Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 USA [email protected] Package: Total Device Weight March, 2013 % of Total Pkg. Wt. Weight (g) Die 4.50% 0.0078 Mold 49.65% 0.0864 D/A Epoxy Wire Solder Balls Substrate 0.65% 5.29% 9.50% 30.41% 184 csBGA 0.174 Grams with SnAgCu Solder Balls Copper Bond Wire Halogen Free MSL: 3 Peak Reflow Temp: 260°C % of Total Weight (g) Pkg. Wt. Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 143 x 147 mil 41.31% 2.48% 0.74% 2.48% 2.48% 0.15% 0.0719 0.0043 0.0013 0.0043 0.0043 0.0003 Silica fused Epoxy Resin A Epoxy Resin B Phenol Novolac Metal Hydroxide Carbon Black 60676-86-0 9003-35-4 1333-86-4 Mold Compound: EME-G750E 75 to 95% Fused silica filler (LSC uses 83.2% in our calculation) 2 to 8% Epoxy resin A (LSC uses 5% in our calculation) 0.5 to 2.5% Epoxy resin B (LSC uses 1.5% in our calculation) 2 to 8% Phenol Novolac (LSC uses 5% in our calculation) 2 to 8% Metal Hydroxide (LSC uses 5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.3% in our calculation) 0.90% 0.22% 0.0009 0.0002 Silver filled epoxy Silver (Ag) Organic esters and resins 7440-22-4 - Die attach epoxy: Ablebond 2100A 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) 5.15% 0.14% 0.0074 0.0018 Copper Palladium 7440-50-8 7440-05-3 Pd coated Copper, 0.8 mil diameter 98.5% 1.5% 10.70% 0.45% 0.06% 0.0160 0.0005 0.0001 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 20.69% 2.53% 5.07% 0.84% 0.03% 4.39% 0.0116 0.0044 0.0088 0.0015 0.0001 0.0054 BT Resin CCL-HL832NX Copper Solder Mask-PSR4000 AUS 308 Nickel plating Gold plating Copper thickness in hole 7440-50-8 7440-02-0 7440-57-5 7440-50-8 0.0011 0.0092 0.0165 0.0529 SAC305 Solder ball composition Sn96.5/Ag3/Cu0.5 CCL-HL832NX 68.06% 8.33% 16.67% 2.78% 0.11% 4.17% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A