Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 Package: Total Device Weight December, 2005 % of Total Pkg. Wt. Weight (g) Die 1.93% 0.079 Mold 36.71% 1.505 516 fpBGA 4.10 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. 33.04% 1.84% 1.84% 1.355 0.075 0.075 Substance CAS # Notes / Assumptions: Silicon 7440-21-3 Die size: 9.63 x 11.36 mm Silica (Fused or Amorphous) Epoxy resin Phenol resin D/A Epoxy 0.27% 0.011 Silver-Filled Epoxy Wire 0.37% 0.015 Gold (Au) Solder Balls 12.53% 0.514 12.03% 0.44% 0.06% Substrate 19.60% 0.803 Foil 28.60% 1.173 0.493 0.018 0.003 Tin (Sn) Silver (Ag) Copper (Cu) Copper (Cu) The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. www.latticesemi.com Qualified Solder ball compositions: 7440-31-5 Sn95.5/Ag4/Cu0.5 7440-22-4 Sn96.5/Ag3/Cu0.5 7440-50-8 LSC uses: Sn96/Ag3.5/Cu0.5 for calculations 129915-35-1 BT Resin Notes: The information provided above is representative of the package as of the date listed, and is subject to change at any time. Mold Compound composition: 60676-86-0 84 to 92% Silica Fused or Amorphous (LSC uses 90% in our calculation) 129915-35-1 5 to 9% Epoxy resin (LSC uses 5% in our calculation) 26834-02-6 4 to 8% Phenol resin (LSC uses 5% in our calculation) Mold Compound Density between 1.8 and 2.1 grams/cc 7440-22-4 Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 7440-57-5 1.00 mil diameter; 1 wire per solder ball 7440-50-8