TSHG8200 Datasheet

TSHG8200
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diode, 830 nm,
GaAlAs Double Hetero
FEATURES
•
•
•
•
Package type: leaded
Package form: T-1¾
Dimensions (in mm): 5
Peak wavelength: p = 830 nm
•
•
•
•
High reliability
High radiant power
High radiant intensity
Angle of half intensity:  = ± 10°
• Low forward voltage
• Suitable for high pulse current operation
• High modulation bandwidth: fc = 18 MHz
94 8389
• Good spectral matching with CMOS cameras
• Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
DESCRIPTION
TSHG8200 is an infrared, 830 nm emitting diode in GaAlAs
double hetero (DH) technology with high radiant power and
high speed, molded in a clear, untinted plastic package.
Note
** Please see document “Vishay Material Category Policy”:
www.vishay.com/doc?99902
APPLICATIONS
• Infrared radiation source for operation with CMOS
cameras (illumination)
• High speed IR data transmission
• Smoke-automatic fire detectors
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
 (deg)
P (nm)
tr (ns)
180
± 10
830
20
TSHG8200
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
TSHG8200
PACKAGING
REMARKS
PACKAGE FORM
Bulk
MOQ: 4000 pcs, 4000 pcs/bulk
T-1¾
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
SYMBOL
VALUE
Reverse voltage
VR
5
V
Forward current
IF
100
mA
mA
PARAMETER
TEST CONDITION
UNIT
Peak forward current
tp/T = 0.5, tp = 100 μs
IFM
200
Surge forward current
tp = 100 μs
IFSM
1
A
Power dissipation
PV
180
mW
Junction temperature
Tj
100
°C
°C
Operating temperature range
Tamb
- 40 to + 85
Storage temperature range
Tstg
- 40 to + 100
°C
t  5 s, 2 mm from case
Tsd
260
°C
J-STD-051, leads 7 mm soldered
on PCB
RthJA
230
K/W
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.3, 23-Aug-11
Document Number: 84755
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSHG8200
www.vishay.com
Vishay Semiconductors
200
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
RthJA = 230 K/W
100
80
60
40
100
80
RthJA = 230 K/W
60
40
20
20
0
0
0
10
21142
20
30
40
50
60
70 80
90 100
0
Tamb - Ambient Temperature (°C)
21143
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
10
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
Fig. 1 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
TEST CONDITION
SYMBOL
TYP.
MAX.
IF = 100 mA, tp = 20 ms
VF
1.5
1.8
IF = 1 A, tp = 100 μs
VF
2.3
Temperature coefficient of VF
IF = 1 mA
TKVF
- 1.8
Reverse current
VR = 5 V
IR
VR = 0 V, f = 1 MHz, E = 0
Cj
IF = 100 mA, tp = 20 ms
Ie
PARAMETER
Forward voltage
Junction capacitance
Radiant intensity
MIN.
180
V
V
mV/K
10
μA
360
mW/sr
125
120
UNIT
pF
IF = 1 A, tp = 100 μs
Ie
1600
IF = 100 mA, tp = 20 ms
e
50
mW
IF = 100 mA
TKe
- 0.35
%/K

± 10
deg
Peak wavelength
IF = 100 mA
p
830
nm
Spectral bandwidth
IF = 100 mA

40
nm
Temperature coefficient of p
IF = 100 mA
TKp
0.25
nm/K
Rise time
IF = 100 mA
tr
20
ns
Fall time
IF = 100 mA
tf
13
ns
IDC = 70 mA, IAC = 30 mA pp
fc
18
MHz
d
3.7
mm
Radiant power
Temperature coefficient of e
Angle of half intensity
Cut-off frequency
Virtual source diameter
Rev. 1.3, 23-Aug-11
mW/sr
Document Number: 84755
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSHG8200
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
Tamb < 50 °C
tp/T = 0.01
1000
Radiant Power (mW)
IF - Forward Current (mA)
0.02
0.05
0.1
10
1
e-
0.2
100
0.5
100
0.01
0.1
0.1
1
10
100
tp - Pulse Duration (ms)
16031
1
16971
1.25
Φe, rel - Relative Radiant Power
1000
100
tp = 100 µs
tp/T = 0.001
10
1.0
0.75
0.5
0.25
0
740
1
0
18873
1
3
2
VF - Forward Voltage (V)
4
900
800
λ- Wavelength (nm)
16972_1
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 6 - Relative Radiant Power vs. Wavelength
0°
10°
20°
Ie rel - Relative Radiant Intensity
100
10
1
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
30°
1000
Ie - Radiant Intensity (mW/sr)
1000
Fig. 5 - Radiant Power vs. Forward Current
Fig. 2 - Pulse Forward Current vs. Pulse Duration
IF - Forward Current (mA)
10
100
IF - Forward Current (mA)
80°
0.1
1
16032
10
100
1000
IF - Forward Current (mA)
Fig. 4 - Radiant Intensity vs. Forward Current
Rev. 1.3, 23-Aug-11
0.6
0.4
0.2
0
15989
Fig. 7 - Relative Radiant Intensity vs. Angular Displacement
Document Number: 84755
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSHG8200
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
C
R 2.49 (sphere)
< 0.7
(4.7)
7.7 ± 0.15
35.5 ± 0.55
8.7 ± 0.3
5.8 ± 0.15
A
Area not plane
5 ± 0.15
1 min.
+ 0.2
0.6 - 0.1
+ 0.15
0.5 - 0.05
+ 0.15
0.5 - 0.05
technical drawings
according to DIN
specifications
2.54 nom.
6.544-5259.02-4
Issue: 8; 19.05.09
95 10917
Rev. 1.3, 23-Aug-11
Document Number: 84755
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 02-Oct-12
1
Document Number: 91000