Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 2.84% 0.0086 Mold 51.61% 0.1564 100 fpBGA 0.303 Grams % of Total Weight (g) Pkg. Wt. 42.84% 3.87% 3.87% 0.77% 0.26% D/A Epoxy 0.40% Wire 0.97% 0.0029 Solder Balls 12.52% 0.0380 Foil 24.82% 6.84% 0.1298 0.0117 0.0117 0.0023 0.0008 Substance CAS # Silicon chip 7440-21-3 Fused silica Epoxy resin Phenol resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation) Silver Organic esters and resins 7440-22-4 - Mold Compound Density ranges between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 1.00 mil diameter; 1 wire per solder ball; wire length 3 mm 0.0012 0.32% 0.08% Substrate with SnAgCu Solder Balls 0.0010 0.00024 Die size: 4.71 x 2.90 mm Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 83% in our calculation) 2 to 10% Epoxy resin (LSC uses 7.5% in our calculation) 2 to 10% Phenal resin (LSC uses 7.5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation) 11.96% 0.50% 0.06% 0.0362 0.0015 0.00019 Tin (Sn) (95.5%) Silver (Ag) (4.0%) Copper (Cu) (0.5%) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn95.5/Ag4.0/Cu0.5% 16.88% 7.94% 0.0511 0.0241 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0752 0.0207 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Notes / Assumptions: