FTBGA Pbfree Cuwire324

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
0.87%
0.0099
Mold
46.36%
0.5285
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.14%
0.39%
29.04%
17.78%
5.42%
324 ftBGA
1.14
Grams
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Copper Wire Version
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Notes / Assumptions:
Silicon chip
7440-21-3
Die size: 4.08 x 3.85 mm
39.40%
2.78%
3.24%
0.70%
0.23%
0.4492
0.0317
0.0370
0.0079
0.0026
Silica
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
Mold Compound: Sumitomo EME-G750
75 to 95% Fused silica filler (LSC uses 85% in our calculation)
2 to 8% Epoxy resin (LSC uses 6% in our calculation)
2 to 10% Phenal resin (LSC uses 7% in our calculation)
0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation)
0.11%
0.03%
0.0013
0.0003
Silver (Ag)
Organic esters and resins
7440-22-4
-
Die attach: Ablebond 2100A
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
0.38%
0.01%
0.00433
0.00007
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5%
1.5%
28.06%
0.87%
0.15%
0.3198
0.0099
0.0017
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn96.5%/Ag3.0%/Cu0.5%
12.09%
5.69%
0.1379
0.0649
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0016
0.0044
0.3311
0.2027
0.0618
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. K