VSMY294310SL Datasheet

VSMY294310SL
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diodes, 940 nm,
Surface Emitter Technology
FEATURES
• Package type: surface mount
• Package form: side view
• Dimensions (L x W x H in mm): 2.3 x 2.55 x 2.3
• Peak wavelength: λp = 940 nm
• High reliability
• High radiant power
• Very high radiant intensity
• Angle of half intensity: ϕ = ± 25°
DESCRIPTION
SurfLightTM
As part of the
portfolio, the VSMY294310SL is
an infrared, 940 nm, side looking emitting diode based on
GaAlAs surface emitter chip technology with extreme high
radiant intensities, high optical power and high speed,
molded in clear, untinted plastic packages (with lens) for
surface mounting (SMD).
• Suitable for high pulse current operation
• Package matches with detector VEMD2xx3SLX01 and
VEMT2xx3SLX01 series
• Floor life: 4 weeks, MSL 2a, acc. J-STD-020
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Miniature light barrier
• Photointerrupters
• Optical switch
• Emitter source for proximity sensors
• IR illumination
• Remote control
PRODUCT SUMMARY
COMPONENT
VSMY294310SL
Ie (mW/sr)
ϕ (deg)
λp (nm)
tr (ns)
25
± 25
940
10
Note
• Test conditions see table “Basic Characteristics“
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMY294310SL
Tape and reel
MOQ: 3000 pcs, 3000 pcs/reel
Side view
Note
• MOQ: minimum order quantity
Rev. 1.0, 13-Oct-15
Document Number: 84230
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY294310SL
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VR
5
V
mA
Reverse voltage
Forward current
Surge forward current
tp = 100 μs
IF
70
IFSM
1
A
PV
140
mW
Power dissipation
Junction temperature
Operating temperature range
Tj
100
°C
Tamb
-40 to +85
°C
°C
Storage temperature range
Soldering temperature
Thermal resistance junction/ambient
Tstg
-40 to +100
acc. figure 10, J-STD-020
Tsd
260
°C
J-STD-051, soldered on PCB
RthJA
250
K/W
80
IF - Forward Current (mA)
PV - Power Dissipation (mW)
140
120
100
80
RthJA = 250 K/W
60
40
20
0
70
60
50
40
30
RthJA = 250 K/W
20
10
0
0
20
40
60
80
100
0
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
Temperature coefficient of VF
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
IF = 70 mA, tp = 20 ms
VF
-
1.5
2.0
V
IF = 1 A, tp = 100 μs
VF
-
2.5
-
V
IF = 20 mA
TKVF
-
-1.7
-
mV/K
VR = 0 V, f = 1 MHz, E = 0 mW/cm2
CJ
-
5
-
pF
IF = 70 mA, tp = 20 ms
Ie
12
25
45
mW/sr
Reverse current
Junction capacitance
Radiant intensity
IR
not designed for reverse operation
UNIT
μA
IF = 1 A, tp = 100 μs
Ie
-
260
-
mW/sr
IF = 70 mA, tp = 20 ms
φe
-
40
-
mW
IF = 70 mA
TKφe
-
-0.2
-
%/K
ϕ
-
± 25
-
deg
Peak wavelength
IF = 20 mA
λp
920
940
960
nm
Spectral bandwidth
IF = 20 mA
Δλ
-
35
-
nm
Temperature coefficient of λp
IF = 20 mA
TKλp
-
0.25
-
nm/K
Rise time
IF = 70 mA, 20 % to 80 %
tr
-
10
-
ns
Fall time
IF = 70 mA, 20 % to 80 %
tf
-
10
-
ns
Radiant power
Temperature coefficient
of radiant power
Angle of half intensity
Rev. 1.0, 13-Oct-15
Document Number: 84230
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY294310SL
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
1000
100
10
1
1.0
tp = 100 μs
Ie - Radiant Intensity (mW/sr)
IF - Forward Current (mA)
tp = 100 µs
100
10
