Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight December, 2012 % of Total Pkg. Wt. Weight (g) Die 1.74% 0.0093 Mold 51.18% 0.2723 D/A Epoxy Wire Solder Balls Substrate Foil 0.28% 0.65% 18.26% 21.57% 6.31% 256 caBGA 0.532 Grams with SnAgCu Solder Balls Copper Bond Wire Version MSL: 3 Peak Reflow Temp: 260°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 3.53 x 4.17 mm 42.48% 3.84% 3.84% 0.77% 0.26% 0.2260 0.0204 0.0204 0.0041 0.0014 Silica Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 0.22% 0.06% 0.0012 0.0003 Silver filled epoxy Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 83% in our calculation) 2 to 10% Epoxy resin (LSC uses 7.5% in our calculation) 2 to 10% Phenal resin (LSC uses 7.5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density ranges between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Resins (LSC uses 20% in our calculation) 0.64% 0.01% 0.00342 0.00005 Copper Palladium 7440-50-8 7440-05-3 Pd coated Copper, 0.8 mil diameter 98.5% 1.5% 17.62% 0.55% 0.09% 0.0937 0.0029 0.0005 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 14.67% 6.90% 0.0780 0.0367 BT Resin Fibrous-glass-wool Resins 65997-17-3 - Copper (Cu) 7440-50-8 0.0015 0.0035 0.0971 0.1148 0.0336 Solder ball composition Sn95.5/Ag3.0/Cu0.5% 60 to 75% glass fiber (LSC uses 68% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. K