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Quality Information
Corporate Quality Policy
Our goal is to exceed the quality
expectations of our customers.
This commitment starts with top
management and extends through
the entire organization. It is achieved
through innovation, technical excellence,
and continuous improvement.
18348
Fig. 1 - Vishay Quality Policy
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VISHAY INTERTECHNOLOGY, INC.
ENVIRONMENTAL, HEALTH, AND SAFETY POLICY
Vishay Intertechnology, Inc. is committed to conducting its worldwide operations in a socially responsible and ethical manner
to protect the environment, and ensure the safety and health of our employees, to conduct their daily activities in an
environmentally responsible manner.
Protection of the Environment: conduct our business operation in a manner that protects the environmental quality of the
communities in which our facilities are located. Reduce risks involved with storage and use of hazardous materials. The
company is also committed to continual improvement of its environmental performance.
Compliance with Environmental, Health and Safety Laws, and Regulations: comply with all relevant environmental, health
and safety laws, and regulations in every location. Maintain a system that provides timely updates of regulatory change.
Cooperate fully with governmental agencies in meeting applicable requirements.
Energy, Resource Conservation, and Pollution Control: strive to minimize energy and material consumption in the design of
products and processes, and in the operation of our facilities. Promote the recycling of materials, including hazardous wastes,
whenever possible. Minimize the generation of hazardous and non-hazardous wastes at our facilities to prevent or eliminate
pollution. Manage and dispose of wastes safely and responsibly.
World Class Excellence
•
2016
•
•
•
2000
•
•
•
•
1995
•
•
•
•
1990
Think Automotive Quality
Zero Defect Strategy
Integrated Management System
Design for Six Sigma
ISO / TS 16949
ISO 14000
QS 9000 / VDA 6.1
EFQM Approach
ISO 9000
Advanced Quality Tools
Cost of Quality
Empowered Improvement Team
17275
Fig. 2 - Vishay Quality Road Map
QUALITY SYSTEM
VISHAY CORPORATE QUALITY
Vishay Corporate Quality defines and implements the Vishay
quality policy at a corporate level. It acts to harmonize the
quality systems of the constituent division and to implement
Total Quality Management throughout the company
worldwide.
QUALITY PROGRAM
At the heart of the quality process is the Vishay worldwide
quality program. This program, which has been in place
since the early 90’s, is specifically designed to meet
rapidly increasing customer quality demands now and in
the future.
Vishay Zero Defect Program
• Exceeding quality expectations of our customers
• Commitment from top management through entire
organization
• Newest and most effective procedures and tools
- Design, manufacturing, and testing
- Management procedures (e.g. SPC, TQM)
• Continuous decreasing numbers for AOQ and failure rate
• Detailed failure analysis using 8D methodology
• Continuous improvement of quality performance of parts
and technology
Vishay Corporate Quality implements the Quality Policy
and translates its requirements for use throughout the
worldwide organization.
Vishay Quality has defined a roadmap with specific targets
along the way. The major target is to achieve world-class
excellence throughout Vishay worldwide.
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QUALITY GOALS AND METHODS
The goals are straightforward: customer satisfaction
through continuous improvement towards zero defects in
every area of our operation. We are committed to meet our
customers’ requirements in terms of quality and service. In
order to achieve this, we build excellence into our products
from concept to delivery and beyond.
• Design-in Quality
Quality must be designed into products. Vishay uses
optimized design rules based on statistical information.
This is refined using electrical, thermal, and mechanical
simulation together with techniques such as FMEA, QFD,
and DOE.
18349
• Built-in Quality
Quality is built into all Vishay products by using qualified
materials, suppliers, and processes. Fundamental to this
is the use of SPC techniques by both Vishay and its
suppliers. The use of these techniques, as well as tracking
critical processes, reduces variability, optimizing the
process with respect to the specification. The target is
defect prevention and continuous improvement.
The procedures used are based upon these standards and
laid down in an approved and controlled quality manual.
