Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight December, 2012 % of Total Pkg. Wt. Weight (g) Die 0.87% 0.0099 Mold 46.36% 0.5285 D/A Epoxy Wire Solder Balls Substrate Foil 0.14% 0.39% 29.04% 17.78% 5.42% 324 ftBGA 1.14 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. Copper Wire Version MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 4.08 x 3.85 mm 39.40% 2.78% 3.24% 0.70% 0.23% 0.4492 0.0317 0.0370 0.0079 0.0026 Silica Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 Mold Compound: Sumitomo EME-G750 75 to 95% Fused silica filler (LSC uses 85% in our calculation) 2 to 8% Epoxy resin (LSC uses 6% in our calculation) 2 to 10% Phenal resin (LSC uses 7% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation) 0.11% 0.03% 0.0013 0.0003 Silver (Ag) Organic esters and resins 7440-22-4 - Die attach: Ablebond 2100A 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) 0.38% 0.01% 0.00433 0.00007 Copper Palladium 7440-50-8 7440-05-3 Pd coated Copper, 0.8 mil diameter 98.5% 1.5% 28.06% 0.87% 0.15% 0.3198 0.0099 0.0017 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn96.5%/Ag3.0%/Cu0.5% 12.09% 5.69% 0.1379 0.0649 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0016 0.0044 0.3311 0.2027 0.0618 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. K