBID15
LCD_R1
LCD_R2
LCD_R3/EBID11
LCD_R4/EBID12
GND
+3.3V
LCD_R5/EBID13
LCD_R6/EBID14
LCD_R7
LCD_PCLK
LCD_VSYNC/RA9
LCD_DE
INT1/TOUCH_INT
TOUCH_WAKE
OC1/LCD_BLEN
GND
+5V
MCLR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
17
19
21
23
GND
+3.3V
16
18
20
22
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
LCD_G0/EBID10
LCD_G1
LCD_G2/EBID5
LCD_G3/EBID6
LCD_B0
LCD_B1
LCD_B2/EBID4
LCD_B3/EBID0
LCD_B4/EBID1
GND
+3.3V
LCD_B5/EBID2
LCD_B6/EBID3
LCD_B7
LCD_STBYB
LCD_HSYNC
EBICS2/LCD_CS
SCL1/TOUCH_SCL
SDA1/TOUCH_SDA
LCD_RESET
GND
+5V
GND
61
GND
62
DISPLAY CONNECTOR
DF12(3.0)-60DP-0.5V(86)
FIGURE A-7:
J9
EBIWE/LCD_PCLK
EBIOE/LCD_PCLK
© 2013-2014 Microchip Technology Inc.
3
2
1
LCD_PCLK
DS70005148B-page 37
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-8:
EBI SRAM MEMORY
U11
EBIA4
RK2/CAM_DATA2/EBIA3
EBIA2
RK1/CAM_DATA1/EBIA1
EBIA0
1
2
3
4
5
6
R39
150R 0.1%
EBICS0
LCD_B3/EBID0
LCD_B4/EBID1
LCD_B5/EBID2
LCD_B6/EBID3
+3.3V
7
8
9
10
11
12
C26
0.1uF
C30
0.01uF
GND
LCD_B2/EBID4
LCD_G2/EBID5
LCD_G3/EBID6
LCD_G4/EBID7
R40 150R 0.1%
EBIWE/LCD_PCLK
13
14
15
16
17
18
19
RK5/CAM_DATA5/EBIA19
RK4/CAM_DATA4/EBIA18
RK3/CAM_DATA3/EBIA17
RK0/CAM_DATA0/EBIA16
EBIA15
20
21
22
23
24
A4
48pin-TSOP
A5
A3
A6
A2
A7
A1
A0
NC
CE
I/O0
I/O1
I/O2
I/O3
A8
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
VDD
GND
GND
VDD
I/O4
I/O11
I/O5
I/O10
I/O6
I/O7
I/O9
I/O8
WE
NC
NC
A9
A19
A10
A18
A17
A16
A15
A11
A12
A13
A14
48
47
46
45
44
43
42
41
40
39
38
EBIA5
EBIA6
EBIA7
EBIA8
R43 150R 0.1%
EBIOE/LCD_PCLK
R42
150R 0.1%
R41
150R 0.1%
EBIBS1
EBIBS0
LCD_R0/EBID15
LCD_R6/EBID14
LCD_R5/EBID13
LCD_R4/EBID12
GND
37
C31
0.01uF
36
C27
0.1uF
+3.3V
35
34
33
32
LCD_R3/EBID11
LCD_G0/EBID10
LCD_G6/EBID9
LCD_G5/EBID8
31
30
29
28
27
26
25
EBIA9
EBIA10
EBIA11
EBIA12
EBIA13
EBIA14
IS64WV102416BLL_48TSOP
DS70005148B-page 38
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-9:
VGA CAMERA SENSOR AND 2.8V REGULATOR
+3.3V
U7
L2
L3
1
3.3uH
C2
0.1uF
2
C59
16V
10uF
3
Vin
DOVDD
5
Vout
R32
470K
GND
+2.8V
3.3uH
C3
0.1uF
4
SHDN ADJ
C60
16V
10uF
R33
348k
TC1071
GND
L4
GND
RB0/CAM_LDO_SHDN
AVDD
3.3uH
C61
16V
10uF
C4
0.1uF
GND
CAM_GND
U6
OC5/CAM_XVCLK/SS3
D2
A1
CAM_PWDN
CAM_SCL
B2
XVCLK
DOVDD
DOVDD
E4
PWDN
C5
0.1uF
SCL
AVDD
CAM_SDA
TP1
INT2/CAM_PCLK
B1
D1
SDA
AVDD
A2
PCLK
C6
0.1uF
TP2
C1
RA1/ CAM_HREF
TP3
CAM_VSYNC
RK0/CAM_DATA0/EBIA16
RK1/CAM_DATA1/EBIA1
RK2/CAM_DATA2/EBIA3
RK3/CAM_DATA3/EBIA17
RK4/CAM_DATA4/EBIA18
RK5/CAM_DATA5/EBIA19
RK6/CAM_DATA6/EBIA20
RK7/CAM_DATA7/EBIA21
C2
B3
B4
C4
D4
E3
D3
E2
E1
HREF
VSYNC
VREF2
A3
DATA0
C7
0.1uF
DATA1
DATA2
DATA3
VREF1
A4
DATA4
C8
0.1uF
DATA5
DATA6
DATA7
AGND
C3
OVM7690-R20A
CAM_GND
© 2013-2014 Microchip Technology Inc.