BUSINESS EXCELLENCE
Total quality management is a management system
combining the resources of all employees, customers, and
suppliers in order to achieve total customer satisfaction. The
fundamental elements of this system are:
• Qualification
All new products are qualified before release by
submitting them to a series of mechanical, electrical, and
environmental tests. The same procedure is used for new
or changed processes or packages.
• Management commitment
• EFQM assessment methodology
• Employee involvement teams (EITs)
• Supplier development and partnership
• Monitoring
A selection of the same or similar tests used for
qualification is also used to monitor the short- and
long-term reliability of the product.
• Quality tools
• Training
• Quality system
• SPC (Statistical Process Control)
SPC is an essential part of all Vishay process control. It
has been established for many years and is used as a
tool for the continuous improvement of processes by
measuring, controlling, and reducing variability.
• Design for Six Sigma
• Think Automotive Quality program
• Zero defect
All Vishay employees from the senior management
downwards are trained in understanding and use of TQM.
Every employee plays its own part in the continuous
improvement process which is fundamental to TQM and our
corporate commitment to exceed customers’ expectations
in all areas including design, technology, manufacturing,
human resources, marketing, and finance. Everyone is
involved in fulfilling this goal. The management believes that
this can only be achieved by employee empowerment.
• Vishay Quality System
All Vishay’s facilities worldwide are approved to ISO 9000.
In addition, depending on their activities, some Vishay
companies are approved to recognized international and
industry standards such as ISO / TS 16949.
• Each subsidiary goal is to fulfill the particular
requirements of customers. The Optoelectronic divisions
of Vishay Semiconductor GmbH are certified according
to ISO / TS 16949.
The Vishay corporate core values
• Leadership by example
• Employee empowerment
• Continuous improvement
• Total customer satisfaction
are the very essence of the Vishay Quality Movement
process.



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• Training
• Gauge Repeatability and Reproducibility (GR and R)
Vishay maintains that it can only realize its aims if the
employees are well trained. It therefore invests heavily in
courses to provide all employees with the knowledge they
need to facilitate continuous improvement. A training profile
has been established for all employees with emphasis being
placed on total quality leadership. Our long-term aim is to
continuously improve our training so as to keep ahead of
projected changes in business and technology.
This technique is used to determine equipment’s suitability
for purpose. It is used to make certain that all equipment is
capable of functioning to the required accuracy and
repeatability. All new equipment is approved before use by
this technique.
• Quality Function Deployment (QFD)
QFD is a method for translating customer requirements into
recognizable requirements for Vishay’s marketing, design,
research, manufacturing, and sales (including after-sales).
QFD is a process, which brings together the life cycle of a
product from its conception, through design, manufacture,
distribution, and use until it has served its expected life.
TQM TOOLS
As part of its search for excellence, Vishay employs many
different techniques and tools. The most important of them
are:
• Auditing
QUALITY SERVICE
As well as third party auditing employed for approval by
ISO 9000 and customers, Vishay carries out its own internal
and external auditing. There is a common auditing
procedure for suppliers and sub-contractors between the
Vishay entities. This procedure is also used for
inter-company auditing between the facilities within Vishay.
It is based on the “Continuous Improvement” concept with
heavy emphasis on the use of SPC and other statistical tools
for the control and reduction of variability.
Vishay believes that quality of service is equally as
important as the technical ability of its products to meet
their required performance and reliability. Our objectives
therefore include:
Internal audits are carried out on a routine basis. They
include audits of satellite facilities (i.e., sales offices,
warehousing etc.). Audits are also used widely to determine
attitudes and expectations both within and outside the
company.
• A partnership with our customers
• On-time delivery
• Short response time to customers’ requests
• Rapid and informed technical support
• Fast handling of complaints
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18352
• Failure Mode and Effect Analysis (FMEA)
• Customer Quality
FMEA is a technique for analyzing the possible methods of
failure and their effect upon the performance / reliability of
the product / process. Process FMEAs are performed for all
processes. In addition, product FMEAs are performed on all
critical or customer products.
