Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight April, 2012 % of Total Pkg. Wt. Weight (g) Die 0.88% 0.00375 Mold 61.36% 0.2609 Tape Wire Solder Balls Substrate 0.04% 0.37% 16.50% 20.84% 256 LBGA 0.425 Grams with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. iCE40 MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 106 X 95 MIL 55.22% 3.37% 2.76% 0.2348 0.0144 0.0117 Silica Epoxy Resin(1) Phenol Resin-1 60676-86-0 Trade secret Trade secret KE-G1250LKDS 75 to 95% Fused silica filler (LSC uses 90% in our calculation) 1 to 10% Epoxy resin (LSC uses 5.5% in our calculation) 2 to 7% Phenol resin (LSC uses 4.5% in our calculation) 0.005% 0.005% 0.003% 0.030% 0.00002 0.00002 0.00001 0.00013 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer 25038-59-9 Trade secret Trade secret Trade secret TAPE FH-900T-25_HR9004 10 to 20% (LSC uses 12% in our calculation) 10 to 20% (LSC uses 12% in our calculation) 1 to 10% (LSC uses 6% in our calculation) 65 to 75% (LSC uses 70% in our calculation) 0.363% 0.010% 0.0015 0.00004 Copper (Cu) Palladium (Pd) Total of impurities 7440-57-5 7440-05-3 NA 15.92% 0.495% 0.083% 0.06769 0.00210 0.00035 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 9.53% 2.38% 5.95% 0.99% 0.04% 1.98% 0.0405 0.0101 0.0253 0.0042 0.0002 0.0084 BT Resin CCL-HL832NX (A-HS) Copper Solder mask PSR4000 AUS 308 Nickel plating Gold plating Copper thickness in hole Trade secret 7440-50-8 Trade secret 7440-02-0 7440-57-5 7440-50-8 0.00018 0.0016 0.0701 0.0886 EX1 0.7 MIL Pd Coated >97.8% Cu <2.7% Pd <0.02% SAC305 Solder ball composition Sn96.5/Ag3.0/Cu0.5% CCL-HL832NX(A-HS), AUS 308 45.7% 11.4% 28.6% 4.8% 0.2% 9.5% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A