GND
DS70005148B-page 39
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-10:
24-BIT AUDIO CODEC
RH3/AUDIO_PDN
R36
U1
100K
4
SDA2/AUDIO_SDA
AGND
0R
R5
GND
1uF
I2C
LIN3
GND
RIN3
12
SVDD
SPP
21
AVDD
30
C39
2.2uF
10V
C22
0.1uF
GND
HPR
C41
2.2uF
10V
C40
2.2uF
10V
1
HPL
PVEE
29
13
25
18
VSS1
VSS2
VSS3
VSS4
AGND
1uF
SPN
VCOM
24
C21
0.1uF
32
33
20
SPP
19
SPN
REGFIL
31
C20
0.1uF
35
DVDD
28
C19
0.1uF
LIN2
TVDD
17
+1.8V
CAVDD
+3.3V
34
MCKO
16
+3.3V
DVDD
MCP1700T_1802E/TT
GND
RIN2
TVDD
2
C34
MCKI
CP
T-PAD
C17
0.1uF
FB4
C35
+1.8V Output
LIN2
15
TVDD
3
SDTO
14
REFCLKO1/AUDIO_MCKI
+3.3V
SVDD
VOUT
VIN
U10
3
+3.3V
BICK
11
AN32/SDI1/AUDIO_SDTO
TP8
RIN1/DMCLK
2
LRCK
10
SCK1/AUDIO_BICK
MPWR2
1
AK4953A
CN
22
23
HPL
HPR
26
27
C42
2.2uF
10V
37
C65
16V
10uF
TP6
LIN1/DMDAT
SDTI
9
SS1/AUDIO_LRCK
TP7
CDTIO/CAD0
8
AN5/SDO1/AUDIO_SDTI
TP5
MPWR1
36
CCLK/SCL
7
TP4
MPWR2
CSN/SDA
6
SCL2/AUDIO_SCL
AGND
C18
0.1uF
DVDD
+1.8V
AGND
PDN
5
AGND
C36
2
LIN2
+3.3V
1uF
4
TVDD
C11
0.1uF
C12
0.1uF
R2
GND
2.2K
R31
3
MPWR2
FB1
0R
1
C62
16V
10uF
AGND
MIC IN
(MONO)
5
+3.3V
J5
AGND
C68
R27
2
HPL
6.8R
4
47uF, Tant
SVDD
HP OUT
(STEREO)
5
+3.3V
R28
C14
0.1uF
R3
6.8R
C63
16V
10uF
C50
0.22uF
47uF, Tant
C51
0.22uF
R29
100R
0R
GND
3
HPR
FB2
C13
0.1uF
C69
1
J6
AGND
R30
100R
AGND
AGND
CAVDD
+3.3V
FB3
C15
0.1uF
C16
0.1uF
R4
C64
16V
10uF
4
5
3
SPP
0R
GND
2
SPN
AGND
SPKR OUT
(STEREO)
1
J7
AGND
DS70005148B-page 40
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
BLUETOOTH® TRANSCEIVER
FIGURE A-11:
U2
1
NC
2
C43
GND
3
2.2uF
10V
SPI_CS#
VDD_AUX
4
5
6
CLK
PIO_0
SPI_MOSI
PIO_3
SPI_PCM#_SEL
PIO_1
VDD_RADIO
VDD_RADI
R
O
24
23
22
21
20
C46
19
TP14
2.2uF
10V
7
8
9
PIO_4
UART_RTS
UART_RX
R
PIO_5
11
UART_TX
VDD_PADS
12
VREG_OUT_HV
18
17
TP15
AN12/SDO2/U2CTS/BT_RTS
16
15
GND
U2RTS/BT_CTS