Complaints fall mainly into two categories:
• Logistical
• Technical
Vishay has a procedure detailing the handling of complaints.
Initially complaints are forwarded to the appropriate sales
office where in-depth information describing the problem,
using the Vishay customer analysis request (CAR), is of
considerable help in giving a fast and accurate response. If
it is necessary to send back the product for logistical
reasons, the sales office issues a returned material
authorization (RMA) number.
• Design of Experiments (DOE)
There is a series of tools that may be used for the statistical
design of experiments. It consists of a formalized procedure
for optimizing and analyzing experiments in a controlled
manner. Taguchi and factorial experiment design are
included in this. They provide a major advantage in
determining the most important input parameters, making
the experiment more efficient and promoting common
understanding among team members of the methods and
principles used.
Rev. 1.8, 25-Jan-16
On receipt of the goods in good condition, credit is
automatically issued.
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If there is a technical reason for complaint, a sample
together with the CAR is sent to the sales office for
forwarding to the failure analysis department of the
supplying facility. The device’s receipt will be acknowledged
and a report issued on completion of the analysis. The
cycle time for this analysis has set targets and is
constantly monitored in order to improve the response time.
Failure analysis normally consists of electrical testing,
functional testing, mechanical analysis (including X-ray),
decapsulation, visual analysis and electrical probing. Other
specialized techniques (i.e. LCD, thermal imaging, SEM,
acoustic microscopy) may be used if necessary.
If the analysis uncovers a quality problem, a corrective
action report (CAR) in 8D format will be issued. Any
subsequent returns are handled with the RMA procedure.



21112
Customer notifies Vishay sales office of a
complaint and sales obtains the necessary
information about return using attached
form (CAR)
Complaint regarding comercial
aspects like wrong product, stock
rotation wrong quantity
Complaint regarding technical
aspects like out of spec, wrong
label, packaging
Samples to be sent by the
customer to the Vishay location
in charge
8D report to be sent to the
customer with Vishay reference
number
Entitled to
return / replacement
products
No
End of return procedure
Yes
22539
Sales assign RMA for customer
product return
Complaint and Return Procedure
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22209
Corrective Action Request Form
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Vishay 8D Form
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Vishay 8D Form
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Change Notification
RELIABILITY AND QUALIFICATION
All product and process changes are controlled and
released via ATP (approval of technical product and process
changes). This requires the approval of the relevant
departments. In the case of a major change, the change is
forwarded to customers via sales / marketing before
implementation. Where specific agreements are in place,
the change will not be implemented unless approved by the
customer.
Qualification is used as a means of verifying that a new
product or process meets specified reliability requirements.
This is also used to verify and release changes to products
or processes including new materials, packages, and
manufacturing locations. At the same time it provides a
means to obtain information on the performance and
reliability of new products and technologies.
QUALITY AND RELIABILITY
• Wafer process / technology qualification
• Package qualification
• Product / device qualification
The actual qualification procedure depends on which of
these (or combinations of these) are to be qualified.
Normally there are three categories of qualification in order
of degree of qualification and testing required.
There are three types of qualification and release:
ASSURANCE PROGRAM
Though both quality and reliability are designed into all
Vishay products, three basic programs must assure them:
• Average outgoing quality (AOQ) -
100 % testing is followed by sample testing to measure
the defect level of the shipped product. This defect level
(AOQ) is measured in ppm (parts per million)
For the qualification there are two different standards. For
Commodity and Industrial products the Vishay internal
standard is used. For Vishay Automotive Grade parts, the
qualification is done according to AEC-Q101.
• Reliability qualification program -
to assure that the design, process, or change is reliable
Accelerated testing is normally used in order to produce
results fast. The stress level employed depends upon the
failure mode investigated. The stress test is set so that the
level used gives the maximum acceleration without
introducing any new or untypical failure mode.
