Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight April, 2012 % of Total Pkg. Wt. Weight (g) Die 1.45% 0.0037 Mold 48.55% 0.1244 Tape Wire Solder Balls Substrate 0.07% 1.15% 9.97% 38.80% 284 LBGA 0.256 Grams with SnAgCu Solder Balls iCE40 MSL: 3 Peak Reflow Temp: 260°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 106 X 94 MIL 43.70% 2.67% 2.18% 0.1120 0.0068 0.0056 Silica Epoxy Resin(1) Phenol Resin-1 60676-86-0 Trade secret Trade secret KE-G1250LKDS 75 to 95% Fused silica filler (LSC uses 90% in our calculation) 1 to 10% Epoxy resin (LSC uses 5.5% in our calculation) 2 to 7% Phenol resin (LSC uses 4.5% in our calculation) 0.018% 0.018% 0.004% 0.049% 0.00002 0.00002 0.00001 0.00013 Epoxy Resin Phenol Resin SiO2 Filler (Meta)Acrylic Copolymer 25038-59-9 Trade secret Trade secret Trade secret FH-900T-25 10 to 20% (LSC uses 12% in our calculation) 10 to 20% (LSC uses 12% in our calculation) 1 to 10% (LSC uses 6% in our calculation) 65 to 75% (LSC uses 70% in our calculation) 1.138% 0.011% 0.0029 0.00003 Gold (Au) Palladium (Pd) 7440-57-5 7440-05-3 9.82% 0.10% 0.05% 0.0252 0.0003 0.0001 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 10.92% 8.19% 3.28% 4.09% 2.73% 0.05% 8.19% 1.37% 0.0280 0.0210 0.0084 0.0105 0.0070 0.0001 0.0210 0.0035 BT Resin (1)(3) GHPL-830NX(A) BT Resin (2) CCL-HL832NX(A-HS) Copper (1)(4) Copper (2)(3) Copper thickness in hole Nickel plating Gold plating Solder mask PSR4000 AUS 308 Trade secret Trade secret 7440-50-8 7440-50-8 7440-50-8 7440-02-0 7440-57-5 Trade secret 0.0002 0.0030 0.0256 0.0995 0.7 MIL GPG-3 (2N) 99% Au 1% Pd SAC105 Solder ball composition Sn98.5/Ag1.0/Cu0.5% GHPL-830NX(A), CCL-HL832NX(A-HS), AUS308 28.1% 21.1% 8.4% 10.5% 7.0% 0.1% 21.1% 3.5% Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A