TP16
TP17
SCK3/U2TX/BT_RX
AN14/SCK2/U2RX/BT_TX
14
13
GND
N
+3.3V
C47
2.2uF
10V
C23
0.1uF
28
27
25
VDD_IN
I
GND
N
VREG_EN_RST#
VREG_EN_
E RST#
GND
N
BT_VREG_EN
UART_CTS
PIO_2
10
C45
2.2uF 10V
VDD_DIG
GND
N
2.2uF
10V
26
C44
GND
SPI_MISO
C48
2.2uF
10V
GND
GND
FIGURE A-12:
Bluetooth_BTM805CL2B
802.11b/g TRANSCEIVER
+3.3V
R12
4.7K
U3
1
GND
2
3
4
5
6
8
R16
4.7K
9
10
11
12
13
14
R22
10K
C37
1.0uF
GND
NC
SCK
NC
I
INT
NC
SDO
16
17
18
GND
NC
VDD
NC
GND
GND
DEBUG_TX
NC
DEBUG_RX
R
NC
GND
NC
NC
CS
NC
NC
WP
NC
VDD
HIBERNATE
HIBERNAT
R
E
GND
GND
MRF24WG0MA-I/RM
© 2013-2014 Microchip Technology Inc.
NC
RESET
R
RE
SET
NC
15
+3.3V
SDI
NC
7
RJ0/WIFI_RESET
GND
NC
R13
4.7K
R14
4.7K
R15
4.7K
36
TP9
GND
35
AN3/SDO4/WIFI_SDI
34
SCK4/WIFI_SCK/SDI3
33
TP10
TP11
INT0/WIFI_INT
32
SD12/SDI4/WIFI_SDO
TP12
31
30
+3.3V
29
C38
1.0uF
28
27
GND
26
25
24
GND
23
TP13
SS4/WIFI_CS
22
21
20
RH14/WIFI_SLEEP
19
GND
DS70005148B-page 41
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-13:
ACCELEROMETER
U9
ADXL325
+3.3V
15
14
7
6
5
3
17
C10
0.1uF
VS
VS
XOUT
12
AN6/ACCEL_XOUT
C52
47nF
COM
COM
COM
COM
EP
YOUT
10
GND
AN7/ACCEL_YOUT
C53
47nF
GND
ST
ZOUT
8 GND
NC
NC
NC
NC
NC
NC
2
AN8/ACCEL_ZOUT
C54
1
4
9
11
13
16
47nF
GND
FIGURE A-14:
TEMPERATURE SENSOR
+3.3V
U8
1
VDD
VOUT
R34
2
AN23/TEMP_SENSE
120R
C24
0.1uF
3
C25
0.1uF
GND
MCP9700T-E/TT
GND
DS70005148B-page 42
GND
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-15:
microSD CARD SLOT
+3.3V
R44
10K
R21
10K
R20
10K
R19
10K
R18
10K
C9
0.1uF
GND
J8
1
SD_DATA2
2
SD_DATA3/SD_CD
3
SD_CMD
4
5
SD_CLK
GND
6
7
SD_DATA0
8
SD_DATA1
9
RJ5/CD
10
11
12
MICRO SD
FIGURE A-16:
DATA 2
DATA3
CMD
VDD
CLK
VSS
DATA0
DATA1
SWITCH
Amphenol P/N: 101-00581-59
R45
10K
GND
GND
GND
GND
TOUCH BUTTONS
© 2013-2014 Microchip Technology Inc.