• Reliability monitoring program -
to measure and assure that there is no decrease in the
reliability of the product
The tests used consist of a set of the following:
• High temperature life test (static)
• High temperature life test (dynamic)
• HTRB (high temperature reverse bias)
• Humidity 85/85 (with or without bias)
• Temperature cycling
• High-temperature storage
• Low-temperature storage
• Marking permanency
• Lead integrity
• Solderability
• Resistance to solder heat
• Mechanical shock (not plastic packages)
• Vibration (not plastic packages)
• ESD characterization
SMD devices only are subjected to pre-conditioning to
simulate board assembly techniques using the methods
defined in standard J-STD-020D before being subjected to
stresses.
18357
AOQ PROGRAM
Before leaving the factory, all products are sampled after
100 % testing to ensure that they meet a minimum quality
level and to measure the level of defects. The results are
accumulated and expressed in ppm (parts per million). They
are the measure of the average number of potentially failed
parts in deliveries over a period of time. The sample size
used is determined by AQL or LTPD tables depending upon
the product. No rejects are allowed in the sample.
The AOQ value is calculated monthly using the method
defined in standard JEDEC® 16:
6
AOQ = p x LAR x 10 (ppm)
where:
Normally, the endpoint tests are related to the datasheet or
to specified parameters. Additionally, they may include:
number of devices rejected
p = -------------------------------------------------------------------------------total number of devices tested
= lot acceptance rate:
number of lots rejected
LAR = 1 – ------------------------------------------------------------number of lots tested
•
•
•
•
•
The AOQ values are recorded separately with regard to
electrical and mechanical (visual) rejects by product type
and package.
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Destructive physical analysis
X-ray
Delamination testing using scanning acoustic microscope
Thermal imaging
Thermal and electrical resistance analysis
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Qualification procedure
Wafer process
qualification
Package
qualification
Device type
qualification
Monitoring
Process change
qualification
18358
A summary of the reliability test results combined with
process flows and technological data will be prepared when
the device has passed the Vishay qualification tests. The
summary is named QualPack.
For Vishay Automotive Grade devices also additional
information according to the PPAP requirements will be
provided on request.
22212
Example of the QualPack
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RELIABILTY MONITORING AND WEAR-OUT
MTTF, MTBF
The monitoring program consists of short-term monitoring
to provide fast feedback on a regular basis in case of a
reduction in reliability and to measure the early-life failure
rate (EFR). At the same time, long-term monitoring is used
to determinate the long-term steady-state failure rate (LFR).
The tests used are a subset from those used for qualification
and consist of:
MTTF (mean time to failure) applies to parts that will be
thrown away on failing. MTBF (mean time between failures)
applies to parts or equipment that is going to be repaired.
MTTF is the inverse failure rate.
1
MTTF = --
So R(t) becomes to: 
• Life tests
• Humidity tests
R (t) = e
• Temperature-cycling tests
= e
t
- ---------------MTTF
After a certain time, t will be equal to MTTF, R(t) becomes:
The actual tests used depend on the product tested.
R (t) = e
Depending on the assembly volume a yearly monitoring and
wear-out test plan is created.
-1
= 0.37

If a large number of units are considered, only 37 % of their
operation times will be longer than MTTF figure.
Wear-out data are very important in optoelectronic device.
Failure
rate
λ
- t
The failure rate () during the constant (random) failure
period is determined from life-test data. The failure rate is
calculated from the formula:
r
r
 = ------------------------------------------- = ---C
  fi x ti  +  N x t 
Useful life
where
 = failure rate (h-1)
21140
Early failure
period
Constant failure rate
period
r = number of observed failures
Wear-out
failure period
fi = failure number
ti = time to defect
Fig. 3 - Bathtub Curve
N = good sample size
The lifetime distribution curve is shown on fig. 3. This curve
is also known as the “bath-tub curve” because of its shape.
