Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight July, 2004 % of Total Pkg. Wt. Weight (g) Die 2.76% 0.013 Mold 38.25% 0.182 D/A Epoxy 0.39% 0.89% 0.004 Solder Balls 30.10% 0.143 Foil 22.20% 5.33% with SnPb Solder Balls % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 240°C Substance CAS # Silicon 7440-21-3 Notes / Assumptions: Die size: 5.50 x 3.30 mm 30.03% 5.36% 0.38% 0.96% 0.38% 0.96% 0.19% 0.143 0.025 0.002 0.005 0.002 0.005 0.001 Silica Epoxy/Phenol Resin Brominated Epoxy Resin Antimony Trioxide Antimony Pentoxide Siloxanes Carbon Black 60676-86-0 68928-70-1 1309-64-4 1314-60-9 1333-86-4 0.31% 0.08% 0.0015 0.0004 Silver Organic esters and resins 7440-22-4 - Mold Compound composition: 65 to 95% Silica (LSC uses 78.5% in our calculation) 5 to 22% Epoxy/Phenol Resin (LSC uses 14% in our calculation) 0 to 2% Brominated Epoxy Resin (LSC uses 1% in our calculation) 0 to 5% Antimony Trioxide (LSC uses 2.5% in our calculation) 0 to 1.5% Antimony Pentoxide (LSC uses 1% in our calculation) 0 to 5% Siloxanes (LSC uses 2.5% in our calculation) 0 to 1% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density between 1.88 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 1.00 mil diameter; 1 wire per solder ball 0.002 Wire Substrate 144 fpBGA 0.475 Grams 15.79% 14.39% 0.075 0.068 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 Solder ball composition Sn63/Pb37 15.10% 7.10% 0.071 0.034 Glass fiber BT resins 65997-17-3 - 60-75% Glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.105 0.025 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B1