Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: 1152 fcBGA (organic) with Eu (Sn63/Pb37) Solder Balls 10.36 Total Device Weight Grams Die % of Total Pkg. Wt. 2.01% Bumps 0.095% December, 2010 Lid Adhesive Underfill 52.06% 0.77% 0.38% Thermally conductive adhesive 0.68% Solder Balls 9.28% Substrate 34.72% Weight (g) % of Total Pkg. Wt. Weight (g) 0.208 SC40 version MSL: 4 Peak Reflow Temp: 225°C Substance CAS # Notes / Assumptions: Silicon (Si) 7440-21-3 Die Size: SC40: 13.60 x 13.07mm 0.0098 0.092% 0.002% 0.0095 0.0003 Tin (Sn) Silver (Ag) 7440-31-5 7440-22-4 97.4% 2.6% 51.805% 0.260% 5.365 0.027 Copper (Cu) Nickel (Ni) 7440-50-8 7440-02-0 99.5% 0.5% 0.695% 0.077% 0.072 0.008 Alumina Others 0.019% 0.038% 0.049% 0.038% 0.211% 0.004% 0.019% 0.0020 0.0039 0.0051 0.0039 0.0218 0.0004 0.0020 Bisphenol A type liquid epoxy resin Bisphenol F type liquid epoxy resin Naphthalene Amine type accelerator Silicon dioxide Carbon black Additives 0.575% 0.101% 0.060 0.011 Aluminum (Al) Resin and additive mixture 5.847% 3.434% 0.606 0.356 Tin (Sn) Lead(Pb) 7.535% 13.611% 13.577% 0.780 1.408 1.407 Glass fiber Resin and additive mixture Copper(Cu) 5.392 0.080 1344-28-1 90% Trade Secret 10% 0.039 25068-38-6 9003-36-5 27610-48-6 Trade Secret 60676-86-0 1333-86-4 Trade Secret 5% 10% 13% 10% 56% 1% 5% 0.070 7429-90-5 85% Trade Secret 15% 0.961 7440-31-5 7439-92-1 63% 37% 3.596 65997-17-3 21.7% Trade Secret 39.2% 7440-50-8 39.1% Notes: The values listed above are nominal values based on the data provided by outside sources and have not been validated. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A