There are three basic sections:
t = entire operating time
C = number of components x h
The result is expressed in either
• Early-life failures (infant mortality)
• Operating-life failures (random failures)
a) % per 1000 component hours by multiplying by 105
• Wear-out failures
or in
Out of that data degradation curves can be made. These
curves show the long time behavior of the different devices.
b) FITs by multiplying by 109 (1 FIT = 10-9 h -1)
Example 1: determination of failure rate 
500 devices were operated over a period of 2000 h (t) with:
1 failure (f1) after 1000 h (t1)
The failure rate of the given example can be calculated as
follows:
1
 = -------------------------------------------------------------------------- 1 x 1000 h  + 499 x 2000 h
Some typical curves are attached in this report.
RELIABILITY PRINCIPLES
Reliability is the probability that a part works operated,
under specific conditions, performs properly for a given
period of time.
–6 –1
 = 1.001 x 10 h
F(t) + R(t) = 1 or R(t) = 1 - F(t)

That means that this sample has an average failure rate of
0.1 %/1000 h or 1001 FIT
where:
R(t) = probability of survival
F(t) = probability of failure
F(t) = 1 - e-t
Example 2: the failure rate of the population
Using example 1 with a failure rate of 1001 FIT and 1 failure:
2/2 at 60 % confidence is 2.02
where
 = instantaneous failure rate
t = time
thus,
2.02
 pop = ---------------------------5- = 2022 FIT
9.99 x 10
This means that the failure rate of the population will not
exceed 2022 FIT with a probability of 60 %.
R(t) = e-t
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Observed failure rates as measured above are for the
specific lot of devices tested. If the predicted failure rate for
the total population is required, statistical confidence
factors have to be applied.
The confidence factors can be obtained from “chi square”
(2) charts. Normally, these charts show the value of (2/2)
rather than 2. The failure rate is calculated by dividing the
2/2 factor by the number of component hours.
  2
 pop = ----------------C
2

The values for 2/2 are given in table 1
18362
ACTIVATION ENERGY
TABLE 1 - 2/2 CHART
Provided the stress testing does not introduce a failure
mode, which would not occur in practice, this method gives
an acceptable method for predicting reliability using short
test periods compared to the life of the device. It is
necessary to know the activation energy of the failure mode
occurring during the accelerated testing. This can be
determined by experiment. In practice, it is unusual to find a
failure or if there is, it is a random failure mode. For this
reason an average activation energy is normally used for this
calculation. Though activation energies can vary between
0.3 eV and 2.2 eV, under the conditions of use, activation
energies of between 0.6 eV and 0.9 eV are used depending
upon the technology.
CONFIDENCE LEVEL
NUMBER OF
FAILURES
60 %
90 %
0
0.92
2.31
1
2.02
3.89
2
3.08
5.30
3
4.17
6.70
4
5.24
8.00
5
6.25
9.25
6
7.27
10.55
• Accelerated Stress Testing
In order to be able to assure long operating life with a
reasonable confidence, Vishay carries out accelerated
testing on all its products. The normal accelerating factor is
the temperature of operation. Most failure mechanisms of
semiconductors are dependent upon temperature. This
temperature dependence is best described by the Arrhenius
equation.
0.8 eV
0.7 eV
Acceleration Factor
T2 = T1 x e
1000
EA  1 1 
------ x  ----- – -----
T1 T2
k
where
k
EA
T1
T2
T
1
T
2
= Boltzmann’s constant 8.63 x 10-5 eV/K
= activation energy (eV)
= operation temperature (K)
= stress temperature (K)
= operation failure rate
= stress-test failure rate
0.6 eV
100
0.5 eV
10
1
55
18361
75
95
115
135
155
Temperature (°C)
Fig. 4 - Acceleration Factor for different Activation Energies
Normalized to T = 55 °C
Using this equation, it is possible from the stress test results
to predict what would happen in use at the normal
temperature of operation.
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ACTIVATION ENERGIES FOR COMMON
FAILURE MECHANISMS
• Climatic Tests Models
Temperature cycling failure rate
The inverse power law is used to model fatigue failures of
materials that are subjected to thermal cycling. For the
purpose of accelerated testing, this model relationship is
called Coffin-Manson relationship, and can be expressed as
follows:
The activation energies for some of the major
semiconductor failure mechanisms are given in the table
below. These are estimates taken from published literature.