RH6/LED4/AN42
B1
AN28/RA10
B2
DS70005148B-page 43
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-17:
PICtail™ CONNECTOR
+3.3V
TP18
J2
1
2
SCL2/AUDIO_SCL
3
4
SCL1/TOUCH_SCL
SDA2/AUDIO_SDA
5
6
SDA1/TOUCH_SDA
SD12/SDI4/WIFI_SDO
7
8
SD12/SDI4/WIFI_SDO
AN12/SDO2/U2CTS/BT_RTS
9
10
AN3/SDO4/WIFI_SDI
11 12
SCK4/WIFI_SCK/SDI3
AN14/SCK2/U2RX/BT_TX
SS2
13 14
LCD_VSYNC/RA9
SS1/AUDIO_LRCK
AN32/SDI1/AUDIO_SDTO
15 16
SCK4/WIFI_SCK/SDI3
AN28/RA10
17 18
AN3/SDO4/WIFI_SDI
SCK3/U2TX/BT_RX
19 20
SCK3/U2TX/BT_RX
AN5/SDO1/AUDIO_SDTI
21 22
OC5/CAM_XVCLK/SS3
RB0/CAM_LDO_SHDN
23 24
SCK1/AUDIO_BICK
25 26
SS1/AUDIO_LRCK
27 28
SS4/WIFI_CS
+3.3V
GND
DS70005148B-page 44
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-18:
PUSH BUTTON AND USER CONTROLLED LEDS
+3.3V
D2
R6
470R
R7
D3
Green
Red
D4
D5
Red
Red
D6
D7
Red
RH0/LED1
470R
R8
RH2/LED2
470R
R9
RH1/LED3
470R
R10
RH6/LED4/AN42
470R
R11
RH11/LED5
470R
Red
RA0/PUSH_BUTTON
S1
GND
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 45
Multimedia Expansion Board II (MEB II) User’s Guide
FIGURE A-19:
DISPLAY PANEL CONNECTOR AND BACKLIGHT CIRCUIT
R1
+3.3V
0.5R
U1
8
C1
16V
10uF
VIN
2
R3 GND
10K
GND
GND
5
SHDN
6
OC1/LCD_BLEN
NC
L1 15uH
CS
EXT
FB
NC
D1
3
LED+
LPS3015-153ML
SD107WS-7-F
1
R2
7.68K
Q1
AO3424
4
C3
10uF
35V
GND
R4
470R
7
GND
MCP1650S-E/MS
LEDGND
LEDLED+
LCD_G5
LCD_G6
LCD_G7
LCD_R0
LCD_R1
LCD_R2
LCD_R3
LCD_R4
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
27
GND
29
+3.3V
LCD_R5
LCD_R6
LCD_R7
LCD_PCLK
LCD_VSYNC
LCD_DE
INT1/TOUCH_INT/PGD
TOUCH_WAKE
OC1/LCD_BLEN
GND
+5V
MCLR
GND
31
26
C2
16V
10uF
+3.3V
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
LCD_R0
LCD_R1
GND
LCD_R2
LCD_G0
LCD_R3
LCD_G1
LCD_R4
LCD_G2
LCD_R5
LCD_G3
LCD_R6
LCD_B0
LCD_R7
LCD_B1
LCD_G0
LCD_B2
LCD_G1
LCD_B3
LCD_G2
LCD_B4
28
30
LCD_CS
GND
LCD_G3
GND
LCD_G4
+3.3V
LCD_G5
LCD_B5
LCD_G6
LCD_B6
LCD_G7
LCD_B7
LCD_B0
LCD_B1
LCD_HSYNC
LCD_B2
LCD_CS
LCD_B3
SCL1/TOUCH_SCL
LCD_B4
SDA1/TOUCH_SDA
LCD_B5
LCD_RESET
LCD_B6
GND
LCD_B7
+5V
GND
TP1
J2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
XF2M-4015-1A
LCD_G4
1
DF12-60DS-0.5V(86)
+3.3V
+3.3V
62
J1
GND
LCD_PCLK
TP2
LCD_RESET
TP3
LCD_HSYNC
GND
61
LCD_VSYNC
TP4
LCD_DE
GND
DS70005148B-page 46
© 2013-2014 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-20:
TOUCH CONTROLLER
PICkit Serial Analyzer
Connection
J5
1
2
3
4
5
6
+3.3V
GND
DNP
TP5
U2
SDA1/TOUCH_SDA
T16
T15
T14
C8
GND
T13
10uF
1
SDA
2
3
4
5
6
TP7
INT1/TOUCH_INT/PGD
PGC
TX11
TX16
TX10
TX15
TX9
TX14
VDD
VCAP
8
INT
9
10
T12
