FCBGA SNPB1704

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package: 1704 fcBGA (organic) with Eu(Sn63/Pb37) Solder Balls
19.72
Total Device Weight
Grams
Die
% of Total
Pkg. Wt.
1.69%
Bumps
0.070%
December, 2010
Lid
Ring
Adhesive
Underfill
38.89%
26.06%
0.71%
0.35%
Thermally conductive
adhesive
0.58%
Solder Balls
5.64%
Substrate
26.00%
Weight (g)
% of Total
Pkg. Wt.
Weight (g)
0.334
MSL: 4
Peak Reflow Temp: 225°C
Substance
CAS #
Silicon (Si)
7440-21-3
Die Size: SC80: 18.20x15.7mm
Notes / Assumptions:
0.0138
0.068%
0.002%
0.0134
0.0004
Tin (Sn)
Silver (Ag)
7440-31-5
7440-22-4
97.4%
2.6%
38.691%
0.194%
7.6300
0.0383
Copper (Cu)
Nickel (Ni)
7440-50-8
7440-02-0
99.5%
0.5%
25.931%
0.130%
5.1136
0.0257
Copper (Cu)
Nickel (Ni)
7440-50-8
7440-02-0
99.5%
0.5%
0.639%
0.071%
0.1260
0.0140
Alumina
Others
1344-28-1
Trade Secret
90%
10%
0.018%
0.035%
0.046%
0.035%
0.199%
0.004%
0.018%
0.0035
0.0070
0.0091
0.0070
0.0392
0.0007
0.0035
Bisphenol A type liquid epoxy resin
Bisphenol F type liquid epoxy resin
Naphthalene
Amine type accelerator
Silicon dioxide
Carbon black
Additives
25068-38-6
9003-36-5
27610-48-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
5%
10%
13%
10%
56%
1%
5%
0.496%
0.087%
0.0978
0.0173
Aluminum
Resin and additive mixture
7429-90-5
Trade Secret
85%
15%
3.555%
2.088%
0.7010
0.4117
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
63%
37%
0.018%
0.035%
0.046%
1.1124
2.0081
2.0066
Glass fiber
Resin and additive mixture
Copper(Cu)
65997-17-3
Trade Secret
7440-50-8
7.668
5.139
0.140
0.070
0.115
1.113
5.127
21.7%
39.2%
39.1%
Notes:
The values listed above are nominal values based on the data provided by outside sources and have not been validated.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A