1
0.1
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
1
2.8
VF - Forward Voltage (V)
Ie, rel - Relative Radiant Intensity (%)
110
IF = 20 mA
VF - Forward Voltage (V)
1000
Fig. 6 - Radiant Intensity vs. Forward Current
1.50
1.45
1.40
1.35
1.30
1.25
1.20
- 60 - 40 - 20
0
20
40
60
80
IF = 20 mA
105
100
95
90
85
80
- 60 - 40 - 20
100
Tamb - Ambient Temperature (°C)
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 4 - Forward Voltage vs. Ambient Temperature
Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature
115
100
Ie, rel - Relative Radiant Intensity (%)
VF, rel - Relative Forward Voltage (%)
100
IF - Forward Current (mA)
Fig. 3 - Forward Current vs. Forward Voltage
IF = 20 mA
110
105
100
95
90
- 60 - 40 - 20
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 5 - Relative Forward Voltage vs. Ambient Temperature
Rev. 1.0, 13-Oct-15
10
IF = 20 mA
90
80
70
60
50
40
30
20
10
0
800
850
900
950
1000
1050
λ - Wavelength (nm)
Fig. 8 - Relative Radiant Intensity vs. Wavelength
Document Number: 84230
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY294310SL
www.vishay.com
Vishay Semiconductors
DRYPACK
0°
10°
20°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
Ie rel - Relative Radiant Intensity
30°
80°
0.6
0.4
0.2
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020
DRYING
0
22688
Fig. 9 - Relative Radiant Intensity vs. Angular Displacement
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
SOLDER PROFILE
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
200
max. 30 s
150
max. 100 s
max. 120 s
100
max. ramp down 6 °C/s
50
max. ramp up 3 °C/s
0
0
19841
50
100
150
200
250
300
Time (s)
Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
Rev. 1.0, 13-Oct-15
Document Number: 84230
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY294310SL
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters: VSMY294310SL
Ø 1.8
1.6
0.3
2.55
0.85
0.4
2.2
2.22
3.8
2.3
0.9
2.3
0.05 ± 0.1
Cathode
Technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.2
0.5
Anode
Solder pad proposal
acc. IPC 7351
Exceeding cut residues or cut ins allowed
within the tolerance of the leads
0.9
1.2
0.9
4.2
center of pick
and place area
Drawing-No.: 6.544-5410.03-4
Issue: 3; 02.10.15
Rev. 1.0, 13-Oct-15
Document Number: 84230
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY294310SL
www.vishay.com
Vishay Semiconductors
TAPING AND REEL DIMENSIONS in millimeters: VSMY294310SL
X
Reel
Unreel direction
±0
Ø 62 ± 0.5
2 .5
Ø
13
±
0.5
Ø 330 ± 1
.5
Tape position
coming out from reel
6000 pcs / reel
Technical drawings
according to DIN
specifications
Label posted here
12.4 ± 1.5
Leader and trailer tape
Empty (160 mm min.)
Parts mounted
Direction of pulling out
Empty (400 mm min.)
Device
Lead I
1.75 ± 0.1
Terminal position in tape
Lead II
VSMB2943SLX01
4 ± 0.1
2 ± 0.05
Ø 1.55 ± 0.05
X (2 : 1)
I
VSMF2893SLX01
Cathode
Anode
Collector
Emitter
Anode
Cathode
+ 0.3
- 0.1
VEMD2023SLX01
VEMT2023SLX01
VEMT2523SLX01
12
VEMD2523SLX01
VSMY2853SL
VSMY2943SL
5.5 ± 0.05
VSMB2948SL
8 ± 0.1
II
2.85 ± 0.1
VSMY294310SL
Drawing-No.: 9.800-5123.01-4
Issue: 4; 02.10.15
Rev. 1.0, 13-Oct-15
Document Number: 84230
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000