TX17
VSS
7
11
SCL
VSS
TX5
TX6
NC
TX7
RX12
TX8
RX11
TX4
TX13
TX0
TX12
TX1
44
43
TP6
SCL1/TOUCH_SCL
T10
42
41
J3
T9
( DNP )
+3.3V
+3.3V
1
40
C6
0.1uF
39
38
37
36
35
34
2
GND
SCL1/TOUCH_SCL
T8
GND
SDA1/TOUCH_SDA
T7
INT1/TOUCH_INT
T6
TOUCH_WAKE
3
4
52271-0679
NC
+V
GND
SDA
SCL
INT
5
6
T5
T4
12
13
CS9
CS8
14
RX10
15
RX9
16
GND
C4
0.1uF
17
+3.3V
MCLR
CS7
18
19
20
CS6
CS5
VSS
VDD
VDD
RESET
RX0
RX8
RX1
RX6
22
TX3
VSS
RX7
21
TX2
RX5
RX2
RX3
RX4
33
32
31
30
GND
T0
T0
T1
T1
T2
T2
T3
T4
T3
T5
29
GND
C5
0.1uF
28
27
26
25
24
23
CS0
CS1
CS2
CS3
CS4
T6
T7
T8
+3.3V
T9
T10
T11
T12
T13
T14
T15
T16
CS0
CS1
CS2
MTCH6301
CS3
CS4
CS5
CS6
CS7
CS8
CS9
© 2013-2014 Microchip Technology Inc.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
XF2M-3015-1A
J4
T11
DS70005148B-page 47
Multimedia Expansion Board II (MEB II) User’s Guide
NOTES:
DS70005148B-page 48
© 2013-2014 Microchip Technology Inc.
MULTIMEDIA EXPANSION BOARD II
(MEB II) USER’S GUIDE
Appendix B. Bill of Materials
TABLE B-1:
MULTIMEDIA EXPANSION BOARD II (MEB II) BILL OF MATERIALS
Qty.
Reference
Description
27
C1, C2, C3,
C4, C5, C6,
C7, C8, C9,
C10, C11,
C12, C13,
C14, C15,
C16, C17,
C18, C19,
C20, C21,
C22, C23,
C24, C25,
C26, C27
Cap, Ceramic, 0.1 µF, 50V X7R
Manufacturer
2
C30, C31
Cap, Ceramic, 0.01 µF 50V X7R
TDK Corporation
C1608X7R1H103M
5
C34, C35,
C36, C37,
C38
Cap, Ceramic, 1 µF 16V X5R
TDK Corporation
C1608X5R1C105K
11
C39, C40,
C41, C42,
C43, C44,
C45, C46,
C47, C48,
C49
Cap, Ceramic, 2.2 µF 10V 20% X5R 0603
TDK Corporation
C1608X5R1A225M/0.80
2
C50, C51
Cap, Ceramic, 0.22 µF 16V Y5V 0603
Murata Electronics North America
GRM188F51C224ZA01D
3
C52, C53,
C54
Cap, Ceramic, 0.047 µF 50V 10% X7R 0603
TDK Corporation
C1608X7R1H473K080AA
TDK Corporation
Part No.
C1608X7R1H104M
1
C55
Cap, Ceramic, 0.022 µF 50V 20% X7R 0603
Murata Electronics North America
GRM188R71H223MA01D
10
C56, C57,
C58, C59,
C60, C61,
C62, C63,
C64, C65
Cap, Ceramic, 10 µF 16V X5R
Taiyo Yuden
EMK212BJ106MG-T
2
C66, C67
Cap, Ceramic, 22 µF 16V 10% X5R 0805
TDK Corporation
C2012X5R1C226K
2
C68, C69
Cap, Tantalum, 47 µF 6.3V 20% 1206
Kemet
T494A476M006AT
5
R1, R2, R3,
R4, R5
Resistor, 0.0 Ohm 1/10W 0603 SMD
Rohm Semiconductor
MCR03EZPJ000
Rohm Semiconductor
MCR03EZPFX4700
6
R6, R7, R8, Resistor, 470 Ohm 1/10W 1% 0603 SMD
R9, R10, R11
5
R12, R13,
R14, R15,
R16
Resistor, 4.70K Ohm 1/10W 1% 0603 SMD
Panasonic - ECG
ERJ-3EKF4701V
8
R17, R18,
R19, R20,
R21, R22,
R44, R45
Resistor, 10K Ohm 1/10W 1% 0603 SMD
Stackpole Electronics Inc.