TABLE 2 - ACTIVATION ENERGIES FOR
COMMON FAILURE MECHANISM
T stress M
A F =  --------------------
 T use 
FAILURE MECHANISM
ACTIVATION ENERGY
Mechanical wire shorts
0.3 to 0.4
Diffusion and bulk defects
0.3 to 0.4
AF
Tuse
Oxide defects
0.3 to 0.4
Tstress = temp. range under stress operation
Top-to-bottom metal short
where:
0.5
M
= acceleration factor
= temp. range under normal operation
= constant characteristic of the failure mechanism
Electro migration
0.4 to 1.2
Electrolytic corrosion
0.8 to 1.0
TABLE 3 - COFFIN - MANSON EXPONENT M
Gold-aluminum intermetallics
0.8 to 2.0
FAILURE MECHANISM
M
Gold-aluminum bond degradation
1.0 to 2.2
Al wire bond failure
Intermetallic bond fracture
Au wire bond heel crack
Chip-out bond failure
3.5
4.0
5.1
7.1
Ionic contamination
1.02
Alloy pitting
1.77
Failure rates are quoted at an operating temperature of
55 °C and 60 % confidence using an activation energy (EA)
of 0.8 eV for optoelectronic devices.
For instance:
T use = 15 °C/60 °C = 45 °C
T stress = -25 °C/100 °C = 125 °C
Example 3: conversion to 55 °C
In Example 2, the life test was out at 125 °C so to transform
to an operating temperature of 55 °C.
T1 = 273 + 55 = 328 K
T1 = 273 + 125 = 398 K
Acceleration factor =
3
125 °C
A F =  ------------------  21
 45 °C 
Relative Humidity failure rate
Moisture effect modeling is based upon the
Howard-Pecht-Peck model using the acceleration factor of
the equation shown below:
T 
 (423 K)
----------2- = ----------------- = 144
T 
 (328 K)
1
thus
  423 K 
2022
  328 K  = -------------------- = ------------144
144
RH stress
A F =  ---------------------
 RH use 
= 14 FIT
(at 55 °C with a confidence of 60 %)
C
xe
E 1
1
-----A-  --------- – ------------
k  T use T stress
where:
This figure can be re-calculated for any operating / junction
temperature using this method.
RHstress = relative humidity during test
RHuse
= relative humidity during operation
• EFR (Early Life Failure Rate)
Tstress
= temperature during test
This is defined as the proportion of failures that will occur
during the warranty period of the system for which they were
designed. In order to standardize this period, Vishay uses
1000 operation hours as the reference period. This is the
figure also used by the automotive industry; it equates to
one year in the life of an automobile. In order to estimate this
figure, Vishay normally operates a sample of devices for
48 h or 168 h under the accelerated conditions detailed
above. The Arrhenius law is then used as before to calculate
the failure rate at 55 °C with a confidence level of 60 %. This
figure is multiplied by 1000 to give the failures in 1000 h and
by 106 to give a failure in ppm. All EFR figures are quoted in
ppm (parts per million).
Tuse
= temperature during operation
EA
= activation energy
k
= Boltzmann constant
C
= material constant
For instance:
RHstress = 85 %, RHuse = 92 %
Tstress = 85 °C, Tuse = 40 °C
0.8
1
1
 ---------------------------------------- – ----------
-5
8.617 x 10  313 358
85 % RH 3

A F = ------------------------ x e
 92 % RH
A F  33
The value of EFR and LFR is also depending on the amount
of new products brought to market in the period. If a lot of
new products are released the EFR and the LFR value can
also be increased in that period due to increased rejects.
Rev. 1.8, 25-Jan-16
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This example shows how to transform test conditions into
environmental or into another test conditions. This equation
is applicable for devices subjected to temperature humidity
bias (THB) testing.
