Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight August, 2012 % of Total Pkg. Wt. Weight (g) Die 1.00% 0.0071 Mold 55.31% 0.390 D/A Epoxy 0.16% 1.07% 0.0075 Solder Balls 13.78% 0.097 28.69% with SnAgCu Solder Balls MSL: 3 Peak Reflow Temp: 260°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 3.35 x 3.35 mm 45.91% 4.15% 4.15% 0.83% 0.28% 0.3237 0.0292 0.0292 0.0058 0.0019 Silica Epoxy Resin Phenol Resin Metal Hydroxide Carbon Black 60676-86-0 1333-86-4 0.13% 0.03% 0.0009 0.0002 Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Fused silica filler (LSC uses 83% in our calculation) 2 to 10% Epoxy resin (LSC uses 7.5% in our calculation) 2 to 10% Phenol resin (LSC uses 7.5% in our calculation) 0.5 to 2.5% Metal hydroxide (LSC uses 1.5% in our calculation) 0.1 to 0.5% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density ranges between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per package lead Solder ball composition Sn96.5%/Ag3.0%/Cu0.5% 0.0011 Wire Substrate 256 ftBGA 0.705 Grams 13.16% 0.55% 0.07% 0.0937 0.0029 0.0005 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 13.10% 3.27% 8.19% 1.36% 0.05% 2.73% 0.0923 0.0231 0.0577 0.0096 0.0004 0.0192 BT Resin CCL-HL832 Copper Solder mask PSR4000 AUS 308 Nickel plating Gold plating Copper thickness in hole 7440-50-8 7440-02-0 7440-57-5 7440-50-8 0.202 BT Resin CCL-HL832 45.71% 11.43% 28.57% 4.76% 0.19% 9.52% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B