RMCF0603FT10K0
6
R23, R24,
R25, R26,
R37, R38
Resistor, 1.10K Ohm 1/10W 1% 0603 SMD
Panasonic Electronic Components
ERJ-3EKF1101V
2
R27, R28
Resistor, TF 6.8 Ohm 1% 0.1W 0603
Stackpole Electronics Inc.
RMCF0603FT6R80
2
R29, R30
Resistor, 100 Ohm 1/10W 1%
Yageo
RC0603FR-07100RL
1
R31
Resistor, 2.20K Ohm 1/10W 1% 0603 SMD
Rohm Semiconductor
MCR03EZPFX2201
1
R32
Resistor, 470K 1/10W 1%
Panasonic - ECG
ERJ-3EKF4703V
1
R33
Resistor, TF 348K Ohm 1% 0.1W 0603
Stackpole Electronics Inc.
RMCF0603FT348K
1
R34
Resistor, 120 Ohm, 1/10W 1%
Stackpole Electronics Inc.
RMCF0603FT120R
1
R36
Resistor, 100K Ohm 1/10W 1% 0603 SMD
Stackpole Electronics Inc.
RMCF0603FT100K
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 49
Multimedia Expansion Board II (MEB II) User’s Guide
TABLE B-1:
Qty.
Reference
5
R39, R40,
R41, R42,
R43
MULTIMEDIA EXPANSION BOARD II (MEB II) BILL OF MATERIALS (CONTINUED)
Description
Resistor, 150 OHM 1/10W 1% 0603 SMD
Manufacturer
Part No.
TE
3-1676481-5
SS110-TP
1
D1
DIODE SCHOTTKY 1A 100V SMA
Micro Commercial Co.
1
D2
LED, SMD, GRN, 0603 package
Kingbright Corp.
APT1608SGC
5
D3, D4, D5,
D6, D7
LED, SMD, RED, 0603 package
Kingbright Corp.
APT1608EC
1
J1
Hirose FX10_ 168-pin Receptacle/ESK MH
Hirose Electric Co. Ltd.
FX10A-168S-SV
1
J2
Connector, FEMALE 28 POS DL .1" R/A TIN
Sullins Connector Solutions
PPTC142LJBN-RC
1
J3
Connector, POWER JACK 2.5 X 5.5 MM HI CUR
CUI Inc.
PJ-002BH-SMT
1
J4
Connector, HDR 60 POS 0.5 MM SMD GOLD
Hirose Electric Co. Ltd.
DF12(3.0)-60DP-0.5V(86)
3
J5, J6, J7
Connector, JACK STEREO 5 POS 3.5 MM SMD
Switchcraft Inc.
35RASMT4BHNTRX
1
J8
Connector, Mini microSD 8-PIN PCB GOLD
Amphenol
101-00581-59
1
J9
Connector, HEADER 3 POS .100 RT/A SMD
Sullins Connector Solutions
GBC03SBSN-M89
1
J10
Connector, MOD JACK R/A 6P6C SMD
Amphenol
RJLSE6202101T
1
L1
4.7 µH 20%
CoilCraft
LPS4018-472M
3
L2, L3, L4
INDUCTOR MULTILAYER 3300 NH 0603
Abracon Corporation
AIML-0603-3R3K-T
4
FB1, FB2,
FB3, FB4
FERRITE CHIP 600 OHM 500 MA 0805
TDK Corporation
MMZ2012Y601B
1
U1
CODEC (24-bit Stereo)
AKM
AK4953A
1
U2
Dual-mode Bluetooth HCI
Flaircomm
FLC_BTM805
1
U3
TX RX RF 2.4 GHz PCB ANT 802.11b
Microchip Technology Inc.
MRF24WG0MA-I/RM
1
U4
IC REG BUCK SYNC 5V 2A 16-VQFN
Microchip Technology Inc.
MCP16322T-500E/NG
1
U5
IC LDO REG 1000 mA 3.3V SOT223-3
Microchip Technology Inc.
MCP1826S-3302E/DB
1
U6
SENSOR CAMERA CMOS 20 CAMERACUBE
OmniVision Technologies Inc
OVM7690-R20A
1
U7
IC REG LDO ADJ 50 mA SOT23A-5
Microchip Technology Inc.
TC1071VCT713
1
U8
LP Linear Active Thermistor SOT-23-3
Microchip Technology Inc.
MCP9700T-E/TT
1
U9
Accelerometer ADXL325
Analog Devices Inc
ADXL325BCPZ-RL7
1
U10
LDO Voltage Regulator 1.8V 250 mA
Microchip Technology Inc.
MCP1700T-1802E/TT
1
U11
SRAM 16M (1M x 16) 10 ns Async SRAM
Integrated Silicon Solution Inc.
IS61WV102416BLL-10TLI
1
S1
SWITCH TACTILE SPST-NO 0.05A 12V
C&K Components
PTS635SK25SMTR LFS
1
GND
TP-115 * 50_SMT
Keystone Electronics
5015
TABLE B-2:
DISPLAY BOARD BILL OF MATERIALS
Qty.
Reference
1
4.3" Display
4.3" Display w/ TP
Description
3
C1, C2, C7
Cap, Ceramic, 10 µF 16V X5R
Taiyo Yuden
EMK212BJ106MG-T
1
C3
Cap, Ceramic, 10 µF 35V 10% X5R 1206
Taiyo Yuden
GMK316BJ106KL-T
3
C4, C5, C6
Cap, Ceramic, .10 µF 50V X7R 0603
TDK Corporation
C1608X7R1H104M
1
D1
Diode, Schottky, 30V 100 mA SOD323
Diodes Inc.
SD107WS-7-F
1
J1
Connector, RCPT 60 POS 0.5 mm SMD GOLD
Hirose Electric Co. Ltd.
DF12(30)-60DS-0.5V(86)
1
J2
Connector, FPC 40 POS 0.5 mm PITCH SMD
Omron Electronics Inc., EMC Div
XF2M-4015-1A
1
J4
Connector, FPC 30 POS 0.5 mm PITCH SMD
Omron Electronics Inc., EMC Div
XF2M-3015-1A
1
L1
15 µH ±20%
CoilCraft
LPS3015-153ML
1
Q1
MOSFET N-CH 30V 2A SOT23
Alpha & Omega Semiconductor Inc.
AO3424
1
R1
Resistor, .50 Ohm 1/3W 1% 0805 SMD
Susumu
RL1220S-R50-F
1
R2
Resistor, 7.68K Ohm 1/10W 1% 0603 SMD
Panasonic - ECG
ERJ-3EKF7681V
1
R3
Resistor, 10K Ohm 1/10W 1% 0603 SMD
Stackpole Electronics Inc.
RMCF0603FT10K0
1
R4
Resistor, 470 Ohm 1/10W 1% 0603 SMD
Rohm Semiconductor
MCR03EZPFX4700
1
U1
MCP1650-E/MS_BOOST
Microchip Technology Inc.
MCP1650S-E/MS
1
U2
MTCH6301
Microchip Technology Inc.
MTCH6301-I/PT
1
J3
Connector, FFC 6 POS 1 mm R/A ZIF SMD
Molex Connector Corporation
52271-0679
DS70005148B-page 50
Manufacturer
Part No.
AMTouch USA
P3003-02-1-01 Touch
Panel/LCD assembly
© 2013-2014 Microchip Technology Inc.
NOTES:
© 2013-2014 Microchip Technology Inc.
DS70005148B-page 51
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
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Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 774-760-0087
Fax: 774-760-0088
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Tel: 630-285-0071
Fax: 630-285-0075
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Tel: 216-447-0464
Fax: 216-447-0643
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Tel: 972-818-7423
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Tel: 248-848-4000
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Tel: 281-894-5983
Indianapolis
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Tel: 317-773-8323
Fax: 317-773-5453
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Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS70005148B-page 52
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
10/28/13
© 2013-2014 Microchip Technology Inc.