These include the use of:
• Earthen wrist straps and benches
• Conductive floors
• Protective clothing
Using these acceleration factors the useful lifetime can be
calculated. Applying the acceleration factor once more,
useful lifetime for the moisture effect model for parts
subjected to THB can be estimated by the following
equation:
Useful life years
• Controlled humidity
It also lays down the methods for routinely checking these
and other items such as the earthen of machines.
A semiconductor device is only completely protected when
enclosed in a «Faraday Cage». This is a completely closed
conductive container (i.e., sealed conductive bag or box).
A F x test hours
= ---------------------------------------hours per year
with:
test hours = 1000
hours per year = 8760
Most packaging material (i.e. tubes) used for
semiconductors is now manufactured from anti-static
material or anti-static-coated material. This does not mean
that the devices are completely protected from ESD, only
that the packing will not generate ESD. Devices are
completely protected only when surrounded on all sides by
a conductive package.
AF  118 (40 °C / 60 % RH)
118 x 1000
Useful life years = ------------------------------  13.5 years
8760
This means that operation in 40 °C / 60 % RH environment
is good for around 13 years, calculated out of the
85 °C / 85 % RH 1000 h humidity stress test.
It should also be remembered that devices can equally as
easily be damaged by discharge from a high voltage to
ground as vice-versa.
HANDLING FOR QUALITY
Testing for ESD resistance is part of the qualification
procedure. The methods used are detailed in
MIL-STD-883 Method 3015.7 (human body model)
and EOS/ESD-S5.1-1993 (machine model) specification.
Also testing according to the CDM (charged coupled device
model) is part of the advanced qualification procedure.
• Electrostatic Discharge (ESD) Precautions
Electrostatic discharge is defined as the high voltage, which
is generated when two dissimilar materials move in contact
with one another. This may be by rubbing (i.e. walking on a
carpet) or by hot air or gas passing over an insulated object.
Sometimes, ESD is easily detectable as when a person is
discharged to ground.
• Soldering
All products are tested to ascertain their ability to withstand
the industry standard soldering conditions after storage. In
general, these conditions are as follows:
Electronic devices may be irreversibly damaged when
subjected to this discharge. They can also be damaged if
they are charged to a high voltage and then discharged to
ground.
• Wave soldering: Double-wave soldering according to
CECC 00802
Damage due to ESD may occur at any point in the process
of manufacture and use of the device. ESD is a particular
problem if the humidity is low (< 40 %) which is very
common in non-humidified but air-conditioned buildings.
ESD is not just generated by the human body but can also
occur with ungrounded machinery.
• Reflow soldering: according to JEDEC STD 20D
Note
• Certain components may have limitations due to their
construction
• Dry pack
ESD may cause a device to fail immediately or damage a
device so that it will fail later. Whether this happens or not,
usually depends on the energy available in the ESD pulse.
When being stored, certain types of device packages can
absorb moisture, which is released during the soldering
operations, thus causing damage to the device. The
so-called “popcorn” effect is such an example. To prevent
this, surface mount devices (SMD) are evaluated during
qualification, using a test consisting of moisture followed by
soldering simulation (pre-conditioning) and then subjected
to various stress tests. In table 4 - Moisture Sensitivity
Levels - the six different levels, the floor life conditions as
well as the soak requirements belonging to these levels are
described. Any device which is found to deteriorate under
these conditions is packaged in “dry pack”.
All ESD-sensitive Vishay products are protected by means
of
• Protection structures on chip
• ESD protection measures during handling and shipping
Vishay has laid down procedures, which detail the methods
to be used for protection against ESD. These measures
meet or exceed the standards for ESD-protective and
preventative measures.
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

Rev. 1.8, 25-Jan-16
The dry-packed devices are packed generally according
to IPC JEDEC STD 33 “Handling, Packing, Shipping and
use of Moisture / Reflow Sensitive Surface Mount Devices”,
IPC-SM-786 “Recommended Procedures for Handling of
Moisture Sensitive Plastic IC Packages”.
