Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight August, 2012 % of Total Pkg. Wt. Weight (g) Die 4.43% 0.0021 Mold 35.68% 0.0171 D/A Epoxy 0.72% 3.17% 0.0015 Solder Balls 16.59% 0.0080 Foil 30.50% 8.92% with SnPb Solder Balls % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 240°C Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 1.77 x 1.91 mm 30.32% 2.14% 2.14% 0.89% 0.18% 0.3032 0.0214 0.0214 0.0089 0.00178 Silica Epoxy resin Phenol resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 Mold Compound composition: 75-95% Silica (LSC uses 85% in our calculation) 2-10% Epoxy resin (LSC uses 6% in our calculation) 2-10% Phenol Resin (LSC uses 6% in our calculation) 0.5 to 2.5% Metal Hydroxide (LSC uses 2.5% in our calculation) 0.1-0.5% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density between 1.9 and 2.1 grams/cc 0.33% 0.08% 0.00027 0.00007 Silver (Ag) Organic esters and resins 7440-22-4 - 60 to 90% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball 0.00034 Wire Substrate 64 csBGA 0.048 Grams 10.45% 6.14% 0.0050 0.0029 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 Solder ball composition Sn63/Pb37 20.74% 9.76% 0.0100 0.0047 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.0146 0.0043 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. J