Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight March, 2011 % of Total Pkg. Wt. Weight (g) Die 0.72% 0.0075 Mold 45.04% 0.469 D/A Epoxy 0.10% 0.91% 0.0095 Solder Balls 11.32% 0.1177 Foil 27.29% 14.62% with SnAgCu Solder Balls % of Total Weight (g) Pkg. Wt. Halogen Free MSL: 3 Peak Reflow Temp: 260°C Substance CAS # Silicon chip 7440-21-3 Notes / Assumptions: Die size: 3.40 x 3.50 mm 40.53% 2.70% 1.80% 0.09% 0.422 0.028 0.019 0.0009 Silica Epoxy Resin Phenol Resin Carbon Black 60676-86-0 1333-86-4 0.08% 0.02% 0.0008 0.0002 Silver filled epoxy Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 86 to 93% Silica Fused or Amorphous (LSC uses 90% in our calculation) 1.5 to 7% Epoxy resin (LSC uses 6% in our calculation) 1 to 6% Phenol resin (LSC uses 4% in our calculation) 0.2% Carbon Black Mold Compound Density ranges between 1.99 and 2.09 grams/cc Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.0114 mm (radius) 0.0011 Wire Substrate 332 caBGA 1.04 Grams 10.86% 0.40% 0.06% 0.1130 0.0041 0.0006 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn96.5/Ag3/Cu0.5 18.56% 8.73% 0.1930 0.0908 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.284 0.152 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. C