14
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Vishay Semiconductors
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Following some general recommendations:
• Shelf life in the packaging at < 40 °C and 90 % RH is
12 months
• After opening, the devices should be handled according to
the specifications mentioned on the dry-pack label
• If the exposure or storage time is exceeded, the devices
should be baked:
- Low-temperature baking - 192 h at 40 °C and 5 % RH
- High-temperature baking - 24 h at 125 °C
TABLE 4 - MOISTURE SENSITIVITY LEVELS
FLOOR LIFE
SOAK REQUIREMENTS
LEVEL
CONDITIONS
TIME
TIME (h)
CONDITIONS
1
 30 °C / 90 % RH
Unlimited
168
85 °C / 85 % RH
2
 30 °C / 60 % RH
1 year
168
85 °C / 60 % RH
2a
 30 °C / 60 % RH
4 weeks
696
30 °C / 60 % RH
X
Y
Z
3
 30 °C / 60 % RH
168 h
24
168
192
30 °C / 60 % RH
4
 30 °C / 60 % RH
72 h
24
72
96
30 °C / 60 % RH
5
 30 °C / 60 % RH
48 h
24
48
72
30 °C / 60 % RH
5a
 30 °C / 60 % RH
24 h
24
24
48
30 °C / 60 % RH
6
 30 °C / 60 % RH
6h
0
6
6
30 °C / 60 % RH
X = Default value of Semiconductor manufacturer’s exposure time (MET) between bake and bag plus the maximum time
allowed out of the bag at the distributor’s facility. The actual times may be used rather than the default times, but they must
be used if they exceed the default times.
Y = Floor life of package after it is removed from dry pack bag.
Z = Total soak time for evaluation (X + Y).
Note
• There are two possible floor lives and soak times in level 5. The correct floor life will be determined by the manufacturer and will be noted
on the dry pack bag label per JEP 113. “Symbol and Labels for Moisture Sensitive Devices”.
Rev. 1.8, 25-Jan-16
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Vishay Semiconductors
QUALITY AND RELIABILITY DATA
Average Outgoing Quality (AOQ)
AOQ IRDC
AOQ Visibles
AOQ el.
3
AOQ el.
4
AOQ mech.
AOQ mech.
3
ppm
ppm
2
2
1
1
0
0
2011
22213
2012
2013
2014
2011
22870
2013
2014
AOQ Couplers
AOQ IR Receiver
4
2012
1.0
AOQ el.
AOQ el.
AOQ mech.
AOQ mech.
ppm
ppm
3
2
0.5
1
0
2011
22214
2012
2013
AOQ Sensors
0
2014
22871
2011
2012
2013
2014
AOQ el.
8
AOQ mech.
7
ppm
6
5
4
3
2
1
0
22869
2011
Rev. 1.8, 25-Jan-16
2012
2013
2014
16
Document Number: 80077
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Quality Information
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Vishay Semiconductors
Early Failure Rate (EFR)
40
35
30
ppm
ppm
EFR Visibles
45
EFR IRDC
450
400
350
300
250
200
150
100
50
0
25
20
15
10
5
0
2011
2012
2013
2014
2011
22218
2012
2013
2014
22873
EFR Couplers
EFR IR Receiver
35
10
30
8
20
ppm
ppm
25
15
6
4
10
2
5
0
0
2011
2012
2013
2014
2011
22219
2012
2013
2014
22874
EFR Sensors
20
ppm
15
10
5
0
2011
2012
2013
2014
22872
Rev. 1.8, 25-Jan-16
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Vishay Semiconductors
Latent Failure Rate (LFR)
LFR IRDC
LFR IRDC
24
20
20
16
16
FIT
FIT
24
12
12
8
8
4
4
0
0
2011
2012
2013
2014
2011
22223
2012
2013
2014
22876
LFR IR Receiver
4
4
FIT
3
FIT
LFR Couplers
5
2
1
3
2
1
0
0
2011
2012
2013
2014
2011
2012
2013
2014
22877
22224
LFR Sensors
16
14
12
FIT
10
8
6
4
2
0
2011
2012
2013
2014
22875
Rev. 1.8, 25-Jan-16
18
Document Number: 80077
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